Bubble removing device for chip bonding

Abstract

The utility model relates to the technical field of chip production, and discloses a bubble removing device for chip bonding, which comprises a working box, a motor is fixedly connected to the inner wall of the working box, a rotating shaft is fixedly connected to the output end of the motor, a connecting rod is rotatably connected to the outer wall of the rotating shaft, a transmission rod is rotatably connected to the outer wall of the connecting rod, and the transmission rod is fixedly connected to the inner wall of the working box. A first connecting plate is rotatably connected to the outer wall of the transmission rod, a connecting block is rotatably connected to the middle of the first outer wall of the connecting plate, a fixing rod is rotatably connected to the interior of the connecting block, a second connecting plate is fixedly connected to the outer wall of the fixing rod, a limiting block is fixedly connected to one side of the outer wall of the second connecting plate, and a vibrating rod is slidably connected to the interior of the limiting block. A fixing shaft is fixedly connected to the interior of the vibration rod, and a first connecting plate is rotationally connected to the outer wall of the fixing shaft. According to the utility model, the motor enables the placing table to vibrate through the transmission device, and cooperates with the heating plate to enable the bubbles to float to the surface of the chip, thereby achieving the effect of efficiently removing the bubbles in the chip.

Description

Technical Field

[0001] The utility model relates to the technical field of chip production, in particular to a bubble removal device used for chip bonding. Background Art

[0002] The main reason why bubbles may be adsorbed on chips during the manufacturing process is the characteristics of the material and the air or other gases that may exist in the production process. These bubbles will have a negative impact on the performance of the chip, such as reducing conductivity, increasing thermal resistance, etc., so they need to be removed during the manufacturing process. Removing bubbles helps improve the reliability and performance of the chip and ensures its stable operation in various applications. A series of process measures are taken in chip manufacturing, such as vacuum treatment, chemical treatment, etc., to minimize or eliminate the presence of bubbles to ensure the quality and function of the chip.

[0003] A search of the patent application number CN207775080U discloses a device for removing bubbles from a transparent glass body, comprising a clamping mechanism, a heating mechanism, a laser, and a driving mechanism. The clamping mechanism comprises two chucks arranged opposite to each other, each of which has a clamping portion for clamping the transparent glass body on its opposite wall surface. The heating mechanism comprises a heating area for receiving and heating the heated area of ​​the transparent glass body. The laser emits laser light directed toward the bubbles in the transparent glass body. The driving mechanism is connected to both chucks and is used to drive at least one of the chucks toward or away from the other chuck, as well as to drive the two chucks to rotate. The device provided by the utility model has a simple structure and is easy to use. The laser opens a hole in the transparent glass body and directly reaches the bubbles, expels the gas in the bubbles, and then applies a compressive force by heating to squeeze the concave portion where the bubbles are located until they disappear, thereby effectively removing the bubbles from the transparent glass body. The patent application removes the bubbles by laser after heating, and then squeezes the bubbles until the concave portion disappears. However, there is a problem that the bubbles cannot float to the surface for removal after heating, resulting in low efficiency in subsequent operations. Utility Model Content

[0004] In order to make up for the above shortcomings, the utility model provides a bubble removal device for chip bonding, which aims to improve the problem in the prior art that bubbles cannot be floated to the surface for simple removal after heating.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a bubble removal device for chip bonding, comprising a working box, the inner wall of the working box is fixedly connected to a motor, the output end of the motor is fixedly connected to a rotating shaft, the outer wall of the rotating shaft is rotatably connected to a connecting rod, the outer wall of the connecting rod is rotatably connected to a transmission rod, the outer wall of the transmission rod is rotatably connected to a connecting plate 1, the middle of the outer wall of the connecting plate 1 is rotatably connected to a connecting block, the inner wall of the connecting block is rotatably connected to a fixed rod, the outer wall of the fixed rod is fixedly connected to a connecting plate 2, the lower surface of the connecting plate 2 is fixedly connected to the inner wall of the working box, one side of the outer wall of the connecting plate 2 is fixedly connected to a limiting block, the inner wall of the limiting block is slidably connected to a vibration rod, the inner wall of the vibration rod is fixedly connected to a fixed shaft, the outer wall of the fixed shaft is rotatably connected to the connecting plate 1, the upper surface of the working box is fixedly connected to a placing table, and a heating component is provided on the upper surface of the placing table.

[0006] Furthermore, the heating assembly includes a heating plate, the lower surface of which is fixedly connected to the upper surface of the placement table, a groove is provided inside the heating plate, a chip body is provided inside the heating plate, and one side of the outer wall of the chip body is attached to the inner wall of the groove.

[0007] Furthermore, a sealing cover is provided on the upper surface of the placement table, an exhaust pipe is fixedly connected to the inside of the sealing cover, an exhaust pump is provided on the upper surface of the placement table, and an input end of the exhaust pump is fixedly connected to one end of the exhaust pipe.

[0008] Furthermore, the outer wall of the rotating shaft is rotatably connected to the inside of the second connecting plate, and the upper surface of the vibration rod is attached to the lower surface of the working box.

[0009] Furthermore, heat dissipation holes are provided inside the working box, and a fan is provided on the inner wall of the working box.

[0010] Furthermore, the sealing cover is arranged on a side adjacent to the heating plate, and the air extraction pump is arranged on a side adjacent to the sealing cover.

[0011] Furthermore, a box door is provided on the inner wall of the working box.

[0012] Furthermore, a handle is fixedly connected to the upper surface of the sealing cover.

[0013] The utility model has the following beneficial effects:

[0014] 1. In the present invention, a motor drives a connecting rod connected to a rotating shaft, so that the transmission rod rotates around the rotating shaft along with the connecting rod, and then a connecting plate connected to the transmission rod is restrained by a connecting block, and becomes a connecting plate to drive the vibration rod to move up and down. Finally, the vibration generated by the vibration rod on the placement table is transmitted to the chip body by the heating plate, so that the bubbles in the heated chip float to the surface of the chip, thereby facilitating the subsequent removal of bubbles in the chip.

[0015] 2. In the present invention, the chip body is placed on a heating plate for proper heating. The vibration rod vibrates to make the bubbles in the chip body float to the surface. Then the vacuum pump works to extract the air within the sealing cover through the vacuum pipe, and finally the bubbles on the surface of the chip body overflow to achieve the effect of removing bubbles. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a three-dimensional structural diagram of a bubble removal device for chip bonding proposed by the present invention;

[0017] Figure 2 This is a schematic diagram of the internal structure of a heating plate of a bubble removal device for chip bonding proposed by the present invention;

[0018] Figure 3 This is a schematic diagram of the interior of a working box of a bubble removal device for chip bonding proposed in the present invention;

[0019] Figure 4 for Figure 3 Enlarged view of point A in the middle.

[0020] Legend:

[0021] 1. Working box; 2. Motor; 3. Rotating shaft; 4. Connecting rod; 5. Transmission rod; 6. Connecting plate 1; 7. Connecting block; 8. Fixed rod; 9. Connecting plate 2; 10. Fixed shaft; 11. Vibrating rod; 12. Limit block; 13. Placement table; 14. Heating plate; 15. Groove; 16. Chip body; 17. Sealing cover; 18. Exhaust pipe; 19. Exhaust pump; 20. Heat dissipation hole; 21. Fan; 22. Box door; 23. Handle. DETAILED DESCRIPTION

[0022] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] Reference Figure 1 and Figure 3-4 , the utility model provides an embodiment: a bubble removal device for chip bonding, comprising a working box 1, the inner wall of the working box 1 is fixedly connected to a motor 2, the output end of the motor 2 is fixedly connected to a rotating shaft 3, the outer wall of the rotating shaft 3 is rotatably connected to a connecting rod 4, the outer wall of the connecting rod 4 is rotatably connected to a transmission rod 5, the outer wall of the transmission rod 5 is rotatably connected to a connecting plate 6, the middle part of the outer wall of the connecting plate 6 is rotatably connected to a connecting block 7, the inside of the connecting block 7 is rotatably connected to a fixing rod 8, the outer wall of the fixing rod 8 is fixedly connected to a connecting plate 2 9, the lower surface of the connecting plate 2 9 is fixedly connected to the inner wall of the working box 1, and one side of the outer wall of the connecting plate 2 9 is fixedly connected to a limiting block 12, the inner surface of the limiting block 12 is slidably connected to a vibration rod 11, the inner surface of the vibration rod 11 is fixedly connected to a fixed shaft 10, the outer wall of the fixed shaft 10 is rotatably connected to a connecting plate 6, the upper surface of the working box 1 is fixedly connected to a placing table 13, and the upper surface of the placing table 13 is provided with a heating component.

[0024] Specifically, the motor 2 drives the connecting rod 4 and the transmission rod 5 connected to the rotating shaft 3 to pull the connecting plate 6 to swing, which can achieve the effect of precisely controlling the swing of the connecting plate 6, causing the placement table 13 and the heating plate 14 to vibrate, and can achieve the effect of converting the motion trajectory. After heating, the bubbles in the chip body 16 float to the surface of the chip body 16, so that the bubbles can gather on the surface, achieving the effect of effectively dealing with the bubbles inside the chip using a simple method, avoiding damage to the chip, and being able to achieve the effect of more thoroughly removing the bubbles in the chip, thereby improving the quality and reliability of the chip.

[0025] Reference Figure 1-3 The heating assembly includes a heating plate 14, the lower surface of the heating plate 14 is fixedly connected to the upper surface of the placing table 13, a groove 15 is opened inside the heating plate 14, a chip body 16 is arranged inside the heating plate 14, and one side of the outer wall of the chip body 16 is attached to the inner wall of the groove 15, a sealing cover 17 is provided on the upper surface of the placing table 13, an exhaust pipe 18 is fixedly connected inside the sealing cover 17, an exhaust pump 19 is provided on the upper surface of the placing table 13, and an input end of the exhaust pump 19 is fixedly connected to one end of the exhaust pipe 18, the outer wall of the rotating shaft 3 is rotatably connected to the inside of the connecting plate 29, the upper surface of the vibration rod 11 is attached to the lower surface of the working box 1, a heat dissipation hole 20 is opened inside the working box 1, a fan 21 is provided on the inner wall of the working box 1, the sealing cover 17 is arranged on the adjacent side of the heating plate 14, the exhaust pump 19 is arranged on the adjacent side of the sealing cover 17, a box door 22 is opened on the inner wall of the working box 1, and a handle 23 is fixedly connected to the upper surface of the sealing cover 17.

[0026] Specifically, by placing the chip body 16 on the heating plate 14, after the heating plate 14 heats the chip body 16, the heating plate 14 is vibrated by the vibration rod 11 so that bubbles can float to the surface of the chip body 16, which helps to remove potential bubbles, and then the air in the sealing cover 17 is extracted by the vacuum pump 19, and the vacuum effect is used to promote the discharge of bubbles. The working box 1 is provided with heat dissipation holes 20 and a fan 21 to ensure the heat dissipation effect during normal operation of the equipment, and the handle 23 on the sealing cover 17 and the box door 22 in the working box 1 facilitate operation and maintenance.

[0027] Working principle: When it is necessary to use a bubble removal device for chip bonding, first place the chip body 16 on the heating plate 14, and then use the heating plate 14 to properly heat the chip body 16, and then use the motor 2 to drive the rotating shaft 3 to rotate, and then make the connecting rod 4 and the transmission rod 5 connected to the rotating shaft 3 in sequence rotate around the rotating shaft 3, and finally the connecting plate 6 connected to the transmission rod 5 makes the vibration rod 11 swing up and down under the restriction of the fixed rod 8, so that the placement table 13 vibrates, so as to achieve the effect of making the bubbles in the chip body 16 float to the upper surface, and then the vacuum pump 19 extracts the air in the sealing cover 17 through the vacuum pipe 18, so that the air in the bubbles on the surface of the chip body 16 will escape, and finally achieve the purpose of removing bubbles, thereby improving work efficiency. Heat dissipation holes 20 are opened inside the working box 1, and a fan 21 is provided on the inner wall of the working box 1, which is conducive to reducing the temperature in the working box 1, removing dust, and extending the service life of the device.

[0028] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A bubble removal device for chip bonding, comprising a working box (1), characterized in that: The inner wall of the working box (1) is fixedly connected to a motor (2), the output end of the motor (2) is fixedly connected to a rotating shaft (3), the outer wall of the rotating shaft (3) is rotatably connected to a connecting rod (4), the outer wall of the connecting rod (4) is rotatably connected to a transmission rod (5), the outer wall of the transmission rod (5) is rotatably connected to a connecting plate (6), the middle part of the outer wall of the connecting plate (6) is rotatably connected to a connecting block (7), the interior of the connecting block (7) is rotatably connected to a fixing rod (8), and the outer wall of the fixing rod (8) is fixedly connected to the connecting plate Two (9), the lower surface of the connecting plate two (9) is fixedly connected to the inner wall of the working box (1), and one side of the outer wall of the connecting plate two (9) is fixedly connected to a limit block (12), the inner part of the limit block (12) is slidably connected to a vibration rod (11), the inner part of the vibration rod (11) is fixedly connected to a fixed shaft (10), and the outer wall of the fixed shaft (10) is rotatably connected to the connecting plate one (6), and the upper surface of the working box (1) is fixedly connected to a placement table (13), and the upper surface of the placement table (13) is provided with a heating component.

2. The bubble removal device for chip bonding according to claim 1, characterized in that: The heating assembly comprises a heating plate (14), the lower surface of the heating plate (14) is fixedly connected to the upper surface of the placement platform (13), a groove (15) is provided inside the heating plate (14), a chip body (16) is provided inside the heating plate (14), and one side of the outer wall of the chip body (16) is attached to the inner wall of the groove (15).

3. The bubble removal device for chip bonding according to claim 2, characterized in that: A sealing cover (17) is provided on the upper surface of the placement table (13), and an exhaust pipe (18) is fixedly connected inside the sealing cover (17). An exhaust pump (19) is provided on the upper surface of the placement table (13), and an input end of the exhaust pump (19) is fixedly connected to one end of the exhaust pipe (18).

4. The bubble removal device for chip bonding according to claim 1, characterized in that: The outer wall of the rotating shaft (3) is rotatably connected to the inside of the second connecting plate (9), and the upper surface of the vibration rod (11) is attached to the lower surface of the working box (1).

5. The bubble removal device for chip bonding according to claim 1, characterized in that: The working box (1) is provided with heat dissipation holes (20) inside, and a fan (21) is provided on the inner wall of the working box (1).

6. The bubble removal device for chip bonding according to claim 3, characterized in that: The sealing cover (17) is arranged on a side adjacent to the heating plate (14), and the air extraction pump (19) is arranged on a side adjacent to the sealing cover (17).

7. The bubble removal device for chip bonding according to claim 1, characterized in that: The inner wall of the working box (1) is provided with a box door (22).

8. The bubble removal device for chip bonding according to claim 3, characterized in that: A handle (23) is fixedly connected to the upper surface of the sealing cover (17).

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