Substrate fixing device for flying probe test

Abstract

The utility model discloses a substrate fixing device for a flying probe test in the technical field of flying probe tests, and aims to solve the problem of low flying probe test efficiency caused by the fact that a single-piece test mode is adopted for an LTCC (Low Temperature Co-Fired Ceramic) substrate to avoid scratching of a conductor on the surface of the substrate in the prior art. The device comprises a bottom plate, a plurality of grooves used for containing substrates are formed in the top of the bottom plate, protection holes are formed in corners in the grooves, through holes are formed in the bottoms of the grooves, and the through holes communicate with the bottom of the bottom plate; when the substrate is placed in the groove, a gap exists between the groove and the substrate; according to the utility model, a plurality of substrates can be placed in the grooves on the bottom plate at the same time, the influence of the sintering shrinkage rate of the substrates is avoided, then the plurality of substrates can be tested at the same time through the plurality of mobile probes, and the working efficiency of the device is ensured; and meanwhile, the taking and placing work of the base plate is simplified, collision and scratches of the base plate are avoided, and meanwhile the ceramic cracking phenomenon is avoided when the base plate is taken and placed.

Description

Technical Field

[0001] The utility model relates to a substrate fixing device for flying probe testing, belonging to the technical field of flying probe testing. Background Art

[0002] Flying probe testing technology is primarily used to inspect PCBs or sintered LTCC substrates to verify the connectivity of multilayer wiring and assess the substrate's electrical characteristics. Flying probe testing utilizes probes that can be moved freely across the substrate surface, based on the substrate's network logic. Under program guidance, the probes are inserted and contacted at both ends of the substrate under test. Voltage is applied to the probes and the current is measured to determine the substrate's continuity. Taking LTCC substrates as an example, LTCC technology involves manufacturing a green ceramic tape using low-temperature sintering ceramic powder. The designed circuit layout is then created through processes such as punching, filling, and screen printing. Multiple components, such as low-capacitance capacitors, resistors, filters, and couplers, are embedded within the multilayer ceramic substrate and laminated together. Internal and external electrodes can be made of metal materials such as Ag, Cu, and Au. Sintering is performed at temperatures below 1000°C, ultimately creating a 3D, high-density integrated circuit. Circuit modules based on LTCC technology are costly, especially in the subsequent assembly process, where the cost of chips and components contributes significantly. Therefore, continuity testing is essential before assembling chips and components on LTCC substrates. The testing equipment is a flying probe tester. Since the flying probe test of LTCC substrates requires that the puncture marks on the substrates be as shallow as possible, and since LTCC substrates have certain shrinkage rate errors, some substrates contain cavity structures, and some substrates contain embedded devices, etc., flying probe testing of LTCC substrates is different from flying probe testing of PCB boards. It is difficult and requires special design to achieve.

[0003] In the prior art, when performing flying probe testing on LTCC substrates, the LTCC substrates are generally clamped and fixed, and a single-piece test method is used to avoid scratches caused by conductors on the substrate surface. At the same time, due to differences in sintering shrinkage rates of LTCC substrates, the substrates will have certain dimensional accuracy errors. The position needs to be readjusted for each test, resulting in low efficiency when performing flying probe testing on LTCC substrates, affecting the working efficiency of the device. Utility Model Content

[0004] The purpose of the utility model is to overcome the shortcomings of the existing technology and provide a substrate fixing device for flying probe testing. The utility model solves the problem that the existing technology generally clamps and fixes LTCC substrates and adopts a single-piece testing method to avoid scratches caused by conductors on the surface of the substrate. At the same time, due to the difference in sintering shrinkage rate of LTCC substrates, there will be certain dimensional accuracy errors in the substrates. The position needs to be readjusted for each test, resulting in low efficiency when performing flying probe testing on LTCC substrates.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] The utility model provides a substrate fixing device for flying probe testing, comprising a base plate, a top of the base plate being provided with a plurality of grooves for placing the substrate, corners inside the grooves being provided with protective holes, a bottom of the grooves being provided with through holes, and the through holes being connected to the bottom of the base plate.

[0007] Furthermore, a plurality of the grooves are evenly opened on the top of the bottom plate.

[0008] Furthermore, the length of the groove is greater than the length of the substrate.

[0009] Furthermore, the width of the groove is greater than the width of the substrate.

[0010] Furthermore, the depth of the groove is greater than the height of the substrate.

[0011] Furthermore, the protection hole is circular.

[0012] Furthermore, the through hole is rectangular.

[0013] Furthermore, the through hole and the groove are arranged coaxially.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] The substrate fixing device for flying probe testing can simultaneously place multiple substrates into the grooves on the base plate by cooperating with the grooves, the base plate and the through holes, while avoiding the influence of the sintering shrinkage rate of the substrates. Then, multiple substrates can be tested simultaneously by multiple movable probes. Different from the single-chip test in the prior art, the efficiency of LTCC substrates in flying probe testing is greatly improved, and the working efficiency of the device is guaranteed. At the same time, the present application simplifies the work of taking and placing the substrates by cooperating with the protective holes and the through holes, avoids bumps and scratches on the substrates, and avoids the ceramic chipping phenomenon of the substrates during taking and placing, thereby ensuring the stability of the device during operation and further improving the working efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the three-dimensional structure of a substrate fixing device for flying probe testing provided according to an embodiment of the present utility model;

[0017] Figure 2 This is a front perspective structural diagram of a substrate fixing device for flying probe testing provided according to an embodiment of the utility model;

[0018] Figure 3This is a bottom-up perspective structural diagram of a substrate fixing device for flying probe testing provided in accordance with an embodiment of the present utility model;

[0019] Figure 4 It is a schematic diagram of the three-dimensional structure of the groove provided according to an embodiment of the utility model.

[0020] In the figure: 1, bottom plate; 2, groove; 3, protection hole; 4, through hole. DETAILED DESCRIPTION

[0021] The present invention will be further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention and are not intended to limit the scope of protection of the present invention.

[0022] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0023] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0024] like Figure 1-4 As shown, the utility model provides a substrate fixing device for flying probe testing, including a base plate 1, a plurality of grooves 2 for placing substrates are opened on the top of the base plate 1, protection holes 3 are opened at the corners inside the grooves 2, and a through hole 4 is opened at the bottom of the grooves 2, and the through hole 4 is connected to the bottom of the base plate 1; when the substrate is placed inside the grooves 2, there is a gap between the grooves 2 and the substrate.

[0025] Specifically, when it is necessary to perform flying probe testing on the LTCC substrate, a substrate is placed in each groove 2, and the substrate is located inside the groove 2. There is a certain gap between the substrate and the groove 2. The LTCC substrate has a certain shrinkage error. The gap ensures that the LTCC substrate can be placed in the groove 2, while avoiding large relative movement between the LTCC substrate and the groove 2, and avoiding collision of the substrate. The substrate is directly placed in the groove 2 before the test, which reduces the operation of clamping the LTCC substrate and the visual alignment time of the flying probe test. At the same time, the groove 2 has a certain depth, so that the test substrate will not be affected by the shaking of the flying probe test. The protection hole 3 is used to protect the four corners of the substrate to avoid the ceramic chipping phenomenon caused by collision at the four corners of the substrate, thereby ensuring the stability of the operation of the device. During specific operation, the base plate 1 is fixed on the flying probe tester for testing, and multiple completely independent moving probes are moved to the surface of the substrate in the groove 2 for three-dimensional movement, thereby completing the testing of multiple substrates at the same time, improving the testing efficiency. After the substrate test is completed, it can be tested through the through hole 4 lifts and removes the substrate from the groove 2, simplifying the substrate placement work, avoiding possible damage to the substrate during placement, ensuring the stability of the device during operation, and allowing the through-hole 4 to be used for flying probe testing. Optionally, the base plate 1 is made of acrylic material, which has a higher surface hardness than that of the LTCC substrate, a lower surface hardness, surface glossiness, and good high-temperature resistance. Acrylic material has good processing performance, is lightweight and durable, and can provide good support for the product. In the present application, through the coordination of the groove 2, the base plate 1, and the through-hole 4, multiple substrates can be placed simultaneously in the groove 2 on the base plate 1, while avoiding the influence of the substrate sintering shrinkage rate. Multiple substrates can then be tested simultaneously by multiple movable probes. Unlike the single-piece testing in the prior art, this greatly improves the efficiency of the LTCC substrate during flying probe testing and ensures the working efficiency of the device. At the same time, through the coordination of the protective hole 3 and the through-hole 4, the substrate placement work is simplified, avoiding bumps and scratches on the substrate, and preventing the substrate from cracking during placement, ensuring the stability of the device during operation and further improving the working efficiency.

[0026] In one embodiment, a plurality of the grooves 2 are evenly opened on the top of the base plate 1. Optionally, the number of the grooves 2 is sixteen, and a flying probe test of sixteen-piece substrates can be performed, with each four grooves 2 forming a group. During the flying probe test, the software test system drives four completely independent mobile probes to perform three-dimensional movement on the surface of the substrate to be tested, and contacts the test points in a set order and manner. By applying a certain voltage and current to specific probes, different test signals are obtained, and then data is collected to give test results according to the parameters set by the user.

[0027] In one embodiment, the length of the groove 2 is greater than the length of the substrate, the width of the groove 2 is greater than the width of the substrate, and the depth of the groove 2 is greater than the height of the substrate. Optionally, the dimensions of the groove 2 are 0.1 mm larger than the size of the LTCC substrate, the vertical depth of the groove 2 is 0.1 mm larger than the size of the LTCC substrate, and rounded corners are used on all sides.

[0028] In one embodiment, the protection hole 3 is circular, the through hole 4 is rectangular, and the through hole 4 is coaxially arranged with the groove 2, so as to facilitate pushing the substrate out from the bottom center of the substrate to avoid damage to the substrate.

[0029] This application targets the requirements for the shape and dimensional accuracy of the LTCC substrate. By designing the size and structure of the groove 2, the LTCC substrate can be tested on a joint piece basis, facilitating the loading and unloading operations and reducing scratches on the LTCC substrate. This application can greatly improve the testing efficiency and meet the needs of mass production of LTCC substrates.

[0030] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A substrate fixing device for flying probe testing, characterized in that: The bottom plate (1) comprises a plurality of grooves (2) for placing substrates on the top of the bottom plate (1), protection holes (3) are provided at the corners of the grooves (2), a through hole (4) is provided at the bottom of the grooves (2), and the through hole (4) is communicated with the bottom of the bottom plate (1); When the substrate is placed inside the groove (2), a gap exists between the groove (2) and the substrate.

2. The substrate fixing device for flying probe testing according to claim 1, characterized in that: A plurality of the grooves (2) are evenly arranged on the top of the bottom plate (1).

3. The substrate fixing device for flying probe testing according to claim 1, characterized in that: The length of the groove (2) is greater than the length of the substrate.

4. The substrate fixing device for flying probe testing according to claim 1, characterized in that: The width of the groove (2) is greater than the width of the substrate.

5. The substrate fixing device for flying probe testing according to claim 1, characterized in that: The depth of the groove (2) is greater than the height of the substrate.

6. The substrate fixing device for flying probe testing according to claim 1, characterized in that: The protection hole (3) is circular.

7. The substrate fixing device for flying probe testing according to claim 1, characterized in that: The through hole (4) is rectangular.

8. The substrate fixing device for flying probe testing according to claim 1, characterized in that: The through hole (4) and the groove (2) are arranged coaxially.

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