Silicon wafer sorting machine

By designing silicon wafer sorting machines with structures such as semi-ring frames and arc frames, the universality problem in sorting silicon wafers of different diameters is solved, fast and accurate sorting and screening are achieved, and production efficiency and quality are improved.

CN223361321UActive Publication Date: 2025-09-19SUZHOU DERUIMU ULTRASONIC TECH CO LTD
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Patent Information

Application Number
CN202422980231.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-04
Publication Date
2025-09-19
Estimated Expiration
2034-12-04

AI Technical Summary

Technical Problem

Existing silicon wafer sorting devices have poor versatility when dealing with silicon wafers of different diameters and require frequent debugging and calibration, resulting in large consumption of manpower and material resources and affecting sorting accuracy and stability.

Method used

A silicon wafer sorting machine was designed, which included a semi-ring frame, an arc frame, a mounting plate, a slide plate, an adjustment block and a push plate. The arc frame limited the silicon wafers, the slide plate and the adjustment block adjusted the height of the silicon wafers, and the push plate detected the deviation, thereby achieving rapid sorting.

Benefits of technology

It realizes the rapid detection and sorting of silicon wafers of different diameters, ensures processing quality, and reduces the consumption of manpower and material resources and the impact of errors.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of silicon wafer production, and particularly relates to a silicon wafer sorting machine which comprises a semi-ring frame plate, baffles are installed at the two ends of the semi-ring frame plate, receding grooves are formed in the baffles, a plurality of arc-shaped frames matched with the receding grooves are connected to the inner wall of the semi-ring frame plate in a sliding mode, installation grooves are formed in the outer walls of the baffles, and the arc-shaped frames are connected with the installation grooves in a sliding mode. A mounting plate is connected to the inner wall of the mounting groove in a clamped mode, two transverse rods are fixedly connected between the two adjusting blocks, a push plate is connected between the transverse rods in a sliding mode, and a vertical plate is vertically arranged on the push plate in a sliding mode; silicon wafers are limited through the arc-shaped frames to be located in the inner walls of the semi-ring frame plates, the two sides of the tops of the silicon wafers can be limited according to the sizes of the silicon wafers in cooperation with the installation grooves, the installation plates and the sliding plates, the silicon wafers can be supported at the same height, the silicon wafers are detected by the adjusting blocks, the transverse rods and the push plates, and the height of the adjusting blocks can be adjusted according to the sizes of the silicon wafers; the device can quickly detect a batch of silicon wafers, and unqualified silicon wafers can be screened and taken out.
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Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer production, and particularly relates to a silicon wafer sorting machine. Background Art

[0002] When sorting silicon wafers, if the silicon wafers with deviations in production diameter do not meet the output requirements, they need to be discarded. However, the existing sorting equipment has extremely poor versatility and is not convenient for performing simultaneous inspection and sorting operations on multiple batches of silicon wafers with different diameters. Every time a batch of silicon wafers is replaced (that is, the diameter of the silicon wafers changes), the sorting equipment needs to be complexly re-debugged, calibrated, or even replaced with some parts to make it adapt to the diameter range of the new batch of silicon wafers. This not only requires a lot of manpower, material resources and time costs, but also frequent adjustments are likely to introduce new error factors, further affecting the accuracy and stability of sorting. Utility Model Content

[0003] The utility model provides a silicon wafer sorting machine, which has the characteristic of solving the problem that the existing silicon wafer sorting device is inconvenient to sort silicon wafers with different diameters.

[0004] The utility model provides the following technical solution: it includes a semi-ring frame plate, baffles are installed at both ends of the semi-ring frame plate, a give way groove is provided on the baffle, a plurality of arc frames matching the give way groove are slidably connected to the inner wall of the semi-ring frame plate, a mounting groove is provided on the outer wall of the baffle, the mounting plate is snap-connected to the inner wall of the mounting groove, a slide plate is slidably connected between the two mounting plates, a clamping groove is provided on the baffle, the inner wall of the clamping groove is snap-connected to the clamping plate, an adjustment groove is provided on the clamping plate, an adjustment block is slidably connected to the inner wall of the adjustment groove, two cross bars are fixedly connected between the two adjustment blocks, a push plate is slidably connected between the cross bars, and a vertical plate is vertically slidably provided on the push plate.

[0005] A sliding groove is provided on one side of the mounting plate, and sliders matching the sliding groove are fixedly connected to both ends of the slide plate, and the sliders are connected to the sliding groove via a spring.

[0006] Wherein, a positioning rod is fixedly connected to the inner wall of the sliding groove, the spring is sleeved on the outer wall of the positioning rod, and the positioning rod passes through the sliding block.

[0007] Wherein, corresponding connecting holes are provided on the installation groove and the sliding groove, and the connecting holes are connected by a connecting rod.

[0008] The inner wall of the adjusting groove is fixedly connected with an adjusting rod, one of the adjusting rods passes through one of the adjusting blocks, and the other adjusting rod is threadedly connected to the other adjusting block.

[0009] Wherein, a support groove is opened on one side of the cross bar, and a support block matching the support groove is fixedly connected to the push plate.

[0010] Wherein, a limiting rod is installed on the push plate, a side plate is fixedly connected to the top of the vertical plate, and the limiting rod passes through the side plate.

[0011] The beneficial effects of the utility model are as follows: the silicon wafers are limited by a plurality of arc-shaped frames so that they are located in the inner wall of the semi-ring frame plate; the mounting grooves, mounting plates and slide plates can be used to limit the top two sides according to the size of the silicon wafers, so that the silicon wafers can be supported at the same height and detected by the adjustment block, cross bar and push plate; the height of the adjustment block can be adjusted according to the size of the silicon wafers, so that the device can quickly detect a batch of silicon wafers, screen and remove unqualified silicon wafers, and can perform use detection on silicon wafers of different sizes produced, thereby ensuring the processing quality of the silicon wafers after production.

[0012] The parts not involved in the device are the same as those in the prior art or can be implemented by using the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0014] Figure 2 This is a schematic diagram of the split structure of the installation slot in the utility model;

[0015] Figure 3 For this utility model Figure 1 A is an enlarged schematic diagram;

[0016] Figure 4 For this utility model Figure 1 A magnified schematic diagram of B.

[0017] In the figure: 1. semi-ring frame plate; 11. baffle; 12. give way groove; 13. arc frame; 2. mounting groove; 21. mounting plate; 22. slide groove; 23. slide plate; 24. slide block; 25. positioning rod; 26. spring; 27. connecting hole; 271. connecting rod; 3. clamping groove; 31. clamping plate; 32. adjustment groove; 33. adjustment rod; 34. adjustment block; 35. cross bar; 351. support groove; 36. push plate; 361. support block; 362. limit rod; 37. vertical plate; 371. side plate. DETAILED DESCRIPTION

[0018] See also Figures 1-4The utility model provides the following technical solutions: it includes a semi-ring frame plate 1, baffles 11 are installed at both ends of the semi-ring frame plate 1, and a makeshift groove 12 is opened on the baffle 11, and a plurality of arc-shaped frames 13 matching the makeshift groove 12 are slidably connected to the inner wall of the semi-ring frame plate 1, a mounting groove 2 is opened on the outer wall of the baffle 11, and a mounting plate 21 is snap-connected to the inner wall of the mounting groove 2, and a slide plate 23 is slidably connected between the two mounting plates 21, a slot 3 is opened on the baffle 11, and a card plate 31 is snap-connected to the inner wall of the slot 3, an adjustment slot 32 is opened on the card plate 31, and an adjustment block 34 is slidably connected to the inner wall of the adjustment slot 32, and two cross bars 35 are fixedly connected between the two adjustment blocks 34, a push plate 36 is slidably connected between the cross bars 35, and a vertical plate 37 is vertically slidably provided on the push plate 36.

[0019] In this embodiment: the semi-ring frame plate 1 is a carrier of the carrying device. At this time, the baffles 11 installed at both ends of the semi-ring frame plate 1 can support and protect both sides of the inner cavity of the semi-ring frame plate 1. At this time, the recesses 12 opened on the outer walls of the baffles 11 can make way for the installation of the arc frame 13. When the silicon wafers need to be sorted, the arc frames 13 can be pushed into the inner wall of the semi-ring frame plate 1 through several arc frames 13. The inner wall of the arc frame 13 slides and fits with the inner wall of the semi-ring frame plate 1. After the arc frame 13 is in the semi-ring frame plate 1, the silicon wafer can be placed on the inner wall of the arc frame 13. , by placing the semi-ring frame plate 1 horizontally, so that the silicon wafer is limited by the arc frame 13, it is relatively vertical to the semi-ring frame plate 1, so that its bottom is in the inner wall of the arc frame 13, and the silicon wafer can be clamped in the arc frame 13 under the action of its own gravity. At the same time, when the silicon wafers to be inspected and sorted are screened, the mounting plate 21 is clamped in the inner wall of the mounting groove 2. At this time, the slide plate 23 slidingly connected between the mounting plates 21 can be on the outside of the silicon wafer. The two slide plates 23 on both sides of the silicon wafer can slide toward the silicon wafer, so that silicon wafers of different sizes can be clamped and positioned by the slide plates 23, so that the silicon wafer can be limited in position. The arc frame 13 is located at the center, and several silicon wafers are supported and limited by a group of slides 23, so that the bottom of the silicon wafer is supported on the inner wall of the arc frame 13. After the silicon wafer is supported on the bottom of the inner wall of the arc frame 13, the bottoms of several silicon wafers are at the same height. When the radius of the silicon wafer after cutting produces a large error, the card plate 31 can be engaged with the inner wall of the card slot 3 at this time, and the adjustment block 34 is installed through the adjustment slot 32 opened on the card plate 31. The adjustment block 34 slides up and down on the inner wall of the adjustment slot 32. The two cross bars 35 fixedly connected between the adjustment blocks 34 can support and limit the push plate 36, so that the push plate 36 can slide horizontally between the cross bars 35, and the adjustment block 34 can adjust the height of the cross bars 35 and the push plate 36 according to the diameter of the silicon wafer, so that it can correspond to the diameter of silicon wafers of different sizes. When the push plate 36 slides on the cross bar 35, the cross bar 35 and the top of the silicon wafer supported on the arc frame 13 will deviate. Then, it can slide on the push plate 36 according to the vertical plate 37, and the deviation can be accurately measured according to the scale opened on the outer wall of the vertical plate 37, so that the device can quickly detect a batch of silicon wafers, screen out unqualified silicon wafers, and ensure the processing quality of the silicon wafers after production.

[0020] A slide groove 22 is provided on one side of the mounting plate 21, and sliders 24 matching the slide groove 22 are fixedly connected at both ends of the slide plate 23, and the slider 24 is connected to the slide groove 22 by a spring 26; the slide groove 22 provided on one side of the mounting plate 21 can limit the slider 24 fixedly connected to one end of the slide plate 23, so that the slide plate 23 can be limited by the slider 24 and the slide groove 22, so that it can slide firmly between the two mounting plates 21, ensuring that the two slide plates 23 are symmetrical, clamping the two sides of the top of the silicon wafer so that the silicon wafer can be limited on the arc frame 13, ensuring that the bottom of each silicon wafer maintains the same height, and the slider 24 can be pulled by the spring 26, so that the spring 26 can pull the slide plate 23, so that it can be limited according to silicon wafers of different sizes.

[0021] A positioning rod 25 is fixedly connected to the inner wall of the slide groove 22, and a spring 26 is sleeved on the outer wall of the positioning rod 25, and the positioning rod 25 passes through the slider 24; the positioning rod 25 fixedly connected to the inner wall of the slide groove 22 can limit the sliding of the slider 24. By passing the positioning rod 25 through the slider 24, the slider 24 slides on the inner wall of the slide groove 22, which can prevent the slide plate 23 from tilting, so that the slide plate 23 can remain relatively vertical to the mounting plate 21, so that it limits the position of the silicon wafer, and the spring 26 is sleeved on the outer wall of the positioning rod 25, so that it can pull the slider 24.

[0022] Corresponding connecting holes 27 are provided on the mounting groove 2 and the slide groove 22, and the connecting holes 27 are connected by a connecting rod 271; the connecting holes 27 provided on the mounting groove 2 and the slide groove 22 can be connected to the connecting holes 27 after the mounting plate 21 is installed on the inner wall of the mounting groove 2 by the connecting rod 271, so that the mounting plate 21 can be firmly supported on the baffle 11, so that the slide plate 23 can correspond to the outer side of the silicon wafer.

[0023] An adjusting rod 33 is fixedly connected to the inner wall of the adjusting groove 32, one of the adjusting rods 33 passes through one of the adjusting blocks 34, and the other adjusting rod 33 is threadedly connected to the other adjusting block 34; the adjusting rod 33 fixedly connected to the inner wall of the adjusting groove 32 can limit the adjusting block 34 and, by rotating an adjusting rod 33 threadedly connected to the adjusting block 34, the height of the adjusting block 34 on the adjusting rod 33 can be adjusted, so that the height of the cross bar 35 and the push plate 36 can be adjusted according to the size of the silicon wafer, so as to facilitate the detection and screening of silicon wafers of different sizes in a batch.

[0024] A support groove 351 is provided on one side of the cross bar 35, and a support block 361 matching the support groove 351 is fixedly connected to the push plate 36; the support groove 351 provided on one side of the cross bar 35 is used to support and limit the support block 361 fixedly connected to the push plate 36, so that the push plate 36 can slide horizontally between the cross bars 35, so that the position of the push plate 36 can be continuously pushed and adjusted, so as to facilitate the inspection of the silicon wafers on the arc frame 13 in turn and the sorting operation of the silicon wafers that have not reached the cutting target.

[0025] A limiting rod 362 is installed on the push plate 36, and a side plate 371 is fixedly connected to the top of the vertical plate 37, and the limiting rod 362 passes through the side plate 371; the limiting rod 362 installed on the push plate 36 can pass through the side plate 371 fixedly connected to the top of the vertical plate 37, so that the side plate 371 slides on the limiting rod 362, so that when the vertical plate 37 slides up and down on the push plate 36, the vertical plate 37 can ensure vertical up and down displacement, so that the vertical plate 37 can dock with the top position of the outer wall of the silicon wafer, so as to facilitate the detection of the error caused thereto, so that the silicon wafers can be accurately sorted.

[0026] The working principle and usage process of the present invention are as follows: after passing through the give way groove 12, several arc frames 13 are pushed into the inner wall of the semi-ring frame plate 1, and the silicon wafer support to be tested is placed on the inner wall of the arc frame 13. At this time, the mounting plate 21 can be installed on the mounting groove 2, and the two slides 23 can slide to push the two sides of the top of the silicon wafer so that several silicon wafers are in the arc frame 13. At the same time, the sliding range of the slide 23 can be adjusted according to the size of the silicon wafer to ensure that the bottoms of silicon wafers of batches of different sizes remain at the same height. The adjusting block 34 slides on the inner wall of the adjusting groove 32 so that it can correspond to the diameters of silicon wafers of different sizes. When the push plate 36 slides on the cross bar 35, the cross bar 35 and the top of the silicon wafer supported on the arc frame 13 produce a deviation. The vertical plate 37 can slide on the push plate 36, and the deviation can be accurately measured according to the scale opened on the outer wall of the vertical plate 37, so that the device can quickly detect a batch of silicon wafers, screen out unqualified silicon wafers, and ensure the processing quality of the silicon wafers after production.

Claims

1. A silicon wafer sorting machine, comprising a half-ring frame plate (1), characterized in that: Baffles (11) are installed at both ends of the semi-ring frame plate (1), and a clearance groove (12) is opened on the baffle plate (11). The inner wall of the semi-ring frame plate (1) is slidably connected with a plurality of arc-shaped frames (13) matching the clearance groove (12). The outer wall of the baffle plate (11) is provided with a mounting groove (2), and the inner wall of the mounting groove (2) is snap-connected with a mounting plate (21). A slide plate (23) is slidably connected between the two mounting plates (21). The baffle (11) is provided with a card slot (3), the inner wall of the card slot (3) is engaged with a card plate (31), the card plate (31) is provided with an adjustment slot (32), the inner wall of the adjustment slot (32) is slidably connected with an adjustment block (34), two cross bars (35) are fixedly connected between the two adjustment blocks (34), a push plate (36) is slidably connected between the cross bars (35), and a vertical plate (37) is vertically slidably provided on the push plate (36).

2. A silicon wafer sorting machine according to claim 1, characterized in that: A slide groove (22) is provided on one side of the mounting plate (21), and sliders (24) matching the slide groove (22) are fixedly connected to both ends of the slide plate (23), and the sliders (24) are connected to the slide groove (22) via springs (26).

3. A silicon wafer sorting machine according to claim 2, characterized in that: The inner wall of the sliding groove (22) is fixedly connected with a positioning rod (25), the spring (26) is sleeved on the outer wall of the positioning rod (25), and the positioning rod (25) passes through the slider (24).

4. A silicon wafer sorting machine according to claim 3, characterized in that: The installation groove (2) and the sliding groove (22) are provided with corresponding connecting holes (27), and the connecting holes (27) are connected via a connecting rod (271).

5. The silicon wafer sorting machine according to claim 1, characterized in that: An adjusting rod (33) is fixedly connected to the inner wall of the adjusting groove (32), one of the adjusting rods (33) passes through one of the adjusting blocks (34), and the other adjusting rod (33) is threadedly connected to the other adjusting block (34).

6. The silicon wafer sorting machine according to claim 1, characterized in that: A support groove (351) is provided on one side of the crossbar (35), and a support block (361) matching the support groove (351) is fixedly connected to the push plate (36).

7. The silicon wafer sorting machine according to claim 1, characterized in that: A limiting rod (362) is installed on the push plate (36), a side plate (371) is fixedly connected to the top of the vertical plate (37), and the limiting rod (362) passes through the side plate (371).