Heat dissipation plate convenient to use

Abstract

The utility model relates to the technical field of heat dissipation plates, and discloses a heat dissipation plate convenient to use, a water cooling groove is arranged in a heat dissipation plate body, a cavity boss is arranged on the upper portion of the heat dissipation plate body, a heat dissipation flow guide seat is communicated and installed in the middle of a backflow side liquid supply guide pipe through a sealing side seat, and the cavity boss is correspondingly attached to a heating device after installation. Overall conduction and heat dissipation of elements on the upper portion of the circuit board can be achieved, the heat dissipation structure and the circuit board body are integrally installed, installation is convenient, the water cooling groove is formed close to a cavity boss according to element distribution, the heat dissipation efficiency of the board body can be effectively improved, the heat dissipation auxiliary assembly is arranged on the backflow pipeline side of the liquid supply guide pipe, and the heat dissipation efficiency is improved. The water cooling liquid is shunted and dredged through the flow guide holes formed in the middle of the heat dissipation flow guide base, the contact area of the heat dissipation flow guide base and the water cooling liquid is increased, the heat dissipation flow guide base is matched with the heat dissipation fins to conduct auxiliary dissipation on heat of the water cooling liquid, the temperature of the backflow water cooling liquid can be reduced, and the heat dissipation efficiency of the heat dissipation plate can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation plates, in particular to a heat dissipation plate that is easy to use. Background Art

[0002] The heat sink is a plate-type heat dissipation structure with excellent heat dissipation performance. The heat sink is mostly made of excellent thermal conductive materials. The plate-base structure is used to conduct heat, and the heat is taken away by the heat dissipation medium through ventilation cooling or water cooling. Through heat conduction and exchange, it can ensure effective heat dissipation and cooling of electrical components.

[0003] Nowadays, for products with high heat generation, most of them adopt water cooling, that is, placing a water cooling plate at the bottom of the product, making the bottom of the product close to the water cooling plate, and conducting heat into the water cooling plate by heat conduction to achieve the purpose of heat dissipation. The water cooling plate is large in size and occupies a large space. In addition, due to the large number of components, multiple water cooling plate structures need to be used. When installing the product on the water cooling plate, in order to prevent gaps from appearing, thermal grease (or thermal conductive pads) need to be applied. Not only is the installation operation very inconvenient, but it also leads to a decrease in the heat dissipation speed, thereby affecting the overall heat dissipation effect of the product. Moreover, the water cooling structure is only distributed near the heat-generating device, and cannot effectively conduct heat dissipation to other components, resulting in poor heat dissipation effect. Therefore, a heat dissipation plate that is easy to use is proposed. Summary of the Invention

[0004] The purpose of the present invention is to provide a heat dissipation plate that is easy to use, so as to solve the problems raised in the above background technology.

[0005] To achieve the above objectives, the present invention provides the following technical solutions: a heat sink that is easy to use, comprising a heat sink body and a water cooling mechanism, wherein a water cooling tank is provided inside the heat sink body, a cavity boss is provided on the upper portion of the heat sink body, and a thermally conductive adhesive pad is provided on the upper portion of the cavity boss;

[0006] The water cooling mechanism includes a liquid supply pipe, a water cooler and a heat dissipation auxiliary component. The water cooler is installed in communication with the water cooling tank through the liquid supply pipe. The heat dissipation auxiliary component includes a sealing edge seat and a heat dissipation guide seat. The heat dissipation guide seat is installed in the middle of the return side liquid supply pipe through the sealing edge seat. The middle of the heat dissipation guide seat is evenly provided with guide holes, and the outer peripheral side of the heat dissipation guide seat is evenly provided with heat dissipation fins.

[0007] Preferably, mounting screw holes are evenly provided on the sides of the heat dissipation plate body, mounting bolts are provided inside the mounting screw holes, and the heat dissipation plate body is fixed to the upper part of the equipment bracket by the mounting bolts. The upper part of the heat dissipation plate body is provided with mounting pillars, and the upper part of the mounting pillars is installed with a circuit board by bolts.

[0008] Preferably, there are multiple cavity bosses, and several of the cavity bosses are fixedly arranged on the upper part of the heat dissipation plate body according to the distribution of components on the upper part of the circuit board. The thermal conductive adhesive pad is fixedly fitted on the upper part of the cavity boss, and the components on the upper part of the circuit board are in contact with the thermal conductive adhesive pad.

[0009] Preferably, the heat dissipation plate body is divided into two parts, the water cooling grooves of the two parts are fixedly connected to form an integrated plate seat structure, and the water cooling grooves are opened in the middle of the interlayer between the upper and lower heat dissipation plate bodies.

[0010] Preferably, a liquid inlet interface and a return interface are provided on the side of the above-mentioned heat dissipation plate body, and the liquid inlet interface and the return interface are respectively connected to the two opening sides of the water cooling tank, and the liquid inlet interface and the return interface are respectively connected to the liquid outlet end and the liquid inlet end of the water cooling machine through the liquid supply conduit.

[0011] Preferably, the number of the above-mentioned sealing side seats is two, and the heat dissipation guide seat is fixed and clamped in the middle of the two sealing side seats by bolts, and a sealing ring gasket is fixed on the edge installation side of the sealing side seat.

[0012] Preferably, a conduit interface is provided in the middle of the sides of the two above-mentioned sealing side seats, and the conduit interface is fixedly connected to the end of the return side liquid supply conduit, the guide holes are evenly arranged in a circular shape in the middle of the heat dissipation guide seat, and the heat dissipation fins are evenly fixed in a circular shape on the outer circumference side of the heat dissipation guide seat.

[0013] Compared with the prior art, the above technical solution adopted by the present invention has the following technical effects:

[0014] The heat dissipation device of the present invention is to make the water-cooling liquid in the water-cooling liquid, realize the heat dissipation of heat from the cooling element to the cooling element, so as to realize the heat dissipation of the cooling element by direct current circulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0016] Figure 1 This is a schematic diagram of the upper planar structure of the heat dissipation plate of the present invention;

[0017] Figure 2 This is a schematic diagram of the internal cross-sectional structure of the heat dissipation plate of the present invention;

[0018] Figure 3 This is a schematic diagram of the installation structure of the thermal conductive pad and the cavity boss of the utility model;

[0019] Figure 4 This is a schematic diagram of the heat transfer path of the present utility model;

[0020] Figure 5 This is a schematic diagram of the connection structure between the heat dissipation plate and the water cooler of the utility model;

[0021] Figure 6 This is a schematic diagram of the disassembled structure of the heat dissipation auxiliary component of the present utility model;

[0022] Figure 7 It is a schematic diagram of the cross-sectional structure of the middle part of the heat dissipation guide seat of the present utility model.

[0023] Explanation of the accompanying symbols: 1. Heat dissipation plate; 2. Cavity boss; 3. Thermal conductive pad; 4. Mounting pillar; 5. Water cooling tank; 6. Liquid inlet interface; 7. Return interface; 8. Mounting screw hole; 9. Liquid supply duct; 10. Water cooler; 11. Heat dissipation auxiliary component; 12. Sealing side seat; 13. Heat dissipation guide seat; 14. Duct interface; 15. Heat dissipation fin; 16. Guide hole; 17. Sealing ring gasket. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application. Example

[0026] See also Figure 1-7 The utility model provides a technical solution: a heat sink that is easy to use, including a heat sink body 1 and a water cooling mechanism. The main body of the heat sink body 1 is made of aluminum alloy and has good thermal conductivity. In order to facilitate the connection and installation of the heat sink body 1, mounting screw holes 8 are evenly opened on the side of the heat sink body 1. Mounting bolts are arranged inside the mounting screw holes 8. The heat sink body 1 is fixed to the upper part of the equipment bracket by the mounting bolts.

[0027] In order to facilitate the connection and installation of the circuit board, a mounting support 4 is provided on the upper part of the heat dissipation plate body 1. The circuit board is mounted on the upper part of the mounting support 4 by bolts. In order to facilitate the heat dissipation by fitting with the components on the upper part of the circuit board, as shown in the attached figure, Figure 1 As shown, a cavity boss 2 is provided on the upper part of the heat dissipation plate body 1. There are multiple cavity bosses 2. Several cavity bosses 2 are fixedly provided on the upper part of the heat dissipation plate body 1 according to the distribution of components on the upper part of the circuit board. In order to facilitate the conduction of heat and the fitting support of the components, a thermal conductive adhesive pad 3 is provided on the upper part of the cavity boss 2. The thermal conductive adhesive pad 3 is a soft thermal conductive patch. The thermal conductive adhesive pad 3 is fixedly fitted on the upper part of the cavity boss 2. The components on the upper part of the circuit board are in contact with the thermal conductive adhesive pad 3. The distance h from the surface of the heat generating device to the bottom is calculated by the height of the circuit board mounting surface and the heat generating device. Because the height of the component itself has an error range, when soldered on the circuit board There is also a certain error, so the value of "distance h" has a certain fluctuation range. In order to achieve the purpose of heat conduction for all heating devices, a thermally conductive adhesive pad 3 is added between the heating device and the cavity boss 2. The thermally conductive adhesive pad 3 has a certain amount of compression, which ensures that the heating device, the thermally conductive adhesive pad 3 and the cavity boss 2 are tightly fitted. The size of the cavity boss 2 is the same as the size of the heating device. It can be larger than the size of the heating device without interfering with other devices on the circuit board. After installation, the cavity boss 2 and the heating device are fitted accordingly, which can realize the overall conduction and heat dissipation of the components on the upper part of the circuit board. The heat dissipation structure is installed integrally with the circuit board body, which is easy to install.

[0028] The water cooling mechanism includes a liquid supply conduit 9, a water cooler 10 and a heat dissipation auxiliary component 11. In order to facilitate the circulation of water-cooled liquid and heat dissipation, a water cooling groove 5 is provided inside the heat dissipation plate body 1. The heat dissipation plate body 1 is divided into two parts, the upper and lower parts, and the two parts of the water cooling groove 5 are fixedly connected to form an integrated plate seat structure. The water cooling groove 5 is opened in the middle of the sandwich of the upper and lower parts of the heat dissipation plate body 1. The water cooling groove 5 is processed on the aluminum plate by a machining center according to a certain route. The route passes through the heating device or is close to the bottom of the heating device. After the processing is completed, the water cooling groove 5 is welded into shape by friction welding. In order to facilitate the connection of the water cooler 10, as shown in the attached figure Figure 2 As shown, the side of the heat dissipation plate body 1 is provided with a liquid inlet interface 6 and a return interface 7, which are respectively connected to the two opening sides of the water cooling tank 5, and the distance between the liquid inlet interface 6 and the return interface 7 is about 40 to 60 mm. The liquid inlet interface 6 and the return interface 7 are respectively connected to the liquid outlet and the liquid inlet of the water cooling machine 10 through the liquid supply pipe 9. When the water cooling machine 10 is started during operation, the cooling liquid flows in the water cooling tank 5 and takes the heat out of the cavity through heat transfer. The heat transfer path is shown in the attached figure. Figure 4 As shown, the water cooling groove 5 is opened near the cavity boss 2 according to the component distribution, which can facilitate the water cooling liquid to take away the heat inside the cavity boss 2 and effectively improve the heat dissipation efficiency of the board.

[0029] The heat dissipation auxiliary component 11 includes a sealing edge seat 12 and a heat dissipation guide seat 13. The heat dissipation guide seat 13 is made of aluminum alloy. Figure 6 As shown, the number of sealing edge seats 12 is two, and the heat dissipation guide seat 13 is fixed and clamped in the middle of the two sealing edge seats 12 by bolts. In order to improve the sealing of the connection, a sealing ring gasket 17 is fixed on the edge installation side of the sealing edge seat 12. In order to facilitate the connection and installation with the liquid supply conduit 9, a conduit interface 14 is provided in the middle of the side of the two sealing edge seats 12. The conduit interface 14 is fixedly connected with the end of the return side liquid supply conduit 9. The heat dissipation guide seat 13 is connected and installed in the middle of the return side liquid supply conduit 9 through the sealing edge seat 12. In order to accelerate the conduction of heat, guide holes 16 are evenly provided in the middle of the heat dissipation guide seat 13, as shown in the attached figure. Figure 7 As shown, the middle part of the guide hole 16 is a semicircular turning mouth, and the guide hole 16 is evenly opened in the middle of the heat dissipation guide seat 13 in a circular shape. The guide hole 16 set in the middle of the heat dissipation guide seat 13 is used to divert and guide the water-cooling liquid, thereby increasing the contact area between the heat dissipation guide seat 13 and the water-cooling liquid. In order to accelerate the conduction and dissipation of heat, heat dissipation fins 15 are evenly arranged on the outer circumference of the heat dissipation guide seat 13. The heat dissipation fins 15 are evenly fixed on the outer circumference of the heat dissipation guide seat 13 in a circular shape. The heat dissipation of the water-cooling liquid is assisted by the heat dissipation guide seat 13 and the heat dissipation fins 15, which can reduce the temperature of the reflux water-cooling liquid and improve the heat dissipation efficiency of the heat sink.

[0030] Working principle or structural principle, when installing, fix the heat sink body 1 through the mounting screw holes 8, then mount the circuit board on the upper part of the heat sink body 1 through the mounting pillars 4 with the bolts, and ensure that the components on the upper part of the circuit board are aligned with the thermal conductive adhesive pad 3 on the upper part of the cavity boss 2 during installation, and then connect the end of the liquid supply conduit 9 to the corresponding interface on the side of the heat sink body 1. When connecting, the air in the water cooling tank 5 must be discharged by slowly supplying liquid to complete the installation operation of the device. When working, the heat generated by the components on the upper part of the circuit board is conducted to the cavity boss 2 through the thermal conductive adhesive pad 3, and the water cooling The liquid is transported by the water-cooling machine 10 from the liquid supply pipe 9 into the water-cooling tank 5. Under the circulation and conduction of the water-cooling liquid, the heat is carried by the water-cooling liquid and flows out through the reflux interface 7. When the water-cooling liquid flows through the heat dissipation auxiliary component 11, the diverted water-cooling liquid through the guide hole 16 flows through the heat dissipation guide seat 13 through the guide hole 16. During the circulation process, the heat is conducted to the heat dissipation fins 15, and then dissipated to the outside through the heat dissipation fins 15, thereby realizing auxiliary heat dissipation of the return water-cooling liquid. After that, the water-cooling liquid flows back to the water-cooling machine 10, and after further cooling and recovery, it is re-delivered to the heat dissipation plate body 1 through the liquid supply pipe 9 to complete the heat dissipation cycle.

[0031] The heat dissipation device of embodiment 1 is provided with heat dissipation device 2, and heat dissipation device 2 is provided with heat dissipation device 2. Heat dissipation device 2 is provided with heat dissipation device 2. Heat dissipation device 2 is provided with heat dissipation device 2. Heat dissipation device 2 is provided with heat dissipation device 2. Heat dissipation device 2 is provided with heat dissipation device 2. Heat dissipation device 2 is provided with heat dissipation device 2. Heat dissipation device 2 is provided with heat dissipation device 2.

[0032] Those skilled in the art will appreciate that various combinations and / or combinations of features described in the various embodiments and / or claims of the present invention may be employed, even if such combinations and / or combinations are not explicitly described in the present invention. In particular, various combinations and / or combinations of features described in the various embodiments and / or claims of the present invention may be employed without departing from the spirit and teachings of the present invention. All such combinations and / or combinations fall within the scope of the present invention.

Claims

1. A heat sink that is easy to use, comprising a heat sink body (1) and a water cooling mechanism, characterized in that: A water cooling tank (5) is provided inside the heat dissipation plate body (1), a cavity boss (2) is provided on the upper portion of the heat dissipation plate body (1), and a thermal conductive pad (3) is provided on the upper portion of the cavity boss (2); The water cooling mechanism includes a liquid supply conduit (9), a water cooler (10) and a heat dissipation auxiliary component (11). The water cooler (10) is connected and installed with the water cooling tank (5) through the liquid supply conduit (9). The heat dissipation auxiliary component (11) includes a sealing edge seat (12) and a heat dissipation guide seat (13). The heat dissipation guide seat (13) is connected and installed in the middle of the return side liquid supply conduit (9) through the sealing edge seat (12). The middle of the heat dissipation guide seat (13) is evenly provided with guide holes (16), and the outer peripheral side of the heat dissipation guide seat (13) is evenly provided with heat dissipation fins (15).

2. The heat dissipation plate according to claim 1, characterized in that: The sides of the heat dissipation plate body (1) are evenly provided with mounting screw holes (8), and the interiors of the mounting screw holes (8) are provided with mounting bolts. The heat dissipation plate body (1) is fixedly mounted on the upper part of the equipment bracket by the mounting bolts. The upper part of the heat dissipation plate body (1) is provided with mounting pillars (4), and the upper part of the mounting pillars (4) is provided with a circuit board by bolts.

3. The heat dissipation plate according to claim 2, characterized in that: A plurality of cavity bosses (2) are provided, and a plurality of cavity bosses (2) are fixedly provided on the upper part of the heat dissipation plate body (1) according to the distribution of components on the upper part of the circuit board. The thermal conductive adhesive pad (3) is fixedly attached to the upper part of the cavity boss (2), and the components on the upper part of the circuit board are in contact with and attached to the thermal conductive adhesive pad (3).

4. The heat dissipation plate according to claim 3, characterized in that: The heat dissipation plate body (1) is divided into two parts, the upper and lower parts, and the water cooling grooves (5) of the two parts are fixedly connected to form an integrated plate seat structure. The water cooling grooves (5) are opened in the middle of the interlayer of the upper and lower heat dissipation plate bodies (1).

5. The heat dissipation plate according to claim 1, characterized in that: A liquid inlet interface (6) and a return interface (7) are provided on the side of the heat dissipation plate body (1), and the liquid inlet interface (6) and the return interface (7) are respectively connected to the two opening sides of the water cooling tank (5), and the liquid inlet interface (6) and the return interface (7) are respectively connected to the liquid outlet end and the liquid inlet end of the water cooling machine (10) through the liquid supply conduit (9).

6. The heat dissipation plate according to claim 5, characterized in that: The number of the sealing edge seats (12) is two, and the heat dissipation guide seat (13) is fixed and clamped in the middle of the two sealing edge seats (12) by bolts, and a sealing ring gasket (17) is fixed on the edge installation side of the sealing edge seat (12).

7. The heat dissipation plate according to claim 6, characterized in that: A conduit interface (14) is provided in the middle of the side of each of the two sealing side seats (12), and the conduit interface (14) is fixedly connected to the end of the return side liquid supply conduit (9), the guide hole (16) is uniformly opened in a circumferential shape in the middle of the heat dissipation guide seat (13), and the heat dissipation fins (15) are uniformly fixed in a circumferential shape on the outer circumference side of the heat dissipation guide seat (13).

Images