Travelling crane carrying device and wafer packaging equipment

Abstract

The utility model discloses a travelling crane carrying device and a wafer packaging device, the travelling crane carrying device comprises a travelling crane fixing area, a wafer loading area and a wafer packaging area, the travelling crane fixing area is internally provided with the travelling crane carrying device, the travelling crane carrying device comprises a horizontal assembly, a vertical assembly, a clamping assembly, a first dustproof plate and a second dustproof plate, the top of the vertical assembly is movably connected to the horizontal assembly, and the top of the clamping assembly is movably connected to the wafer loading area. The clamping assembly is movably connected to the bottom of the vertical assembly, the first dustproof plate is fixedly arranged on the horizontal assembly and located on the first side, the second dustproof plate is fixedly arranged on the horizontal assembly and located on the second side, and a first height difference exists between the first dustproof plate and the second dustproof plate in the vertical direction; the top of the vertical assembly extends into the first height difference. According to the technical scheme of the utility model, pollutants such as dust, impurities and the like can be prevented from falling into the lower region from the upper region of the equipment and invading into the packaging region for packaging the wafers in the wafer carrying process, so that the wafers are prevented from being polluted in the packaging process, and the internal part of the wafer packaging equipment is clean.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer equipment, and in particular to a crane transport device and wafer packaging equipment. Background Art

[0002] A wafer is the substrate used to manufacture semiconductor transistors or integrated circuits. It is a crystalline material, round in shape, hence the name. The wafer storage basket used in automated wafer processing equipment in the semiconductor industry is a multi-layered, slotted structure.

[0003] Wafer packaging equipment typically uses a crane to transport all wafers within the equipment. However, in traditional packaging equipment, this crane is typically located in the lower area of ​​the equipment. This not only limits the space available for arranging various devices within the equipment, but also prevents dust, impurities, and other contaminants from falling from the upper area of ​​the equipment during wafer transport from entering the packaging area of ​​the wafers, leading to wafer contamination and difficulty in cleaning the equipment. Utility Model Content

[0004] One of the purposes of the present invention is to overcome the deficiencies in the prior art and to provide a crane transport device and wafer packaging equipment in response to the above-mentioned problems in the prior art.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0006] In the first aspect, the utility model provides a vehicle handling device, including a horizontal component, a vertical component, a clamping component, a first dustproof plate and a second dustproof plate, the horizontal component extends in the horizontal direction and has a first side and a second side relative to each other in the front-to-back direction, the vertical component extends in the vertical direction and has a top and a bottom in the vertical direction, the horizontal direction, the vertical direction and the front-to-back direction are perpendicular to each other, the top of the vertical component is movably connected to the horizontal component, the clamping component is movably connected to the bottom of the vertical component, and the clamping component is moved in the vertical and horizontal directions through the vertical component and the horizontal component, the first dustproof plate is fixedly arranged on the horizontal component and is located on the first side, the second dustproof plate is fixedly arranged on the horizontal component and is located on the second side, there is a first height difference between the first dustproof plate and the second dustproof plate in the vertical direction, and the top of the vertical component extends into the first height difference.

[0007] In a preferred embodiment of the present application, the first dustproof plate has an air intake portion, a ventilation portion and an exhaust portion, the exhaust portion is fixed on the horizontal component, the air intake portion and the exhaust portion are connected through the ventilation portion, and the air enters from the air intake portion, flows into the exhaust portion through the ventilation portion, and is finally discharged from the exhaust portion.

[0008] In a preferred embodiment of the present application, the air intake portion has an air inlet, and the air inlet is opened on a side of the air intake portion away from the exhaust portion.

[0009] In a preferred embodiment of the present application, the air inlet portion and the vent portion are open at top ends in the vertical direction.

[0010] In a preferred embodiment of the present application, there is a second height difference between the first bottom surface of the air inlet portion and the second bottom surface of the exhaust portion in the vertical direction and the first bottom surface is higher than the second bottom surface, and the ventilation portion has an inclined bottom surface, which connects the first bottom surface and the second bottom surface.

[0011] In a preferred embodiment of the present application, an exhaust hole is provided on the second bottom surface of the exhaust portion, and air is discharged from the exhaust hole.

[0012] In a preferred embodiment of the present application, there are multiple exhaust holes, which are arranged on the second bottom surface in the form of rows, columns or matrices.

[0013] In a preferred embodiment of the present application, the exhaust portion has a first connecting portion and a second connecting portion, the first connecting portion extends from the second top surface of the exhaust portion to the first side and is connected to the horizontal component on the first side, the second connecting portion extends from the second top surface to the second side and is connected to the horizontal component on the second side, and an avoidance gap is formed between the first connecting portion and the second connecting portion, and the avoidance gap is located below the horizontal component.

[0014] In a preferred embodiment of the present application, the top of the vertical component is movably connected to the second side, the second dustproof plate is higher than the first dustproof plate in the vertical direction, the vertical component is located below the second dustproof plate, and the top of the vertical component is gap-fitted with the second dustproof plate.

[0015] In the second aspect, the utility model provides a wafer packaging device, including a crane fixing area, a wafer loading area and a wafer packaging area, the wafer loading area and the wafer packaging area are located below the crane fixing area, and the crane handling device as described in the first aspect is arranged in the crane fixing area, the horizontal component of the crane handling device is fixedly arranged in the crane fixing area, and the vertical component of the crane handling device extends from the crane fixing area and can drive the clamping component to move back and forth in the horizontal direction between the wafer loading area and the wafer packaging area through the horizontal component.

[0016] The crane handling device and wafer packaging equipment disclosed in the present invention can prevent dust, impurities and other pollutants from falling from the upper area of ​​the equipment into the lower area and invading the packaging area of ​​the packaged wafers during the wafer handling process, thereby ensuring that the wafers are not contaminated during the packaging process and the interior of the wafer packaging equipment is clean. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention is described with the help of the following drawings:

[0018] Figure 1 It is a structural schematic diagram of a wafer packaging device in an embodiment of the present utility model;

[0019] Figure 2 This is a schematic diagram of the three-dimensional structure of the crane transport device in an embodiment of the present utility model;

[0020] Figure 3 This is a side structural diagram of a crane transport device according to an embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of the bottom structure of the crane transport device in an embodiment of the present utility model;

[0022] Figure 5 This is a front structural diagram of the first dustproof plate in the crane transport device according to an embodiment of the present invention;

[0023] Figure 6 It is a schematic diagram of the back structure of the first dustproof plate in the crane transport device in the embodiment of the present utility model.

[0024] Reference numerals:

[0025] 1- Crane fixed area; 2- Wafer loading area; 3- Wafer packaging area; 4- Crane handling device; 5- Basket; 6- Material basket; 7- Wafer;

[0026] 10-horizontal component; 11-first side; 12-second side; 20-vertical component; 21-top; 22-bottom; 30-clamping component; 40-first dustproof plate; 41-air inlet; 42-ventilation; 43-exhaust; 44-first bottom surface; 45-second bottom surface; 46-slanted bottom surface; 47-exhaust hole; 48-first connecting part; 49-second connecting part; 50-second dustproof plate; 60-air inlet; 70-avoidance gap; H1-first height difference; H2-second height difference; D1-horizontal direction; D2-vertical direction; D3-front and back direction. DETAILED DESCRIPTION

[0027] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0028] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0029] like Figure 1 As shown, an embodiment of the present invention provides a wafer 7 packaging device, including a crane fixing area 1, a wafer loading area 2 and a wafer packaging area 3. The wafer loading area 2 and the wafer packaging area 3 are located below the crane fixing area 1. A crane transport device 4 is provided in the crane fixing area 1. The crane transport device 4 includes a horizontal component 10, a vertical component 20, a clamping component 30, a first dustproof plate 40 and a second dustproof plate 50. Figure 2 As shown. The horizontal component 10 of the traveling crane transporting device 4 is fixedly set in the traveling crane fixed area 1, and the vertical component 20 of the traveling crane transporting device 4 extends out from the traveling crane fixed area 1 and can drive the clamping component 30 to move back and forth along the horizontal direction D1 between the wafer loading area 2 and the wafer packaging area 3 through the horizontal component 10. By setting the traveling crane transporting device 4 in the traveling crane fixed area 1 in the upper area of ​​the wafer 7 packaging equipment, the horizontal component 10 of the traveling crane transporting device 4 is located above the wafer loading area 2 and the wafer packaging area 3, and the vertical component 20 can move back and forth between the wafer loading area 2 and the wafer packaging area 3. In conjunction with the first dustproof plate 40 and the second dustproof plate 50, dust, impurities and other pollutants can be isolated outside the wafer loading area 2 and the wafer packaging area 3, preventing the wafer 7 from being contaminated during the packaging process and affecting the packaging effect of the wafer 7.

[0030] See also Figure 2 、 Figure 3 and Figure 4In the traveling transport device 4 of the present embodiment, the horizontal component 10 extends along the horizontal direction D1 and has a first side 11 and a second side 12 opposite to each other in the front-to-back direction D3. The vertical component 20 extends along the vertical direction D2 and has a top 21 and a bottom 22 in the vertical direction D2. The horizontal direction D1, the vertical direction D2 and the front-to-back direction D3 are perpendicular to each other. The top 21 of the vertical component 20 is movably connected to the horizontal component 10. The clamping component 30 is movably connected to the bottom 22 of the vertical component 20. The clamping component 30 is moved in the vertical direction D2 and the horizontal direction D1 through the vertical component 20 and the horizontal component 10. The clamping component 30 can be used to clamp and transport the basket 5. The basket 6 is placed in the basket 5, and the basket 6 is loaded with wafers 7. When the wafer 7 packaging equipment starts working, the clamping component 30 is at the bottom 22 of the vertical component 20. The components 20 and the horizontal component 10 are moved to the wafer cargo area 2 to prepare for transporting the basket 5. After the clamping component 30 moves into place, the clamping basket 5 begins to be transported. The position is adjusted in the vertical direction D2 by the vertical component 20, so that the basket 5 is in place in the vertical direction D2 before entering the wafer packaging area 3. Then the position is adjusted in the horizontal direction D1 by the horizontal component 10, so that the basket 5 enters the wafer packaging area 3 to perform the corresponding process, and the clamping component 30 can also fine-tune the position of the basket 5 in the front-to-back direction D3 perpendicular to the vertical direction D2 and the horizontal direction D1. Through the above-mentioned movement method, the vertical component 20, the horizontal component 10 and the clamping component 30 jointly realize the movement of the basket 5 in the three degrees of freedom of the vertical direction D2, the horizontal direction D1 and the front-to-back direction D3, which can basically meet the requirements of the wafer 7 being able to move to various areas in the wafer 7 packaging equipment. The first dustproof plate 40 is fixedly provided on the horizontal component 10 and is located on the first side 11, and the second dustproof plate 50 is fixedly provided on the horizontal component 10 and is located on the second side 12. There is a first height difference H1 between the first dustproof plate 40 and the second dustproof plate 50 in the vertical direction D2, and the top 21 of the vertical component 20 extends into the first height difference H1. By arranging the first dustproof plate 40 and the second dustproof plate 50 up and down and being arranged on both sides of the horizontal component 10, all dust, impurities and other pollutants above the horizontal component 10 can be isolated to prevent them from invading the wafer cargo area 2 and the wafer packaging area 3, and will not affect the movement of the vertical component 20 on the horizontal component 10. The top 21 of the vertical component 20 is extended into and fills the space of the first height difference H1, which makes full use of the thickness of the horizontal component 10 in the vertical direction D2 and saves space in the wafer 7 packaging equipment.The top 21 of the vertical component 20 is movably connected to the second side 12, the second dustproof plate 50 is higher than the first dustproof plate 40 in the vertical direction D2, the vertical component 20 is located below the second dustproof plate 50, and the gap between the top 21 of the vertical component 20 and the second dustproof plate 50 is matched, which neither affects the movement of the vertical component 20 on the horizontal component 10, nor avoids the friction between the vertical component 20 and the second dustproof plate 50 during movement to generate contaminants that invade the wafer packaging area 3 below and contaminate the wafer 7 and equipment.

[0031] See also Figure 5 and Figure 6 The first dustproof plate 40 has an air intake portion 41, a ventilation portion 42 and an exhaust portion 43. The exhaust portion 43 is fixed on the horizontal component 10. The air intake portion 41 and the exhaust portion 43 are connected through the ventilation portion 42. After entering from the air intake portion 41, the air flows into the exhaust portion 43 through the ventilation portion 42 and is finally discharged from the exhaust portion 43. The air duct through the air intake portion 41, the ventilation portion 42 and the exhaust portion 43 can achieve the dustproof function without affecting the air circulation performance inside the wafer 7 packaging equipment.

[0032] In the first dustproof plate 40, the air inlet portion 41 and the air vent portion 42 are open at the top ends in the vertical direction D2. Figure 5 As shown, the air flow area of ​​the air in the air inlet 41 and the vent 42 can be significantly larger than the air flow area of ​​the air in the exhaust 43, so that the air flow rate can be significantly accelerated after entering the exhaust 43, thereby facilitating air circulation. The air inlet 41 has an air inlet 60, which is opened on the side of the air inlet 41 away from the exhaust 43. Figure 3 、 Figure 5 and Figure 6 A second height difference H2 is formed between the first bottom surface 44 of the air inlet portion 41 and the second bottom surface 45 of the air outlet portion 43 in the vertical direction D2, and the first bottom surface 44 is higher than the second bottom surface 45. The air vent portion 42 has an inclined bottom surface 46, which connects the first bottom surface 44 and the second bottom surface 45 and is used to guide air from the air inlet portion 41 to the air vent portion 42 and then to the air outlet portion 43. Figure 4 and Figure 6 The second bottom surface 45 of the exhaust portion 43 is provided with exhaust holes 47, through which air is discharged. Dust, impurities and other pollutants of a certain size can be isolated through the exhaust holes 47. There are multiple exhaust holes 47, which are arranged in rows, columns or a matrix on the second bottom surface 45. This can further increase the size of pollutants that can be isolated without affecting the ventilation performance. Figure 3 and Figure 5The exhaust portion 43 has a first connection portion 48 and a second connection portion 49. The first connection portion 48 extends from the second top surface of the exhaust portion 43 to the first side 11 and is connected to the horizontal component 10 on the first side 11. The second connection portion 49 extends from the second top surface to the second side 12 and is connected to the horizontal component 10 on the second side 12. An avoidance gap 70 is formed between the first connection portion 48 and the second connection portion 49. The avoidance gap 70 is located below the horizontal component 10. This structural design can not only save space inside the equipment in the front-to-back direction D3, but also prevent dust, impurities and other pollutants generated by the horizontal component 10 during operation from falling into the wafer cargo area 2 and the wafer packaging area 3 through the avoidance gap 70, thereby effectively isolating pollutants and further ensuring the cleanliness of the inside of the wafer 7 packaging equipment.

[0033] The crane handling device and wafer packaging equipment disclosed in the present invention can prevent dust, impurities and other pollutants from falling from the upper area of ​​the equipment into the lower area and invading the packaging area of ​​the packaged wafers during the wafer handling process, thereby ensuring that the wafers are not contaminated during the packaging process and the interior of the wafer packaging equipment is clean.

[0034] It should be understood that the above description of the specific embodiments of the present invention is merely for the purpose of illustrating the technical approach and features of the present invention. Its purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. However, the present invention is not limited to the above-described specific embodiments. Any changes or modifications made within the scope of the claims of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A driving transport device, characterized in that: The support frame comprises a horizontal component, a vertical component, a clamping component, a first dustproof plate and a second dustproof plate, the horizontal component extends in the horizontal direction and has a first side and a second side relative to each other in the front-to-back direction, the vertical component extends in the vertical direction and has a top and a bottom in the vertical direction, the horizontal direction, the vertical direction and the front-to-back direction are perpendicular to each other, the top of the vertical component is movably connected to the horizontal component, the clamping component is movably connected to the bottom of the vertical component, the clamping component is moved in the vertical and horizontal directions through the vertical component and the horizontal component, the first dustproof plate is fixedly arranged on the horizontal component and is located on the first side, the second dustproof plate is fixedly arranged on the horizontal component and is located on the second side, there is a first height difference between the first dustproof plate and the second dustproof plate in the vertical direction, and the top of the vertical component extends into the first height difference.

2. The vehicle transport device according to claim 1, characterized in that: The first dustproof plate has an air intake portion, a ventilation portion and an exhaust portion. The exhaust portion is fixed on the horizontal component. The air intake portion and the exhaust portion are connected through the ventilation portion. After entering from the air intake portion, the air flows into the exhaust portion through the ventilation portion and is finally discharged from the exhaust portion.

3. The vehicle transport device according to claim 2, characterized in that: The air inlet portion has an air inlet, and the air inlet is opened on a side of the air inlet portion away from the exhaust portion.

4. The vehicle transport device according to claim 2, characterized in that: The air inlet portion and the air vent portion are open at top ends in the vertical direction.

5. The vehicle transport device according to claim 2, characterized in that: There is a second height difference between the first bottom surface of the air intake portion and the second bottom surface of the air exhaust portion in the vertical direction, and the first bottom surface is higher than the second bottom surface. The vent portion has an inclined bottom surface connecting the first bottom surface and the second bottom surface.

6. The vehicle transport device according to claim 2, characterized in that: An exhaust hole is provided on the second bottom surface of the exhaust portion, and air is exhausted from the exhaust hole.

7. The vehicle transport device according to claim 6, characterized in that: There are multiple exhaust holes, which are arranged on the second bottom surface in the form of rows, columns or matrices.

8. The vehicle transport device according to claim 2, characterized in that: The exhaust portion has a first connecting portion and a second connecting portion, the first connecting portion extends from the second top surface of the exhaust portion to the first side and is connected to the horizontal component on the first side, the second connecting portion extends from the second top surface to the second side and is connected to the horizontal component on the second side, and an avoidance gap is formed between the first connecting portion and the second connecting portion, and the avoidance gap is located below the horizontal component.

9. The vehicle transport device according to claim 1, characterized in that: The top of the vertical component is movably connected to the second side, the second dustproof plate is higher than the first dustproof plate in the vertical direction, the vertical component is located below the second dustproof plate, and the top of the vertical component is gap-fitted with the second dustproof plate.

10. A wafer packaging device, characterized in that: It includes a crane fixing area, a wafer loading area and a wafer packaging area, the wafer loading area and the wafer packaging area are located below the crane fixing area, and the crane handling device according to any one of claims 1 to 9 is provided in the crane fixing area, the horizontal component of the crane handling device is fixedly provided in the crane fixing area, the vertical component of the crane handling device extends from the crane fixing area and can drive the clamping component to move back and forth in the horizontal direction between the wafer loading area and the wafer packaging area through the horizontal component.

Images