Information protection structure, circuit and electronic equipment

Abstract

The utility model discloses an information protection structure, a circuit and electronic equipment. The information protection structure comprises a first circuit layer on which a signal line is arranged; the second circuit layer is provided with a first safety winding, and the first safety winding is configured to partially cover the signal line; the carrier is provided with a second safety winding and a plurality of bonding pads; wherein the second safety wire is configured to complementarily cover the signal line, and is connected with the first safety wire through the plurality of bonding pads. By arranging the carrier and the second safety winding, the signal line in the first circuit layer can be protected, the information safety of the electronic equipment is improved, a third layer of circuit does not need to be added, the number of layers of the whole circuit board is reduced to two from three, the production cost and the production time are fully saved, and the production efficiency is improved. And the size of the electronic equipment is reduced.

Description

Technical Field

[0001] The present application relates to the field of information protection technology, and in particular to an information protection structure, circuit, and electronic device. Background Art

[0002] For the security of electronic devices in the financial sector, hardware security is equally important, not only for software-level information security. For example, in point-of-sale (POS) systems, to ensure secure information transmission on the I2C communication bus, the entire I2C wiring must be protected with wire wraps to prevent signal decryption using physical tools like probes. Therefore, the security of electronic device signal lines warrants careful attention. Utility Model Content

[0003] In view of this, the present application provides an information protection structure, circuit, and electronic device to address the technical problem of low security of signal lines in electronic devices. In a first aspect, an information protection structure is provided, comprising: a first circuit layer on which a signal line is disposed; a second circuit layer on which a first security winding is disposed, the first security winding being configured to partially cover the signal line; and a carrier on which a second security winding and a plurality of solder pads are disposed. The second security winding is configured to supplementally cover the signal line and is connected to the first security winding via the plurality of solder pads.

[0004] The above information protection structure, through the carrier and the second safety winding on the carrier, can securely protect the signal lines on the first circuit layer, thereby improving the safety of the electronic device. Furthermore, the design of the carrier and pads can flexibly adapt to different signal line routing designs, fully protecting the signal lines and improving the flexibility of the electronic device circuit board layout. It also eliminates the need for a third layer of circuitry, reducing production costs and the overall circuit structure size.

[0005] Optionally, the second safety winding is further configured to cover a plurality of pads.

[0006] Optionally, the second safety winding and the plurality of pads are arranged on the same surface or different surfaces of the carrier.

[0007] Optionally, the carrier further includes: a third safety winding, which is arranged on the carrier opposite to the second safety winding and connected to the second safety winding through a via hole, and the third safety winding is configured to cover a plurality of pads.

[0008] Optionally, one or more of the first safety winding, the second safety winding, or the third safety winding is a serpentine structure.

[0009] Optionally, the shape of the carrier is determined based on the signal line to be supplementarily covered, including: a regular pattern or an irregular pattern.

[0010] Optionally, the carrier is rectangular; there are four pads, which are respectively arranged at four vertices of the carrier.

[0011] Optionally, the first circuit layer and the second circuit layer are flexible circuit boards; the material of the carrier is silver paste material; a welding structure corresponding to the pad on the carrier is provided on the flexible circuit board; the carrier is connected to the flexible board through the pad and the welding structure by a bonding process.

[0012] In a second aspect, an information protection circuit is provided, comprising: the information protection structure provided in the first aspect; and a security circuit connected to the second security winding and configured to detect level changes on the second security winding.

[0013] In a third aspect, an electronic device is provided, comprising: the information protection circuit provided in the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The following is a brief introduction to the drawings used in describing the embodiments of the present disclosure:

[0015] Figure 1 A schematic diagram of an information protection structure provided in some embodiments of the present application is shown;

[0016] Figure 2 A schematic diagram showing another information protection structure provided in some embodiments of the present application is shown;

[0017] Figure 3 A schematic structural diagram of a plurality of pads and a carrier provided in some embodiments of the present application is shown;

[0018] Figure 4 A schematic diagram showing a structure of another information protection structure provided in some embodiments of the present application is shown;

[0019] Figure 5 A schematic structural diagram of an information protection circuit provided in some embodiments of the present application is shown. DETAILED DESCRIPTION

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the specific implementation methods of the present application will be described below with reference to the accompanying drawings. The drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings or embodiments can be obtained based on these drawings or embodiments without inventive work. Adjustments and improvements made without departing from the concept of the present application are all within the scope of protection of the present application.

[0021] In this application, unless otherwise expressly specified and limited, ordinal numbers such as "first" and "second" are only used to distinguish and describe related objects, and cannot be understood as indicating or implying the relative importance or order between related objects; in addition, they do not represent the number of related objects. "Multiple" includes two or more, and other quantifiers are similar. " / " is used to describe the relationship between related objects, which indicates an "or" relationship between related objects. "And / or" is used to describe the relationship between related objects, which includes any combination relationship between related objects, for example, "a and / or b" includes: "alone a", "alone b", or "a and b". "One or more" or "at least one" in multiple objects refers to any object or any combination of multiple objects, for example, "one or more of a1, a2, a3" or "at least one of a1, a2, a3" includes: "alone a1", "alone a2", "alone a3", "a1 and a2", "a1 and a3", "a2 and a3" or "a1, a2 and a3".

[0022] For the security of electronic devices in the financial sector, hardware security is equally important, in addition to software-level information security. For example, in point-of-sale (POS) systems, to ensure secure information transmission within the I2C communication bus, I2C traces must be fully protected with wire wraps to prevent signal decryption using physical tools such as probes. For example, in the INCELL process for electronic device screens, flexible printed circuit boards (LCD FPCs) typically consist of a two-layer structure. Because financial POS products require security, the screen's I2C signals must be fully protected with wire wraps. A two-layer LCD FPC solution may not fully cover the I2C traces, failing to meet security requirements. One solution is to create a three-layer LCD FPC, adding a layer with wire wraps to protect the I2C signals and thereby pass financial security certification. However, a three-layer LCD FPC structure can lead to long lead times and high costs for manufacturers, impacting product competitiveness. Another solution is to add a PCB protection board above the LCD FPC, using a hard board with safety wires to protect the FPC below, allowing the LCD FPC to be made of only two layers. However, this solution affects the overall stacking and circuit layout, has many limitations, and is also expensive to produce. Therefore, this application uses a two-layer FPC as a basis, provides a carrier in the area where the I2C signal is not covered by the safety wires, and installs a safety wire on the carrier. The safety wire is connected to the signal line on the protected FPC via a solder pad, thereby achieving more flexible signal line protection, reducing production costs, and reducing the overall circuit structure volume.

[0023] The following is a description with reference to the accompanying drawings:

[0024] Please refer to Figure 1 , which shows a schematic structural diagram of an information protection structure provided in some embodiments of the present application. The information protection structure includes at least: a first circuit layer 110, on which a signal line 111 is disposed; a second circuit layer 120, on which a first security winding 121 is disposed, and the first security winding 121 is configured to partially cover the signal line 111 in a first direction F1; a carrier 130, on which a second security winding 131 and a plurality of pads 132 are disposed; wherein the second security winding 131 is configured to supplementally cover the signal line 111 and is connected to the first security winding 121 via the plurality of pads 132.

[0025] The signal lines 111 on the first circuit layer 110 can transmit information related to electronic device information exchange or security authentication, such as a user's account number, password, or other authentication information, as well as control instructions and other data. The first security winding 121 on the second circuit layer 120 and the second security winding 131 on the carrier 130 can be a special protection circuit in the Payment Card Industry Data Security Standard (PCIDSS) and can be used to protect sensitive signals. For example, it can protect the I2C bus in the LCD FPC of financial electronic devices. The signal transmitted in the bus can reflect the information of the user's input password. The first security winding 121 and the second security winding 131 can have a dense winding structure, such as a serpentine winding, a Z-shaped winding, or a meandering winding. This winding structure allows an attacker to probe the I2C signal of the lower layer with a probe. If the probe attack causes the first security winding 121 or the second security winding 131 to be open or short-circuited, the electronic device will immediately trigger an alarm, clearing sensitive information stored in the device, such as passwords, card numbers, or user personal identity information. In the information protection structure of the present application, the first security winding 121 and the second security winding 131 can cover the signal line 111 in the direction of the vertical projection of the first circuit layer 110, that is, from top to bottom, the carrier 130, the second circuit layer 120, and the first circuit layer 110, or in a direction within a certain angle range from the vertical projection direction of the first circuit layer 110, to cover the signal line 111. Because the first security winding 121 may be occupied by other wiring in the circuit layer, it cannot fully cover the signal line 111 to be protected, thus posing a security risk. The second security winding 131 can supplement the portion not covered by the first security winding 121, and the first security winding 121 and the second security winding 131 jointly achieve protection for the signal line 111. Figure 2The second security winding 131 can be arranged on any side of the carrier 130, for example, the second security winding 131 is arranged on the side of the carrier 130 away from the first circuit layer 110, that is, Figure 1 For example, the second safety winding 131 is disposed on the side of the carrier 130 close to the first circuit layer 110, that is, Figure 2 The situation shown is not specifically limited here. Multiple pads 132 can fix the carrier 130 and the second security winding 131 on the carrier to the second circuit layer 110 through a bonding process. The pads 132 can electrically connect the second security winding 131 and the first security winding 121. Once an attacker attacks through a probe or other physical destruction method, if one or both of the first security winding 121 and the second security winding 131 are disconnected, the device's security management module will be aware of this behavior and take corresponding actions, such as interrupting the data transmission and communication of the signal line 111. The carrier 130 can be made of silver paste material, and the shape and size of the carrier 130 can be designed according to the shape and size of the signal line area that needs to be protected. This application bonds the first circuit layer 110 and the second circuit layer 120, which serve as LCD FPCs, with the carrier 130, which serves as a silver paste winding. This protects the LCD FPC signal lines without adding a third PCB or LCD FPC layer, reducing the number of overall circuit layers from three to two. This significantly saves production costs and time, and can reduce the space occupied by the overall circuit in the device, further reducing the size of the device. At the same time, the carrier 130 can be flexibly positioned in locations where the LCD FPC signal lines are not fully protected. Its size and shape can be designed and adjusted based on the shape of the signal line area to be covered, thereby increasing the flexibility of the electronic device circuit board layout. Due to the lightweight design of the carrier 130, the coverage range of the second safety winding 131 is relatively flexible, effectively complementing the first safety winding 121, improving the security of the overall circuit and preventing external attacks from deciphering the information on the signal lines.

[0026] In some embodiments of the present application, the second safety winding 131 is further configured to cover the plurality of pads 132 .

[0027] The pad 132 can be the starting point of the signal of the second security winding 131. Since the area of ​​the pad 132 is large, it is easier to be attacked by an external attacker using a probe. Therefore, the second security winding 131 can be used to cover the protection pad 132 to ensure the safety of the source input signal of the second security winding 131 on the carrier 130.

[0028] In some embodiments of the present application, the second safety winding 131 and the plurality of pads 132 are disposed on the same surface or different surfaces of the carrier 130 .

[0029] In some embodiments of this application, please continue to refer to Figure 1 One or more of the first safety winding 121, the second safety winding 131, or the third safety winding may have a serpentine structure. The serpentine structure of the safety winding may be formed by first completely covering the carrier with the winding material and then etching the serpentine structure of the safety winding. Alternatively, the serpentine structure may be pre-formed and then the safety winding may be disposed on the carrier 130 or the second circuit layer 120.

[0030] In some embodiments of the present application, the shape of the carrier 130 is determined based on the signal line 111 to be covered, including: regular graphics or irregular graphics. In the present application, the shape of the carrier 130 can be a polygonal pattern, such as a triangle, a quadrilateral, a pentagon... Or, an arc pattern, such as a circle, an ellipse, etc. Or a regular or irregular pattern, which is not specifically limited here. It can be determined based on the shape, size, etc. of the signal line 111 to be covered to improve the flexibility of circuit design.

[0031] In some embodiments of this application, please continue to refer to Figure 1 , the carrier 130 is rectangular; there are 4 solder pads 132, which are respectively arranged at the four vertices of the carrier 130. The number, shape, and position of the solder pads 132 can be set according to the setting position, size, shape and other parameters of the signal line 111 to achieve electrical connection between the second safety winding 131 and the signal line 111. For example, the number of solder pads 132 is 5, 6, 7..., and the shape of the solder pads 132 can be a polygonal pattern, an arc pattern, a regular or irregular pattern, which is not specifically limited here. When connecting the first safety winding 121 and the second safety winding 131, the solder pads 132 can be connected by all or part of the solder pads 132. For example, when the number of solder pads 132 is 4, two of the solder pads 132 are used to establish a connection between the first safety winding 121 and the second safety winding 131. The setting position of the solder pad 132 may not be limited to the vertex position, and may be located at any position on the carrier 130. For example, the specific position of the solder pad 132 may be determined based on the connection position between the first safety winding 121 and the second safety winding 131, such as concentrated on one side of the second surface of the carrier 130, or dispersed around the second surface of the carrier 130, and so on. Figure 3 A schematic diagram of a structure of multiple pads and a carrier provided in some embodiments of the present application is shown. Carrier 130 is an irregular shape, namely, a combination of two rectangles. A second safety winding 131 is disposed within a portion of the plane of carrier 130, and multiple pads 132 are disposed within another portion of the plane of carrier 130. Second safety winding 131 and multiple pads 132 are located on the same surface of carrier 130.

[0032] In some embodiments of the present application, Figure 4 A structural schematic diagram of another information protection structure provided in some embodiments of the present application is shown. The carrier 130 also includes a third security winding 133, which is arranged on the carrier 130 relative to the second security winding 131 and is connected to the second security winding 131 through a via. The third security winding 133 is configured to cover multiple pads 132. In this embodiment, the second security winding 131 can supplement the first security winding 121 in covering the signal line 111. Similarly, the third security winding 133 can also supplement the first security winding 121 and the second security winding 131 in covering the signal line 111. In addition, since the area of ​​the multiple pads 132 is large, it is also very important for security protection. The third security winding 133 can cover the multiple pads 132 to protect them from external physical attacks.

[0033] In some embodiments of the present application, the first circuit layer 110 and the second circuit layer 120 are flexible circuit boards (FPCs); the carrier 130 is made of silver paste. The FPC is provided with soldering structures corresponding to the solder pads 132 on the carrier 130; the carrier 130 is connected to the FPC via the solder pads 132 and the soldering structures through a bonding process. The FPC can be bent according to the actual application of the electronic device circuit. For example, when connecting the main circuit board and the display screen of an electronic device, compared to the connection method of a PCB board, the FPC allows for flexible connection between the main circuit board and the display screen, eliminating the need to place the main circuit board and the display screen on the same plane. The silver paste carrier 130 is similar to a FPC with a safety wire. Compared to combining two FPCs, the advantage is that the carrier 130 and the soldering structures can be directly bonded to the FPC using an ACF process, thereby safely and effectively connecting the carrier 130 and the second circuit layer 120 without exposing the safety wire pads.

[0034] In some embodiments of the present application, the signal line 111 is an I2C signal line. The signal line 111 in the present application can be an I2C signal line or other types of signal lines, such as signal lines that comply with the payment card industry data security standard and can be protected.

[0035] Based on the same technical concept, the present application provides an information protection circuit, including: the information protection structure provided in the above embodiments.

[0036] In some embodiments of this application, please refer to Figure 5, which shows a schematic diagram of the structure of an information protection circuit provided in some embodiments of the present application. It includes: the information protection structure 510 provided in the above embodiments; and a security circuit 520 connected to the second security winding 131 in the information protection structure 510 and configured to detect voltage level changes on the second security winding 131. After the first circuit layer 110 and the carrier 130 are electrically connected through a bonding process, once the carrier 130 is removed, the second security winding 131 connecting the carrier 130 and the second circuit layer 120 is disconnected. The security circuit can detect this disconnection and trigger an alarm. For example, the security circuit can be configured with a set of sensors that continuously monitor signals in one or more of the second security winding 131, the pad 132, and the third security winding 133. Any voltage level change triggers an alarm. For example, if a high voltage level persists on the second security winding 131, in the event of a disconnection or short circuit, the high voltage level will change to a low voltage level, immediately erasing sensitive information stored within the electronic device to ensure user information security. Figure 5 The connection between the middle security circuit 520 and the second security winding 131 of the information protection structure 510 is for illustration only; other connection methods are possible, such as via vias or circuit board traces. Furthermore, the security circuit 520 can also be connected to the first security winding 121, or to the soldering pad 132, or to the third security winding 133. This means that by determining the connection between the first security winding 121, the second security winding 131, the third security winding 133, and the soldering pad 132, security monitoring can be performed to detect potential tampering, thereby improving information security.

[0037] Based on the same technical concept, the present application also provides an electronic device, including: the information protection circuit provided in the above embodiments.

[0038] To simplify the drawings, the figures schematically illustrate only the portions relevant to the embodiments and do not represent the actual structure of the products. Furthermore, to simplify the drawings and facilitate understanding, in some figures, only a portion of components with the same structure or function are schematically depicted; in practice, more or fewer components with the same structure or function may exist.

Claims

1. An information protection structure, characterized in that: include: a first circuit layer on which signal lines are arranged; a second circuit layer, on which a first safety winding is disposed, wherein the first safety winding is configured to partially cover the signal line; A carrier is provided with a second safety winding and a plurality of pads; wherein the second safety winding is configured to supplementally cover the signal line and is connected to the first safety winding through the plurality of pads.

2. The information protection structure according to claim 1, characterized in that: The second safety winding is further configured to cover the plurality of pads.

3. The information protection structure according to claim 2, characterized in that: The second safety winding and the plurality of pads are disposed on the same surface or different surfaces of the carrier.

4. The information protection structure according to claim 3, characterized in that: The carrier further includes: a third safety winding, which is arranged on the carrier opposite to the second safety winding and connected to the second safety winding through a via hole, and the third safety winding is configured to cover the plurality of pads.

5. The information protection structure according to any one of claims 1 to 4, characterized in that: One or more of the first safety winding, the second safety winding, or the third safety winding is a serpentine structure.

6. The information protection structure according to claim 5, characterized in that: The shape of the carrier is determined based on the signal line to be supplementally covered, and includes a regular pattern or an irregular pattern.

7. The information protection structure according to claim 6, characterized in that: The carrier is rectangular; There are four solder pads, which are respectively arranged at the four vertices of the carrier.

8. The information protection structure according to any one of claims 1 to 3, characterized in that: The first circuit layer and the second circuit layer are flexible circuit boards; the material of the carrier is silver paste material; a welding structure corresponding to the welding pad on the carrier is provided on the flexible circuit board; the carrier is connected to the flexible circuit board through the welding pad and the welding structure by a bonding process.

9. An information protection circuit, characterized in that: include: The information protection structure according to any one of claims 1 to 7; The safety circuit is connected to the second safety winding and is configured to detect a voltage level change on the second safety winding.

10. An electronic device, characterized in that: include: The information protection circuit according to any one of claims 9.

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