Micro-fluidic chip surface modification auxiliary thermocompression bonding device

Abstract

The utility model discloses a micro-fluidic chip surface modification auxiliary thermocompression bonding device, comprising a main body assembly which comprises a bottom plate, a fixed plate fixed on the top surface of the bottom plate, and a cover plate covering the fixed plate; the lock catch assembly comprises a square block fixed to the surface of the fixing plate, a tooth groove formed in the side face of the square block, a rack meshed with the tooth groove, a vertical plate connected with the rack, a limiting buckle fixed to the side wall of the vertical plate, a plug pin connected with the vertical plate, a spring arranged on the plug pin in a sleeving mode, a limiting hole formed in the side end of the cover plate, and a round hole located in the limiting hole. The placing assembly comprises a pressure spring arranged on the top surface of the fixing plate, a tray connected to the top surface of the pressure spring, and a pressure sensor arranged on the bottom surface of the pressure spring. According to the utility model, through the mutual cooperation of the main body assembly and the lock catch assembly, during use, the hot-pressing bonding pressure is accurately controlled, the influence of temperature and pressure on the micro-channel is reduced, and the use stability of the bonding device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of manufacturing microfluidic chips, in particular to a surface modification auxiliary hot pressing bonding device for a microfluidic chip. Background Art

[0002] The principle of microfluidic chips is to precisely control and manipulate fluids within a micrometer-scale space. In the existing technology, the manufacturing equipment for the substrate and cover of microfluidic chips is becoming increasingly mature. Hot compression bonding is currently the most widely used bonding method due to its simple operation and high bonding strength. However, since it requires heating, the temperature can easily have some minor effects on the microchannels. Excessive pressure can also easily cause deformation of the microchannels. Utility Model Content

[0003] Therefore, the purpose of the present invention is to provide a microfluidic chip surface modification assisted hot pressing bonding device. Through the mutual cooperation of the main body component and the locking component, the hot pressing bonding pressure can be precisely controlled during use, the influence of temperature and pressure on the microchannel can be reduced, and the stability of the bonding device can be improved.

[0004] To solve the above technical problems, according to one aspect of the present invention, the present invention provides the following technical solution: a microfluidic chip surface modification assisted thermal compression bonding device, comprising:

[0005] A main body assembly, the main body assembly comprising a bottom plate, a fixing plate fixed to the top surface of the bottom plate, and a cover plate covering the fixing plate;

[0006] A lock assembly, the lock assembly comprising a square block fixed to the surface of the fixed plate, a tooth groove provided on the side of the square block, a rack engaged with the tooth groove, a vertical plate connected to the rack, a limit buckle fixed to the side wall of the vertical plate, a latch connected to the vertical plate, a spring sleeved on the latch, a limit hole provided on the side end of the cover plate, and a circular hole located within the limit hole;

[0007] A placement component includes a compression spring arranged on the top surface of the fixing plate, a tray connected to the top surface of the compression spring, and a pressure sensor arranged on the bottom surface of the compression spring.

[0008] As a preferred solution of the microfluidic chip surface modification assisted hot pressing bonding device described in the utility model, the main body component also includes a sleeve connected to the side wall of the cover plate, a concave frame fixed to the fixed plate, a long axis fitted with the sleeve, and a torsion spring fitted with the long axis.

[0009] As a preferred solution of the microfluidic chip surface modification assisted hot pressing bonding device described in the utility model, the limiting buckle and the limiting hole are fitted together, and the pin and the circular hole correspond to each other.

[0010] As a preferred solution of the microfluidic chip surface modification assisted hot pressing bonding device described in the utility model, the tray is used to place the microcontroller chip.

[0011] As a preferred solution of the microfluidic chip surface modification assisted hot compression bonding device described in the utility model, there are a plurality of compression springs, and the plurality of compression springs are evenly spaced and distributed on the bottom surface of the tray.

[0012] As a preferred solution of the microfluidic chip surface modification assisted hot pressing bonding device described in the utility model, there are two locking components, and the two locking components are symmetrically arranged at the midline position of the cover plate.

[0013] Compared with the prior art, the advantages of the present invention are:

[0014] By cooperating with the main assembly and the locking assembly, the hot pressing bonding pressure can be precisely controlled during use, reducing the impact of temperature and pressure on the microchannel and improving the stability of the bonding device.

[0015] During specific use, the user presses the limit buckle, and the limit buckle moves backward under the force, driving the pin to insert into the round hole, and the spring is compressed. At this time, the tooth groove and the rack are separated from each other, the rack loses its limit, and the torsion spring recovers its deformation, directly driving the sleeve to rotate along the long axis, thereby opening the cover. At this time, the user places the chip in the tray, and the compression spring provides elastic force. After placement, the user presses down the cover, and the torsion spring is deformed until the cover is fitted with the fixed plate. At this time, the user releases the limit buckle, and the spring recovers its deformation, directly pushing the vertical plate to move until the rack engages with the tooth groove, thereby locking the cover. Tighten, lock the cover and complete the pressure at the same time. The function of the tray is to allow the force provided by the compression spring to act better on the chip. Since the substrate of the chip is different from the size of the bottom film, this tray allows the force provided by the compression spring to cover the entire bottom surface of the bottom film, so that the force on the contact surface of the bottom film and the substrate can be more uniform. When using a compression spring, the existing pressure sensor can be used to detect the pressure provided to ensure that the deformation of the compression spring is constant during bonding, and the force provided is sufficient to complete the bonding, and the microfluidic chip will not be crushed or the bonding strength will not be insufficient due to excessive or insufficient pressure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below in conjunction with the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without inventive labor. Among them:

[0017] Figure 1 This is a first-perspective structural diagram of the present utility model;

[0018] Figure 2 This is a structural diagram from a second perspective of the present utility model;

[0019] Figure 3 This is an exploded structural diagram of the cover plate of the utility model;

[0020] Figure 4 This is a position structure diagram of the limiting hole of the utility model;

[0021] Figure 5 This is a structural diagram of the lock assembly of the utility model;

[0022] Figure 6 This is a structural diagram of the limiting buckle and the limiting hole of the utility model;

[0023] Figure 7 This is a structural diagram of the components placed in this utility model.

[0024] In the figure: 11, bottom plate; 12, fixed plate; 13, cover plate; 14, sleeve; 15, torsion spring; 16, long axis; 17, concave frame; 21, limit buckle; 22, vertical plate; 23, latch; 24, spring; 25, square block; 26, tooth groove; 27, rack; 28, limit hole; 29, round hole; 31, compression spring; 32, tray; 33, pressure sensor. DETAILED DESCRIPTION

[0025] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0026] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. People skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific implementation methods disclosed below.

[0027] Next, the present invention is described in detail with reference to schematic diagrams. For ease of illustration, cross-sectional views of device structures may be partially enlarged and not to scale when describing the embodiments of the present invention. Furthermore, the schematic diagrams are merely illustrative and should not limit the scope of protection of the present invention. Furthermore, in actual production, three-dimensional dimensions, including length, width, and depth, should be included.

[0028] In order to make the purpose, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0029] The utility model provides a microfluidic chip surface modification auxiliary hot pressing bonding device. Through the mutual cooperation of the provided main body component and the locking component, the hot pressing bonding pressure can be accurately controlled during use, the influence of temperature and pressure on the microchannel is reduced, and the stability of the bonding device is improved.

[0030] Figure 1-Figure 7 The figure shows the overall structure of an embodiment of a microfluidic chip surface modification auxiliary hot pressing bonding device of the present invention. Figure 1-7 , the main structure of this embodiment includes: a main body component, a locking component and a placement component;

[0031] The main assembly is used for installation and use with the lock assembly. Specifically, the main assembly includes a bottom plate 11, a fixing plate 12 fixed to the top surface of the bottom plate 11, and a cover plate 13 covering the fixing plate 12. The main assembly also includes a sleeve 14 connected to the side wall of the cover plate 13, a concave frame 17 fixed to the fixing plate 12, a long shaft 16 sleeved with the sleeve 14, and a torsion spring 15 sleeved with the long shaft 16.

[0032] During specific use, the lock assembly is installed and used based on the base plate 11, the fixing plate 12 and the cover plate 13, and the torsion spring 15 is deformed to provide power.

[0033] The lock assembly is used to achieve opening and closing and subsequent keying. Specifically, the lock assembly includes a square block 25 fixed to the surface of the fixed plate 12, a tooth groove 26 provided on the side of the square block 25, a rack 27 engaged with the tooth groove 26, a vertical plate 22 connected to the rack 27, a limit buckle 21 fixed to the side wall of the vertical plate 22, a latch 23 connected to the vertical plate 22, a spring 24 fitted on the latch 23, a limit hole 28 provided on the side end of the cover plate 13, and a circular hole 29 located in the limit hole 28;

[0034] During actual use, the user presses the limit buckle 21, and the limit buckle 21 moves backward under the force, driving the pin 23 to be inserted into the circular hole 29, and the spring 24 is compressed. At this time, the tooth groove 26 and the rack 27 are separated from each other, and the rack 27 loses its limit. The torsion spring 15 recovers its deformation and directly drives the sleeve 14 to rotate along the long axis 16, thereby opening the cover 13. The user presses down the cover 13, and the torsion spring 15 is deformed until the cover 13 is fitted with the fixed plate 12. At this time, the user releases the limit buckle 21, and the spring 24 recovers its deformation, directly pushing the vertical plate 22 to shift until the rack 27 engages with the tooth groove 26, thereby achieving the locking of the cover 13.

[0035] The placement component is used to cooperate to achieve precise control of pressure. Specifically, the placement component includes a compression spring 31 arranged on the top surface of the fixed plate 12, a tray 32 connected to the top surface of the compression spring 31, and a pressure sensor 33 arranged on the bottom surface of the compression spring 31;

[0036] During specific use, when the cover 13 is closed, pressure is applied to complete the pressure application. The function of the tray 32 is to allow the force provided by the compression spring 31 to better act on the chip. Since the chip substrate and the bottom film are of different sizes, this tray 32 allows the force provided by the compression spring 31 to cover the entire bottom surface of the bottom film, so that the force applied to the contact surface between the bottom film and the substrate can be more uniform. When using the compression spring 31, the existing pressure sensor 33 can be used to detect the pressure provided to ensure that the deformation of the compression spring 31 during bonding is constant and the force provided is sufficient to complete the bonding.

[0037] Working principle: the user presses the limit buckle 21, and the limit buckle 21 moves backward under the force, driving the pin 23 to insert into the circular hole 29, and the spring 24 is compressed. At this time, the tooth groove 26 and the rack 27 are separated from each other, and the rack 27 loses its limit. The torsion spring 15 recovers its deformation and directly drives the sleeve 14 to rotate along the long axis 16, thereby opening the cover 13. At this time, the user places the chip in the tray 32, and the compression spring 31 provides elastic force. After placement, the user presses down the cover 13. At this time, the torsion spring 15 is deformed until the cover 13 fits with the fixed plate 12. At this time, the user releases the limit buckle 21, and the spring 24 recovers its deformation, directly pushing the vertical plate 22 to shift until the rack 27 and The tooth grooves 26 are engaged to achieve the locking of the cover plate 13. The cover plate 13 is locked and the pressure is applied at the same time. The function of the tray 32 is to allow the force provided by the compression spring 31 to act better on the chip. Since the substrate of the chip is different from the size of the bottom film, this tray 32 allows the force provided by the compression spring 31 to cover the entire bottom surface of the bottom film, so that the force applied to the contact surface between the bottom film and the substrate can be more uniform. When using the compression spring 31, the existing pressure sensor 33 can be used to detect the pressure provided to ensure that the deformation of the compression spring 31 is constant during bonding, and the force provided is sufficient to complete the bonding, and the microfluidic chip will not be crushed or the bonding strength will not be insufficient due to excessive or insufficient pressure.

[0038] While the present invention has been described above with reference to specific embodiments, various modifications may be made and equivalent components may be substituted without departing from the scope of the present invention. In particular, as long as no structural conflicts exist, the various features of the embodiments disclosed herein may be combined with one another in any manner, and the omission of an exhaustive description of these combinations in this specification is solely for the sake of space and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions within the scope of the claims.

Claims

1. A microfluidic chip surface modification assisted thermal compression bonding device, characterized in that: include: A main body component, the main body component comprising a bottom plate (11), a fixing plate (12) fixed to the top surface of the bottom plate (11), and a cover plate (13) covering the fixing plate (12); A lock assembly, comprising a square block (25) fixed to the surface of the fixing plate (12), a tooth groove (26) provided on the side of the square block (25), a rack (27) meshed with the tooth groove (26), a vertical plate (22) connected to the rack (27), a limiting buckle (21) fixed to the side wall of the vertical plate (22), a latch (23) connected to the vertical plate (22), a spring (24) sleeved on the latch (23), a limiting hole (28) provided on the side end of the cover plate (13), and a circular hole (29) located in the limiting hole (28); A placement component comprises a compression spring (31) arranged on the top surface of the fixing plate (12), a tray (32) connected to the top surface of the compression spring (31), and a pressure sensor (33) arranged on the bottom surface of the compression spring (31).

2. A microfluidic chip surface modification assisted thermal compression bonding device according to claim 1, characterized in that: The main body assembly further comprises a sleeve (14) connected to the side wall of the cover plate (13), a concave frame (17) fixed to the fixing plate (12), a long shaft (16) sleeved with the sleeve (14), and a torsion spring (15) sleeved with the long shaft (16).

3. A microfluidic chip surface modification assisted thermal compression bonding device according to claim 2, characterized in that: The limiting buckle (21) and the limiting hole (28) are fitted together, and the latch (23) and the circular hole (29) correspond to each other.

4. A microfluidic chip surface modification assisted thermal compression bonding device according to claim 3, characterized in that: The tray (32) is used for placing the microcontroller chip.

5. A microfluidic chip surface modification assisted thermal compression bonding device according to claim 4, characterized in that: A plurality of compression springs (31) are provided, and the plurality of compression springs (31) are distributed at equal intervals on the bottom surface of the tray (32).

6. The microfluidic chip surface modification assisted thermal compression bonding device according to claim 5, characterized in that: Two locking components are provided, and the two locking components are symmetrically arranged at the midline position of the cover plate (13).

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