Wafer ultrasonic cleaning device

Abstract

The utility model relates to a wafer ultrasonic cleaning device which comprises a cleaning box body and a wafer carrying frame, an ultrasonic generator is fixedly installed on the inner wall of the cleaning box body, the wafer carrying frame is arranged in the cleaning box body, and a plurality of groups of material carrying inserting grooves are formed in the surface of the inner wall of the wafer carrying frame at equal intervals. The material loading slots comprise guide sections and limiting sections, the guide sections are vertically arranged on the two sides of the inner wall of the wafer loading frame, the limiting sections are arranged at the lower end of the inner wall of the wafer loading frame, the number of the limiting sections is multiple, and the multiple limiting sections are arranged at the lower end of the inner wall of the wafer at intervals in the circumferential direction; a convex block is arranged in the limiting section, the convex block is matched with the outer side of the wafer, and the height of the convex block is smaller than that of the limiting section; an L-shaped frame is fixedly connected to the upper end of the wafer carrying frame, and a transmission assembly is arranged at the bottom end of the cleaning box body; one end of the L-shaped frame is connected with the upper end of the wafer carrier, and the other end is connected with the transmission assembly. By adopting the structure, the dirt on the wafer can be quickly separated and removed, the cleaning operation time of the wafer is shortened, and the cleaning efficiency of the wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of ultrasonic cleaning, in particular to a wafer ultrasonic cleaning device. Background Art

[0002] A wafer refers to a silicon chip used in the manufacture of silicon semiconductor integrated circuits. Due to its round shape, it is called a silicon wafer. In wafer production process tests, it is often necessary to perform operations such as cutting on the wafers to save test costs. After the wafers are cut as needed, in order to ensure the cleanliness of the wafers and avoid contaminating the production line equipment and affecting daily batch production, the wafers need to be ultrasonically cleaned. During use, existing wafer cleaning equipment usually utilizes the cavitation, acceleration and straight flow effects of ultrasonic waves in liquids to disperse, emulsify and peel off the dirt to achieve the cleaning purpose. However, if the dirt is highly adherent, it is difficult to quickly remove the dirt on the wafer, resulting in a longer cleaning time for the wafer, affecting the efficiency of the wafer cleaning process.

[0003] Therefore, there is an urgent need to provide a wafer ultrasonic cleaning device to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to overcome the shortcomings and defects of the existing technology and provide a wafer ultrasonic cleaning device, which can quickly separate and remove dirt on the wafer, shorten the cleaning operation time of the wafer, and improve the cleaning efficiency of the wafer.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A wafer ultrasonic cleaning device comprises a cleaning box and a wafer carrier, wherein an ultrasonic generator is fixedly mounted on the inner wall of the cleaning box, the wafer carrier is arranged in the cleaning box, and a plurality of loading slots are evenly spaced on the inner wall surface of the wafer carrier;

[0007] The loading slot includes a guide section and a limit section, wherein the guide section is vertically arranged on both sides of the inner wall of the wafer carrier, and the limit section is arranged at the lower end of the inner wall of the wafer carrier. The limit sections are provided in multiple groups, and the multiple groups of limit sections are circumferentially spaced and arranged at the lower end of the inner wall of the wafer; a protrusion is provided in the limit section, and the protrusion is adapted to the outer side of the wafer, and the height of the protrusion is less than the height of the limit section;

[0008] The upper end of the wafer carrier is fixedly connected to an L-shaped frame, and the bottom end of the cleaning box is provided with a transmission assembly; one end of the L-shaped frame is connected to the upper end of the wafer carrier, and the other end is connected to the transmission assembly, and the transmission assembly is used to drive the L-shaped frame to reciprocate in the vertical direction.

[0009] Optionally, the transmission assembly includes a transmission rod, a drive motor, a drive wheel and a connecting rod. The drive motor is arranged at the bottom end of the outer side of the cleaning box, the drive wheel is connected to the drive motor, the lower end of the transmission rod is fixedly connected to the outer periphery of the drive wheel through the connecting rod, and the upper end is fixedly connected to the L-shaped frame.

[0010] Optionally, a transmission sleeve is provided at the lower end of the transmission rod, the connecting rod is slidably inserted into the transmission sleeve, and a limit block is provided on the outer side of the connecting rod.

[0011] Optionally, a guide assembly is further provided on the outside of the cleaning box; the transmission rod is movably provided in the guide assembly and is connected to the L-shaped frame.

[0012] Optionally, the guide assembly includes a circular frame and two groups of guide shafts, the guide shafts are rotatably installed inside the circular frame, the transmission rod is passed between the two groups of guide shafts, and the circumferential surface of the guide shaft abuts against the outer side of the transmission rod.

[0013] Optionally, a plurality of hollow openings are spaced apart at the lower end of the wafer carrier, a plurality of liquid through openings are spaced apart at the side of the wafer, and the hollow openings and the liquid through openings are both connected to the loading slot.

[0014] Optionally, a control panel is fixedly provided on the side wall of the cleaning box, and the ultrasonic generator and the transmission assembly are electrically connected to the control panel.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] In the utility model, the wafer ultrasonic cleaning device includes a cleaning box, a wafer carrier, an L-shaped frame and a transmission assembly, the ultrasonic generator is used to generate ultrasonic waves and form high-frequency vibrations in the cleaning liquid to achieve cleaning of the wafers; a plurality of groups of loading slots are equidistantly provided on the inner wall surface of the wafer carrier, the loading slots are used to place wafers, and the equidistant arrangement of the plurality of loading slots allows multiple groups of wafers to be placed in parallel and maintain a distance from each other, which is convenient for subsequent cleaning and simultaneously achieves cleaning of multiple groups of wafers, thereby improving cleaning efficiency; the loading slots include a guide section and a limiting section, the guide section is used to limit the middle side end of the wafer and guide it during placement; there are multiple groups of limiting sections, and the multiple groups of limiting sections are circumferentially spaced at the lower end of the inner wall of the wafer, and are circumferentially spaced to reduce the contact area between the wafer and the wafer carrier, so that a larger area is exposed to the outside for easy cleaning; the groove formed by the protrusion and the limiting section can limit the wafer, further reducing the contact area between the wafer and the wafer carrier, thereby improving cleaning efficiency. An L-shaped frame is fixedly connected to the upper end of the wafer carrier, and a transmission component is provided at the bottom of the cleaning box to drive the wafer and the wafer carrier to toss slightly, thereby more effectively cleaning impurities such as particles from the surface of the wafer. Through the setting of the above components, the dirt on the wafer can be quickly separated and removed, shortening the cleaning operation time of the wafer and improving the cleaning efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural diagram of the present utility model.

[0018] Figure 2 for Figure 1 A local enlarged view of the AA point in the middle.

[0019] Figure 3 for Figure 1 A partial enlarged view of the middle BB.

[0020] Figure 4 This is a schematic structural diagram of the wafer carrier in the present invention.

[0021] Figure 5 This is a schematic structural diagram of another embodiment of the wafer carrier in the present invention.

[0022] Figure 6 It is a front view of the utility model.

[0023] The above drawings include the following reference numerals:

[0024] 11. Cleaning box, 12. Wafer carrier, 121. Liquid port, 21. Guide section, 22. Limit section, 23. Bump, 3. L-shaped frame, 4. Transmission assembly, 41. Transmission rod, 42. Drive motor, 43. Drive wheel, 44. Connecting rod, 45. Transmission sleeve, 46. Limit block, 5. Guide assembly, 51. Reciprocating frame, 52. Guide shaft, 6. Control panel. DETAILED DESCRIPTION

[0025] The present invention will be described in further detail below with reference to the embodiments and drawings, but the embodiments of the present invention are not limited thereto.

[0026] The technical solution of the utility model provides a wafer ultrasonic cleaning device.

[0027] Reference Figures 1 to 6 In this embodiment, a cleaning box 11 and a wafer carrier 12 are included. An ultrasonic generator is fixedly installed on the inner wall of the cleaning box 11. The wafer carrier 12 is arranged in the cleaning box 11. A plurality of loading slots are evenly spaced on the inner wall surface of the wafer carrier 12.

[0028] The loading slot includes a guide section 21 and a limit section 22. The guide sections 21 are vertically arranged on both sides of the inner wall of the wafer carrier 12. The limit section 22 is arranged at the lower end of the inner wall of the wafer carrier 12. There are multiple groups of limit sections 22, and the multiple groups of limit sections 22 are circumferentially spaced and arranged at the lower end of the inner wall of the wafer; a protrusion 23 is provided in the limit section 22, and the protrusion 23 is adapted to the outer side of the wafer, and the height of the protrusion 23 is less than the height of the limit section 22;

[0029] An L-shaped frame 3 is fixedly connected to the upper end of the wafer carrier 12, and a transmission assembly 4 is provided at the bottom end of the cleaning box 11; one end of the L-shaped frame 3 is connected to the upper end of the wafer carrier 12, and the other end is connected to the transmission assembly 4, which is used to drive the L-shaped frame 3 to reciprocate in the vertical direction.

[0030] Optionally, in this embodiment, the wafer ultrasonic cleaning device includes a cleaning box 11, a wafer carrier 12, an L-shaped frame 3 and a transmission assembly 4, the ultrasonic generator is arranged in the cleaning box 11, for generating ultrasonic waves and forming high-frequency vibrations in the cleaning liquid, the vibrations generate tiny eddies and bubbles, forming a cavitation effect, thereby achieving cleaning of the wafers; the wafer carrier 12 is arranged in the cleaning box 11, and the inner wall surface of the wafer carrier 12 is equidistantly provided with a plurality of loading slots, the loading slots are used to place wafers, and the equidistant arrangement of the plurality of loading slots allows multiple groups of wafers to be placed in parallel and maintain a distance from each other, which is convenient for subsequent cleaning, and the cleaning of multiple groups of wafers is achieved at the same time, thereby improving the cleaning efficiency; the loading slots include guide The guide section 21 and the limiting section 22, wherein the guide section 21 is arranged on both sides of the inner wall of the wafer carrier 12, for limiting the middle side end of the wafer and guiding it when placed; the limiting section 22 is provided with multiple groups, and the multiple groups of limiting sections 22 are circumferentially spaced at the lower end of the inner wall of the wafer, and the circumferential spacing is used to reduce the contact area between the wafer and the wafer carrier 12, so that a larger area is exposed to the outside for easy cleaning; a protrusion 23 is provided in the limiting section 22, which is adapted to the outside of the wafer, and the height of the protrusion 23 is less than the height of the limiting section 22, even if the groove formed by the protrusion 23 and the limiting section 22 can form a limit to the wafer, the contact area between the wafer and the wafer carrier 12 is further reduced, thereby improving the cleaning efficiency. The upper end of the wafer carrier 12 is fixedly connected to an L-shaped frame 3, and the bottom end of the cleaning box 11 is provided with a transmission component 4, one end of the L-shaped frame 3 is connected to the upper end of the wafer carrier 12, and the other end is connected to the transmission component 4. The transmission component 4 is used to drive the L-shaped frame 3 to reciprocate in the vertical direction, thereby driving the wafer carrier 12 to reciprocate up and down, that is, driving the wafer and the wafer carrier 12 to toss slightly, so as to more effectively clean impurities such as particulate matter from the surface of the wafer; the transmission distance of the transmission component 4 should be kept within a certain range, that is, the wafer is always immersed in the cleaning liquid during the tossing process, so as to promote the rapid separation of dirt on the wafer; through the arrangement of the above components, the rapid separation and removal of dirt on the wafer is achieved, the cleaning operation time of the wafer is shortened, and the cleaning efficiency of the wafer is improved.

[0031] In this embodiment, the transmission assembly 4 includes a transmission rod 41, a driving motor 42, a driving wheel 43 and a connecting rod 44, wherein the driving motor 42 is arranged at the bottom end of the cleaning box 11, and the output end of the driving motor 42 is connected to the driving wheel 43, the lower end of the transmission rod 41 is fixedly connected to the outer periphery of the driving wheel 43 through the connecting rod 44, and the upper end is connected to the L-shaped frame 3, that is, the driving motor 42 drives the driving wheel 43 to rotate, thereby driving the transmission rod 41 to move up and down through the connecting rod 44, thereby realizing the up and down movement of the wafer carrier 12; further, in this embodiment, a transmission sleeve 45 is provided at the lower end of the transmission rod 41, and the connecting rod 44 is passed through the transmission sleeve 45, and the connecting rod 44 can slide in the transmission sleeve 45, thereby driving the transmission rod 41 to move up and down, and a limit block 46 is provided on the outside of the connecting rod 44 to prevent the connecting rod 44 from falling from the transmission sleeve 45, thereby ensuring the stability of the connection between the transmission sleeve 45 and the driving wheel 43.

[0032] In this embodiment, a guide assembly 5 is further provided on the outside of the cleaning box 11. The transmission rod 41 is movably passed through the guide assembly 5 and connected to the L-shaped frame 3. The guide assembly 5 is provided to limit the moving direction of the transmission rod 41 to prevent the moving direction of the transmission rod 41 from being offset; further, the guide assembly 5 includes a return frame and two groups of guide shafts 52, which are rotatably installed inside the return frame, and the transmission shaft is passed between the two groups of guide shafts 52, and the circumferential surface of the guide shaft 52 abuts against the outer side of the transmission rod 41.

[0033] In this embodiment, a plurality of hollow openings are spaced apart at the lower end of the crystal carrier, and a plurality of liquid through openings 121 are spaced apart on the side of the wafer, and both the hollow openings and the liquid through openings 121 are connected to the loading slot to allow the cleaning liquid in the cleaning box 11 to enter the wafer carrier 12.

[0034] In this embodiment, a control panel 6 is fixedly provided on the side wall of the cleaning box 11 , and the ultrasonic generator and the transmission assembly 4 are electrically connected to the control panel 6 , and the operation of the ultrasonic generator and the transmission assembly 4 can be controlled through the control panel 6 .

[0035] The working principle of the present invention is as follows: a number of wafers are inserted into the loading slots in sequence, the ultrasonic generator is turned on through the control panel 6, and the cavitation effect, acceleration effect and straight flow effect of the ultrasonic wave in the cleaning liquid are used to disperse, emulsify and peel off the dirt on the wafers. At the same time, the driving motor 42 drives the driving wheel 43 to rotate continuously, and the connection between the driving wheel 43 and the transmission sleeve 45 drives the transmission rod 41 to reciprocate in the vertical direction. The guide component 5 is used to guide the transmission rod 41, and the wafer carrier 12 moves synchronously with the transmission rod 41, so that the wafer carrier 12 slightly tosses the wafers in the loading slot up and down, and the cleaning liquid quickly flows into the wafer carrier 12 through the hollow port and the liquid port 121. The wafer is always immersed in the cleaning liquid during the tossing process, which can prompt the dirt on the wafer to be quickly separated and removed, thereby shortening the cleaning time of the wafer.

[0036] The above-described embodiments merely represent implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A wafer ultrasonic cleaning device, comprising a cleaning box and a wafer carrier, characterized in that: An ultrasonic generator is fixedly installed on the inner wall of the cleaning box, and the wafer carrier is arranged in the cleaning box. A plurality of groups of loading slots are evenly spaced on the inner wall surface of the wafer carrier; The loading slot includes a guide section and a limit section, wherein the guide section is vertically arranged on both sides of the inner wall of the wafer carrier, and the limit section is arranged at the lower end of the inner wall of the wafer carrier. The limit sections are provided in multiple groups, and the multiple groups of limit sections are circumferentially spaced and arranged at the lower end of the inner wall of the wafer; a protrusion is provided in the limit section, and the protrusion is adapted to the outer side of the wafer, and the height of the protrusion is less than the height of the limit section; The upper end of the wafer carrier is fixedly connected to an L-shaped frame, and the bottom end of the cleaning box is provided with a transmission assembly; one end of the L-shaped frame is connected to the upper end of the wafer carrier, and the other end is connected to the transmission assembly, and the transmission assembly is used to drive the L-shaped frame to reciprocate in the vertical direction.

2. A wafer ultrasonic cleaning device according to claim 1, characterized in that, The transmission assembly includes a transmission rod, a drive motor, a drive wheel and a connecting rod. The drive motor is arranged at the bottom end of the outer side of the cleaning box, the drive wheel is connected to the drive motor, the lower end of the transmission rod is fixedly connected to the outer periphery of the drive wheel through the connecting rod, and the upper end is fixedly connected to the L-shaped frame.

3. A wafer ultrasonic cleaning device according to claim 2, characterized in that, A transmission sleeve is provided at the lower end of the transmission rod, the connecting rod is slidably inserted into the transmission sleeve, and a limit block is provided on the outer side of the connecting rod.

4. The wafer ultrasonic cleaning device according to claim 3, characterized in that: A guide assembly is further provided on the outside of the cleaning box; the transmission rod is movably arranged through the guide assembly and is connected to the L-shaped frame.

5. The wafer ultrasonic cleaning device according to claim 4, characterized in that: The guide assembly includes a circular frame and two groups of guide shafts. The guide shafts are rotatably installed inside the circular frame. The transmission rod is inserted between the two groups of guide shafts, and the circumferential surface of the guide shaft abuts against the outer side of the transmission rod.

6. The wafer ultrasonic cleaning device according to claim 1, characterized in that: The lower end of the wafer carrier is provided with a plurality of hollow openings at intervals, and the side surface of the wafer is provided with a plurality of liquid through openings at intervals, and the hollow openings and the liquid through openings are both communicated with the loading slot.

7. The wafer ultrasonic cleaning device according to claim 1, characterized in that: A control panel is fixedly provided on the side wall of the cleaning box, and the ultrasonic generator and the transmission assembly are both electrically connected to the control panel.

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