Diamond grinding disc tool

Abstract

The utility model discloses a diamond grinding disc tool which comprises a grinding disc base body, the grinding disc base body is provided with a grinding face, the grinding face is provided with a plurality of diamond grinding particle sets, and the diamond grinding particle sets are arranged in the radial direction of the grinding disc base body from inside to outside. The diamond abrasive particle group comprises a plurality of diamond abrasive particles, and the plurality of diamond abrasive particles are distributed in the circumferential direction of the grinding disc base body; and a chip removal interval is formed between every two adjacent diamond abrasive particles. According to the diamond grinding disc tool, a plurality of diamond grinding particles are arranged on the grinding surface of the grinding disc base body, chip removal intervals are formed through the arrangement structure of the diamond grinding particles, and accumulation of grinding chips is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of polishing tools, in particular to a diamond grinding disc tooling. Background Art

[0002] At present, in the industrial ceramic production process, ceramics are usually polished, and the existing polishing tools generally use grinding wheels. Since the grinding wheel removes the grinding chips by vacuuming during the grinding process, the grinding chips are also prone to accumulation on the grinding wheel surface. During the grinding process, there is a risk of dents and scratches on the ceramic surface, resulting in a rough ceramic surface. Therefore, a dust removal fan is used to remove the grinding chips to reduce the accumulation of grinding chips.

[0003] In addition, after a period of time, the grinding wheel will generally wear out to a greater extent, affecting its service life. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the purpose of the present invention is to provide a diamond grinding disc tooling, which can form chip removal intervals by arranging a plurality of diamond abrasive grains on the grinding surface of the grinding disc base, thereby reducing the accumulation of grinding chips.

[0005] The purpose of this utility model is achieved by the following technical solutions:

[0006] A diamond grinding wheel tool comprises a grinding wheel base, the grinding wheel base is provided with a grinding surface, a plurality of diamond abrasive grain groups are arranged on the grinding surface, and the plurality of diamond abrasive grain groups are arranged in the radial direction of the grinding wheel base from the inside to the outside; the diamond abrasive grain group includes a plurality of diamond abrasive grains, and the plurality of diamond abrasive grains are arranged around the circumference of the grinding wheel base; and a chip removal gap is provided between two adjacent diamond abrasive grains.

[0007] Furthermore, the diamond abrasive grains are round, and two adjacent diamond abrasive grains are tangent to each other.

[0008] Furthermore, the plurality of diamond abrasive grain groups are distributed at equal intervals.

[0009] Furthermore, two adjacent diamond abrasive grains are distributed at equal intervals.

[0010] Furthermore, the diamond abrasive grains are fixed to the grinding disc base by brazing.

[0011] Furthermore, the outer diameter of the diamond abrasive grains is 0.01 mm.

[0012] Furthermore, a connecting hole is provided at the end of the grinding disc base away from the grinding surface, and the connecting hole is connected to a clamp via a connecting piece.

[0013] Furthermore, the outer peripheral edge of the grinding surface is connected to the outer peripheral surface of the grinding disc base through a conical surface.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] Multiple diamond abrasive grains are distributed around the circumference of the grinding disc base, ensuring contact with the workpiece in both the circumferential and radial directions. This allows for multi-point contact with the workpiece surface, resulting in a larger polishing surface and a more uniform polishing effect. Furthermore, because there is a chip removal gap between adjacent diamond abrasive grains, grinding debris can be discharged through the chip removal gap during the rotation of the grinding disc base, reducing the accumulation of grinding debris on the polishing surface and improving polishing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic structural diagram of the grinding disc base of the present utility model;

[0017] Figure 2 This is a schematic structural diagram of the diamond grinding disc tooling of the present utility model;

[0018] Figure 3 This is a cross-sectional view of the diamond grinding disc tooling of the present utility model;

[0019] Figure 4 It is a cross-sectional view of the grinding disc base of the present utility model.

[0020] In the figure: 10, grinding disc base; 11, grinding surface; 12, connecting hole; 13, conical surface; 20, diamond abrasive grains; 21, chip removal interval; 30, fixture; 40, workpiece. DETAILED DESCRIPTION

[0021] Below, the present invention is further described with reference to the accompanying drawings and specific embodiments:

[0022] In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0024] like Figures 1-4 The diamond grinding wheel tooling shown includes a grinding wheel base 10 having a grinding surface 11. Multiple diamond abrasive grain groups are disposed on the grinding surface 11. The diamond abrasive grain groups are arranged radially from the inside outward of the grinding wheel base 10. Specifically, the diamond abrasive grain groups include multiple diamond abrasive grains 20, which are arranged circumferentially around the grinding wheel base 10. A chip removal gap 21 is provided between adjacent diamond abrasive grains 20.

[0025] Based on this structure, when using the diamond grinding wheel fixture of the present invention, during grinding, the multiple diamond abrasive grain groups on the grinding surface 11 of the grinding wheel base 10 contact the surface to be ground of the workpiece 40 from the inside to the outside. At the same time, multiple diamond abrasive grains 20 are distributed circumferentially around the grinding wheel base 10. In this way, the diamond abrasive grains 20 contact the workpiece 40 in both the circumferential and radial directions. This allows for multi-point contact with the surface to be ground of the workpiece 40, a large grinding surface 11, and a uniform grinding effect. At the same time, because there is a chip removal gap 21 between two adjacent diamond abrasive grains 20, during the rotation of the grinding wheel base 10, grinding chips can be discharged through the chip removal gap 21, reducing the accumulation of grinding chips on the grinding surface 11 and improving grinding accuracy.

[0026] Furthermore, the diamond abrasive grains 20 are round, and two adjacent diamond abrasive grains 20 are tangent to each other. When the diamond abrasive grains 20 are grinding, they adopt a round grain structure and contact with the arc surface. The grinding chips can enter the chip removal gap 21 through the arc surface, and the chips are effectively removed during use.

[0027] It should also be noted that the diamond abrasive grains 20 are made of a relatively hard material, and thus have a high grinding strength, which not only improves grinding efficiency but also increases service life. The grinding disc base 10 is made of stainless steel, and the diamond abrasive grains 20 are brazed to the grinding disc base 10, so that the diamond abrasive grains 20 are not easy to fall off, thereby improving the stability of the diamond abrasive grains 20.

[0028] Furthermore, multiple diamond abrasive groups are distributed at equal intervals, that is, diamonds are arranged in an orderly manner on the particle tool, so that each group of diamond abrasive groups is distributed at equal intervals. When the entire grinding surface 11 contacts the surface to be ground of the workpiece 40, diamond abrasive groups are distributed at equal intervals from the inside to the outside of the surface to be ground of the workpiece 40. The diamond abrasive groups are evenly distributed and the force is stable. They are not prone to deflection during the grinding process, so the grinding accuracy is higher.

[0029] Furthermore, two adjacent diamond abrasive grains 20 are distributed at equal intervals, that is, the diamond abrasive grains 20 are also distributed at equal intervals in the circumferential direction, and the diamond abrasive grains 20 distributed in the circumferential direction are also distributed at equal intervals, so that the force is more balanced and the grinding stability is improved.

[0030] Furthermore, the outer diameter of the diamond abrasive grains 20 is 0.01 mm.

[0031] Furthermore, a connecting hole 12 is provided at the end of the grinding disc base 10 facing away from the grinding surface 11, and the connecting hole 12 is connected to a clamp 30 through a connecting piece. The specific clamp 30 can be a grinder clamp 30 or a milling machine clamp 30 in the existing technology, and then the clamp 30 is connected to the connecting hole 12 of the grinding disc base 10 through connecting pieces such as bolts.

[0032] Furthermore, the outer peripheral edge of the grinding surface 11 is connected to the outer peripheral surface of the grinding disc base 10 by a conical surface 13. In this way, during grinding, the grinding chips can be thrown out through the chip removal gap 21, and some of the grinding chips located at the edge of the grinding surface 11 can be guided and thrown out through the conical surface 13, thereby improving the chip removal efficiency.

[0033] Those skilled in the art can make various other corresponding changes and deformations based on the technical solutions and concepts described above, and all of these changes and deformations should fall within the scope of protection of the claims of the present utility model.

Claims

1. A diamond grinding disc tool, characterized in that: The invention comprises a grinding disc base, wherein the grinding disc base is provided with a grinding surface, and a plurality of diamond abrasive grain groups are arranged on the grinding surface, and the plurality of diamond abrasive grain groups are arranged in the radial direction of the grinding disc base from the inside to the outside; the diamond abrasive grain group includes a plurality of diamond abrasive grains, and the plurality of diamond abrasive grains are arranged around the circumference of the grinding disc base; and there is a chip removal gap between two adjacent diamond abrasive grains.

2. The diamond grinding disc tooling according to claim 1, characterized in that: The diamond abrasive grains are round, and two adjacent diamond abrasive grains are tangent to each other.

3. The diamond grinding disc tooling according to claim 1, characterized in that: The plurality of diamond abrasive grain groups are distributed at equal intervals.

4. The diamond grinding disc tooling according to claim 3, characterized in that: The adjacent diamond abrasive grains are distributed at equal intervals.

5. The diamond grinding disc tooling according to any one of claims 1 to 4, characterized in that: The diamond abrasive grains are fixed to the grinding disc base in a brazing manner.

6. The diamond grinding disc tooling according to any one of claims 1 to 4, characterized in that: The outer diameter of the diamond abrasive grains is 0.01 mm.

7. The diamond grinding disc tooling according to any one of claims 1 to 4, characterized in that: The end of the grinding disc base body facing away from the grinding surface is provided with a connecting hole, and the connecting hole is connected to a clamp through a connecting piece.

8. The diamond grinding disc tooling according to any one of claims 1 to 4, characterized in that: The outer peripheral edge of the grinding surface is connected with the outer peripheral surface of the grinding disc base through a conical surface.

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