Vapor chamber
By adopting the first, second and third capillary structures of metal powder sintered body in the heat spreader, the tolerance to external and internal pressure is enhanced, the expansion problem is solved, and the heat transfer characteristics and deformation resistance are improved.
Patent Information
- Application Number
- CN202390000223.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2022-02-28
- Filing Date
- 2023-02-28
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2033-02-28
AI Technical Summary
Existing vapor chambers tend to expand under high-temperature conditions, which reduces the working fluid flow and heat transfer characteristics and makes them unable to withstand both external and internal pressures.
The first, second and third capillary parts are composed of a sintered body containing metal powder. One end of the third capillary part is integrated with the first capillary part, and the other end is integrated with the second capillary part. The supporting part is composed of the third capillary part, and when viewed from above, the porosity of the capillary part at the part overlapping with the supporting part is smaller than that at the part not overlapping, thereby increasing the connection area to improve the integrity.
Improves the vapor chamber's tolerance to external and internal pressure, prevents expansion, and enhances heat transfer characteristics and deformation resistance.
Smart Images

Figure CN223345989U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a vapor chamber which has excellent tolerance not only to pressure from the external environment but also to pressure from inside the vapor chamber, thereby having excellent deformation resistance even when the temperature of the use environment rises. Background Art
[0002] Electronic components such as semiconductor elements mounted on electrical / electronic equipment have increased in heat generation due to their high-density mounting with high functionality, and cooling has become more important in recent years. In addition, heating elements such as electronic components are sometimes placed in a small space due to the miniaturization of electronic equipment. As a cooling mechanism for heating elements such as electronic components placed in a small space, a heat spreader (flat heat pipe) with a flat container is sometimes used.
[0003] In addition, from the perspective of miniaturization and lightweighting of the heat spreader, it is required to make the wall thickness of the container of the heat spreader thinner. On the other hand, since the interior of the container is decompressed, when the wall thickness of the container is thinned, the pressure from the external environment such as atmospheric pressure may cause the container to deform. If the container is deformed, the circulation characteristics of the working fluid may be reduced, which in turn may lead to a reduction in the heat transfer characteristics of the heat spreader. Therefore, inside the container of the heat spreader, in order to maintain the internal space of the container, a columnar support portion (pillar portion) is sometimes provided.
[0004] To maintain the internal space of a container against pressure from the external environment, a vapor chamber with a support portion provided inside the container has been proposed. The vapor chamber comprises: a capillary body disposed within a space sealed by an upper plate, a lower plate, and a plurality of side walls, connected to the upper and lower plates, and having a plurality of first capillary portions each having a straight portion; and a support column disposed within the space and connected to the upper and lower plates, the support column being spaced apart from the straight portion between adjacent ones of the plurality of first capillary portions (Patent Document 1). In Patent Document 1, the vapor chamber, because it includes the support column connected to the upper and lower plates, is resistant to pressure from the external environment, and a steam flow path can be ensured even if the thickness of the container is reduced.
[0005] On the other hand, vapor chambers are sometimes used in high-temperature environments (for example, above 100°C). Because a working fluid, such as water, is enclosed in the vapor chamber, when the ambient temperature rises, the pressure inside the vapor chamber may rise, causing the vapor chamber to expand. Expansion of the vapor chamber reduces the flow characteristics of the working fluid, degrading the heat transfer characteristics of the vapor chamber and sometimes reducing the thermal connection with the heat source being cooled.
[0006] Prior art literature
[0007] Patent Literature
[0008] Patent Document 1: International Publication No. 2017 / 104819 Utility Model Content
[0009] Problems to be solved by utility models
[0010] In view of the above situation, the purpose of the present invention is to provide a heat spreader that is not only resistant to pressure from the external environment, but also has excellent tolerance to pressure from inside the heat spreader, thereby preventing the heat spreader from expanding and thus having excellent deformation resistance even if the temperature of the use environment rises.
[0011] Means used to solve problems
[0012] The gist of the structure of the present invention is as follows.
[0013] [1] A vapor chamber, wherein:
[0014] have:
[0015] A container having a cavity formed therein and having a first surface thermally connected to the heat generating element and a second surface opposite to the first surface;
[0016] a first capillary portion, disposed on the first surface inside the container;
[0017] a second capillary portion, disposed on the second surface inside the container;
[0018] a supporting portion having a third capillary portion inside the container and protruding in a direction connecting the first surface and the second surface;
[0019] a working fluid sealed in the cavity; and
[0020] A steam flow path for circulating the working fluid in the gas phase and provided in the cavity portion,
[0021] One end of the third capillary portion is integrated with the first capillary portion, and the other end of the third capillary portion is integrated with the second capillary portion.
[0022] [2] The vapor chamber according to [1], wherein:
[0023] The porosity of the first capillary portion at a portion overlapping with the support portion in a plan view is smaller than the porosity of the first capillary portion at a portion not overlapping with the support portion in a plan view.
[0024] [3] The vapor chamber according to [1] or [2], wherein:
[0025] The porosity of the second capillary portion at a portion overlapping with the support portion in a plan view is smaller than the porosity of the second capillary portion at a portion not overlapping with the support portion in a plan view.
[0026] [4] The vapor chamber according to any one of [1] to [3], wherein
[0027] The first capillary portion, the second capillary portion, and the third capillary portion are sintered bodies containing powder of metal powder.
[0028] [5] The vapor chamber according to any one of [1] to [4], wherein
[0029] The supporting portion is formed by the third capillary portion.
[0030] [6] The vapor chamber according to any one of [1] to [5], wherein
[0031] The supporting portion is formed by a convex portion protruding from the first surface toward the cavity portion or a convex portion protruding from the second surface toward the cavity portion, and the third capillary portion covering a surface of the convex portion.
[0032] [7] The vapor chamber according to [6], wherein:
[0033] The convex portion is solid.
[0034] [8] The vapor chamber according to any one of [1] to [7], wherein
[0035] The porosity of the first capillary portion at a portion that does not overlap with the support portion in a plan view is smaller than the porosity of the second capillary portion at a portion that does not overlap with the support portion in a plan view.
[0036] [9] The vapor chamber according to any one of [1] to [8], wherein
[0037] The porosity of the first capillary portion at a portion that does not overlap with the supporting portion in a plan view is smaller than the porosity of the third capillary portion.
[0038]
[10] The vapor chamber according to any one of [1] to [9], wherein
[0039] The porosity of the third capillary portion is smaller than the porosity of the second capillary portion at a portion that does not overlap with the supporting portion in a plan view.
[0040]
[11] The vapor chamber according to any one of [1] to
[10] , wherein
[0041] The void ratio of the third capillary portion is different from the void ratio of the first capillary portion or the void ratio of the second capillary portion.
[0042]
[12] The vapor chamber according to any one of [1] to
[10] , wherein
[0043] The void ratio of the third capillary portion is different from the void ratio of the first capillary portion and different from the void ratio of the second capillary portion.
[0044] In the above embodiment, the first surface that is thermally connected to the heat generating element and the second surface that faces the first surface are the main surfaces of the container. "Top view" in the present invention refers to a state of viewing from a position facing the first surface that is the main surface of the container.
[0045] Effect of utility model
[0046] In the vapor chamber configuration of the present invention, one end of the third capillary portion of the support portion is integrated with the first capillary portion provided on the first surface, and the other end of the third capillary portion of the support portion is integrated with the second capillary portion provided on the second surface, thereby securing both the first and second surfaces of the container to the support portion. Therefore, the vapor chamber configuration of the present invention is not only highly resistant to pressure from the external environment, but also to pressure from within the vapor chamber, thereby preventing expansion of the vapor chamber. Consequently, a vapor chamber with excellent deformation resistance is achieved even when the temperature of the operating environment rises.
[0047] Furthermore, according to the vapor chamber configuration of the present invention, one end of the third capillary portion of the support portion is integrated with the first capillary portion provided on the first surface, and the other end of the third capillary portion of the support portion is integrated with the second capillary portion provided on the second surface. This prevents the formation of an interface between the capillary portion of the second surface and the capillary portion of the support portion, and also prevents the formation of an interface between the capillary portion of the first surface and the capillary portion of the support portion. Consequently, the backflow characteristics of the liquid-phase working fluid from the capillary portion of the second surface to the capillary portion of the support portion and the backflow characteristics of the liquid-phase working fluid from the capillary portion of the support portion to the capillary portion of the first surface are improved, thereby improving the heat transfer characteristics of the vapor chamber.
[0048] According to the heat spreader method of the present invention, the porosity of the first capillary portion at the portion overlapping with the support portion when viewed from above is smaller than the porosity of the first capillary portion at the portion not overlapping with the support portion when viewed from above. Thus, the connection area between the third capillary portion of the support portion and the first capillary portion can be increased. Therefore, the integrity between the third capillary portion and the first capillary portion is improved, thereby achieving better deformation resistance.
[0049] According to the heat spreader method of the present invention, the porosity of the second capillary portion at the portion overlapping with the support portion when viewed from above is smaller than the porosity of the second capillary portion at the portion not overlapping with the support portion when viewed from above. Thus, the connection area between the third capillary portion and the second capillary portion of the support portion can be increased. Therefore, the integrity between the third capillary portion and the second capillary portion is improved, thereby achieving better deformation resistance.
[0050] According to the heat spreader of the present invention, since the first capillary portion, the second capillary portion and the third capillary portion are sintered bodies containing metal powder, the integrity of the third capillary portion and the first capillary portion and the integrity of the third capillary portion and the second capillary portion are reliably improved.
[0051] According to the aspect of the vapor chamber of the present invention, the supporting portion is constituted by the third capillary portion, thereby further improving the backflow characteristics of the liquid-phase working fluid from the second capillary portion to the first capillary portion.
[0052] According to the heat spreader method of the present invention, the supporting portion is formed by a convex portion protruding from the first surface toward the cavity portion or a convex portion protruding from the second surface toward the cavity portion, and the third capillary portion covering the surface of the convex portion. Thus, the reflux characteristics of the liquid working fluid from the second capillary portion to the first capillary portion can be improved, and the deformation resistance of the heat spreader can be further improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0053] Figure 1 This is a perspective view illustrating an outline of a heat spreader according to the first embodiment of the present invention.
[0054] Figure 2 This is a side cross-sectional view schematically illustrating the internal structure of the heat spreader according to the first embodiment of the present invention.
[0055] Figure 3 It is an explanatory diagram showing the reflow of the liquid-phase working fluid in the heat spreader according to the first embodiment of the present invention.
[0056] Figure 4 This is a side cross-sectional view schematically illustrating the internal structure of a heat spreader according to a second embodiment of the present invention.
[0057] Figure 5 This is a side cross-sectional view schematically illustrating the internal structure of a heat spreader according to a third embodiment of the present invention.
[0058] Figure 6This is a side cross-sectional view schematically illustrating the internal structure of a heat spreader according to a fourth embodiment of the present invention.
[0059] Figure 7 This is a side cross-sectional view schematically illustrating the internal structure of a heat spreader according to a fifth embodiment of the present invention. DETAILED DESCRIPTION
[0060] Hereinafter, a vapor chamber according to the present invention will be described. First, a vapor chamber according to a first embodiment of the present invention will be described with reference to the drawings. Figure 1 This is a perspective view illustrating an outline of a heat spreader according to the first embodiment of the present invention. Figure 2 This is a side cross-sectional view schematically illustrating the internal structure of the heat spreader according to the first embodiment of the present invention. Figure 3 This is an explanatory diagram showing the backflow of the liquid phase working fluid in the heat spreader according to the first embodiment of the present invention.
[0061] like Figure 1 As shown, a first embodiment of the present invention includes a heat spreader 1 having a container 10 with a cavity formed therein by overlapping two opposing plate-like bodies: a plate-like body 11 and a plate-like body 12 opposing the plate-like body 11. Container 10 is in the shape of a thin plate, and therefore is a flat container. One plate-like body 11 has a first surface 21 serving as a first principal surface, and the other plate-like body 12 has a second surface 22 serving as a second principal surface. Thus, container 10 has first surface 21 serving as a first principal surface, and second surface 22 serving as a second principal surface opposing first surface 21.
[0062] For ease of explanation, the top view of the vapor chamber 1 is a quadrilateral. The top view shape of the vapor chamber 1 is not particularly limited, and examples thereof include a shape having a curved portion, a shape having a recessed portion, a shape having a protruding portion, a polygon other than a quadrilateral, a circular shape, an elliptical shape, a straight portion, and a curved portion.
[0063] like Figure 2As shown, the heat spreader 1 comprises: a container 10, in which a cavity 13 is formed internally by overlapping a plate-like body 11 and another plate-like body 12 opposite to the plate-like body 11, and the container 10 has a first surface 21 thermally connected to the heating element 100 and a second surface 22 opposite to the first surface 21; a working fluid (not shown) sealed in the cavity 13; and a steam flow path 15 for circulating the working fluid in the gas phase, which is provided in the cavity 13. The cavity 13, which is the internal space of the container 10, is a closed space that has been depressurized by a degassing process. The heating element 100 is thermally connected to the outer surface of the first surface 21.
[0064] In the vapor chamber 1, a capillary structure 30 is provided in the cavity 13. The capillary structure 30 is a member that exerts capillary force. The capillary structure 30 includes a first capillary portion 31 provided on the first surface 21 inside the container 10, a second capillary portion 32 provided on the second surface 22 inside the container 10, and a third capillary portion 33 protruding from the container 10 in a direction connecting the first surface 21 and the second surface 22.
[0065] The first capillary portion 31 is provided on the inner surface of the first face 21 and extends substantially entirely along the inner surface of the first face 21. The second capillary portion 32 is provided on the inner surface of the second face 22 and extends substantially entirely along the inner surface of the second face 22.
[0066] In the vapor chamber 1, the third capillary section 33 serves as the support portion 23 for maintaining the internal space of the container 10. Furthermore, the third capillary section 33 also serves as a member for returning the liquid working fluid from the second capillary section 32 to the first capillary section 31. The third capillary section 33, also serving as a support portion, has the function of maintaining the internal space of the container 10, namely, the cavity 13, under reduced pressure.
[0067] The support portion 23 has a third capillary portion 33. In the vapor chamber 1, the support portion 23 is composed of the third capillary portion 33. The third capillary portion 33 is a columnar member extending along the thickness direction of the container 10 when viewed from the side. Furthermore, in the vapor chamber 1, the third capillary portion 33 is a member extending from the second capillary portion 32 toward the first capillary portion 31. The third capillary portion 33 is composed of a plurality of columnar members when viewed from the side. The third capillary portion 33 is a structure in which a plurality of columnar members when viewed from the side are arranged side by side at predetermined intervals along the main surface of the container 10. In the vapor chamber 1, the space between the third capillary portions 33 serves as a vapor flow path 15 through which the working fluid of the gas phase flows.
[0068] like Figure 2As shown, one end 41 of the third capillary portion 33 extends to the first capillary portion 31 and is integrated with the first capillary portion 31. In the vapor chamber 1, one end 41 of the third capillary portion 33 is bonded to the first capillary portion 31, thereby integrating the third capillary portion 33 with the first capillary portion 31. Furthermore, the other end 42 of the third capillary portion 33 extends to the second capillary portion 32 and is integrated with the second capillary portion 32. In the vapor chamber 1, the third capillary portion 33 is integrally formed with the second capillary portion 32, thereby integrating the third capillary portion 33 with the second capillary portion 32.
[0069] In the vapor chamber 1 , the porosity of the first capillary portion 31 at a portion 34 overlapping the support portion 23 in a plan view is smaller than the porosity of the first capillary portion 31 at a portion 35 not overlapping the support portion 23 in a plan view.
[0070] The materials of the first capillary portion 31, the second capillary portion 32, and the third capillary portion 33 are not particularly limited as long as they exhibit capillary force. However, in the vapor chamber 1, the first capillary portion 31, the second capillary portion 32, and the third capillary portion 33 are all sintered bodies made from a powder containing metal powder having a predetermined average particle size. A sintered body made from a powder containing metal powder is a porous member. Examples of sintered bodies containing metal powder include sintered bodies of metal powders such as copper powder and stainless steel powder, and sintered bodies of mixed powders of metal powders such as copper powder and carbon powder. The entire first capillary portion 31 is a sintered body formed from the same powder raw material, and the entire second capillary portion 32 is a sintered body formed from the same powder raw material. Furthermore, the third capillary portion 33 is a sintered body formed from the same powder raw material from one end 41 to the other end 42.
[0071] In the vapor chamber 1, the powder raw material of the third capillary portion 33 is different from the powder raw material of the first capillary portion 31, and the sintered body constituting the third capillary portion 33 has a different structure from the sintered body constituting the first capillary portion 31. Furthermore, the porosity of the third capillary portion 33 is different from the porosity of the first capillary portion 31. Furthermore, in the vapor chamber 1, the powder raw material of the third capillary portion 33 is the same as the powder raw material of the second capillary portion 32, and the sintered body constituting the third capillary portion 33 has a substantially similar structure to the sintered body constituting the second capillary portion 32. Furthermore, the porosity of the third capillary portion 33 is substantially the same as the porosity of the second capillary portion 32.
[0072] The capillary forces of the first capillary portion 31, the second capillary portion 32, and the third capillary portion 33 are not particularly limited. However, in the vapor chamber 1, the capillary force of the first capillary portion 31 is greater than the capillary force of the second capillary portion 32. Specifically, in the vapor chamber 1, the porosity of the first capillary portion 31 at a portion 35 that does not overlap with the support portion 23 (i.e., the third capillary portion 33) when viewed from above is smaller than the porosity of the second capillary portion 32 at a portion 37 that does not overlap with the support portion 23 (i.e., the third capillary portion 33) when viewed from above. Consequently, the capillary force of the first capillary portion 31 is greater than the capillary force of the second capillary portion 32. In addition, in the heat spreader 1, the porosity at a portion 37 of the second capillary portion 32 that does not overlap with the support portion 23 when viewed from above is approximately the same as the porosity at a portion 36 of the second capillary portion 32 that overlaps with the support portion 23 when viewed from above, and the second capillary portion 32 as a whole has approximately the same capillary force.
[0073] Furthermore, in the vapor chamber 1, the capillary force of the first capillary portion 31 is greater than the capillary force of the third capillary portion 33. Specifically, in the vapor chamber 1, the porosity of the first capillary portion 31 at a portion 35 that does not overlap with the support portion 23 when viewed from above is smaller than the porosity of the third capillary portion 33, resulting in a greater capillary force in the first capillary portion 31 than in the third capillary portion 33.
[0074] Furthermore, as described above, since the porosity of the third capillary portion 33 is substantially the same as the porosity of the second capillary portion 32 , the capillary force of the third capillary portion 33 is substantially the same as the capillary force of the second capillary portion 32 .
[0075] The porosity and capillary force of a sintered body containing metal powder can be adjusted by appropriately setting the average particle size of the powder raw material. Reducing the average particle size of the powder raw material can reduce the porosity of the sintered body containing metal powder, thereby increasing the capillary force of the sintered body. Conversely, increasing the average particle size of the powder raw material can increase the porosity of the sintered body containing metal powder, thereby decreasing the capillary force of the sintered body.
[0076] The steam flow path 15 is an internal space of the container 10 and extends throughout the container 10 . Therefore, the working fluid in a gaseous phase can flow throughout the container 10 through the steam flow path 15 .
[0077] The material of the container 10 is not particularly limited, and examples thereof include copper, copper alloys, aluminum, aluminum alloys, tin, tin alloys, titanium, titanium alloys, nickel, and nickel alloys. Furthermore, the working fluid enclosed within the container 10 can be appropriately selected depending on the material of the container 10, and examples thereof include water, freon substitutes, perfluorocarbons, cyclopentane, ethylene glycol, and mixtures thereof with water.
[0078] Next, an example method for manufacturing the vapor chamber 1 according to the first embodiment will be described. First, a powder containing metal powder with a predetermined average particle size is applied to the inner surface of one plate-like body 11 and then sintered to form a sintered body serving as the first capillary portion 31. Simultaneously, a powder containing metal powder with a predetermined average particle size is applied to the inner surface of another plate-like body 12 and then sintered to form a sintered body integrally formed with the third capillary portion 33 and the second capillary portion 32. Then, by overlapping one plate-like body 11 and the other plate-like body 12 with the tip of the third capillary portion 33 facing the first capillary portion 31 and sintering them, the third capillary portion 33 is bonded and integrated with the first capillary portion 31, thereby manufacturing the vapor chamber 1. In the manufacture of the heat spreader 1, when the height of the third capillary portion 33 based on the inner surface of the other plate-like body 12 is slightly higher than the dimension obtained by subtracting the thickness of the first capillary portion 31 from the thickness of the cavity portion 13, the porosity of the first capillary portion 31 at a portion 34 of the first capillary portion 31 that overlaps with the support portion 23 when viewed from above is smaller than the porosity of the first capillary portion 31 at a portion 35 that does not overlap with the support portion 23 when viewed from above.
[0079] Next, the operation of the heat spreader 1 involved in the first embodiment of the present invention is described. In the container 10, the heating element 100 is thermally connected to the outer surface of the first surface 21, the first surface 21 functions as a heating surface, and the portion of the outer surface of the first surface 21 that is in contact with the heating element 100 functions as a heating portion. When the heat spreader 1 is heated from the heating element 100 in the heating portion, the liquid-phase working fluid sealed in the cavity portion 13 undergoes a phase change from the liquid phase to the gas phase in the heating portion, and the gas-phase working fluid after the phase change circulates in the steam flow path 15 and diffuses from the heating portion of the heat spreader 1 to the entire cavity portion 13. The gas-phase working fluid diffused from the heating portion to the entire cavity portion 13 releases latent heat, thereby undergoing a phase change from the gas phase to the liquid phase. At this time, the released latent heat is released from the entire container 10 to the external environment of the heat spreader 1. The working fluid that changes from the gas phase to the liquid phase flows back from the second capillary portion 32 to the first capillary portion 31 via the third capillary portion 33. In addition, the liquid phase working fluid in the first capillary portion 31 flows back from the entire first capillary portion 31 to the portion of the first capillary portion 31 corresponding to the heat receiving portion due to the capillary force of the first capillary portion 31.
[0080] In vapor chamber 1, one end 41 of the third capillary portion 33 of the support portion 23 is integrated with the first capillary portion 31 provided on the first surface 21, and the other end 42 of the third capillary portion 33 of the support portion 23 is integrated with the second capillary portion 32 provided on the second surface 22. As a result, both the first surface 21 and the second surface 22 of the container 10 are fixed to the support portion 23. Therefore, vapor chamber 1 is not only highly resistant to pressure from the external environment, such as atmospheric pressure, but also to pressure from within vapor chamber 1. Therefore, even if the operating environment temperature rises, promoting the vaporization of the working fluid, vapor chamber 1 is prevented from expanding and exhibits excellent deformation resistance.
[0081] In addition, if Figure 3 As shown, one end 41 of the third capillary portion 33 of the support portion 23 is integrated with the first capillary portion 31 provided on the first surface, thereby preventing the formation of an interface between the first capillary portion 31 and the third capillary portion 33. Furthermore, the other end 42 of the third capillary portion 33 of the support portion 23 is integrated with the second capillary portion 32 provided on the second surface, thereby preventing the formation of an interface between the second capillary portion 32 and the third capillary portion 33. Consequently, the backflow characteristics of the liquid-phase working fluid L from the second capillary portion 32 to the third capillary portion 33 and the backflow characteristics of the liquid-phase working fluid L from the third capillary portion 33 to the first capillary portion 31 are improved, thereby enhancing the heat transfer characteristics of the vapor chamber 1.
[0082] In addition, in the heat spreader 1, the porosity of the first capillary portion 31 at a portion 34 that overlaps with the third capillary portion 33 serving as the support portion 23 when viewed from above is smaller than the porosity of the first capillary portion 31 at a portion 35 that does not overlap with the third capillary portion 33 serving as the support portion 23 when viewed from above. As a result, the connection area between the third capillary portion 33 and the first capillary portion 31 is increased, thereby improving the integrity between the third capillary portion 33 and the first capillary portion 31 and achieving better deformation resistance.
[0083] In addition, in the heat spreader 1, since the first capillary portion 31, the second capillary portion 32 and the third capillary portion 33 are all sintered bodies containing metal powder, the integrity of the third capillary portion 33 and the first capillary portion 31 and the integrity of the third capillary portion 33 and the second capillary portion 32 can be reliably improved.
[0084] Furthermore, in the heat spreader 1 , since the support portion 23 is formed of the third capillary portion 33 , the backflow characteristics of the liquid-phase working fluid from the second capillary portion 32 to the first capillary portion 31 can be further improved.
[0085] Next, a vapor chamber according to a second embodiment of the present invention will be described in detail. The vapor chamber according to the second embodiment has the same main components as the vapor chamber according to the first embodiment, and thus the same components as those of the vapor chamber according to the first embodiment are described using the same reference numerals. Figure 4 This is a side cross-sectional view schematically illustrating the internal structure of a heat spreader according to a second embodiment of the present invention.
[0086] In the heat spreader 1 according to the first embodiment, one end 41 of the third capillary portion 33 is joined to the first capillary portion 31, thereby integrating the third capillary portion 33 and the first capillary portion 31. Figure 4 As shown, in the heat spreader 2 according to the second embodiment, the third capillary portion 33 is integrally formed with the first capillary portion 31 provided on the first surface 21 thermally connected to the heat generating element 100, thereby integrating the third capillary portion 33 with the first capillary portion 31. In addition, in the heat spreader 1 according to the first embodiment, the third capillary portion 33 is integrally formed with the second capillary portion 32, thereby integrating the third capillary portion 33 with the second capillary portion 32. However, as shown in FIG. Figure 4 As shown, in the heat spreader 2 according to the second embodiment, the other end 42 of the third capillary portion 33 is bonded to the second capillary portion 32 on the second surface 22 , whereby the third capillary portion 33 and the second capillary portion 32 are integrated.
[0087] In the vapor chamber 2 , the porosity of the second capillary portion 32 at a portion 36 overlapping the support portion 23 in a plan view is smaller than the porosity of the second capillary portion 32 at a portion 37 not overlapping the support portion 23 in a plan view.
[0088] In the vapor chamber 1 according to the first embodiment, the porosity of the third capillary portion 33 is approximately the same as that of the second capillary portion 32. However, in the vapor chamber 2, the porosity of the third capillary portion 33 is different from that of the second capillary portion 32. The powder raw material of the third capillary portion 33 is different from that of the second capillary portion 32, and the sintered body constituting the third capillary portion 33 has a different structure from that of the second capillary portion 32. Furthermore, in the vapor chamber 2, the powder raw material of the third capillary portion 33 is the same as that of the first capillary portion 31, and the sintered body constituting the third capillary portion 33 has a structure approximately the same as that of the first capillary portion 31. Furthermore, the porosity of the third capillary portion 33 is approximately the same as that of the first capillary portion 31. Consequently, the capillary force of the third capillary portion 33 is approximately the same as that of the first capillary portion 31.
[0089] In the vapor chamber 2, the porosity of the third capillary portion 33 is lower than the porosity of the second capillary portion 32 at a portion 37 that does not overlap with the support portion 23 when viewed from above. Consequently, the capillary force of the third capillary portion 33 is greater than the capillary force of the second capillary portion 32 at a portion 37 that does not overlap with the support portion 23 when viewed from above.
[0090] In the heat spreader 2, one end 41 of the support portion 23 is integrated with the first capillary portion 31 provided on the first surface 21, and the other end 42 of the support portion 23 is integrated with the second capillary portion 32 provided on the second surface 22. As a result, the heat spreader 2 not only has tolerance to pressure from the external environment such as atmospheric pressure, but also has excellent tolerance to pressure from the inside of the heat spreader 2. Therefore, even if the temperature of the operating environment rises and promotes the vaporization of the working fluid, the heat spreader 2 can be prevented from expanding, thereby achieving excellent deformation resistance.
[0091] In addition, in the heat spreader 2, the formation of an interface between the first capillary portion 31 and the third capillary portion 33 is prevented, and the formation of an interface between the second capillary portion 32 and the third capillary portion 33 is prevented. Therefore, the backflow characteristics of the liquid-phase working fluid from the second capillary portion 32 to the third capillary portion 33 and the backflow characteristics of the liquid-phase working fluid from the third capillary portion 33 to the first capillary portion 31 are improved, thereby improving the heat transfer characteristics of the heat spreader 2.
[0092] In addition, in the heat spreader 2, the porosity of the second capillary portion 32 at the portion 36 that overlaps with the support portion 23 when viewed from above is smaller than the porosity of the second capillary portion 32 at the portion 37 that does not overlap with the support portion 23 when viewed from above. Thus, the connection area between the third capillary portion 33 of the support portion 23 and the second capillary portion 32 is increased, thereby improving the integrity between the third capillary portion 33 and the second capillary portion 32, thereby achieving better deformation resistance.
[0093] Next, a vapor chamber according to a third embodiment of the present invention will be described in detail. The vapor chamber according to the third embodiment shares the same primary structural components as those of the first and second embodiments. Therefore, the same structural components as those of the first and second embodiments are described using the same reference numerals. Figure 5 This is a side cross-sectional view schematically illustrating the internal structure of a heat spreader according to a third embodiment of the present invention.
[0094] like Figure 5As shown, in the vapor chamber 3 according to the third embodiment, one end 41 of the third capillary portion 33 is bonded to the first capillary portion 31 on the first surface 21, thereby integrating the third capillary portion 33 with the first capillary portion 31. The other end 42 of the third capillary portion 33 is bonded to the second capillary portion 32 on the second surface 22, thereby integrating the third capillary portion 33 with the second capillary portion 32. In the vapor chamber 3, the third capillary portion 33 is not integrally formed with either the first capillary portion 31 or the second capillary portion 32.
[0095] In the vapor chamber 3, the porosity of the first capillary section 31 at a portion 34 of the first capillary section 31 that overlaps with the support portion 23 when viewed from above is lower than the porosity of the first capillary section 31 at a portion 35 that does not overlap with the support portion 23 when viewed from above. Furthermore, the porosity of the second capillary section 32 at a portion 36 of the second capillary section 32 that overlaps with the support portion 23 when viewed from above is lower than the porosity of the second capillary section 32 at a portion 37 that does not overlap with the support portion 23 when viewed from above.
[0096] In the vapor chamber 3, the porosity of the third capillary section 33 is different from that of the first capillary section 31 and from that of the second capillary section 32. The powder raw materials of the first capillary section 31, the second capillary section 32, and the third capillary section 33 are different from each other, and the sintered bodies constituting the first capillary section 31, the second capillary section 32, and the third capillary section 33 have different structures. In the vapor chamber 3, the porosity of the first capillary section 31 is smaller than that of the third capillary section 33, and the porosity of the third capillary section 33 is smaller than that of the second capillary section 32. Consequently, in the vapor chamber 3, the capillary force of the first capillary section 31 is greater than that of the third capillary section 33, and the capillary force of the third capillary section 33 is greater than that of the second capillary section 32.
[0097] In the heat spreader 3, one end 41 of the support portion 23 is integrated with the first capillary portion 31 provided on the first surface 21, and the other end 42 of the support portion 23 is integrated with the second capillary portion 32 provided on the second surface 22. As a result, the heat spreader 3 not only has tolerance to pressure from the external environment such as atmospheric pressure, but also has excellent tolerance to pressure from the inside of the heat spreader 3. Therefore, even if the temperature of the operating environment rises and promotes the vaporization of the working fluid, the heat spreader 3 can be prevented from expanding, thereby achieving excellent deformation resistance.
[0098] In addition, in the heat spreader 3, the formation of an interface between the first capillary portion 31 and the third capillary portion 33 is prevented, and the formation of an interface between the second capillary portion 32 and the third capillary portion 33 is prevented. Therefore, the backflow characteristics of the liquid-phase working fluid from the second capillary portion 32 to the third capillary portion 33 and the backflow characteristics of the liquid-phase working fluid from the third capillary portion 33 to the first capillary portion 31 are improved, thereby improving the heat transfer characteristics of the heat spreader 3.
[0099] Next, a detailed description will be given of the heat spreader according to the fourth embodiment of the present invention. Since the heat spreader according to the fourth embodiment has the same major structural components as those of the first to third embodiments, the same reference numerals will be used for the structural components that are identical to those of the first to third embodiments. Figure 6 This is a side cross-sectional view schematically illustrating the internal structure of a heat spreader according to a fourth embodiment of the present invention.
[0100] In the heat spreader 1 according to the first embodiment, the support portion 23 is formed by the third capillary portion 33, but instead, as shown in FIG. Figure 6 As shown, in the heat spreader 4 according to the fourth embodiment, the support portion 23 is formed by a convex portion 50 that protrudes from the second surface 22 toward the cavity 13 and a third capillary portion 33 that covers the surface of the convex portion 50. The convex portion 50 is formed on the second surface 22 and protrudes from the second surface 22 toward the first surface 21. The convex portion 50 is a solid metal member. The metal member of the convex portion 50 can be the same as that of the container 10.
[0101] The convex portion 50 may be formed integrally with the second surface 22 or may be a member different from the second surface 22. In the heat spreader 4, the convex portion 50 is formed integrally with the second surface 22.
[0102] Since the third capillary portion 33 at one end 41 of the support portion 23 is joined to the first capillary portion 31, the third capillary portion 33 is integrated with the first capillary portion 31. Furthermore, since the third capillary portion 33 is integrally formed with the second capillary portion 32, the third capillary portion 33 is integrated with the second capillary portion 32.
[0103] In the heat spreader 4, one end 41 of the support portion 23 is integrated with the first capillary portion 31 provided on the first surface 21, and the other end 42 of the support portion 23 is integrated with the second capillary portion 32 provided on the second surface 22. As a result, the heat spreader 4 not only has tolerance to pressure from the external environment such as atmospheric pressure, but also has excellent tolerance to pressure from the inside of the heat spreader 4. Therefore, even if the temperature of the operating environment rises and promotes the vaporization of the working fluid, the heat spreader 4 can be prevented from expanding and can exhibit excellent deformation resistance.
[0104] In addition, in the heat spreader 4, the formation of an interface between the first capillary portion 31 and the third capillary portion 33 is prevented, and the formation of an interface between the second capillary portion 32 and the third capillary portion 33 is prevented. Therefore, the backflow characteristics of the liquid-phase working fluid from the second capillary portion 32 to the third capillary portion 33 and the backflow characteristics of the liquid-phase working fluid from the third capillary portion 33 to the first capillary portion 31 are improved, thereby improving the heat transfer characteristics of the heat spreader 4.
[0105] In addition, in the heat spreader 4, since the support portion 23 is formed by a convex portion 50 protruding from the second surface 22 toward the cavity portion 13 and a third capillary portion 33 covering the surface of the convex portion 50, it is possible to further improve the deformation resistance of the heat spreader 4 while improving the reflux characteristics of the liquid working fluid from the second capillary portion 32 to the first capillary portion 31.
[0106] Next, a fifth embodiment of the present invention will be described in detail. The fifth embodiment has the same major structural components as the first to fourth embodiments, and therefore, the same structural components as those of the first to fourth embodiments are described using the same reference numerals. Figure 7 This is a side cross-sectional view schematically illustrating the internal structure of a heat spreader according to a fifth embodiment of the present invention.
[0107] In the second embodiment of the heat spreader 2, the support portion 23 is composed of the third capillary portion 33, but instead, as shown in FIG. Figure 7 As shown, in the heat spreader 5 according to the fifth embodiment, the support portion 23 is formed by a convex portion 51 that protrudes from the first surface 21 toward the cavity 13, and a third capillary portion 33 that covers the surface of the convex portion 51. The convex portion 51 is formed on the first surface 21 and protrudes from the first surface 21 toward the second surface 22. The convex portion 51 is a solid metal member. The metal member of the convex portion 51 can be the same as that of the container 10.
[0108] The convex portion 51 may be formed integrally with the first surface 21 or may be a member separate from the first surface 21. In the heat spreader 5, the convex portion 51 is a member separate from the first surface 21.
[0109] Since the third capillary portion 33 located at the other end 42 of the support portion 23 is joined to the second capillary portion 32, the third capillary portion 33 is integrated with the second capillary portion 31. Furthermore, since the third capillary portion 33 is integrally formed with the first capillary portion 31, the third capillary portion 33 is integrated with the first capillary portion 31.
[0110] In the heat spreader 5, one end 41 of the support portion 23 is integrated with the first capillary portion 31 provided on the first surface 21, and the other end 42 of the support portion 23 is integrated with the second capillary portion 32 provided on the second surface 22. As a result, the heat spreader 5 not only has tolerance to pressure from the external environment such as atmospheric pressure, but also has excellent tolerance to pressure from the inside of the heat spreader 5. Therefore, even if the temperature of the operating environment rises and promotes the vaporization of the working fluid, the heat spreader 5 can be prevented from expanding and can exhibit excellent deformation resistance.
[0111] In addition, in the heat spreader 5, the formation of an interface between the first capillary portion 31 and the third capillary portion 33 is prevented, and the formation of an interface between the second capillary portion 32 and the third capillary portion 33 is prevented. Therefore, the backflow characteristics of the liquid-phase working fluid from the second capillary portion 32 to the third capillary portion 33 and the backflow characteristics of the liquid-phase working fluid from the third capillary portion 33 to the first capillary portion 31 are improved, thereby improving the heat transfer characteristics of the heat spreader 5.
[0112] In addition, in the heat spreader 5, since the support portion 23 is formed by the convex portion 51 protruding from the first surface 21 toward the cavity portion 13 and the third capillary portion 33 covering the surface of the convex portion 51, it is possible to further improve the deformation resistance of the heat spreader 5 while improving the reflux characteristics of the liquid working fluid from the second capillary portion 32 to the first capillary portion 31.
[0113] Industrial applicability
[0114] The heat spreader of the present invention is not only resistant to pressure from the external environment, but also has excellent tolerance to pressure from inside the heat spreader, thereby preventing the heat spreader from expanding. Therefore, it has high utilization value in the field of cooling heating elements set in an environment with high ambient gas temperature.
[0115] Description of reference numerals:
[0116] 1, 2, 3, 4, 5 heat sinks
[0117] 10 containers
[0118] 13 cavity
[0119] 15 Steam flow path
[0120] 21 Page 1
[0121] 22 Side 2
[0122] 23 support part
[0123] 31 First capillary
[0124] 32 Second capillary
[0125] 33 Third capillary
[0126] 41 end
[0127] 42 The other end
Claims
1. A vapor chamber, wherein: have: A container having a cavity formed therein and having a first surface thermally connected to the heat generating element and a second surface opposite to the first surface; a first capillary portion, disposed on the first surface inside the container; a second capillary portion, disposed on the second surface inside the container; a supporting portion having a third capillary portion inside the container and protruding in a direction connecting the first surface and the second surface; A working fluid is sealed in the cavity; as well as A steam flow path for circulating the working fluid in the gas phase and provided in the cavity portion, One end of the third capillary portion is integrated with the first capillary portion, and the other end of the third capillary portion is integrated with the second capillary portion, whereby the first surface and the second surface of the container are fixed to the support portion. The porosity of the first capillary portion at a portion overlapping with the support portion in a plan view is smaller than the porosity of the first capillary portion at a portion not overlapping with the support portion in a plan view.
2. A vapor chamber, wherein: have: A container having a cavity formed therein and having a first surface thermally connected to the heat generating element and a second surface opposite to the first surface; a first capillary portion, disposed on the first surface inside the container; a second capillary portion, disposed on the second surface inside the container; a supporting portion having a third capillary portion inside the container and protruding in a direction connecting the first surface and the second surface; A working fluid is sealed in the cavity; as well as A steam flow path for circulating the working fluid in the gas phase and provided in the cavity portion, One end of the third capillary portion is integrated with the first capillary portion, and the other end of the third capillary portion is integrated with the second capillary portion, whereby the first surface and the second surface of the container are fixed to the support portion. The porosity of the second capillary portion at a portion overlapping with the support portion in a plan view is smaller than the porosity of the second capillary portion at a portion not overlapping with the support portion in a plan view.
3. The vapor chamber according to claim 1 or 2, wherein: The first capillary portion, the second capillary portion, and the third capillary portion are sintered bodies containing powder of metal powder.
4. The vapor chamber according to claim 1 or 2, wherein: The supporting portion is formed by the third capillary portion.
5. The vapor chamber according to claim 1 or 2, wherein: The supporting portion is formed by a convex portion protruding from the first surface toward the cavity portion or a convex portion protruding from the second surface toward the cavity portion, and the third capillary portion covering a surface of the convex portion.
6. The vapor chamber according to claim 5, wherein: The convex portion is solid.
7. The vapor chamber according to claim 1 or 2, wherein: The void ratio of the third capillary portion is different from the void ratio of the first capillary portion or the void ratio of the second capillary portion.
8. The vapor chamber according to claim 1 or 2, wherein: The void ratio of the third capillary portion is different from the void ratio of the first capillary portion and different from the void ratio of the second capillary portion.
9. A vapor chamber, wherein: have: A container having a cavity formed therein and having a first surface thermally connected to the heat generating element and a second surface opposite to the first surface; a first capillary portion, disposed on the first surface inside the container; a second capillary portion, disposed on the second surface inside the container; a supporting portion having a third capillary portion inside the container and protruding in a direction connecting the first surface and the second surface; A working fluid is sealed in the cavity; as well as A steam flow path for circulating the working fluid in the gas phase and provided in the cavity portion, One end of the third capillary portion is integrated with the first capillary portion, and the other end of the third capillary portion is integrated with the second capillary portion. The porosity of the first capillary portion at a portion that does not overlap with the support portion in a plan view is smaller than the porosity of the second capillary portion at a portion that does not overlap with the support portion in a plan view.
10. A vapor chamber, wherein: have: A container having a cavity formed therein and having a first surface thermally connected to the heat generating element and a second surface opposite to the first surface; a first capillary portion, disposed on the first surface inside the container; a second capillary portion, disposed on the second surface inside the container; a supporting portion having a third capillary portion inside the container and protruding in a direction connecting the first surface and the second surface; A working fluid is sealed in the cavity; as well as A steam flow path for circulating the working fluid in the gas phase and provided in the cavity portion, One end of the third capillary portion is integrated with the first capillary portion, and the other end of the third capillary portion is integrated with the second capillary portion. The porosity of the first capillary portion at a portion that does not overlap with the supporting portion in a plan view is smaller than the porosity of the third capillary portion.
11. A vapor chamber, wherein: have A container having a cavity formed therein and having a first surface thermally connected to the heat generating element and a second surface opposite to the first surface; a first capillary portion, disposed on the first surface inside the container; a second capillary portion, disposed on the second surface inside the container; a supporting portion having a third capillary portion inside the container and protruding in a direction connecting the first surface and the second surface; A working fluid is sealed in the cavity; as well as A steam flow path for circulating the working fluid in the gas phase and provided in the cavity portion, One end of the third capillary portion is integrated with the first capillary portion, and the other end of the third capillary portion is integrated with the second capillary portion. The porosity of the third capillary portion is smaller than the porosity of the second capillary portion at a portion that does not overlap with the supporting portion in a plan view.
Citation Information
Patent Citations
Vapor chamber
WO2017104819A1