Chip reflow soldering mechanism

Abstract

The utility model relates to the technical field of welding, in particular to a chip reflow soldering mechanism, which comprises a workbench, a transmission track and an airflow circulation assembly, the workbench is provided with an upper heating part and a lower heating part, a feed port and a discharge port are arranged between the upper heating part and the lower heating part, the feed port and the discharge port are arranged on the side wall of the workbench, and the airflow circulation assembly is arranged on the transmission track. A plurality of groups of temporary storage parts are oppositely arranged on the outer wall, deviating from the feeding hole and the discharging hole, of the worktable; one end of the conveying track penetrates through the feeding port, the other end of the conveying track penetrates through the discharging port, the conveying track is located between the oppositely-arranged temporary storage parts, a clamping part is arranged on the conveying track, the lower heating part is provided with a heating assembly facing the conveying track, and the clamping part is located above the heating assembly; the airflow circulation assembly is arranged on the outer edge of the workbench in a surrounding mode and comprises an air supply opening and an air suction opening, the air supply opening is formed in the upper heating part in a penetrating mode and faces the clamping part, and the air suction opening is formed in the lower heating part in a penetrating mode. The utility model aims to improve the chip processing efficiency and effect.

Description

Technical Field

[0001] The utility model relates to the technical field of welding, in particular to a chip reflow soldering mechanism. Background Art

[0002] A chip is an integrated circuit, typically made of semiconductor materials, used to perform various functions in electronic devices. Chips are a vital component of modern technology, and chip reflow is a common soldering process used in electronics manufacturing and assembly. It's primarily used to assemble chips onto circuit boards. Reflow gets its name from the two main steps in the soldering process: hot air "reflow" and cooling.

[0003] In the related art, a transmission track is set in the box, and the box is provided with an inlet and an outlet along the transmission direction of the transmission track. The chip can be placed on the transmission track and transported into the box by the transmission track. A heating component is provided on the top of the box facing the transmission track. The chip can be dried after passing through the heating component, and then cooled from the output end after heating to complete the entire processing procedure. However, this processing method only heats the upper surface of the chip, resulting in uneven heating of the chip and difficulty in achieving a good processing effect. Utility Model Content

[0004] The main purpose of the utility model is to provide a chip reflow soldering mechanism, aiming to improve chip processing efficiency and effect.

[0005] To achieve the above-mentioned purpose, the present invention proposes a chip reflow soldering mechanism, comprising a workbench, a transmission track, and an airflow circulation component:

[0006] The workbench is provided with an upper heating part and a lower heating part, a feed port and a discharge port are provided between the upper heating part and the lower heating part, the feed port and the discharge port are opened on the side wall of the workbench, and a plurality of buffer portions are provided on the outer wall of the workbench away from the feed port and the discharge port;

[0007] One end of the transmission track is provided through the feed port, and the other end is provided through the discharge port. The transmission track is located between the oppositely arranged buffer portions. A clamping portion is provided on the transmission track. The lower heating portion is provided with a heating assembly facing the transmission track, and the clamping portion is located above the heating assembly.

[0008] The airflow circulation component is arranged around the outer edge of the workbench, and the airflow circulation component includes an air supply port and an air exhaust port. The air supply port is arranged through the upper heating part and faces the clamping part, and the air exhaust port is arranged through the lower heating part.

[0009] In one embodiment of the present application, the transmission track includes a transmission shaft, a transmission track, and a connecting portion:

[0010] The transmission shaft is connected to the inner wall of the workbench, and a plurality of the transmission shafts are provided, and the plurality of transmission shafts are arranged in sequence along the direction from the feed port to the discharge port;

[0011] The transmission crawler belt is drivingly connected to one side of the transmission shaft, and at least two groups of the transmission crawler belts are provided, and the two groups of the transmission crawler belts are arranged opposite to each other; and

[0012] The connecting portion is connected between the two connected transmission belts. There are multiple connecting portions, and the multiple connecting portions are evenly spaced along the transmission belts. Two adjacent connecting portions and the transmission belts are surrounded to form a clamping portion.

[0013] In one embodiment of the present application, there are at least two groups of transfer tracks, the two groups of transfer tracks are relatively connected to the inner walls on both sides of the workbench, a chip rack is provided between the two groups of transfer tracks, and the chip rack is clamped to the clamping portion.

[0014] In one embodiment of the present application, the connection portion is provided with a limiting portion protruding along a direction away from the transmission track, two adjacent limiting portions are wrapped around the clamping portion, and the chip rack is connected to the limiting portions.

[0015] In one embodiment of the present application, the upper heating part includes a sealing adjustment part and a drying part:

[0016] The sealing adjustment part is connected to the upper heating part, the sealing adjustment part is rotatably connected to one side of the workbench, and a handle is provided on the end surface of the sealing adjustment part away from the workbench; and

[0017] The drying part is connected to the other side of the upper heating part away from the sealing adjustment part and is arranged facing the transmission track. The air supply port is opened in the drying part.

[0018] In one embodiment of the present application, the heating component includes multiple groups of heating wires, and the multiple groups of heating wires are evenly spaced along the direction from the feed port to the discharge port. The exhaust port is arranged facing the heating wires, and the air supply port and the exhaust port are evenly spaced in multiple groups.

[0019] In one embodiment of the present application, the workbench extends a buffer portion along the extension direction of both sides of the sealing adjustment portion, the feed port and the discharge port are opened in the buffer portion, the buffer portion is provided with an air inlet facing away from the workbench, the air inlet is above the feed port, and the end face of the air inlet facing the drying portion is connected to a blowing mechanism, and the blowing mechanism is arranged facing the transmission track.

[0020] The technical solution of the present invention adopts the method of splitting the chip reflow soldering mechanism into a workbench, a transmission track, and an air circulation component in terms of structure and function. The transmission track and the air circulation component are all arranged on the workbench, a drying space is opened in the workbench, and a feed port and a discharge port are opened on the opposite side walls of the workbench. The workbench and the drying space are divided into an upper heating part and a lower heating part along the feed port and the discharge port to ensure that the chips transported along the feed port and the discharge port can be heated evenly to ensure the processing effect. At the same time, a cache part is protruded from the outer wall of the workbench relative to the feed port and the discharge port, and the transmission track is passed through the feed port and the discharge port and connected to the two cache parts arranged oppositely. The cache part can make the workbench and the transmission track more convenient to take and unload materials, so that the input and output of the chips are smoother, thereby improving the processing efficiency of the chips. The transmission track is provided with a clamping part, which can be more convenient to take and unload materials through the clamping part. The chip can be fixed conveniently to avoid derailment and loss of the chip during transportation, heating and drying. The lower heating part is provided with a heating component facing the transmission track for heating the bottom of the chip, and the air circulation component is arranged between the feed port and the discharge port, and facing the clamping part. The air circulation component includes an air supply port and an air exhaust port. The air supply port is arranged facing the clamping part, and the air exhaust port is passed through the lower heating part and facing the heating component. The air path can come out from the air supply port and pass through the chip and the heating component in turn, and be extracted by the air exhaust port, transported inside the air circulation component, and blown out again from the air supply port facing the chip. The heated air will be sucked away by the air circulation component and heat the top of the chip. The air circulation component and the heating component cooperate with each other, which can effectively improve the chip processing effect, reduce heat dissipation, and improve energy utilization. The above structure can effectively improve the heating effect and efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0022] Figure 1 This is a schematic diagram of the structure of the chip reflow soldering mechanism of the present invention;

[0023] Figure 2 for Figure 1 A partial enlarged view of point A in the middle;

[0024] Figure 3 This is a cross-sectional view of the chip reflow soldering mechanism of the present invention in one direction;

[0025] Figure 4This is a cross-sectional view of the chip reflow soldering mechanism of the present invention from another direction.

[0026] Description of Figure Numbers:

[0027] 1. Workbench; 11. Feed port; 12. Discharge port; 13. Buffer section; 2. Upper heating section; 21. Sealing adjustment section; 22. Drying section; 3. Buffer section; 31. Blowing mechanism; 4. Lower heating section; 5. Transmission track; 51. Drive shaft; 52. Drive track; 53. Connecting section; 54. Limiting section; 55. Clamping section; 6. Heating assembly; 61. Heating wire; 7. Air circulation assembly; 71. Air supply port; 72. Exhaust port.

[0028] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0030] To solve the problems in the background technology, such as Figures 1 to 4 As shown, a chip reflow soldering mechanism proposed by the present invention includes a workbench 1, a transmission track 5 and an air circulation component 7. The workbench 1 is provided with an upper heating part 2 and a lower heating part 4. A feed port 11 and a discharge port 12 are provided between the upper heating part 2 and the lower heating part 4. The feed port 11 and the discharge port 12 are opened on the side wall of the workbench 1. The outer wall of the workbench 1 is opposite to the feed port 11 and the discharge port 12 and is provided with multiple groups of buffer parts 13; one end of the transmission track 5 is passed through the feed port 11, and the other end is passed through the feed port 11. One end is passed through the discharge port 12, and the transmission track 5 is between the relatively arranged buffer parts 13. A clamping part 55 is provided on the transmission track 5. The lower heating part 4 is provided with a heating component 6 facing the transmission track 5, and the clamping part 55 is above the heating component 6; the air circulation component 7 is arranged around the outer edge of the workbench 1, and the air circulation component 7 includes an air supply port 71 and an air exhaust port 72. The air supply port 71 is passed through the upper heating part 2 and is arranged facing the clamping part 55. The air exhaust port 72 is passed through the lower heating part 4.

[0031] In a chip reflow soldering mechanism of the present application, the chip reflow soldering mechanism is divided into a workbench 1, a transmission track 5, and an air circulation component 7 in terms of structure and function. The transmission track 5 and the air circulation component 7 are both arranged on the workbench 1. A drying space is provided in the workbench 1, and a feed port 11 and a discharge port 12 are provided on the opposite side walls of the workbench 1. The workbench 1 and the drying space are divided into an upper heating part 2 and a lower heating part 4 along the feed port 11 and the discharge port 12 to ensure that the material is fed along the feed port 11 and the discharge port 12. The chips fed can be heated evenly to ensure the processing effect. At the same time, the outer wall of the workbench 1 is provided with a buffer portion 13 relative to the feed port 11 and the discharge port 12. The transmission track 5 is provided through the feed port 11 and the discharge port 12 and is connected to the two buffer portions 13 provided relatively. Through the buffer portion 13, the workbench 1 and the transmission track 5 can be more convenient to take and unload materials, making the input and output of the chip smoother to improve the processing efficiency of the chip. The transmission track 5 is provided with a clamping portion 55, which is connected to the clamping portion 55 can fix the chip more conveniently, avoiding the chip from derailing and causing loss during the transportation and heating and drying process. The lower heating part 4 is provided with a heating component 6 facing the transportation track 5 for heating the bottom of the chip, and the air circulation component 7 is arranged between the feed port 11 and the discharge port 12, and is arranged facing the clamping part 55. The air circulation component 7 includes an air supply port 71 and an air exhaust port 72. The air supply port 71 is arranged facing the clamping part 55, and the air exhaust port 72 is penetrated by the lower heating part 4 and arranged facing the heating component 6. The air path can come out from the air supply port 71, pass through the chip and the heating component 6 in turn, and be extracted by the air exhaust port 72, transported inside the air circulation component 7, and blown out again from the air supply port 71 facing the chip. The heated air will be sucked away by the air circulation component 7 and heat the top of the chip. The air circulation component 7 and the heating component 6 cooperate with each other, which can effectively improve the chip processing effect, reduce heat dissipation, and improve energy utilization. The above structure can effectively improve the heating effect and efficiency of the chip.

[0032] See also Figure 2 In one embodiment of the present application, the transmission track 5 includes a transmission shaft 51, a transmission belt 52 and a connecting portion 53. The transmission shaft 51 is connected to the inner wall of the workbench 1. There are multiple transmission shafts 51, and the multiple transmission shafts 51 are arranged in sequence along the direction from the feed port 11 to the discharge port 12; the transmission belt 52 is driven and connected to one side of the transmission shaft 51. There are at least two groups of transmission belts 52, and the two groups of transmission belts 52 are arranged opposite to each other; the connecting portion 53 is connected between the two connected transmission belts 52. There are multiple connecting portions 53, and the multiple connecting portions 53 are evenly spaced along the transmission belt 52. The two adjacent connecting portions 53 and the transmission belt 52 are surrounded by a clamping portion 55.

[0033] In a chip reflow soldering mechanism of the present application, the transmission track 5 includes a transmission shaft 51, a transmission belt 52 and a connecting part 53. The transmission track 5 is driven by the transmission shaft 51 and transmitted by the transmission belt 52. The connecting part 53 is used to connect two adjacent transmission belts 52 to prevent the transmission belt 52 from derailing and ensure the stability of the transmission of the transmission belt 52. Multiple transmission shafts 51 can ensure the stability of the installation of the transmission belt 52 and prevent it from falling, which may cause the chip to be unable to be transported normally. The two adjacent connecting parts 53 and the transmission belt 52 are surrounded by a clamping part 55. The two sides of the chip rack for placing the chip can be provided with clamping parts relative to the clamping part 55. The clamping parts can enable the chip rack to be stably and quickly transported by the transmission belt, thereby ensuring the efficiency of the entire chip processing.

[0034] See also Figures 1 to 2 In one embodiment of the present application, there are at least two groups of transmission tracks 5, and the two groups of transmission tracks 5 are relatively connected to the inner walls on both sides of the workbench 1. A chip rack is provided between the two groups of transmission tracks 5, and the chip rack is clamped to the clamping portion 55.

[0035] In a chip reflow mechanism of the present application, at least two groups of transmission tracks 5 are provided, and the two groups of transmission tracks 5 are relatively connected to the inner walls on both sides of the workbench 1. Through such a structure, the transmission tracks 5 can suspend the entire chip rack in the air, so that the upper and lower heating parts 4 can directly heat the chip, reducing the loss of the transmission tracks 5 while ensuring the heating effect of the chip and saving energy.

[0036] See also Figures 1 to 2 In one embodiment of the present application, a limiting portion 54 is protruded from the connecting portion 53 in a direction away from the transmission track 52 , two adjacent limiting portions 54 are wrapped around the clamping portion 55 , and the chip rack is connected to the limiting portion 54 .

[0037] In a chip reflow mechanism of the present application, a limiting portion 54 is protruded from the connecting portion 53 in a direction away from the transmission belt 52. The height of the limiting portion 54 is higher than the transmission belt 52. The adjacent limiting portions 54 can wrap around the clamping portion 55, so that the clamping effect of the clamping portion 55 is better, which can limit the chip rack to prevent it from derailing and ensure the stability of the chip transportation during processing.

[0038] See also Figures 1 to 4 In one embodiment of the present application, the upper heating part 2 includes a sealing adjustment part 21 and a drying part 22. The sealing adjustment part 21 is connected to the upper heating part 2, and the sealing adjustment part 21 is rotatably connected to one side of the workbench 1. The end surface of the sealing adjustment part 2 facing away from the workbench 1 is provided with a handle; the drying part 22 is connected to the other side of the upper heating part 2 facing away from the sealing adjustment part 21, and is arranged facing the transmission track 5, and the air supply outlet 71 is opened in the drying part 2.

[0039] In a chip reflow soldering mechanism of the present application, the upper heating part 2 includes a sealing adjustment part 21 and a drying part 22. The sealing adjustment part 21 is connected to the drying space and is rotatably connected to the workbench 1. It can be unlocked and opened by a handle, which can facilitate maintenance of various components in the machine body. The drying part 22 is also in the upper heating part 2 and is arranged opposite to the sealing adjustment part 21. The air supply port 71 in the air flow circulation component 7 is provided above the chip between two adjacent transmission tracks 5, which can ensure the stability of heating the upper part of the chip and ensure the processing effect of the chip.

[0040] See also Figures 1 to 3 In one embodiment of the present application, the heating component 6 includes multiple groups of heating wires 61, which are evenly spaced along the direction from the feed port 11 to the discharge port 12, and the exhaust port 72 is arranged facing the heating wires 61, and the air supply port 71 and the exhaust port 72 are evenly spaced.

[0041] In a chip reflow soldering mechanism of the present application, the heating component 6 includes multiple groups of heating wires 61, and the multiple groups of heating wires 61 are evenly spaced along the direction from the feed port 11 to the discharge port 12. The evenly arranged heating wires 61 can ensure the heating effect on the bottom of the chip, and the exhaust port 72 is arranged facing the heating wires 61, so that the air heated by the heating wires 61 can be recovered as soon as possible to reduce heat dissipation, so that the air supply port 71 can better heat the upper surface of the chip, thereby achieving the purpose of evenly heating the chip and improving the processing effect.

[0042] See also Figures 3 and 4 In one embodiment of the present application, the workbench 1 extends a buffer portion 3 along the extension direction of both sides of the sealing adjustment portion 21, and the feed port 11 and the discharge port 12 are opened in the buffer portion 3. The buffer portion 3 is provided with an air inlet facing away from the workbench 1, and the air inlet is above the feed port 11. The end face of the air inlet facing the drying portion 22 is connected to a blowing mechanism 31, and the blowing mechanism 31 is arranged facing the transmission track 5.

[0043] In a chip reflow soldering mechanism of the present application, the workbench 1 extends a buffer portion 3 along the extension direction of both sides of the sealing adjustment portion 21. The buffer portion 3 is arranged on both sides of the drying portion 22. The feed port 11 and the discharge port 12 are both opened in the buffer portion 3. The buffer portion 3 is provided with an air inlet away from the drying space, and a blower mechanism 31 is provided facing the air inlet. The air outlet of the blower mechanism 31 is arranged facing the transmission track 5. The blower mechanism 31 is arranged away from the air supply port 71 of the air circulation component 7, so that it is stable relative to the drying portion 22. Lower, but higher than the outside world. When the chip enters the buffer section 3 near the feed port 11, it can be slightly preheated to improve the subsequent processing effect. When the chip leaves the drying section 22 and enters the buffer section 3 near the discharge port 12, it will be quickly cooled and warmed up. The blowing mechanism 31 forms an air curtain at the feed port 11 and the discharge port 12, which can reduce the internal heat from the feed port 11 and the discharge port 12. Efficient use of energy, the above structure can effectively improve the processing efficiency and effect of the chip.

[0044] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the drawings. This is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0045] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A chip reflow mechanism, characterized in that: include: A workbench, wherein the workbench is provided with an upper heating portion and a lower heating portion, a feed port and a discharge port are provided between the upper heating portion and the lower heating portion, the feed port and the discharge port are opened on the side wall of the workbench, and a plurality of buffer portions are provided on the outer wall of the workbench away from the feed port and the discharge port; A transmission track, one end of which passes through the feed port and the other end of which passes through the discharge port, the transmission track being located between the oppositely arranged buffer portions, the transmission track being provided with a clamping portion, the lower heating portion being provided with a heating assembly facing the transmission track, the clamping portion being located above the heating assembly; and An air circulation component is arranged around the outer edge of the workbench. The air circulation component includes an air supply port and an air exhaust port. The air supply port is arranged through the upper heating part and faces the clamping part. The air exhaust port is arranged through the lower heating part.

2. A chip reflow mechanism according to claim 1, characterized in that: The transmission track includes: A transmission shaft, the transmission shaft is connected to the inner wall of the workbench, and a plurality of the transmission shafts are provided, and the plurality of transmission shafts are arranged in sequence along the direction from the feed port to the discharge port; A transmission crawler belt, wherein the transmission crawler belt is drivingly connected to one side of the transmission shaft, and at least two groups of the transmission crawler belts are provided, and the two groups of the transmission crawler belts are arranged opposite to each other; and The connecting part is connected between the two connected transmission belts. There are multiple connecting parts, and the multiple connecting parts are evenly spaced along the transmission belts. The adjacent two connecting parts and the transmission belts are surrounded to form a clamping part.

3. A chip reflow mechanism according to claim 2, characterized in that: There are at least two groups of transmission tracks, and the two groups of transmission tracks are relatively connected to the inner walls on both sides of the workbench. A chip rack is provided between the two groups of transmission tracks, and the chip rack is clamped to the clamping part.

4. A chip reflow mechanism according to claim 3, characterized in that: The connection portion is provided with a limiting portion protruding along a direction away from the transmission track, two adjacent limiting portions are wrapped around the clamping portion, and the chip frame is connected to the limiting portions.

5. A chip reflow mechanism according to any one of claims 1 to 4, characterized in that: The upper heating part comprises: a sealing adjustment portion, the sealing adjustment portion being connected to the upper heating portion, the sealing adjustment portion being rotatably connected to one side of the workbench, and a handle being provided on an end surface of the sealing adjustment portion facing away from the workbench; and The drying part is connected to the other side of the upper heating part away from the sealing adjustment part and is arranged facing the transmission track. The air supply port is opened in the drying part.

6. A chip reflow mechanism according to claim 5, characterized in that: The heating assembly includes multiple groups of heating wires, which are evenly spaced along the direction from the feed port to the discharge port. The exhaust port is arranged facing the heating wires, and the air supply port and the exhaust port are evenly spaced.

7. A chip reflow mechanism according to claim 6, characterized in that: The workbench extends a buffer portion along the extension direction of both sides of the sealing adjustment portion, the feed port and the discharge port are opened in the buffer portion, the buffer portion is provided with an air inlet facing away from the workbench, the air inlet is located above the feed port, and the end face of the air inlet facing the drying portion is connected to a blowing mechanism, and the blowing mechanism is arranged facing the transmission track.

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