Cold plate, heat dissipation device and electronic equipment

Abstract

The utility model relates to a cold plate, a heat dissipation device and electronic equipment. The cold plate comprises a plate body and a liquid supplementing core; the plate body is provided with an inner cavity, a liquid inlet and an air outlet, the inner cavity comprises a liquid cavity and an air cavity, the liquid cavity and the air cavity are arranged in parallel, the liquid inlet is communicated with the liquid cavity, the air outlet is communicated with the air cavity, the plate body is provided with a contact wall, at least part of the contact wall is used for forming at least part of the cavity wall of the liquid cavity, and the outer surface of the contact wall is configured to be thermally coupled with a heat source; the liquid supplementing core is arranged in the liquid cavity. According to the scheme, the arrangement of the air cavity is not limited by the arrangement of the liquid supplementing core, so that the air cavity has a large space. In this way, the circulation smoothness of steam entering the air outlet after escaping from the liquid cavity can be improved, a large interface can be formed between the air cavity and the liquid cavity, and therefore the area of the steam escaping face can be increased, and steam formed after working fluid in the liquid cavity absorbs heat can rapidly escape into the air cavity. Therefore, the gas escape efficiency can be improved, and the heat dissipation efficiency can be further improved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a cold plate, a heat dissipation device and an electronic device. Background Art

[0002] Large servers, such electronic devices, contain numerous components such as high-performance processors, memory modules, high-speed hard drives, and various high-speed communication chips. These components generate significant heat during operation. For example, the thermal power of a single chip currently reaches 550W, and GPU chip power has increased to 600W. Therefore, large servers require cooling devices to control their operating temperatures. Currently, loop heat pipes are the predominant cooling device for large servers. These loop heat pipes consist of a tubular evaporator, a condenser, a liquid reservoir, a steam pipe, and a liquid return pipe. The evaporator includes a housing, a fluid replenishment core, and a working fluid. The evaporator housing transfers heat from the heat source to the working fluid, causing it to absorb heat and transform into vapor. The vapor enters the condenser through the steam pipe, where it is condensed into a liquid. The condensed working fluid enters the liquid reservoir through the liquid return pipe. Simultaneously, the working fluid is replenished from the reservoir to the evaporator through the capillary force of the fluid replenishment core.

[0003] Since the refill core is wrapped around the liquid inlet channel and the refill core needs to continuously absorb liquid to replenish the evaporator, the steam formed by the working fluid absorbing heat cannot pass through the refill core. Therefore, an exhaust channel needs to be set between the refill core and the outer shell of the tubular evaporator. The refill core needs to be supported by the outer shell at the center of the tubular evaporator, and the heat source needs to be thermally coupled with the working fluid in the refill core through the outer shell. Therefore, it is necessary to set a support structure on the outer shell to support the refill core, so as to support the refill core at the center of the tubular evaporator and allow the heat source to transfer heat to the working fluid in the refill core through the support structure. In this way, the support structure occupies part of the space of the exhaust channel, so that the layout of the exhaust channel is limited, resulting in a limited steam escape area, which is not conducive to the rapid escape of steam to the steam pipe, resulting in low steam escape efficiency. Ultimately, the heat dissipation efficiency of the heat dissipation device is low and cannot meet the heat dissipation needs of large servers under high-power working conditions. Utility Model Content

[0004] The embodiments of the present application provide a cold plate, a heat dissipation device, and an electronic device, which can improve the heat dissipation efficiency of the cold plate to at least solve the above-mentioned technical problems.

[0005] In order to achieve the above-mentioned purpose, according to the first aspect of the present application, a cold plate is provided, which includes a plate body and a fluid replenishment core; the plate body has an inner cavity, a liquid inlet and an air outlet, the inner cavity includes a liquid cavity and an air cavity, the liquid cavity and the air cavity are arranged in parallel, the liquid inlet is connected to the liquid cavity, and the air outlet is connected to the air cavity, the plate body has a contact wall, at least part of the contact wall is used to form part of the cavity wall of the liquid cavity, and the outer surface of the contact wall is configured to be thermally coupled with a heat source; the fluid replenishment core is arranged in the liquid cavity, and the fluid replenishment core is used to suck the fluid from the liquid inlet into the inner cavity.

[0006] Optionally, the liquid infusion core includes a capillary structure plate and a liquid absorbent core arranged in a stacked manner, the capillary structure plate is located on the side of the liquid absorbent core facing away from the air cavity, the liquid absorbent core is provided with a plurality of exhaust holes, one end of the exhaust hole faces the capillary structure plate, and the other end is connected to the air cavity; the end of at least one of the capillary structure plate and the liquid absorbent core extends into the liquid inlet.

[0007] Optionally, one end of the capillary structure plate and the liquid wick both extend into the liquid inlet.

[0008] Optionally, the absorbent core has first capillary pores, the capillary structure plate has second capillary pores, and the pore diameter of the first capillary pores is larger than the pore diameter of the second capillary pores.

[0009] Optionally, the exhaust through hole is a rectangular hole, and / or the plurality of exhaust through holes are distributed in a matrix.

[0010] Optionally, the air outlet and the liquid inlet are arranged on the same side wall of the plate body, and the air outlet is arranged closer to the air cavity than the liquid inlet.

[0011] Optionally, an exhaust port is provided at a portion of the liquid infusion core facing the air outlet, a portion of the air outlet is directly connected to the air cavity, and another portion is connected to the air cavity through the exhaust port.

[0012] Optionally, the air outlet is located on a side of the fluid replacement core facing away from the contact wall.

[0013] Optionally, the plate body includes a plate body and a cover plate, the plate body and the cover plate cover each other to form an inner cavity, the plate body has a contact wall, the contact wall is arranged opposite to the cover plate, the liquid inlet is arranged on the plate body, and the air outlet is arranged on the cover plate or the peripheral side wall of the plate body.

[0014] Optionally, the contact wall is located on a side of the fluid infusion core facing away from the air cavity.

[0015] According to a second aspect of the present application, a heat dissipation device is provided, which includes a condenser and the aforementioned cold plate; one end of the condenser is connected to the air outlet through a steam pipe, and the other end is connected to the liquid inlet through a return liquid pipe.

[0016] According to a third aspect of the present application, an electronic device is provided. The electronic device includes the aforementioned heat dissipation device. The electronic device has a heat generating component, and the contact wall is thermally coupled to the heat generating component.

[0017] In the cold plate of the embodiment of the present application, by arranging the air cavity and the liquid cavity side by side, the arrangement of the air cavity is not restricted by the arrangement of the liquid replenishing core, so that the air cavity has a larger space. This can improve the smoothness of the flow of steam from the liquid cavity into the gas outlet after escaping, and can also provide a larger interface between the air cavity and the liquid cavity, thereby increasing the area of ​​the steam escape surface, so that the steam formed after the working fluid in the liquid cavity absorbs heat can escape quickly into the air cavity. In this way, the gas escape efficiency can be improved, and the heat dissipation efficiency can be improved.

[0018] Optionally, the electronic device is a server.

[0019] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0021] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same drawing numbers represent the same parts in the following description.

[0022] Figure 1 is a cross-sectional view of a cold plate provided in an exemplary embodiment of the present disclosure;

[0023] Figure 2 is an internal cross-sectional view of a plate body provided in an exemplary embodiment of the present disclosure;

[0024] Figure 3 is an exploded view of a cold plate provided in an exemplary embodiment of the present disclosure;

[0025] Figure 4 yes Figure 1 Enlarged view of point A in the middle;

[0026] Figure 5 is a schematic structural diagram of another cold plate provided in an exemplary embodiment of the present disclosure;

[0027] Figure 6 yes Figure 5 Schematic diagram of the internal structure of the cold plate shown;

[0028] Figure 7 is a schematic structural diagram of a heat dissipation device provided in an exemplary embodiment of the present disclosure;

[0029] Figure 8 FIG. 2 is a schematic diagram of a cold plate in contact with a heat source according to an exemplary embodiment of the present disclosure.

[0030] Description of reference numerals:

[0031] 1-Cold plate;

[0032] 11- plate body; 111- contact wall; 112- plate body; 113- cover plate;

[0033] 12-inner cavity; 121-liquid cavity; 122-air cavity;

[0034] 13-liquid inlet; 14-gas outlet;

[0035] 15-liquid replenishing core; 151-capillary structure plate; 1511-second capillary hole; 152-liquid wick; 1521-first capillary hole; 153-exhaust hole;

[0036] 2-heat dissipation device; 21-condenser; 22-liquid return pipe; 23-steam pipe;

[0037] 3-Electronic equipment; 31-Heat-generating components. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0039] See also Figure 1 and Figure 2 , Figure 1 is a cross-sectional view of a cold plate 1 provided in an exemplary embodiment of the present disclosure, Figure 2: is an internal cross-sectional view of a plate body 11 provided in an exemplary embodiment of the present disclosure. An embodiment of the present application provides a cold plate 1. The cold plate 1 includes a plate body 11 and a fluid replenishing core 15. The plate body 11 has an inner cavity 12, a liquid inlet 13 and an air outlet 14. The inner cavity 12 includes a liquid cavity 121 and an air cavity 122. The liquid cavity 121 and the air cavity 122 are arranged in parallel. The liquid inlet 13 is connected to the liquid cavity 121. The air outlet 14 is connected to the air cavity 122. The plate body 11 has a contact wall 111, at least part of which is used to form a part of the cavity wall of the liquid cavity 121. The surface of the contact wall 111 away from the liquid cavity 121 is configured to be thermally coupled with a heat source. The fluid replenishing core 15 is arranged in the liquid cavity 121. The fluid replenishing core 15 draws the fluid from the liquid inlet 13 into the inner cavity 12.

[0040] The parallel arrangement refers to the arrangement in which the liquid cavity 121 and the air cavity 122 are adjacent to each other and any cavity does not include or surround the other cavity.

[0041] Specifically, the liquid cavity 121 and the air cavity 122 are arranged in sequence along a first direction. The first direction can be any direction. Optionally, the first direction is parallel to the thickness direction of the plate body 11.

[0042] It can be understood that thermal coupling refers to the heat conduction between two components, so that the low-temperature component can absorb the heat of the high-temperature component.

[0043] It can be understood that part of the contact wall 111 can form all the cavity walls of the liquid cavity 121, or part of the contact wall 111 can form part of the cavity walls of the liquid cavity 121, or the entire contact wall 111 can form all the cavity walls of the liquid cavity 121, or the entire contact wall 111 can form part of the cavity walls of the liquid cavity 121.

[0044] It will be understood that the air outlet 14 is connected to one end of the condenser 21, and the liquid inlet 13 is connected to the other end of the condenser 21. The contact wall 111 contacts the heat source to achieve thermal coupling, allowing the contact wall 111 to absorb heat from the heat source and transfer the heat to the working fluid in the liquid cavity 121. After absorbing heat, the working fluid forms vapor, which escapes into the air cavity 122 and enters the condenser 21 through the air outlet 14. The condenser 21 liquefies the vapor and directs it to the liquid inlet 13. Under the action of capillary force, the liquid replenishment wick 15 draws the working fluid from the liquid inlet 13 into the liquid cavity 121.

[0045] The pressure difference between the gas cavity 122 and the condensing cavity of the condenser 21 can direct the steam into the condenser 21. The working fluid formed by the condensation of the steam in the condenser 21 can be directed into the liquid inlet 13 under the action of gravity. Alternatively, the working fluid at the liquid inlet 13 can be directed into the liquid cavity 121 under the action of gravity combined with capillary force.

[0046] In addition, at least the contact wall 111 is made of metal material, optionally, copper material, aluminum material, or a metal composite material.

[0047] Optionally, the gas outlet 14 is a tube with a smooth inner wall. When the working fluid in the liquid cavity 121 absorbs heat and turns into steam, the smooth inner wall of the gas outlet 14 has a small resistance to the flow of steam, which can improve the smoothness of steam discharge.

[0048] Optionally, there may be multiple air outlets 14 .

[0049] In this embodiment, by arranging the air cavity 122 and the liquid cavity 121 side by side, the arrangement of the air cavity 122 is not restricted by the arrangement of the liquid refilling core 15, thereby providing a larger space for the air cavity 122. This improves the smoothness of the flow of steam from the liquid cavity 121 into the gas outlet 14, and creates a larger interface between the air cavity 122 and the liquid cavity 121, thereby increasing the area of ​​the steam escape surface. This facilitates the rapid escape of steam generated by the working fluid in the liquid cavity 121 after absorbing heat into the air cavity 122. This improves the gas escape efficiency, thereby improving the heat dissipation efficiency.

[0050] Furthermore, the steam escapes from the liquid chamber 121 to the gas chamber 122 and then into the gas outlet 14; the working fluid flows from the liquid inlet 13 to the liquid chamber 121. This makes the gas and liquid flow paths of the cold plate 1 independent of each other, effectively preventing flow obstruction caused by the different flow directions. This ensures that the flow speeds of the working fluid and steam are maintained, allowing the cold plate 1 to have higher liquid inlet and outlet speeds, thereby improving heat dissipation efficiency.

[0051] Moreover, since the gas and liquid flow paths are independent of each other, the gas and liquid can each have a larger flow speed to meet the needs of long-distance transmission, thereby increasing the heat-carrying distance and reducing its requirements for the installation environment, thereby improving its applicability.

[0052] See also Figure 3 , Figure 3 is an exploded view of the cold plate 1 provided in an exemplary embodiment of the present disclosure. In some embodiments, the liquid infusion wick 15 includes a capillary structure plate 151 and a liquid wick 152 arranged in a stacked manner. The capillary structure plate 151 is located on the side of the liquid wick 152 facing away from the air cavity 122. The liquid wick 152 is provided with a plurality of exhaust holes 153. One end of the exhaust holes 153 faces the capillary structure plate 151, and the other end is connected to the air cavity 122. The end of at least one of the capillary structure plate 151 and the liquid wick 152 extends into the liquid inlet 13.

[0053] It can be understood that the capillary structure plate 151 is a plate-like material with a microstructure, which contains a large number of tiny pores. These pores can produce a capillary phenomenon, allowing the liquid to spontaneously flow from the liquid inlet 13 into the liquid cavity 121.

[0054] It is understandable that the wick 152 is a structure that can utilize capillary action to absorb and transmit liquid. It has a large number of tiny pores that allow liquid to flow into the liquid chamber 121 spontaneously from the liquid inlet 13.

[0055] In this embodiment, the liquid replenishment core 15 is composed of a capillary structure plate 151 and a liquid absorbent core 152. On the one hand, the strong capillary force of the capillary structure can ensure the efficiency of the working fluid entering the liquid cavity 121 from the liquid inlet 13, so as to ensure the heat dissipation efficiency; on the other hand, the steam can escape through the exhaust hole 153 whose aperture is larger than the aperture of the capillary structure, so as to improve the smoothness of the steam escape, thereby improving the efficiency of the steam escaping from the liquid cavity 121 to the air cavity 122 through the exhaust hole 153 of the liquid absorbent core 152.

[0056] Furthermore, the wick 152 can be used to store a large amount of working fluid in the liquid chamber 121, thereby eliminating the need for a liquid reservoir. This not only reduces the number of components in the heat sink 2, thereby lowering its manufacturing cost and space requirements, but also allows the entire working fluid to be absorbed within the wick 152 and capillary structure plate 151 due to capillary forces, effectively reducing the risk of leakage.

[0057] Furthermore, the working fluid is completely absorbed in the liquid wick 152 and the capillary structure plate 151 , which can also reduce the starting power of the heat dissipation device 2 and thus reduce power consumption.

[0058] The proportions of the capillary structure plate 151 and the liquid wick 152 can be adjusted according to the working power of the heat dissipation object of the cold plate 1. For example, when the power of the heat source is large, the working fluid vaporizes faster, and a larger capillary structure plate 151 can be configured to ensure the liquid inflow speed.

[0059] See also Figure 4 , Figure 4 yes Figure 1 Enlarged view of point A in the middle. In some embodiments, one end of the capillary structure plate 151 and one end of the wick 152 both extend into the liquid inlet 13. This ensures efficient liquid inflow into the cold plate 1, facilitating smooth heat dissipation. In particular, when the power of the heat source increases, causing the working fluid to vaporize more rapidly, the ends of the capillary structure plate 151 and the wick 152 extending into the liquid inlet 13 facilitate rapid replenishment of the working fluid, ensuring smooth heat dissipation.

[0060] Specifically, the ends of the capillary structure plate 151 and the wick 152 fill the entire liquid inlet 13 .

[0061] In some embodiments, the wick 152 has a first capillary pore 1521. The capillary structure plate 151 has a second capillary pore 1511. The first capillary pore 1521 has a larger diameter than the second capillary pore 1511. This allows for rapid liquid replenishment through the capillary structure plate 151, allowing the working fluid to quickly flow into the liquid chamber 121, where it can exchange heat with the contact wall 111 to form vapor, improving heat dissipation efficiency. Furthermore, the larger first capillary pore 1521 allows for smoother vapor escape, thereby improving vapor escape efficiency.

[0062] Specifically, the working fluid of the capillary structure plate 151 and the working fluid of the wick 152 are heated to vaporize, forming steam. Of the steam formed by the working fluid of the capillary structure plate 151, a portion escapes through the exhaust hole 153, and a portion flows to the first capillary hole 1521 and then escapes through the exhaust hole 153. At the same time, part of the heat in the capillary structure plate 151 is transferred to the wick 152, and the working fluid at the bottom of the wick 152 is heated and vaporized to form steam, which escapes through the exhaust hole 153. The above-escaped steam flows to the air cavity 122, flows to the steam pipe 23 through the air outlet 14, and enters the condenser 21. After the steam is cooled and liquefied in the condenser 21, it can flow into the liquid inlet 13 under the capillary force of the capillary structure of the condensing cavity and the capillary force of the capillary structure of the return liquid pipe 22, as well as under the action of gravity. Under the action of the capillary force of the liquid replenishing core 15 , the liquefied working fluid is absorbed into the capillary structure plate 151 and the liquid absorbent core 152 .

[0063] See also Figure 3 In some embodiments, the exhaust through-hole 153 is a rectangular hole, and / or the plurality of exhaust through-holes 153 are distributed in a matrix.

[0064] It can be understood that by configuring the exhaust holes 153 as rectangular holes, the wick 152 can be provided with more exhaust holes 153 to increase the cross-sectional area of ​​the steam escape channel, thereby improving the heat dissipation efficiency.

[0065] Furthermore, the plurality of exhaust holes 153 are arranged in a matrix, giving the wick 152 a honeycomb structure. This increases the steam overflow area, speeding up the steam overflow and delaying the onset of boiling, thereby increasing the vaporization rate of the working fluid and improving the working fluid's ability to remove heat.

[0066] See also Figure 5 , Figure 5 This is a schematic diagram of the structure of another cold plate 1 provided in an exemplary embodiment of the present disclosure. In some embodiments, the air outlet 14 and the liquid inlet 13 are disposed on the same side wall of the plate body 11, with the air outlet 14 being positioned closer to the air cavity 122 than the liquid inlet 13. This makes the structure of the cold plate 1 more compact, thereby reducing the installation requirements of the cold plate 1.

[0067] See also Figure 6 , Figure 6 yes Figure 5 The internal structure of the cold plate 1 is shown in FIG. In some embodiments, an exhaust port is provided on the portion of the liquid replenishment core 15 facing the air outlet 14. A portion of the air outlet 14 is directly connected to the air cavity 122, while another portion is connected to the air cavity 122 through the exhaust port. This ensures that, when the air outlet 14 and the liquid inlet 13 are arranged compactly, steam in the air cavity 122 can flow smoothly into the air outlet 14, thereby ensuring efficient heat dissipation.

[0068] See also Figure 2 In some embodiments, the air outlet 14 is located on the side of the liquid replenishing core 15 away from the contact wall 111. In this way, the consistency of steam entering the air outlet 14 from various parts of the air cavity 122 can be improved, thereby improving the steam flow efficiency.

[0069] Optionally, the air outlet 14 is arranged opposite to the center of the air cavity 122 .

[0070] See also Figure 3 In some embodiments, the plate body 11 includes a plate body 112 and a cover plate 113. The plate body 112 and the cover plate 113 overlap to form an inner cavity 12. The plate body 112 has a contact wall 111, which is disposed opposite the cover plate 113. The liquid inlet 13 is disposed on the plate body 112. The air outlet 14 is disposed on the cover plate 113 or the peripheral side wall of the plate body 112. In this way, the plate body 11 has a simple structure and is easy to manufacture.

[0071] Optionally, the plate body 112 and the cover plate 113 are metal parts, which are welded to form the plate body 11 .

[0072] Optionally, a capillary structure is provided on a side of the cover plate 113 facing the inner cavity.

[0073] It is understandable that the capillary structure may be provided on the side of the cover plate 113 facing the inner cavity, or may not be provided with the capillary structure, which can be selectively provided according to the use environment.

[0074] See also Figure 2 In some embodiments, the contact wall 111 is located on the side of the liquid replenishing core 15 away from the air cavity 122. This can improve the consistency of the steam generated by the working fluid in the liquid cavity 121 entering the air cavity 122, thereby improving the efficiency of steam escape and thus improving heat dissipation efficiency.

[0075] In some embodiments, the contact wall 111 is made of metal. Specifically, the plate body 11 can be made of aluminum, copper, or other alloy materials.

[0076] The cold plate 1 provided in the embodiments of the present application can be manufactured using the following method: The plate body 112, the cover plate 113, and a mold for forming the exhaust holes 153 are fabricated; the mold is placed within the plate body 112 and filled with powder, such as copper powder or aluminum powder. The powder is then compacted to ensure that the pores used to form the capillary structure meet the requirements of the application scenario. The powder layers of the capillary structure plate 151 and the wick 152 can be compacted separately. After compaction, the mold and plate body 112 are sent to a sintering furnace for sintering. After sintering, they are sent to a reduction furnace for deoxidation. The cover plate 113, liquid inlet 13, and liquid outlet are then welded to the plate body 112. The plate body 112 can then be sent to a reduction furnace for secondary reduction. Liquid is then injected, and the injection hole is sealed after evacuation. Other reliability tests, such as airtightness testing and thermal performance testing, can then be performed to verify weld quality. Fins or other components can also be welded to the plate body 112.

[0077] See also Figure 7 , Figure 7 is a schematic diagram of the structure of a heat sink 2 provided in an exemplary embodiment of the present disclosure. Accordingly, an embodiment of the present application also provides a heat sink 2. This heat sink 2 includes a condenser 21 and the aforementioned cold plate 1. One end of the condenser 21 is connected to the gas outlet 14 via a steam pipe 23, and the other end is connected to the liquid inlet 13 via a liquid return pipe 22.

[0078] According to the application scenario, the heat dissipation device 2 may further include a working pump to accelerate the flow speed of the medium in the heat dissipation device 2 .

[0079] In this embodiment, by adopting the cold plate 1 provided in some embodiments of the present application, the smoothness of steam circulation can be improved through the air cavity 122, and a larger interface can be provided between the air cavity 122 and the liquid cavity 121, thereby increasing the area of ​​the steam escape surface, thereby facilitating the quick escape of steam generated by the working fluid in the liquid cavity 121 after absorbing heat into the air cavity 122. In this way, the gas escape efficiency can be improved, thereby improving the heat dissipation efficiency of the heat dissipation device 2.

[0080] See also Figure 8 , Figure 8 Schematic diagram of a cold plate 1 in contact with a heat source, provided in an exemplary embodiment of the present disclosure. The present application also provides an electronic device 3. The electronic device 3 includes the aforementioned heat sink 2. The electronic device 3 has a heat-generating component 31. The contact wall 111 is thermally coupled to the heat-generating component 31.

[0081] In this embodiment, by adopting the heat dissipation device 2 provided in some embodiments of the present application, the heat dissipation efficiency of the electronic device 3 can be improved to ensure the working reliability of the electronic device 3.

[0082] The electronic device 3 may be a server, specifically a large server, and the heat generating component 31 may be a chip.

[0083] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0084] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0085] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0086] The above are merely preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A cold plate (1), characterized in that include: A plate body (11) has an inner cavity (12), a liquid inlet (13) and an air outlet (14); the inner cavity (12) includes a liquid cavity (121) and an air cavity (122); the liquid cavity (121) and the air cavity (122) are arranged in parallel; the liquid inlet (13) is in communication with the liquid cavity (121); the air outlet (14) is in communication with the air cavity (122); the plate body (11) has a contact wall (111); at least a portion of the contact wall (111) is used to shape at least a portion of a cavity wall of the liquid cavity (121); and an outer surface of the contact wall (111) is configured to be thermally coupled to a heat source; A fluid replenishing core (15) is arranged in the liquid cavity (121), and the fluid replenishing core (15) is used to absorb the fluid from the liquid inlet (13) into the inner cavity (12).

2. The cold plate (1) according to claim 1, characterized in that The liquid-replenishing core (15) comprises a capillary structure plate (151) and a liquid-absorbing core (152) arranged in a stacked manner, wherein the capillary structure plate (151) is located on a side of the liquid-absorbing core (152) away from the air cavity (122), and the liquid-absorbing core (152) is provided with a plurality of exhaust holes (153), one end of the exhaust hole (153) faces the capillary structure plate (151), and the other end is communicated with the air cavity (122); At least one of the capillary structure plate (151) and the liquid absorbent core (152) extends into the liquid inlet (13).

3. The cold plate (1) according to claim 2, characterized in that The capillary structure plate (151) and the liquid absorbent core (152) both extend into the liquid inlet (13).

4. The cold plate (1) according to claim 2, characterized in that The absorbent core (152) has a first capillary pore (1521), and the capillary structure plate (151) has a second capillary pore (1511), and the pore size of the first capillary pore (1521) is larger than the pore size of the second capillary pore (1511).

5. The cold plate (1) according to any one of claims 2 to 4, characterized in that The exhaust through hole (153) is a rectangular hole, and / or the plurality of exhaust through holes (153) are distributed in a matrix.

6. The cold plate (1) according to any one of claims 1 to 4, characterized in that The air outlet (14) and the liquid inlet (13) are arranged on the same side wall of the plate body (11), and the air outlet (14) is arranged closer to the air cavity (122) than the liquid inlet (13).

7. The cold plate (1) according to claim 6, characterized in that An exhaust port is provided at a portion of the fluid replenishing core (15) facing the air outlet (14); a portion of the air outlet (14) is directly connected to the air cavity (122), and another portion is connected to the air cavity (122) through the exhaust port.

8. The cold plate (1) according to any one of claims 1 to 4, characterized in that The air outlet (14) is located on a side of the fluid-replenishing core (15) facing away from the contact wall (111).

9. The cold plate (1) according to any one of claims 1 to 4, characterized in that The plate body (11) includes a plate body (112) and a cover plate (113), wherein the plate body (112) and the cover plate (113) cover each other to form the inner cavity (12), the plate body (112) has the contact wall (111), and the contact wall (111) is arranged opposite to the cover plate (113), the liquid inlet (13) is arranged on the plate body (112), and the air outlet (14) is arranged on the cover plate (113) or the peripheral side wall of the plate body (112).

10. The cold plate (1) according to any one of claims 1 to 4, characterized in that The contact wall (111) is located on a side of the fluid-replenishing core (15) facing away from the air cavity (122).

11. A heat dissipation device (2), characterized in that: include: The cold plate (1) according to any one of claims 1 to 10; The condenser (21) has one end connected to the gas outlet (14) through a steam pipe (23) and the other end connected to the liquid inlet (13) through a liquid return pipe (22).

12. An electronic device (3), characterized in that The heat dissipation device (2) according to claim 11, wherein the electronic device (3) has a heat generating component (31), and the contact wall (111) is thermally coupled to the heat generating component (31).

13. The electronic device (3) according to claim 12, characterized in that The electronic device is a server.

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