Open type ceramic pressure and temperature sensor for non-conducting medium

Abstract

The utility model discloses an open-type ceramic pressure and temperature sensor for a non-conducting medium, which solves the problem of uneven plane of a conductive silk-screen layer by sintering the conductive silk-screen layer on a ceramic chip and covering a glass glaze layer on the conductive layer to serve as a sealing surface of an O-shaped ring, and enables the surface of the conductive silk-screen layer to be sealed through a conductive pin outside the internal O-shaped ring. And a temperature signal of the NTC is transmitted to the FPC at the upper part of the pressure core body, so that the transmission of the NTC signal is realized. O-shaped rings are arranged on the upper surface and the lower surface of the ceramic chip for product sealing, and the influence of temperature change on the sealing structure can be almost ignored.

Description

Technical Field

[0001] The utility model belongs to the technical field of pressure and temperature sensors, and in particular relates to an open-type ceramic pressure and temperature sensor for non-conductive media. Background Art

[0002] Most pressure and temperature sensors that require an NTC (Negative Temperature Coefficient) thermistor directly immersed in the medium use a molded clamp on the pressure-bearing component of the sealed structure to transmit the NTC signal and isolate the medium from the medium. Because the molded clamp is directly immersed in the medium and bears the pressure, the different shrinkage rates of the clamp and the plastic can cause a gap to form between them when the temperature changes. This gap allows the medium to penetrate into the product, causing the sensor seal to fail. Utility Model Content

[0003] Technical problems solved: In response to the above technical problems, the utility model provides an open-type ceramic pressure and temperature sensor for non-conductive media, which solves the problem that the NTC thermistor can be directly immersed in the medium to speed up the temperature response time, while ensuring that the product will not fail to seal due to medium penetration due to the influence of temperature changes.

[0004] Technical solution: An open-type ceramic pressure and temperature sensor for non-conductive media, comprising a ceramic carrier, a plastic carrier, a pressure sensing core, a socket and an NTC thermistor. The ceramic carrier comprises a ceramic substrate, on which a conductive silk-screen layer and a glass glaze layer are sequentially provided. The ceramic carrier is provided with an NTC through-hole, a pin hole and a pressure hole. The pin of the NTC thermistor passes through the NTC through-hole and is fixed by an NTC conductive fixing piece. A conductive pin is provided in the pin hole, and the conductive pin is fixed in the pin hole by a lower pin conductive fixing piece. The plastic carrier is arranged on the conductive pin and is fixed by an upper pin conductive fixing piece through an FPC through the conductive pin. The claw at the lower part of the plastic carrier is connected to the upper edge of the ceramic carrier. An internal upper O-ring is provided between the plastic carrier and the ceramic carrier. The socket, FPC and pressure sensing core are connected in sequence from top to bottom. The pressure sensing core is arranged in the plastic carrier, and the claw on the socket is connected to the buckle on the plastic carrier.

[0005] Preferably, the sensor further comprises a metal shell, which is arranged outside the plastic carrier and the ceramic carrier, and the top of the metal shell is connected to the socket.

[0006] Furthermore, the NTC thermistor is arranged in an NTC protection tube.

[0007] Furthermore, an inner lower O-ring is provided between the ceramic carrier and the metal shell.

[0008] Furthermore, the sensor further includes an NTC protection tube, which is arranged on the NTC thermistor, and an open end of the NTC protection tube is connected to the lower part of the metal shell.

[0009] Preferably, the socket, FPC and pressure sensing core are welded into one body from top to bottom.

[0010] Beneficial Effects: This utility model provides an open-type ceramic pressure and temperature sensor for non-conductive media. By sintering a conductive silk-screen layer on a ceramic wafer and covering it with a layer of glass glaze as the sealing surface for an O-ring, the uneven surface of the conductive silk-screen layer is resolved. Conductive pins on the outside of the internal O-ring transmit the NTC temperature signal to the FPC on the upper portion of the pressure core, achieving NTC signal transmission. O-rings are placed on both the upper and lower sides of the ceramic wafer for product sealing, making the impact of temperature changes on the sealing structure almost negligible. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is an exploded view of an open-type ceramic pressure and temperature sensor for non-conductive media in the utility model;

[0012] Figure 2 This is a structural diagram of an open-type ceramic pressure and temperature sensor for non-conductive media in which a ceramic carrier, NTC, and FPC are connected as one;

[0013] Figure 3 This is a cross-sectional view of an open-type ceramic pressure and temperature sensor for non-conductive media of the utility model, wherein the ceramic carrier is connected with the NTC and FPC as a whole;

[0014] Figure 4 This is a schematic diagram of the O-ring structure of an open-type ceramic pressure and temperature sensor for non-conductive media in the utility model;

[0015] Serial numbers in the figure: 1. Metal shell, 2. Internal upper O-ring, 3. Ceramic carrier, 3-1. Ceramic substrate, 3-2. Glass glaze layer, 3-3. Conductive silk screen layer, 3-4. Pin hole, 3-5. Pressure hole, 3-6. NTC through hole, 4. Conductive pin, 5. Plastic carrier, 6. Pressure sensor core, 7. Socket, 8. NTC conductive fixture, 9. NTC thermistor, 10. FPC, 11. Internal lower O-ring, 12. NTC protection tube, 13. Upper pin conductive fixture, 14. Lower pin conductive fixture. DETAILED DESCRIPTION

[0016] The technical solution of the present utility model is further described in detail below with reference to the accompanying drawings. Example 1

[0017] Reference Figure 1-Figure 4 , an open-type ceramic pressure and temperature sensor for non-conductive media, including a ceramic carrier 3, a plastic carrier 5, a pressure sensing core 6, a socket 7 and an NTC thermistor 9, the ceramic carrier 3 including a ceramic substrate 3-1, the ceramic substrate 3-1 is sequentially provided with a conductive silk screen layer 3-3 and a glass glaze layer 3-2, the ceramic carrier 3 is provided with an NTC through hole 3-6, a pin hole 3-4 and a pressure hole 3-5, the pin of the NTC thermistor 9 passes through the NTC through hole 3-6 and is fixed by an NTC conductive fixing member 8, a conductive pin 4 is provided in the pin hole 3-4, and the conductive pin 4 is fixed in the pin hole 3-4 by a lower pin conductive fixing member 14, the plastic carrier 5 is set on the conductive pin 4, and the conductive pin 4 passes through the FPC 10 is fixed with an upper pin conductive fixing member 13, the claw at the lower part of the plastic carrier 5 is connected to the upper edge of the ceramic carrier 3, an internal upper O-ring 2 is provided between the plastic carrier 5 and the ceramic carrier 3, the socket 7, FPC 10 and pressure sensing core 6 are connected in sequence from top to bottom, the pressure sensing core 6 is arranged in the plastic carrier 5, and the claw on the socket 7 is connected to the buckle on the plastic carrier 5.

[0018] The above-mentioned sensor also includes a metal shell 1, which is arranged outside the plastic carrier 5 and the ceramic carrier 3, and the top of the metal shell 1 is riveted to fix the socket 7. The NTC thermistor 9 is arranged in the NTC protection tube 12, and an internal lower O-ring 11 is provided between the ceramic carrier 3 and the metal shell 1.

[0019] The sensor further includes an NTC protection tube 12 , which is disposed on the NTC thermistor 9 , and an open end of the NTC protection tube 12 is connected to the lower portion of the metal housing 1 .

[0020] The socket 7, FPC 10 and pressure sensing core 6 are welded together from top to bottom.

[0021] Before product assembly, a conductive silk-screen layer 3-3 needs to be printed and sintered on the ceramic substrate 3-1, and then a glass glaze layer 3-2 needs to be printed and sintered again to form a conductive ceramic carrier 3;

[0022] When assembling the product, first, you need to pass the pins of the NTC thermistor 9 through the NTC through-holes 3-6 of the ceramic carrier 3, secure the NTC thermistor 9 with the conductive fixings 8, then insert the conductive pins 4 into the pin holes 3-4 on both sides of the ceramic carrier 3 and secure them with the lower pin conductive fixings 14. After the assembly is completed, the plastic carrier 5 is passed through the fixed conductive pins 4. The claws on the plastic carrier 5 are used to clamp the edge of the ceramic carrier 3, and the internal O-ring 2 is assembled inside to reduce the uneven thickness of the conductive silk screen layer 3-3, which may cause sealing failure. The pressure sensor core 6 is then welded to the FPC 10 and the socket 7 to form an assembly. The pressure sensor core 6 is then placed in the plastic carrier 5, and the conductive pins 4 are passed through the pin holes 3-4 of the FPC 10 and secured with the upper pin conductive fixings 13.

[0023] Then, the claws on the socket 7 are clamped with the buckles on the plastic carrier 5 to form an integrated assembly, which is then installed into the metal housing 1 with the NTC protection tube 12 and the inner lower O-ring 11 clamped therein for product packaging.

[0024] The embodiments of this specific implementation method are all preferred embodiments of the present utility model, and are not intended to limit the scope of protection of the present utility model. Therefore, any equivalent changes made based on the structure, shape, and principle of the present utility model should be included in the scope of protection of the present utility model.

Claims

1. An open-type ceramic pressure and temperature sensor for non-conductive media, characterized in that: The invention comprises a ceramic carrier (3), a plastic carrier (5), a pressure sensing core (6), a socket (7) and an NTC thermistor (9), wherein the ceramic carrier (3) comprises a ceramic substrate (3-1), a conductive silk screen layer (3-3) and a glass glaze layer (3-2) are sequentially provided on the ceramic substrate (3-1), an NTC through hole (3-6), a pin hole (3-4) and a pressure hole (3-5) are provided on the ceramic carrier (3), a pin of the NTC thermistor (9) passes through the NTC through hole (3-6) and is fixed by an NTC conductive fixing member (8), a conductive pin (4) is placed in the pin hole (3-4), and the conductive pin (4) is fixed by The lower pin conductive fixing member (14) is fixed in the pin hole (3-4), the plastic carrier (5) is arranged on the conductive pin (4), and is fixed with the upper pin conductive fixing member (13) through the conductive pin (4) passing through the FPC (10), the lower claw of the plastic carrier (5) is connected to the upper edge of the ceramic carrier (3), an internal upper O-ring (2) is provided between the plastic carrier (5) and the ceramic carrier (3), the socket (7), the FPC (10) and the pressure sensing core (6) are connected in sequence from top to bottom, the pressure sensing core (6) is arranged in the plastic carrier (5), and the claw on the socket (7) is connected to the buckle on the plastic carrier (5).

2. The open-type ceramic pressure and temperature sensor for non-conductive media according to claim 1, characterized in that: It also includes a metal shell (1), which is arranged outside the plastic carrier (5) and the ceramic carrier (3), and the top of the metal shell (1) is connected to the socket (7).

3. The open-type ceramic pressure and temperature sensor for non-conductive media according to claim 2, characterized in that: The NTC thermistor (9) is arranged in an NTC protection tube (12).

4. The open-type ceramic pressure and temperature sensor for non-conductive media according to claim 2, characterized in that: An inner lower O-ring (11) is provided between the ceramic carrier (3) and the metal shell (1).

5. The open-type ceramic pressure and temperature sensor for non-conductive media according to claim 2, characterized in that: It also includes an NTC protection tube (12), which is arranged on the NTC thermistor (9), and the open end of the NTC protection tube (12) is connected to the lower part of the metal shell (1).

6. The open-type ceramic pressure and temperature sensor for non-conductive media according to claim 1, characterized in that: The socket (7), FPC (10) and pressure sensing core (6) are welded together from top to bottom.

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