High-power semi-powder heat conduction pipe for server
By designing high-power semi-powder heat pipes, the heat dissipation problem of high-power servers is solved, rapid heat transfer and efficient heat dissipation are achieved, and the life of the equipment is extended.
Patent Information
- Application Number
- CN202421543083.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-02
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2034-07-02
AI Technical Summary
Conventional heat pipes cannot meet the heat dissipation requirements in high-power servers. The increased chip temperature shortens the equipment life and has low heat transfer efficiency.
It uses high-power semi-powder heat pipes, with the heat dissipation section and heating section formed in one piece. A copper powder layer is provided inside, and the liquid wick enhances the heat dissipation effect. The hollow cavity maintains a vacuum and is sealed by a plug to achieve rapid heat transfer.
It improves the heat dissipation efficiency of the server, reduces the chip temperature, and extends the service life of the equipment.
Smart Images
Figure CN223334913U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of heat pipes, and in particular to a high-power semi-powder heat pipe used in a server. Background Art
[0002] As market demands increase, server computing power increases, and server power consumption increases simultaneously. Conventional heat pipes increase power while increasing the thickness of the copper powder inside the heat pipes. This increases the thermal resistance of the heat pipes themselves, making it impossible to meet the heat dissipation requirements of high-power servers with high computing power.
[0003] For every 10°C rise in chip temperature, its operating life is halved. When using high-power heat pipes, the copper powder inside the heat pipe becomes thicker, and the thermal resistance of the heat pipe itself also increases. The heat transfer resistance of the server chip through the heat pipe is large, causing the server chip to remain in a high-temperature state for a long time.
[0004] Conventional heat pipes are surrounded by uniformly heated copper powder (capillary structure), which relies on the gas-liquid conversion of the working medium to achieve heat exchange. The heat pipe absorbs heat from the heat source and then transfers the heat to the cooling section through vaporization. The copper powder on the tube wall in the cooling section of the heat pipe is in a particle combination state, with certain capillary gaps, which cannot quickly transfer heat to the heat sink, resulting in serious heat accumulation inside the heat pipe. Therefore, we proposed a high-power semi-powder heat pipe for use in servers. Utility Model Content
[0005] The present application provides a server using a high-power semi-powder heat pipe to solve the above-mentioned problems.
[0006] The present application provides a high-power semi-powder heat pipe for a server, comprising:
[0007] A heat dissipation section, wherein a transition section is integrally formed at the heat entry point of the heat dissipation section, and a heating section is integrally formed at the heat entry point of the transition section;
[0008] The interiors of the transition section and the heating section are sintered to provide a copper powder layer.
[0009] Preferably, the inner side walls of the heat dissipation section, the transition section and the heating section are all provided with liquid absorption cores.
[0010] Preferably, the copper powder layer is arranged on the inner side of the liquid wick.
[0011] Preferably, the heat dissipation section, the transition section and the heating section are an integrated structure, and the shapes of the heat dissipation section, the transition section and the heating section are set shapes.
[0012] Preferably, the outer ends of the heat dissipation section and the heating section are both sealed by plugs.
[0013] Preferably, the heat dissipation section, the transition section and the heating section have hollow cavities inside.
[0014] Preferably, the inner and outer side walls of the heat dissipation section are smooth.
[0015] Preferably, the heat dissipation section, the transition section and the heating section are all copper tubes.
[0016] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:
[0017] The structure provided in the embodiment of the present application does not add a copper powder layer to the heat dissipation section, effectively and quickly absorbs heat from the external chip in the heating section and transfers the heat to the heat dissipation section through the transition section. In addition, there is no copper powder layer inside the heat dissipation section, and the heat is quickly transferred to the external heat sink, thereby increasing the heat dissipation of the overall structure of the equipment and achieving the best heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.
[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0020] Figure 1 This is an overall cross-sectional structural diagram provided for an embodiment of the present application.
[0021] In the figure: 1. heat dissipation section; 2. heating section; 3. transition section; 4. copper powder layer; 5. hollow cavity; 6. liquid absorption core; 7. plug. DETAILED DESCRIPTION
[0022] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0023] The various embodiments of the present application may be presented in the form of a range. It should be understood that the description in the form of a range is merely for convenience and brevity and should not be construed as a rigid limitation on the scope of the present application. Therefore, it should be considered that the range description has specifically disclosed all possible sub-ranges and single numerical values within the range. For example, it should be considered that the range description from 1 to 6 has specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the range, such as 1, 2, 3, 4, 5 and 6, regardless of the range. In addition, whenever a numerical range is indicated in this application, it is intended to include any quoted number (fraction or integer) within the indicated range. Unless otherwise specified, the various raw materials, reagents, instruments and equipment used in this application are all commercially available or can be prepared using existing equipment.
[0024] In this application, unless otherwise specified, the directional words used, such as "upper" and "lower", specifically refer to the directions of the drawings in the accompanying drawings. In addition, in this application, the terms "including", "comprising", etc. mean "including but not limited to". In this application, relational terms such as "first" and "second" are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. In this application, "and / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. Wherein A and B can be singular or plural. In this application, "at least one" means one or more, and "plurality" means two or more. "At least one", "at least one of the following" or similar expressions refer to any combination of these items, including any combination of singular or plural items. For example, "at least one of a, b, or c" or "at least one of a, b and c" can both mean: a, b, c, ab, i.e. a and b, ac, bc or abc, where a, b, c can be single or multiple.
[0025] Figure 1 This is an overall cross-sectional structural diagram provided for an embodiment of the present application.
[0026] like Figure 1 As shown, the embodiment of the present application provides a server using a high-power semi-powder heat pipe, comprising:
[0027] The heat dissipation section 1 has smooth inner and outer side walls, a transition section 3 is integrally formed at the heat entry point of the heat dissipation section 1, and a heating section 2 is integrally formed at the heat entry point of the transition section 3;
[0028] The transition section 3 and the heating section 2 are internally sintered with a copper powder layer 4;
[0029] The heat dissipation section 1 , the transition section 3 and the heating section 2 are all copper tubes.
[0030] like Figure 1 As shown, the inner side walls of the heat dissipation section 1 , the transition section 3 and the heating section 2 are all provided with a liquid absorption core 6 .
[0031] Specifically, the liquid absorbent core 6 can increase the heat absorption and heat dissipation effect of the overall structure.
[0032] like Figure 1 As shown: the copper powder layer 4 is arranged on the inner side of the liquid wick 6.
[0033] Specifically, the copper powder layer 4 is sintered at a high temperature and becomes integrated with the transition section 3 and the heating section 2 .
[0034] like Figure 1 As shown: the heat dissipation section 1, the transition section 3 and the heating section 2 are an integrated structure, and the shapes of the heat dissipation section 1, the transition section 3 and the heating section 2 are set shapes.
[0035] Specifically, the heat pipe composed of the heat dissipation section 1, the transition section 3 and the heating section 2 can be set to a specific shape according to the arrangement of the external chips, so as to dissipate heat for the arranged chips.
[0036] like Figure 1 As shown, the outer ends of the heat dissipation section 1 and the heating section 2 are both sealed by plugs 7.
[0037] Specifically, the plug 7 seals the two ends of the hollow cavity 5 to maintain a vacuum effect.
[0038] like Figure 1 As shown, the heat dissipation section 1 , the transition section 3 and the heating section 2 have a hollow cavity 5 therein.
[0039] Specifically, the interior of the hollow cavity 5 is vacuumed.
[0040] When the device is in use, the copper powder layer 4 is not added to the heat dissipation section 1, and the heat absorbed by the heating section 2 from the external chip is effectively and quickly transferred to the heat dissipation section 1 through the transition section 3. There is no copper powder layer 4 inside the heat dissipation section 1, and the heat is quickly transferred to the external heat sink, thereby increasing the heat dissipation of the overall structure of the device and achieving the best heat dissipation effect.
[0041] The foregoing is merely a list of specific embodiments of the present application, intended to enable those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but rather is intended to conform to the broadest scope consistent with the principles and novel features claimed herein.
Claims
1. A server uses a high-power semi-powder heat pipe, characterized in that: include: A heat dissipation section (1), wherein a transition section (3) is integrally formed at a heat entry point of the heat dissipation section (1), and a heating section (2) is integrally formed at a heat entry point of the transition section (3); The transition section (3) and the heating section (2) are internally sintered and provided with a copper powder layer (4).
2. A server using a high-power semi-powder heat pipe according to claim 1, characterized in that: The inner side walls of the heat dissipation section (1), the transition section (3) and the heating section (2) are all provided with a liquid absorption core (6).
3. The server according to claim 1 uses a high-power semi-powder heat pipe, characterized in that: The copper powder layer (4) is arranged on the inner side of the liquid wick (6).
4. The server according to claim 1 uses a high-power semi-powder heat pipe, characterized in that: The heat dissipation section (1), the transition section (3) and the heating section (2) are an integrated structure, and the shapes of the heat dissipation section (1), the transition section (3) and the heating section (2) are set shapes.
5. The server according to claim 1 uses a high-power semi-powder heat pipe, characterized in that: The outer ends of the heat dissipation section (1) and the heating section (2) are both sealed by plugs (7).
6. The server according to claim 1 uses a high-power semi-powder heat pipe, characterized in that: The heat dissipation section (1), the transition section (3) and the heating section (2) have a hollow cavity (5) inside.
7. The server according to claim 1 uses a high-power semi-powder heat pipe, characterized in that: The inner and outer side walls of the heat dissipation section (1) are smooth.
8. The server according to claim 1 uses a high-power semi-powder heat pipe, characterized in that: The heat dissipation section (1), the transition section (3) and the heating section (2) are all copper tubes.