Electronic patch furnace-passing carrier

Abstract

The utility model provides an electronic paster furnace-passing carrier comprising a carrier frame, two symmetrically arranged guide rails are installed on the upper surface of the carrier frame, a plurality of sliding blocks are inserted in the guide rails, vertically arranged studs are installed on the upper surfaces of the sliding blocks, the upper ends of the studs extend to the upper sides of the guide rails, and the upper ends of the studs extend to the lower sides of the guide rails. The upper side of the guide rail is provided with a plurality of L-shaped plates in sliding contact with the guide rail, the horizontal part of each L-shaped plate is provided with a through hole, the stud penetrates through the through hole, the vertical part of each L-shaped plate is provided with a lifting part used for lifting the SMD electronic element inserted in the carrier frame, the upper side of the horizontal part of each L-shaped plate is provided with a lug plate, and the upper surface of each lug plate is provided with a round hole. The stud penetrates through the round hole, one end of the lug plate is fixedly connected with a pressing rod used for pressing the SMD electronic element, a nut is arranged on the upper side of the lug plate, and the nut is in threaded connection with the stud, and the SMD electronic element mounting and dismounting tool has the advantages that the use amount of fasteners is reduced, and the SMD electronic element mounting and dismounting efficiency is improved.

Description

Technical Field

[0001] The utility model relates to an electronic patch furnace carrier, belonging to the technical field of electronic components. Background Art

[0002] During the reflow soldering process of surface mount technology (SMT), the high temperatures inside the furnace can cause circuit board deformation or dislodge larger components, impacting the quality of the finished product. Therefore, using a reflow carrier to firmly support the PCB is crucial. This ensures the PCB maintains structural integrity during thermal stress. Reflow carriers are commonly used in reflow soldering. They hold surface-mount electronic components within a rectangular reflow carrier, facilitating the restraint of the components on all sides. Because the rectangular reflow carrier is open at both ends, multiple retaining members are installed on the top and bottom surfaces of the reflow carrier to confine the components within the carrier. To facilitate adjustment of the relative position of the retaining members and the components, screw fasteners are a common connection method. Because both the retaining members on the top and bottom surfaces of the reflow carrier require screws for position control, a high number of screw fasteners are required, impacting the efficient assembly and disassembly of SMT components. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide an electronic patch furnace carrier to solve the problems raised in the above background technology. The utility model reduces the use of fasteners and improves the efficiency of disassembly and assembly of patch electronic components.

[0004] In order to achieve the above-mentioned purpose, the present invention is realized through the following technical scheme: an electronic patch furnace carrier, including a carrier frame, the upper surface of the carrier frame is equipped with two symmetrically arranged guide rails, a plurality of sliders are inserted in the guide rails, and vertically arranged studs are installed on the upper surface of the sliders, and the upper ends of the studs extend to the upper sides of the guide rails, and the upper sides of the guide rails are provided with a plurality of L-shaped plates that are in sliding contact with the guide rails, the horizontal parts of the L-shaped plates are provided with through holes, and the studs pass through the through holes, and the vertical parts of the L-shaped plates are provided with a lifting part for lifting the patch electronic components inserted in the carrier frame, and the lifting part contacts the bottom of the carrier frame and the patch electronic components, and an ear plate is provided on the upper side of the horizontal part of the L-shaped plate, and a circular hole is provided on the upper surface of the ear plate, and the stud passes through the circular hole, and one end of the ear plate is connected and fixed with a pressure rod for pressing the patch electronic components, and a nut is provided on the upper side of the ear plate, and the nut is threadedly connected to the stud.

[0005] Furthermore, a support ring is provided on the lower side of the ear plate, the support ring is sleeved on the stud, and two support rods are installed on the lower surface of the support ring, and the lower ends of the support rods are in contact with the horizontal part of the L-shaped plate.

[0006] Furthermore, two blind holes are provided on the lower surface of the support ring, and the upper ends of the support rods are connected and fixed in the blind holes.

[0007] Furthermore, the upper surface of the slider is recessed downward to form a positioning hole, and the lower end of the stud is connected and fixed in the positioning hole.

[0008] Furthermore, a plurality of evenly arranged supports are connected and fixed to the bottom of the carrier frame, and the supports and the carrier frame are an integrally formed structure.

[0009] Furthermore, the lifting portion and the L-shaped plate are an integrally formed structure, and the lifting portion and the vertical portion of the L-shaped plate are perpendicular to each other.

[0010] Furthermore, a triangular plate is connected and fixed to one end of the ear plate close to the pressure rod, and the triangular plate is connected and fixed to the upper end of the pressure rod.

[0011] Beneficial effects of the utility model:

[0012] 1. Select an appropriate number of studs, lifting parts and pressure rods, insert the slider on the studs into the guide rail, complete the assembly of the studs and the carrier frame, adjust the position of the studs along the guide rail, and adjust the relative positions of the lifting part, pressure rod and carrier frame as needed. After the studs pass through the through holes and round holes, screw on the nuts, so that the fasteners formed by components such as studs and nuts can simultaneously limit the positions of the lifting part and pressure rod. There is no need to use separate fasteners to limit the relative positions of the lifting part and pressure rod, which reduces the use of fasteners and improves the efficiency of disassembly and assembly of chip electronic components.

[0013] 2. A support ring is set between the horizontal part of the L-shaped plate and the ear plate, and the stud passes through the support ring. At this time, under the restriction of the support rod, there is a gap between the support ring and the horizontal part of the L-shaped plate. When the nut and the stud are rusted due to high temperature and difficult to separate normally, the stud is cut off by using the gap between the support ring and the horizontal part of the L-shaped plate, which facilitates the recycling and reuse of components such as the L-shaped plate, pressure rod, and lifting part, reducing resource waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Other features, objects and advantages of the present invention will become more apparent from the detailed description of the non-limiting embodiments with reference to the following drawings:

[0015] Figure 1 This is a structural diagram of an electronic patch furnace carrier of the utility model;

[0016] Figure 2 This is a three-dimensional diagram from another perspective of an electronic patch furnace carrier of the present invention;

[0017] Figure 3 This is a schematic diagram of the assembly of the pressure rod, ear plate, L-shaped plate, lifting part, slider and stud in an electronic patch furnace carrier of the present invention;

[0018] Figure 4 This is a schematic diagram of the assembly of the lifting part and the L-shaped plate in an electronic patch furnace carrier of the present invention;

[0019] Figure 5 This is a schematic diagram of the assembly of the middle ear plate and the pressure rod of an electronic patch furnace carrier of the present invention;

[0020] Figure 6 This is a schematic diagram of the assembly of the support rod and the support ring in an electronic patch furnace carrier of the present invention;

[0021] In the figure: 1-carrier frame, 2-chip electronic component, 3-support, 4-guide rail, 5-L-shaped plate, 6-stud, 7-nut, 8-pressure rod, 9-ear plate, 10-lifting part, 11-support ring, 12-support rod, 13-slider, 14-through hole, 15-round hole. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0023] See also Figure 1-Figure 3 The utility model provides a technical solution: an electronic patch furnace carrier, including a carrier frame 1, a plurality of evenly arranged supports 3 are connected and fixed to the bottom of the carrier frame 1, the supports 3 and the carrier frame 1 are an integrally formed structure, and the supports 3 realize balanced support for the carrier frame 1, and two symmetrically arranged guide rails 4 are installed on the upper surface of the carrier frame 1, and a plurality of sliders 13 are inserted in the guide rails 4. Vertically arranged studs 6 are installed on the upper surface of the sliders 13, wherein the upper surface of the sliders 13 is recessed downward to form positioning holes, so that the lower ends of the studs 6 are connected and fixed in the positioning holes, thereby improving the stability of the connection between the studs 6 and the sliders 13, and the upper ends of the studs 6 extend to the upper side of the guide rails 4, so that the sliders 13 on the studs 6 are inserted in the guide rails 4, completing the assembly of the studs 6 and the carrier frame 1, and adjusting the position of the studs 6 along the guide rails 4 is convenient for adjusting the relative positions of the lifting portion 10, the pressure rod 8 and the carrier frame 1 as needed.

[0024] See Figure 1-Figure 5, a plurality of L-shaped plates 5 are provided on the upper side of the guide rail 4 in sliding contact with the guide rail 4, a through-hole 14 is provided on the horizontal portion of the L-shaped plate 5, and the stud 6 passes through the through-hole 14, and a lifting portion 10 is installed on the vertical portion of the L-shaped plate 5 for lifting the patch electronic component 2 inserted in the carrier frame 1, wherein the lifting portion 10 and the L-shaped plate 5 are an integrally formed structure and the lifting portion 10 and the vertical portion of the L-shaped plate 5 are perpendicular to each other, and the lifting portion 10 is in contact with the bottom of the carrier frame 1 and the patch electronic component 2, and an ear plate 9 is provided on the upper side of the horizontal portion of the L-shaped plate 5, and a circular hole 15 is provided on the upper surface of the ear plate 9, and the stud 6 passes through the circular hole 15, and one end of the ear plate 9 is connected to a fixed triangle plate, and the triangle plate is connected to the vertical portion for pressing the patch electronic component The upper end of the pressure rod 8 of the component 2 is connected and fixed, and a nut 7 is provided on the upper side of the ear plate 9. The nut 7 is threadedly connected to the stud 6. An appropriate number of studs 6, lifting parts 10 and pressure rods 8 are selected, so that the slider 13 on the stud 6 is inserted into the guide rail 4, so that the relative positions of the lifting part 10, the pressure rod 8 and the carrier frame 1 can be adjusted according to needs. After the stud 6 passes through the through hole 14 and the circular hole 15, the nut 7 is screwed on, so that the fasteners formed by the components such as the stud 6 and the nut 7 can simultaneously limit the positions of the lifting part 10 and the pressure rod 8. There is no need to use fasteners separately to limit the relative positions of the lifting part 10 and the pressure rod 8, which reduces the use of fasteners and improves the efficiency of disassembly and assembly of the chip electronic components 2.

[0025] See Figures 1-6 5 , a support ring 11 is provided on the lower side of the ear plate 9, and the support ring 11 is sleeved on the stud 6. Two support rods 12 are installed on the lower surface of the support ring 11, and the lower ends of the support rods 12 are in contact with the horizontal part of the L-shaped plate 5. Two blind holes are provided on the lower surface of the support ring 11, so that the upper ends of the support rods 12 are connected and fixed in the blind holes, thereby improving the stability of the connection between the support rods 12 and the support ring 11. A support ring 11 is provided between the horizontal part of the L-shaped plate 5 and the ear plate 9, and the stud 6 passes through the support ring 11. At this time, under the restriction of the support rod 12, there is a gap between the support ring 11 and the horizontal part of the L-shaped plate 5. When the nut 7 and the stud 6 are rusted due to high temperature and are difficult to separate normally, the distance between the support ring 11 and the horizontal part of the L-shaped plate 5 is used to cut off the stud 6, which is convenient for recycling and reuse of components such as the L-shaped plate 5, the pressure rod 8, and the lifting part 10, thereby reducing waste of resources.

[0026] Although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. An electronic patch furnace carrier, comprising a carrier frame (1), characterized in that: The upper surface of the carrier frame (1) is provided with two symmetrically arranged guide rails (4), a plurality of sliders (13) are inserted in the guide rails (4), the upper surface of the sliders (13) is provided with vertically arranged studs (6), the upper ends of the studs (6) extend to the upper side of the guide rails (4), the upper side of the guide rails (4) is provided with a plurality of L-shaped plates (5) in sliding contact with the guide rails (4), the horizontal portion of the L-shaped plates (5) is provided with through holes (14), the studs (6) pass through the through holes (14), and the vertical portion of the L-shaped plates (5) is provided with a screw thread for lifting the carrier frame ( 1), the lifting portion (10) of the chip electronic component (2) inserted in the carrier frame (1), the lifting portion (10) contacts the bottom of the carrier frame (1) and the chip electronic component (2), the upper side of the horizontal portion of the L-shaped plate (5) is provided with an ear plate (9), the upper surface of the ear plate (9) is provided with a circular hole (15), the stud (6) passes through the circular hole (15), one end of the ear plate (9) is connected and fixed with a pressure rod (8) for pressing the chip electronic component (2), the upper side of the ear plate (9) is provided with a nut (7), and the nut (7) is threadedly connected to the stud (6).

2. The electronic patch oven carrier according to claim 1, characterized in that: A support ring (11) is provided on the lower side of the ear plate (9), and the support ring (11) is sleeved on the stud (6). Two support rods (12) are installed on the lower surface of the support ring (11), and the lower ends of the support rods (12) are in contact with the horizontal part of the L-shaped plate (5).

3. The electronic patch oven carrier according to claim 2, characterized in that: Two blind holes are provided on the lower surface of the support ring (11), and the upper ends of the support rods (12) are connected and fixed in the blind holes.

4. The electronic patch oven carrier according to claim 1, characterized in that: The upper surface of the slider (13) is recessed downward to form a positioning hole, and the lower end of the stud (6) is connected and fixed in the positioning hole.

5. The electronic patch oven carrier according to claim 1, characterized in that: A plurality of evenly arranged supports (3) are connected and fixed to the bottom of the carrier frame (1); the supports (3) and the carrier frame (1) are an integrally formed structure.

6. The electronic patch oven carrier according to claim 1, characterized in that: The lifting portion (10) and the L-shaped plate (5) are an integrally formed structure, and the lifting portion (10) and the vertical portion of the L-shaped plate (5) are perpendicular to each other.

7. The electronic chip oven carrier according to claim 1, characterized in that: One end of the ear plate (9) close to the pressure rod (8) is connected and fixed with a triangular plate, and the triangular plate is connected and fixed to the upper end of the pressure rod (8).

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