Ball mounting jig for package substrate solder balls

Abstract

The utility model provides a ball mounting tool of a package substrate solder ball. The ball mounting tool comprises a positioning plate and a carrier plate stacked on the positioning plate. The positioning plate is provided with a first rectangular center area and a first frame area, the first center area is provided with a first through hole penetrating through the positioning plate, and the carrier plate is located in the first center area and adsorbed to the surface of the positioning plate in a vacuumizing mode; the upper surface of the positioning plate is provided with the protruding blocks used for being filled in the hollow area of the carrier plate, so that the carrier plate forms a plane integrally after being embedded in the positioning plate, the stability of the ball mounting process is guaranteed, and the defects of multiple balls, poor welding, missing and the like during solder ball mounting are further avoided. By means of the jig, the hollow-out carrier plate can be normally subjected to solder ball planting operation, the production and machining capacity of the hollow-out carrier plate is improved, and abrasion of a scraper and a steel mesh in the operation process is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of ball planting, in particular to a ball planting fixture for packaging substrate solder balls. Background Art

[0002] With the continuous advancement of semiconductor industry technology and growing market demand, hollow substrates have become a key choice in modern electronic design due to their superior heat dissipation, optimized electrical performance, enhanced structural strength, improved material utilization, and innovative, efficient, compact layout flexibility. Pre-bumping and solder balling on hollow substrates is a key method for improving the reliability and performance of package substrates. This process protects the circuit board from environmental hazards, extends product life, and improves package end alignment accuracy and soldering reliability.

[0003] Among them, solder ball planting using a hollow substrate design is a precise and efficient electronic assembly process. However, solder ball planting on a hollow substrate requires extremely high precision, and the solder balls must be accurately placed on the pads. This is especially difficult in hollow designs because the hollow portion may cause problems with the positioning and alignment of the steel mesh and the substrate, unstable adsorption of the adsorption platform of the solder ball planting equipment, and deformation of the solder ball planting steel mesh, resulting in multiple solder ball defects. Due to problems with the alignment and positioning of the steel mesh during the solder ball planting process, defects such as poor welding and missing soldering are prone to occur. These problems will reduce the yield and reliability of the overall product. Therefore, to address such difficulties, a specially designed fixture for solder ball planting (Ball Mount) of hollow design products is urgently needed. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the prior art, the present invention provides a ball planting jig for packaging substrate solder balls, the ball planting jig comprising a positioning plate and a carrier plate stacked on the positioning plate;

[0005] The positioning plate includes a rectangular first central area and a first frame area arranged around the first central area. The first central area is provided with a first through hole penetrating the positioning plate. The carrier plate is located in the first central area.

[0006] The carrier board is provided with a ball planting area and a hollow area. The hollow area is a slot hole running through the carrier board. The upper surface of the positioning plate is provided with a protrusion. The protrusion is used to fill the hollow area of ​​the carrier board so that the surface of the carrier board forms a plane.

[0007] Optionally, the carrier board includes a plurality of blocks, and a single block is provided with a plurality of ball planting areas and hollow areas.

[0008] Optionally, the carrier board includes four blocks, each block is provided with one ball planting area and one hollow area.

[0009] Optionally, in the first central region, the first through-hole density at the edge is greater than the first through-hole density at the center.

[0010] Optionally, in the first central area, the first through holes located at the edge are arranged in a strip shape, and the first through holes located in the center are arranged in a dispersed manner.

[0011] Optionally, a vacuum adsorption platform is further included, on which the positioning plate and the carrier plate are stacked in sequence.

[0012] Optionally, the areas of the vacuum adsorption platform, the positioning plate and the carrier plate decrease in sequence.

[0013] Optionally, the vacuum adsorption platform is provided with a rectangular second central area, the second central area is sequentially provided with a second inner ring area and a second outer ring area outward, and the second central area is provided with a second central through hole; the first central area of ​​the positioning plate is located in the second central area of ​​the vacuum adsorption platform, and the second central through hole is connected to the first through hole.

[0014] Optionally, the first frame area of ​​the positioning plate is located in the second inner ring area of ​​the vacuum adsorption platform, and the second inner ring area is provided with a second inner ring through hole.

[0015] As described above, the present invention provides a ball planting jig for packaging substrate solder balls, comprising a positioning plate and a carrier plate stacked on the positioning plate; the positioning plate is provided with a rectangular first center region and a first frame region, the first center region being provided with a first through-hole penetrating the positioning plate; the carrier plate is located in the first center region and is adsorbed to the surface of the positioning plate by vacuuming; the upper surface of the positioning plate is provided with bumps for filling the hollowed-out region of the carrier plate, so that the carrier plate forms a flat surface after being embedded in the positioning plate, thereby ensuring the stability of the ball planting process and avoiding defects such as multiple balls, poor soldering, and missing solder balls during solder ball planting. This jig enables the solder ball planting operation to be performed normally on the hollowed-out carrier plate, improving the production and processing capacity of the hollowed-out carrier plate and reducing the wear of the scraper and steel mesh during the operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Shown is a schematic top view of the carrier board in the first embodiment of the present invention.

[0017] Figure 2 Shown is a schematic top view of the structure of the positioning plate in the first embodiment of the present invention.

[0018] Figure 3 It shows a schematic top view of the structure of the stacked positioning plate and the carrier plate in the first embodiment of the present invention.

[0019] Figure 4It shows a schematic cross-sectional structure diagram of the stacked positioning plate and the carrier plate in the first embodiment of the present invention.

[0020] Figure 5 Shown is a schematic top view of the structure of the vacuum adsorption platform in Example 1 of the present utility model.

[0021] Figure 6 It shows a schematic top view of the structure of the vacuum adsorption platform, the positioning plate and the carrier plate stacked in the first embodiment of the present invention.

[0022] Component number description

[0023] 10 carrier board

[0024] 20 Positioning plate

[0025] 30 Vacuum adsorption platform

[0026] 111 Ball Planting Area

[0027] 112 hollow area

[0028] 210 First Central Area

[0029] 220 First border area

[0030] 211 First through hole

[0031] 212 Bump

[0032] 310 Second Central Area

[0033] 320 Second Inner Ring Area

[0034] 330 Second Outer Ring Area

[0035] 311 Second center through hole

[0036] 321 Second inner ring through hole DETAILED DESCRIPTION

[0037] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different perspectives and applications without departing from the spirit of the present invention.

[0038] For ease of explanation, when describing the embodiments of the present invention, cross-sectional views of device structures may be partially enlarged and not to scale. These schematic views are merely illustrative and should not limit the scope of protection of the present invention. Furthermore, in actual production, three-dimensional dimensions, including length, width, and depth, should be included.

[0039] For ease of description, spatially relative terms such as "under," "below," "below," "below," "above," and "on" may be used herein to describe the relationship of one element or feature to other elements or features shown in the drawings. It will be understood that these spatially relative terms are intended to encompass orientations of the device in use or operation in addition to the orientation depicted in the drawings. Additionally, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may be present. As used herein, "between" is inclusive of both endpoints.

[0040] In the context of the present application, a structure described as a first feature being "above" a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where an additional feature is formed between the first and second features, such that the first and second features may not be in direct contact.

[0041] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0042] During the solder ball printing process, when the carrier plate is pressed against the stencil, the hollowed-out portion of the carrier plate can cause the stencil to deform and become uneven, leading to abnormal substrate alignment. This can result in uneven flux printing and missing solder balls after the scraper passes through, and can also cause varying degrees of wear on the scraper blade and stencil. Furthermore, the vacuum adsorption platform is prone to adsorption failure, requiring repeated operations and reducing equipment utilization. This technical solution specifically addresses flux and solder ball defects caused by difficulties in aligning and positioning the stencil during the solder ball printing process, improving yield and equipment utilization.

[0043] Example 1

[0044] like Figures 1 to 4 As shown, this embodiment provides a ball placement fixture for solder balls on a package substrate, comprising a positioning plate 20 and a carrier plate 10 stacked on the positioning plate 20;

[0045] The positioning plate 20 has a rectangular first central area 210 and a first frame area 220 arranged around the first central area 210. The first central area 210 has a first through hole 211 that penetrates the positioning plate. The carrier 10 is located in the first central area 210 and is adsorbed on the surface of the positioning plate 20 by vacuuming.

[0046] The carrier board 10 is provided with a ball planting area 111 and a hollow area 112. The hollow area 112 is a slot that runs through the carrier board 10. The ball planting area 111 is used to place the package substrate or circuit board to be ball-planted. The upper surface of the positioning plate 20 is provided with a bump 212. The bump 212 is used to fill the hollow area 112 of the carrier board 10 to supplement the hollow area of ​​the hollow product, so that the carrier board 10 forms a plane as a whole after being embedded on the positioning plate 20, ensuring the normal operation of solder ball planting. Support is formed for the steel mesh on the surface of the carrier board to prevent the steel mesh from being concave and deformed in the hollow area, thereby affecting the flatness, ensuring the stability of the ball planting process, and thus avoiding defects such as multiple balls, poor welding, and missing balls during solder ball planting. The bump is the same thickness as the hollow area. In this embodiment, the positioning plate is made of FR4 material.

[0047] Furthermore, the carrier board 10 includes multiple blocks, each of which is provided with a ball planting area 111 and a hollow area 112. In this embodiment, the carrier board includes four blocks, each of which is provided with one ball planting area and one hollow area, for a total of four ball planting areas and four hollow areas on the entire carrier board. It should be understood that the number of ball planting areas and hollow areas can be flexibly set as needed and is not excessively limited here.

[0048] Furthermore, as a preferred embodiment, within the first central region 210, the density of the first through-holes 211 at the edges is greater than the density of the first through-holes 211 at the center. As an embodiment, within the first central region 210, the first through-holes 211 at the edges are arranged in a strip-like pattern, while the first through-holes 211 at the center are dispersed. The carrier primarily achieves adsorption through the first through-holes at the edges to prevent warping at the edges. Therefore, the density of the first through-holes at the edges needs to be increased, while in the area near the center, the first through-holes need to be staggered away from the ball implant area and the hollow area, thereby appropriately reducing the density.

[0049] Furthermore, if Figures 5 and 6 As shown, the ball planting fixture further includes a vacuum adsorption platform 30 , on which the positioning plate 20 and the carrier plate 10 are sequentially stacked, and the areas of the vacuum adsorption platform 30 , the positioning plate 20 and the carrier plate 10 decrease in sequence.

[0050] The vacuum adsorption platform is provided with a rectangular second central area 310, and the second central area 310 is sequentially provided with a second inner ring area 320 and a second outer ring area 330 outwardly, and the second central area 310 is provided with a second central through hole 311; the first frame area 220 of the positioning plate 20 is located in the second inner ring area 320 of the vacuum adsorption platform 30, and the first central area 210 of the positioning plate is located in the second central area 310 of the vacuum adsorption platform 30, and the second central through hole 311 is connected to the first through hole 211, so that the carrier 10 is adsorbed by utilizing the channel formed by the second central through hole 311 and the first through hole 211; the second inner ring area 320 is provided with a second inner ring through hole 321 to adsorb the positioning plate 20 by vacuum extraction.

[0051] The detailed process of solder ball planting using the above-mentioned ball planting fixture is as follows:

[0052] 1. Printing flux. Secure the prepared stencil to the Flux flux printer, part of the "Microball Mounting Machine and Inspection and Repair Machine" line. Place the appropriate amount of flux on the stencil. Automatically transport the carrier to the Flux flux printer's adsorption platform, where the carrier and stencil are aligned and bonded. Use a scraper to evenly print the flux through the stencil onto the carrier, ensuring that the flux penetrates the pores of the stencil and covers the bump pads in the carrier's ball placement area.

[0053] 2. Print solder balls. Secure the prepared stencil to the solder ball placement machine connected to the "Microball Placement Machine and Inspection and Repair Machine" and place the appropriate amount of micro balls on the stencil. Automatically transport the carrier to the solder ball placement machine's adsorption platform, allowing the carrier and stencil to align and bond. Use a rotating scraper to pre-place solder balls through the stencil onto each bump pad in the carrier's ball placement area.

[0054] In summary, the present invention provides a ball planting jig for packaging substrate solder balls, the ball planting jig comprising a positioning plate and a carrier plate stacked on the positioning plate; the positioning plate is provided with a rectangular first center region and a first frame region, the first center region being provided with a first through hole penetrating the positioning plate, the carrier plate being located in the first center region and being adsorbed to the surface of the positioning plate by vacuuming; the upper surface of the positioning plate is provided with bumps for filling the hollowed-out region of the carrier plate, so that the carrier plate forms a flat surface as a whole after being embedded in the positioning plate, thereby ensuring the stability of the ball planting process and thereby avoiding defects such as multiple balls, poor welding, and missing solder balls during solder ball planting. This jig enables the solder ball planting operation to be carried out normally on the hollowed-out carrier plate, thereby improving the production and processing capacity of the hollowed-out carrier plate and reducing the wear of the scraper and steel mesh during the operation.

[0055] This fixture can effectively improve the printing defects generated during the production process of solder ball mounting for hollow carrier boards. The design of this fixture can be used to optimize the production process of solder ball mounting for hollow carrier boards, thereby improving the technical capabilities of solder ball mounting for hollow carrier boards and promoting carrier board product standards to move toward new requirements for carrier boards due to market demand. This is beneficial to the development of the hollow carrier board industry, effectively promoting the development of the hollow carrier board industry, bringing good technical benefits, and has broad application prospects.

[0056] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit this utility model. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by persons skilled in the art without departing from the spirit and technical concepts disclosed in this utility model shall be covered by the claims of this utility model.

Claims

1. A ball placement fixture for packaging substrate solder balls, characterized in that: The ball planting fixture includes a positioning plate and a carrier plate stacked on the positioning plate; The positioning plate includes a rectangular first central area and a first frame area arranged around the first central area. The first central area is provided with a first through hole penetrating the positioning plate. The carrier plate is located in the first central area. The carrier board is provided with a ball planting area and a hollow area. The hollow area is a slot hole running through the carrier board. The upper surface of the positioning plate is provided with a protrusion. The protrusion is used to fill the hollow area of ​​the carrier board so that the surface of the carrier board forms a plane.

2. The ball placement jig for solder balls on a package substrate according to claim 1, wherein: The carrier board includes a plurality of blocks, and a single block is provided with a plurality of ball planting areas and hollow areas.

3. The ball placement jig for solder balls on a package substrate according to claim 1, wherein: The carrier board includes four blocks, each of which is provided with a ball planting area and a hollow area.

4. The solder ball placement jig for package substrate according to claim 1, characterized in that: In the first central region, the first through-hole density at the edge is greater than the first through-hole density at the center.

5. The ball placement jig for solder balls on a package substrate according to claim 1, wherein: In the first central area, the first through holes at the edge are arranged in a strip shape, and the first through holes at the center are arranged in a dispersed manner.

6. The ball placement jig for solder balls on a package substrate according to claim 1, wherein: It also includes a vacuum adsorption platform, on which the positioning plate and the carrier plate are stacked in sequence, and the areas of the vacuum adsorption platform, the positioning plate and the carrier plate decrease in sequence.

7. The ball placement jig for solder balls on a package substrate according to claim 6, wherein: The vacuum adsorption platform is provided with a rectangular second central area, the second central area is sequentially covered with a second inner ring area and a second outer ring area outward, and the second central area is provided with a second central through hole; the first central area of ​​the positioning plate is located in the second central area of ​​the vacuum adsorption platform, and the second central through hole is connected to the first through hole.

8. The ball placement jig for solder balls on a package substrate according to claim 7, wherein: The first frame area of ​​the positioning plate is located in the second inner ring area of ​​the vacuum adsorption platform, and the second inner ring area is provided with a second inner ring through hole.

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