Circuit board
By setting multiple heat dissipation plates and heat dissipation holes in the circuit board substrate, the bonding force between the heat dissipation block and the substrate is optimized, the problem of blistering in the interface area between the heat dissipation block and the substrate is solved, the thermal conductivity and heat dissipation efficiency of the circuit board are improved, the circuit board is prevented from being scrapped, and the service life is extended.
Patent Information
- Application Number
- CN202422380060.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-09-27
AI Technical Summary
The interface between the heat sink and the substrate in existing circuit boards is poorly bonded, which can easily cause blistering during reflow soldering and affect product yield.
A plurality of first heat dissipation plates are arranged in the substrate, surrounding the heat dissipation block, and the distance between the heat dissipation plates and the heat dissipation block is 14mil≤D1≤24mil. Combined with the arrangement of the heat dissipation holes and the second heat dissipation plates, the heat dissipation effect and thermal expansion protection are optimized.
It effectively inhibits blistering at the interface between the heat sink and the substrate, improves the thermal conductivity and heat dissipation efficiency of the circuit board, prevents the circuit board from being scrapped, extends its service life and improves product yield.
Smart Images
Figure CN223348842U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board. Background Art
[0002] In order to improve the thermal conductivity and heat dissipation efficiency of the circuit board, a heat sink is usually embedded in the substrate.
[0003] Figure 1 This is a partial schematic diagram of a circuit board in the prior art, such as Figure 1 As shown, due to the poor bonding strength between the heat sink 20' and the substrate 10', bubbles are easily generated in the interface between the heat sink and the substrate during reflow due to the high temperature accumulation, resulting in defective products being scrapped.
[0004] Therefore, it is urgent to propose a technical solution that can suppress bubbling in the interface area between the heat sink and the substrate. Utility Model Content
[0005] The utility model provides a circuit board, which can suppress blistering in the interface area between a heat dissipation block and a base plate, thereby improving product yield.
[0006] The embodiment of the utility model provides a circuit board, comprising: a substrate and a heat dissipation block embedded in the substrate;
[0007] The base plate includes a plurality of first heat dissipation plates, and the first heat dissipation plates surround at least a portion of the heat dissipation block;
[0008] The minimum distance D1 between the first heat dissipation plate and the heat dissipation block satisfies: 14 mil≤D1≤24 mil.
[0009] Optionally, a shape formed by the plurality of first heat dissipation plates is the same as a shape of the heat dissipation block.
[0010] Optionally, the first heat dissipation plate includes a plurality of independently arranged heat dissipation units;
[0011] In the same first heat sink, the connecting line outline of the plurality of heat sinks is a circular ring, and the inner diameter R1 of the first heat sink satisfies: 15mil≤R1≤25mil; the outer diameter R2 of the first heat sink satisfies: 28mil≤R2≤38mil.
[0012] Optionally, in the same first heat dissipation plate, a gap D2 between two adjacent heat dissipation units satisfies: 8 mil ≤ D2 ≤ 12 mil.
[0013] Optionally, the distance D3 between two adjacent first heat dissipation plates satisfies: 10 mil ≤ D3 ≤ 40 mil.
[0014] Optionally, the circuit board further includes a plurality of independently arranged heat dissipation holes;
[0015] The heat dissipation hole passes through the substrate and surrounds at least a portion of the heat dissipation block.
[0016] Optionally, the first heat dissipation plate includes a plurality of independently arranged heat dissipation units;
[0017] The plurality of heat dissipation units in the same first heat dissipation plate surround one heat dissipation hole.
[0018] Optionally, the substrate further includes at least one second heat dissipation plate;
[0019] The second heat dissipation plate includes a plurality of independently arranged heat dissipation units;
[0020] The second heat dissipation plate is located between two adjacent first heat dissipation plates; and the number of the heat dissipation units in the second heat dissipation plate is less than the number of the heat dissipation units in the first heat dissipation plate.
[0021] Optionally, the number N1 of the heat dissipation units in the same first heat dissipation plate satisfies: N1 ≥ 3;
[0022] The number N2 of the heat dissipation units in the same second heat dissipation plate satisfies: N1≥2.
[0023] Optionally, the heat dissipation block includes a copper block.
[0024] The technical solution provided by the embodiment of the present invention is to provide a heat sink in the substrate of the circuit board, thereby improving the thermal conductivity and heat dissipation efficiency of the circuit board. By providing multiple first heat sinks in the substrate, the first heat sinks surround at least a portion of the heat sink, and the minimum distance D1 between the first heat sink and the heat sink satisfies the following: 14mil≤D1≤24mil. In other words, the first heat sink is located in the substrate near the heat sink. In this way, the first heat sink can further achieve a heat dissipation effect, prevent heat accumulation and local thermal expansion, and thus suppress blistering at the interface between the heat sink and the substrate during reflow soldering, thereby preventing the circuit board from being scrapped and improving product yield. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 It is a partial schematic diagram of a circuit board in the prior art;
[0026] Figure 2 A partial top view of a first circuit board provided in an embodiment of the present utility model;
[0027] Figure 3 is an enlarged schematic diagram of the first heat dissipation plate;
[0028] Figure 4A partial top view of a second circuit board provided in an embodiment of the present utility model;
[0029] Figure 5 A partial top view of a third circuit board provided in an embodiment of the present utility model;
[0030] Figure 6 A partial top view of a fourth circuit board provided in an embodiment of the present utility model. DETAILED DESCRIPTION
[0031] In order to help those skilled in the art better understand the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.
[0032] It should be noted that the terms "first," "second," and the like in the specification and claims of the present invention and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, such that the embodiments of the present invention described herein can be implemented in an order other than that illustrated or described herein.
[0033] Figure 2 A partial top view of the first circuit board provided in the embodiment of the present utility model is shown as follows: Figure 2 As shown, the circuit board includes: a substrate 10 and a heat sink 20 embedded in the substrate 10; the substrate 10 includes a plurality of first heat sinks 101, and the first heat sinks 101 surround at least part of the heat sink 20; the minimum distance D1 between the first heat sink 101 and the heat sink 20 satisfies: 14mil≤D1≤24mil.
[0034] Specifically, a groove matching the heat dissipation block 20 is opened in the substrate 10 so that the heat dissipation block 20 can be embedded in the substrate 10 to achieve heat conduction and heat dissipation functions during operation of the circuit board.
[0035] Specifically, for ease of presentation, Figure 2 The heat dissipation block 20 is enlarged in the substrate 10 . In fact, the heat dissipation block 20 is only a part of the circuit board, and other devices are also arranged on the substrate.
[0036] Specifically, a first heat sink 101 is provided in the area of the substrate 10 near the heat sink 20 to increase the heat dissipation area so that heat is transferred from the heat sink 20 to the circuit board more quickly and then transferred to the outside world through the air. By providing the first heat sink 101, heat accumulation and local thermal expansion can be prevented, so that blistering in the interface area between the heat sink and the substrate can be suppressed during reflow soldering. Furthermore, the first heat sink 101 surrounds at least part of the heat sink 20, that is, the first heat sink 101 can be located on one side, two sides, three sides or even all four sides of the heat sink 20. Preferably, the first heat sink 101 surrounds the heat sink 20, which is conducive to ensuring that the first heat sink 101 fully disperses the heat, thereby avoiding heat concentration and reducing thermal stress caused by temperature gradients, thereby suppressing blistering in the interface area between the heat sink and the substrate, preventing the circuit board from being scrapped, and improving product yield.
[0037] Specifically, the minimum distance D1 between the first heat sink 101 and the heat sink 20 satisfies: 14mil≤D1≤24mil. In this way, the distance between the first heat sink 101 and the heat sink 20 is moderate, which can ensure the heat dissipation effect and prevent bubbling in the interface area between the heat sink and the substrate. For example, when D1>24mil, it means that the distance between the first heat sink 101 and the heat sink 20 is too far, which will affect the heat dissipation effect. For example, when D1<14mil, it means that the distance between the first heat sink 101 and the heat sink 20 is too close, which will cause excessive heat concentration, thereby generating stress and affecting the reliability and stability of the circuit board. In addition, the close distance between the first heat sink 101 and the heat sink 20 will also lead to insufficient melting of the solder paste or poor formation of solder joints, affecting the welding quality and causing problems such as mutual squeezing between the first heat sink 101 and the heat sink 20 due to thermal expansion.
[0038] The circuit board provided in the embodiment of the present invention improves the thermal conductivity and heat dissipation efficiency of the circuit board by disposing a heat sink in the substrate of the circuit board. Multiple first heat sinks are provided in the substrate, the first heat sinks surround at least a portion of the heat sink, and the minimum distance D1 between the first heat sink and the heat sink satisfies the following: 14 mil ≤ D1 ≤ 24 mil. That is, the first heat sink is located in the substrate near the heat sink. Thus, the first heat sink can further achieve a heat dissipation effect, preventing heat accumulation and local thermal expansion. Furthermore, during reflow soldering, blistering at the interface between the heat sink and the substrate can be suppressed, thereby preventing the circuit board from being scrapped and improving product yield.
[0039] Optional, continue to refer to Figure 2 The shape formed by the multiple first heat dissipation plates 101 is the same as the shape of the heat dissipation block 20 .
[0040] Specifically, the shape of the heat sink 20 is generally a rounded rectangle, and the shape formed by multiple first heat sinks 101 around the heat sink 20 is also a rounded rectangle. This can better achieve the heat dissipation function and prevent stress concentration and thermal expansion problems around the heat sink 20 and the first heat sink 101.
[0041] Optional, Figure 3 This is an enlarged schematic diagram of the first heat sink. Figure 2 and Figure 3 The first heat sink 101 includes a plurality of independently arranged heat sink units 1011; in the same first heat sink 101, the connecting line outline of the plurality of heat sink units 1011 is a circular ring, and the inner diameter R1 of the first heat sink 101 satisfies: 15mil≤R1≤25mil; the outer diameter R2 of the first heat sink 101 satisfies: 28mil≤R2≤38mil.
[0042] Specifically, in the same first heat sink 101, the connecting line outline of multiple heat dissipation units 1011 is a circular ring, that is, each heat dissipation unit 1011 is arc-shaped, and the end of each heat dissipation unit 1011 is arc-shaped, similar to a crescent shape, which can promote air flow and allow heat to dissipate to the surrounding environment faster.
[0043] Specifically, the contour line of each heat dissipation unit 1011 on the side closest to the heat dissipation block 20 coincides with the inner ring line of the circular ring, and the contour line on the side away from the heat dissipation block 20 coincides with the outer ring line of the circular ring. Within the same first heat dissipation plate 101, the inner diameter R1 satisfies the following conditions: 15 mil ≤ R1 ≤ 25 mil, and the outer diameter R2 satisfies the following conditions: 28 mil ≤ R2 ≤ 38 mil. This ensures that the first heat dissipation plate 101 is of appropriate size, facilitating heat dissipation and stress relief, thereby ensuring the stability and reliability of the circuit board.
[0044] Optional, continue to refer to Figure 3 In the same first heat dissipation plate 101 , the gap D2 between two adjacent heat dissipation units 1011 satisfies: 8 mil ≤ D2 ≤ 12 mil.
[0045] Specifically, in the same first heat sink 101, the gap between two adjacent heat dissipation units 1011 can be understood as the distance between the arc-shaped protrusions of the two adjacent heat dissipation units 1011. Furthermore, 8 mil ≤ D2 ≤ 12 mil ensures that the gap between two adjacent heat dissipation units 1011 is moderate, which not only facilitates heat dissipation through the gap, but also reduces stress between the heat dissipation units 1011, thereby ensuring the stability and reliability of the circuit board.
[0046] For example, when D2 is less than 8 mil, it indicates that the gap between two adjacent heat dissipation units 1011 in the same first heat dissipation plate 101 is too small, heat dissipation through the gap is not utilized, and stress accumulation and thermal expansion will occur in the same first heat dissipation plate 101, thereby affecting the heat dissipation performance of the circuit board.
[0047] When D2>12 mil, it means that the gap between two adjacent heat dissipation units 1011 in the same first heat dissipation plate 101 is too large, which will affect the heat dissipation effect.
[0048] Exemplarily, D2=10 mil.
[0049] Optional, continue to refer to Figure 2 , the distance D3 between two adjacent first heat dissipation plates 101 satisfies: 10mil≤D3≤40mil.
[0050] Specifically, the distance D3 between two adjacent first heat dissipation plates 101 satisfies: 10mil≤D3≤40mil. In this way, the distance between two adjacent first heat dissipation plates 101 is moderate, which is conducive to heat dissipation, prevents heat accumulation and local thermal expansion, and thus prevents bubbling in the interface area between the heat dissipation block 20 and the substrate 10, thereby preventing the circuit board from being scrapped and improving product yield.
[0051] For example, when D3 is less than 10 mil, it indicates that the distance between two adjacent first heat dissipation plates 101 is small. Thus, stress accumulation and thermal expansion may occur between the two adjacent first heat dissipation plates 101 , thereby affecting the heat dissipation performance of the circuit board.
[0052] When D3>40mil, it means that the distance between two adjacent first heat dissipation plates 101 is large, which will affect the heat dissipation effect.
[0053] It is understandable that the distance between two adjacent first heat dissipation pads may be equal or unequal.
[0054] Optional, Figure 4 A partial top view of the second circuit board provided in the embodiment of the present invention is shown as follows: Figure 4 As shown, the circuit board further includes a plurality of independently arranged heat dissipation holes 30 ; the heat dissipation holes 30 penetrate the substrate, and the heat dissipation holes 30 surround at least a portion of the heat dissipation block 20 .
[0055] Specifically, by setting heat dissipation holes 30 around the heat dissipation block 20, on the one hand, the heat dissipation effect can be further improved to prevent the circuit board from overheating, thereby extending the life of the circuit board; on the other hand, stress can be reduced to avoid the circuit board from cracking due to uneven thermal expansion.
[0056] It is understandable that the heat dissipation holes 30 can be located on one side, two sides, three sides or even all four sides of the substrate 10 close to the heat dissipation block 20. Preferably, the heat dissipation holes 30 are located around the copper block to improve the heat dissipation effect.
[0057] Exemplarily, the heat dissipation holes 30 may be located on a side of the first heat dissipation plate 101 away from the heat dissipation block 20 , that is, the heat dissipation holes 30 are located on an outer ring of the first heat dissipation plate 101 . Figure 5 Only one circle of heat dissipation holes 30 is shown. It is understandable that the number of heat dissipation holes 30 can also be two circles or even more, and the embodiment of the present invention does not specifically limit this.
[0058] Optional, Figure 5 A partial top view of a third circuit board provided in an embodiment of the present invention is shown in FIG. Figure 5 As shown, the first heat dissipation plate 101 includes a plurality of independently arranged heat dissipation units 1011 ; the plurality of heat dissipation units 1011 in the same first heat dissipation plate 101 surround one heat dissipation hole 30 .
[0059] Specifically, multiple heat dissipation units 1011 within the same first heat sink 101 surround a single heat dissipation hole 30. That is, the heat dissipation hole 30 is located within the first heat sink 101, and the multiple heat dissipation units 1011 surround the single heat dissipation hole 30. This provides a larger surface area for the heat sink, allowing heat to be quickly transferred from the heating element to the circuit board and effectively dissipated through the heat dissipation hole. Furthermore, the multiple heat dissipation units 1011 within the same first heat sink 101 surround the single heat dissipation hole 30, ensuring uniform heat dissipation and preventing local overheating, thereby improving the stability and reliability of the circuit board.
[0060] Optional, Figure 6 A partial top view of a fourth circuit board provided in an embodiment of the present invention is shown in FIG. Figure 6 As shown, the substrate 10 also includes at least one second heat dissipation plate 102; the second heat dissipation plate 102 includes a plurality of independently arranged heat dissipation units 1011; there is a second heat dissipation plate 102 located between two adjacent first heat dissipation plates 101; the number of heat dissipation units 1011 in the second heat dissipation plate 102 is less than the number of heat dissipation units 1011 in the first heat dissipation plate 101.
[0061] Specifically, when the distance between two adjacent first heat sinks 101 is large, a second heat sink 102 may be arranged between the two adjacent first heat sinks. Since the number of heat dissipation units 1011 in the second heat sink 102 is less than the number of heat dissipation units 1011 in the first heat sink 101, that is, the heat sink 20 may not be evenly surrounded by first heat sinks 101, and a second heat dissipation unit 102 may be located between two adjacent first heat sinks 101. This can satisfy the heat dissipation effect on the one hand, and achieve diversified settings for the circuit board on the other.
[0062] For example, if the distance between two adjacent first heat dissipation plates exceeds 40 mil, a second heat dissipation plate may be added between the two adjacent first heat dissipation plates.
[0063] For example, the first heat dissipation plates and the second heat dissipation plates may be arranged alternately around the heat dissipation block 20 .
[0064] Optional, continue to refer to Figure 6 , the number N1 of the heat dissipation units 1011 in the same first heat dissipation plate 101 satisfies: N1≥3; the number N2 of the heat dissipation units 1011 in the same second heat dissipation plate 102 satisfies: N1≥2.
[0065] Specifically, the number of the heat dissipation units 1011 in the second heat dissipation unit 102 is less than the number of the heat dissipation units 1011 in the first heat dissipation plate 101 . This can satisfy the heat dissipation effect on the one hand, and on the other hand, the preparation method of the second heat dissipation plate 102 is simple.
[0066] For example, the number of the heat dissipation units 1011 in the first heat dissipation plate 101 may be four, and the number of the heat dissipation units 1011 in the second heat dissipation plate 102 may be two.
[0067] Optional, continue to refer to Figure 2 , the heat dissipation block 20 includes a copper block.
[0068] Specifically, the copper block has a much higher thermal conductivity than the PCB dielectric layer, allowing it to more effectively transfer heat generated by the power devices to the PCB and dissipate it through the heat sink. Furthermore, through the copper block's conduction, heat can be quickly dissipated to the outside, effectively reducing component temperatures.
[0069] In summary, the circuit board provided by the embodiment of the present invention has a heat sink block arranged in the substrate of the circuit board, which can improve the thermal conductivity and heat dissipation efficiency of the circuit board. By arranging a plurality of first heat sinks in the substrate, the first heat sink surrounds at least part of the heat sink, and the minimum distance D1 between the first heat sink and the heat sink satisfies: 14mil≤D1≤24mil, that is, the first heat sink is located in the substrate close to the heat sink, so that the first heat sink can further achieve the heat dissipation effect, prevent heat accumulation and local thermal expansion, and then during reflow soldering, can suppress bubbling in the interface area between the heat sink and the substrate, thereby preventing the circuit board from being scrapped and improving the product yield. In addition, by arranging a second heat sink and heat dissipation holes, the heat dissipation effect can be further improved, the service life of the circuit board can be extended, and it is beneficial to ensure the stability and reliability of the circuit board.
[0070] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will appreciate that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, combinations, and substitutions are possible for those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the scope of the present invention. The scope of the present invention is determined by the scope of the appended claims.
Claims
1. A circuit board, characterized in that: include: a base plate and a heat sink embedded in the base plate; The base plate includes a plurality of first heat dissipation plates, and the first heat dissipation plates surround at least a portion of the heat dissipation block; The minimum distance D1 between the first heat dissipation plate and the heat dissipation block satisfies: 14 mil≤D1≤24 mil.
2. The circuit board according to claim 1, wherein: The shape formed by the plurality of first heat dissipation plates is the same as the shape of the heat dissipation block.
3. The circuit board according to claim 1, wherein: The first heat dissipation plate includes a plurality of independently arranged heat dissipation units; In the same first heat sink, the connecting line outline of the plurality of heat sinks is a circular ring, and the inner diameter R1 of the first heat sink satisfies: 15mil≤R1≤25mil; the outer diameter R2 of the first heat sink satisfies: 28mil≤R2≤38mil.
4. The circuit board according to claim 3, wherein: In the same first heat dissipation plate, a gap D2 between two adjacent heat dissipation units satisfies: 8 mil ≤ D2 ≤ 12 mil.
5. The circuit board according to claim 1, wherein: The distance D3 between two adjacent first heat dissipation plates satisfies: 10 mil ≤ D3 ≤ 40 mil.
6. The circuit board according to claim 1, wherein: The circuit board also includes a plurality of independently arranged heat dissipation holes; The heat dissipation hole passes through the substrate and surrounds at least a portion of the heat dissipation block.
7. The circuit board according to claim 6, wherein: The first heat dissipation plate includes a plurality of independently arranged heat dissipation units; The plurality of heat dissipation units in the same first heat dissipation plate surround one heat dissipation hole.
8. The circuit board according to claim 7, wherein: The substrate further includes at least one second heat dissipation plate; The second heat dissipation plate includes a plurality of independently arranged heat dissipation units; The second heat dissipation plate is located between two adjacent first heat dissipation plates; and the number of the heat dissipation units in the second heat dissipation plate is less than the number of the heat dissipation units in the first heat dissipation plate.
9. The circuit board according to claim 8, wherein: The number N1 of the heat dissipation units in the same first heat dissipation plate satisfies: N1 ≥ 3; The number N2 of the heat dissipation units in the same second heat dissipation plate satisfies: N1≥2.
10. The circuit board according to claim 1, wherein: The heat dissipation block includes a copper block.