Wafer cleaning device

Abstract

The utility model provides a wafer cleaning device which comprises a cleaning box and a cleaning basket, the two ends of the cleaning basket are fixedly connected with stabilizing plates, one end of each stabilizing plate is provided with a plurality of limiting grooves, one end of each limiting groove is slidably connected with a first clamping rod and a second clamping rod, and the two ends of each first clamping rod and the two ends of each second clamping rod are rotatably connected with idler wheels respectively. A clamping motor is fixedly connected to one end of the cleaning basket, a driving plate is fixedly connected to the power output end of the clamping motor, one end of the driving plate is movably connected to the rolling wheels, and a first supporting table is fixedly connected to one end of the clamping motor; a clamping motor drives a driving plate to rotate, when the outermost side of an arc-shaped boss of the driving plate extrudes the edge of a rolling wheel, a first clamping rod and a second clamping rod at the corresponding position can slide outwards and do not clamp a wafer any more, and the first clamping rod and the second clamping rod moving to an arc-shaped groove can clamp the wafer to be fixed during cleaning; and during cleaning, different positions of the wafer can be clamped in turn, so that a cleaning dead angle which is always covered on the wafer can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer cleaning device. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. It is formed from silicon crystal rods after grinding, polishing, and slicing to form silicon wafers, also known as wafers. During the wafer production process, tiny particles and various chemical residues are often attached to the surface of the wafer. Therefore, the wafer needs to be cleaned during the production process to remove these tiny particles and chemical residues, which affect the wafer quality and cause wafer defects. At the same time, cleaning the wafer can improve the surface smoothness of the wafer, laying the foundation for other subsequent processes. When cleaning the wafer, a cleaning basket needs to be used to fix the wafer. However, the cleaning baskets commonly used on the market will cover part of the edge of the wafer when fixing the wafer, resulting in incomplete cleaning.

[0003] After searching, the Chinese patent publication number CN221708686U discloses a cleaning fixture for placing wafers flat or vertically, including a quadrangular prism structure and positioning pins with a trapezoidal cross-section. The quadrangular prism structure is made of quartz material and is placed in a position that fits the outer frame of the wafer. A circular arc handle structure is provided on one side and a columnar structure with a limited height is provided on the other side. A circular hole structure is provided at the end of the columnar structure, and the size of the circular hole and the positioning pin form an interference fit.

[0004] In view of the problem in the above technology that the edge of the wafer is covered when the wafer is fixed, resulting in incomplete cleaning of the edge of the wafer, a wafer cleaning device is proposed. Utility Model Content

[0005] In view of this, the embodiments of the present invention hope to provide a wafer cleaning device to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial option.

[0006] The technical solution of the embodiment of the utility model is achieved as follows: it includes a cleaning box and a cleaning basket, both ends of the cleaning basket are fixedly connected with a stabilizing plate, one end of the stabilizing plate is provided with a plurality of limiting grooves, one end of the limiting groove is slidably connected with a clamping rod 1 and a clamping rod 2, both ends of the clamping rod 1 and the clamping rod 2 are rotatably connected with rollers, one end of the cleaning basket is fixedly connected with a clamping motor, the power output end of the clamping motor is fixedly connected with a driving plate, and one end of the driving plate is movably connected to the roller.

[0007] In some embodiments, one end of the clamping motor is fixedly connected to support platform 1, and one end of a side stabilization plate is fixedly connected to support platform 2.

[0008] In some embodiments, one end of the support platform 1 and the support platform 2 is fixedly connected to a limit rod, one end of the limit rod is fixedly connected to a spring 1, and one end of the clamping rod 1 and the clamping rod 2 is respectively fixedly connected to the spring 1.

[0009] In some embodiments, one end of the clamping rod is fixedly connected to a mounting rod.

[0010] In some embodiments, one end of the mounting rod and the second clamping rod are respectively slidably connected to a buffer rod, one end of the buffer rod is fixedly connected to a plurality of clamping claws, and one end of the clamping claw is fixedly connected to a second spring.

[0011] In some embodiments, one end of the cleaning box is fixedly connected to a rotating motor, a docking seat is rotatably connected inside the cleaning box, one side of the docking seat is fixedly connected to the power output end of the rotating motor, and docking plugs are fixedly connected to both ends of the cleaning basket, and one end of the docking plug is fixedly connected to the docking seat.

[0012] In some embodiments, a water nozzle track is fixedly connected above the cleaning box.

[0013] In some embodiments, one end of the water nozzle track is slidably connected to a plurality of double-headed nozzles, and one end of the plurality of double-headed nozzles is fixedly connected to a water supply pipe.

[0014] The embodiment of the present invention has the following advantages due to the adoption of the above technical solution:

[0015] 1. A wafer cleaning device, which rotates a driving plate through a clamping motor. When the outermost side of the arc-shaped boss of the driving plate is squeezed to the edge of the roller, the clamping rods 1 and 2 at the corresponding positions can slide outward and no longer clamp the wafer. The clamping rods 1 and 2 moved to the arc-shaped groove can clamp the wafer and fix it during cleaning. During cleaning, different positions of the wafer can be clamped in turn, thereby avoiding any blind corners on the wafer that are always covered.

[0016] 2. A wafer cleaning device, which uses spring 2 to drive the clamping claws to clamp the wafer. When switching between the two groups, the clamping claws on clamping rod 1 and clamping rod 2 can clamp the wafer at the same time. This can prevent the situation where both the clamping rod 1 and the clamping rod 2 do not clamp the wafer, causing the wafer to lose its fixation and slip and be damaged.

[0017] 3. A wafer cleaning device, which can cooperate with the limit rod to clamp the clamping rod 1 and the clamping rod 2 inward through spring 1, so that the rollers on one side of the clamping rod 1 and the clamping rod 2 can roll close to the drive plate to achieve clamping.

[0018] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 This is the main structural diagram of the utility model;

[0021] Figure 2 This is the internal structure diagram of the utility model;

[0022] Figure 3 This is a structural diagram of the cleaning basket of the present utility model;

[0023] Figure 4 This is the local structure of the cleaning basket of the utility model Figure 1 ;

[0024] Figure 5 This is the local structure of the cleaning basket of the utility model Figure 2 .

[0025] Reference numerals:

[0026] 1. Cleaning box; 2. Rotating motor; 3. Water nozzle track; 4. Water supply pipe; 5. Double-head nozzle; 6. Cleaning basket; 7. Docking seat; 8. Docking plug; 9. Stabilizing plate; 10. Clamping rod 1; 11. Clamping rod 2; 12. Clamping motor; 13. Support platform 1; 14. Driving plate; 15. Limit rod; 16. Spring 1; 17. Roller; 18. Buffer rod; 19. Mounting rod; 20. Spring 2; 21. Clamping claw; 22. Support platform 2; 23. Limit slot. DETAILED DESCRIPTION

[0027] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0028] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0029] Example 1:

[0030] like Figure 1-5 As shown, a wafer cleaning device includes a cleaning box 1 and a cleaning basket 6, wherein both ends of the cleaning basket 6 are fixedly connected to a stabilizing plate 9, one end of the stabilizing plate 9 is provided with a plurality of limiting grooves 23, one end of the limiting groove 23 is slidably connected to a clamping rod 10 and a clamping rod 2 11, and both ends of the clamping rod 10 and the clamping rod 2 11 are rotatably connected to rollers 17, one end of the cleaning basket 6 is fixedly connected to a clamping motor 12, a power output end of the clamping motor 12 is fixedly connected to a driving plate 14, and one end of the driving plate 14 is movably connected to the roller 17;

[0031] Before cleaning, the wafer can be installed between multiple clamping rods 10 and clamping rods 11. There are two clamping rods 10 and four clamping rods 11, which can be divided into three groups. The two groups take turns to clamp the wafer. When in use, the roller 17 is close to the edge of the driving plate 14. The driving plate 14 has three arc-shaped bosses and three arc-shaped grooves. When the outermost side of the arc-shaped boss of the driving plate 14 is squeezed to the edge of the roller 17, the clamping rod 10 and the clamping rod 11 at the corresponding position can slide outward and no longer clamp the wafer. The clamping rod 10 and the clamping rod 11 moved to the arc-shaped groove can clamp the wafer and fix it during cleaning. Different positions of the wafer can be clamped in turn during cleaning, so as to avoid cleaning dead corners on the wafer that are always covered.

[0032] In this embodiment, one end of the clamping motor 12 is fixedly connected to the support platform 13, one end of the stabilizing plate 9 is fixedly connected to the support platform 2 22, one end of the support platform 13 and the support platform 2 22 is fixedly connected to the limit rod 15, one end of the limit rod 15 is fixedly connected to the spring 16, and one end of the clamping rod 10 and the clamping rod 2 11 is respectively fixedly connected to the spring 16;

[0033] Spring 16 can cooperate with the limiting rod 15 to clamp the clamping rod 10 and the clamping rod 2 11 inward, so that the roller 17 on one side of the clamping rod 10 and the clamping rod 2 11 can roll close to the drive plate 14 to achieve clamping.

[0034] In this embodiment, one end of the clamping rod 10 is fixedly connected to the mounting rod 19, and one end of the mounting rod 19 and the clamping rod 2 11 are respectively slidably connected to the buffer rod 18, and one end of the buffer rod 18 is fixedly connected to a plurality of clamping claws 21, and one end of the clamping claw 21 is fixedly connected to the spring 20;

[0035] The mounting rod 19 is mounted on the clamping rod 10 on both sides by snapping. The wafer can be taken and placed by removing the mounting rod 19 on the two clamping rods 10. When in use, the spring 20 drives the clamping claw 21 to clamp the wafer. When switching between the two groups, the clamping claws 21 on the clamping rod 10 and the clamping rod 2 11 can clamp the wafer at the same time. This can prevent the situation where both groups of clamping rods 10 and clamping rods 11 do not clamp the wafer, causing the wafer to lose its fixation and slip and be damaged.

[0036] In this embodiment, before cleaning, the wafer can be installed between multiple clamping rods 10 and clamping rods 11. The number of clamping rods 10 is two, and the number of clamping rods 11 is four, which can be divided into three groups. The two groups take turns to clamp the wafer. When in use, the roller 17 is close to the edge of the driving plate 14. The driving plate 14 is shaped with three arc-shaped bosses and three arc-shaped grooves. When the outermost side of the arc-shaped bosses of the driving plate 14 is squeezed to the edge of the roller 17, the clamping rod 10 and the clamping rod 11 at the corresponding position can slide outward and no longer clamp the wafer. The clamping rod 10 and the clamping rod 11 moved to the arc-shaped groove can clamp the wafer and fix it during cleaning. During cleaning, different positions of the wafer can be clamped in turn, which can avoid having a cleaning dead corner on the wafer that is always covered.

[0037] The spring 16 can cooperate with the limiting rod 15 to clamp the clamping rod 10 and the clamping rod 2 11 inward, so that the roller 17 on one side of the clamping rod 10 and the clamping rod 2 11 can roll against the drive plate 14 to achieve clamping;

[0038] The mounting rod 19 is mounted on the clamping rod 10 on both sides by snapping. The wafer can be taken and placed by removing the mounting rod 19 on the two clamping rods 10. When in use, the spring 20 drives the clamping claw 21 to clamp the wafer. When switching between the two groups, the clamping claws 21 on the clamping rod 10 and the clamping rod 2 11 can clamp the wafer at the same time. This can prevent the situation where both groups of clamping rods 10 and clamping rods 11 do not clamp the wafer, causing the wafer to lose its fixation and slip and be damaged.

[0039] Example 2:

[0040] A wafer cleaning device, this embodiment makes the following improvements on the basis of embodiment 1, such as Figure 1-5 As shown, one end of the cleaning box 1 is fixedly connected to the rotating motor 2, and the inside of the cleaning box 1 is rotatably connected to the docking seat 7, one side of the docking seat 7 is fixedly connected to the power output end of the rotating motor 2, and both ends of the cleaning basket 6 are fixedly connected to the docking plug 8, and one end of the docking plug 8 is fixedly connected to the docking seat 7;

[0041] The cleaning box 1 is a model that can emit ultrasonic waves, which can perform ultrasonic vibrations on the internal liquid to improve the cleaning effect. When in use, the docking seat 7 can be used to fix the docking plug 8, and then the rotating motor 2 can drive the cleaning basket 6 and the internal wafer to rotate when working to improve the cleaning effect.

[0042] In this embodiment, a water nozzle track 3 is fixedly connected to the top of the cleaning box 1, and a plurality of double-headed nozzles 5 are slidably connected to one end of the water nozzle track 3. One end of the plurality of double-headed nozzles 5 is fixedly connected to a water supply pipe 4. The water nozzle track 3 can be installed with different numbers of double-headed nozzles 5 as needed, and pure water can be provided for cleaning through the water supply pipe 4.

[0043] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope of protection of the claims.

Claims

1. A wafer cleaning device, comprising a cleaning box (1) and a cleaning basket (6), characterized in that: The two ends of the cleaning basket (6) are fixedly connected to a stabilizing plate (9), one end of the stabilizing plate (9) is provided with a plurality of limiting grooves (23), one end of the limiting groove (23) is slidably connected to a clamping rod (10) and a clamping rod (11), and the two ends of the clamping rod (10) and the clamping rod (11) are rotatably connected to rollers (17), one end of the cleaning basket (6) is fixedly connected to a clamping motor (12), a power output end of the clamping motor (12) is fixedly connected to a driving plate (14), and one end of the driving plate (14) is movably connected to the roller (17).

2. The wafer cleaning device according to claim 1, characterized in that: One end of the clamping motor (12) is fixedly connected to a first support platform (13), and one end of a side stabilizing plate (9) is fixedly connected to a second support platform (22).

3. The wafer cleaning device according to claim 2, wherein: One end of the support platform 1 (13) and the support platform 2 (22) is fixedly connected to a limiting rod (15), one end of the limiting rod (15) is fixedly connected to a spring 1 (16), and one end of the clamping rod 1 (10) and the clamping rod 2 (11) is fixedly connected to the spring 1 (16) respectively.

4. The wafer cleaning device according to claim 1, wherein: One end of the clamping rod (10) is fixedly connected to a mounting rod (19).

5. The wafer cleaning device according to claim 4, characterized in that: One end of the mounting rod (19) and the second clamping rod (11) are respectively slidably connected to a buffer rod (18), one end of the buffer rod (18) is fixedly connected to a plurality of clamping claws (21), and one end of the clamping claw (21) is fixedly connected to a second spring (20).

6. The wafer cleaning device according to claim 1, characterized in that: One end of the cleaning box (1) is fixedly connected to a rotating motor (2); a docking seat (7) is rotatably connected inside the cleaning box (1); one side of the docking seat (7) is fixedly connected to the power output end of the rotating motor (2); both ends of the cleaning basket (6) are fixedly connected to docking plugs (8); one end of the docking plug (8) is fixedly connected to the docking seat (7).

7. The wafer cleaning device according to claim 6, characterized in that: A water spout track (3) is fixedly connected above the cleaning box (1).

8. The wafer cleaning device according to claim 7, characterized in that: One end of the water spout track (3) is slidably connected to a plurality of double-ended spouts (5), and one end of the plurality of double-ended spouts (5) is fixedly connected to a water supply pipe (4).

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