Process chamber
By outputting the optional support block height and limit structure adjustment gear position signals in the process chamber of semiconductor processing equipment, the problem of incorrect operation of parts replacement inside and outside the chamber is solved, and equipment safety and process quality are guaranteed.
Patent Information
- Application Number
- CN202422054502.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-22
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2034-08-22
AI Technical Summary
In existing semiconductor processing equipment, operational errors or recording errors are prone to occur when replacing parts inside and outside the cavity, resulting in mismatched related parts inside and outside the cavity, affecting process quality and possibly causing equipment damage.
A process chamber is provided, which helps determine whether the chamber top or shower head will collide with the wafer by outputting a first signal indicating the height of an optional support block and a second signal indicating the height adjustment position of a limit structure. The process chamber includes a wafer tray, moving parts and a wiring harness, and uses pins and metal shrapnel groups to realize signal transmission and the alarm function of the alarm module.
It effectively avoids the collision between the chamber top or shower head and the wafer, ensures the safety of the equipment, and improves the operation accuracy and equipment stability of the process chamber.
Smart Images
Figure CN223363109U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor device processing, in particular to a process chamber. Background Art
[0002] In the prior art, the vacuum chamber and the outside of the vacuum chamber of semiconductor processing equipment are independent areas. There are some optional parts in the vacuum chamber. These optional parts have similar structures but different characteristic dimensions. For each specific optional part in the chamber, there is a specific external part outside the vacuum chamber that corresponds to and matches it. However, after the internal parts are assembled, the model and size of the internal parts cannot be directly visually identified when the semiconductor processing equipment is in operation. Therefore, when manually replacing the corresponding parts outside the chamber, there are problems such as the mismatch between the related parts inside and outside the chamber due to operating errors or recording errors by the operator who replaces the parts, resulting in errors in the semiconductor processing process and even equipment damage, functional failure and other consequences.
[0003] In order to overcome the above-mentioned defects of the prior art, the art urgently needs an improved process chamber for outputting a first signal indicating the height of the optional support block and a second signal indicating the height adjustment position of the limit structure, so as to help determine whether the chamber top or the shower head will collide with the wafer to be processed, thereby ensuring the equipment safety of the process chamber. Utility Model Content
[0004] The following is a brief summary of one or more aspects to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceivable aspects and is neither intended to identify key or critical elements of all aspects nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that will be provided later.
[0005] In order to overcome the above-mentioned defects of the prior art, the utility model provides a process chamber that can output a first signal indicating the height of an optional support block and a second signal indicating the height adjustment position of a limit structure, so as to help determine whether a collision will occur between the chamber top or the shower head and the wafer to be processed, thereby ensuring the equipment safety of the process chamber.
[0006] Specifically, the above-mentioned process chamber provided according to the first aspect of the present invention includes a wafer tray, a moving part and a wiring harness. The edge of the wafer tray is engaged with one of a plurality of groups of optional support blocks. The plurality of groups of optional support blocks have different heights. A height-adjustable limit structure is provided on the moving part. The limit structure has a plurality of height adjustment gears, and each of the height adjustment gears corresponds to the height of a group of the optional support blocks. One end of the wiring harness is connected to the optional support block of the wafer tray to output a first signal indicating the height of the optional support block, and the other end thereof is connected to the limit structure of the moving part to output a second signal indicating the height adjustment gear of the limit structure.
[0007] Furthermore, in some embodiments of the present invention, the bottom of the optional support block is provided with N+1 through-holes. The top of the wafer tray is provided with N+1 pins corresponding to the through-holes. The N+1 pins include a reference point and N connection points. The reference point is connected to a high voltage level. N is the number of groups of the optional support block.
[0008] Furthermore, in some embodiments of the present invention, the process chamber is provided with three groups of the optional support blocks. Four through holes are respectively provided at the bottom of each of the optional support blocks. Four pins are provided on the top of the wafer tray. The pins include one reference point and three connection points. The first optional support block is clamped on the wafer tray. The first connection point of the first optional support block is connected to the reference point, and a loop is formed through the first pin corresponding to the first connection point and the fourth pin corresponding to the reference point on the wafer tray to output the first signal corresponding to the first optional support block to the wiring harness. Or the second optional support block is clamped on the wafer tray. The second connection point of the second optional support block is connected to the reference point, and a loop is formed through the second pin corresponding to the second connection point and the fourth pin corresponding to the reference point on the wafer tray to output the first signal corresponding to the second optional support block to the wiring harness. Or the third optional support block is clamped on the wafer tray, the third connection point of the third optional support block is connected to the reference point, and a loop is formed through the third pin corresponding to the third connection point and the fourth pin corresponding to the reference point on the wafer tray to output the first signal corresponding to the third optional support block to the wiring harness.
[0009] Furthermore, in some embodiments of the present invention, the limiting structure is provided with N height adjustment gears. The moving component is also provided with a lateral pressure rod, and N metal spring groups corresponding to each of the height adjustment gears. Each of the metal spring groups has the same height as the corresponding height adjustment gear. Each of the metal spring groups includes a first metal spring and a second metal spring. The first metal springs are connected, and the second metal springs are not connected. One end of the lateral pressure rod is connected to the limiting structure, and moves up and down with the up and down movement of the limiting structure, and the other end thereof provides pressure to the first metal spring to connect the first metal spring with the corresponding second metal spring, thereby connecting the metal spring groups corresponding to each of the height adjustment gears to output the corresponding second signal to the wiring harness.
[0010] Furthermore, in some embodiments of the present invention, the first height adjustment position of the position limiting structure corresponds to the first optional support block and is equal to the height of the first metal dome group. The position limiting structure, via the lateral pressure rod, connects the first metal dome of the first metal dome group to the second metal dome, thereby outputting a second signal corresponding to the first height adjustment position to the wiring harness. Alternatively, the second height adjustment position of the position limiting structure corresponds to the second optional support block and is equal to the height of the second metal dome group. The position limiting structure, via the lateral pressure rod, connects the first metal dome of the second metal dome group to the second metal dome, thereby outputting a second signal corresponding to the second height adjustment position to the wiring harness. Alternatively, the third height adjustment position of the position limiting structure corresponds to the third optional support block and is equal to the height of the third metal dome group. The position limiting structure, via the lateral pressure rod, connects the first metal dome of the third metal dome group to the second metal dome, thereby outputting a second signal corresponding to the third height adjustment position to the wiring harness.
[0011] Furthermore, in some embodiments of the present invention, the process chamber further includes an alarm module, which is configured to output an alarm signal and / or stop the moving component when the first signal does not match the second signal.
[0012] Furthermore, in some embodiments of the present invention, the controller is also configured to: in response to the first signal matching the second signal, raise or lower the wafer tray to a preset wafer transfer position via the moving component; in response to a process instruction, lower or raise the wafer tray to a preset process position via the moving component to process the wafer to be processed; and in response to a wafer transfer instruction after processing is completed, raise or lower the wafer tray to the wafer transfer position via the moving component to output the processed wafer.
[0013] Furthermore, in some embodiments of the present invention, the alarm module outputs the alarm signal and / or stops the moving component when (AB1=AB2)∪(BC1=BC2)∪(AC1=AC2)=0. AB1=A1NOR B1. AB2=A2NOR B2. BC1=B1NOR C1. BC2=B2NOR C2. AC1=A1NOR C1. AC2=A2NOR C2. A1 is the first signal generated by the circuit corresponding to the first connection point of the first optional support block. A2 is the second signal generated by the connection of the first metal dome group. B1 is the first signal generated by the circuit corresponding to the second connection point of the second optional support block. B2 is the second signal generated by the connection of the second metal dome group. C1 is the first signal generated by the circuit corresponding to the third connection point of the third optional support block. C2 is the second signal generated by the connection of the third metal dome group. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or characteristics may have the same or similar reference numerals.
[0015] Figure 1 A schematic structural diagram of a process chamber provided according to some embodiments of the present invention is shown.
[0016] Figure 2A A schematic structural diagram of an optional support block provided according to some embodiments of the present utility model is shown.
[0017] Figure 2B A schematic structural diagram of an optional support block provided according to some embodiments of the present utility model is shown.
[0018] Figure 2C A schematic structural diagram of an optional support block provided according to some embodiments of the present utility model is shown.
[0019] Figure 3 A schematic structural diagram of an optional support block provided according to some embodiments of the present utility model is shown.
[0020] Figure 4 A schematic diagram showing the principle of the connection between a wafer tray and an optional support block provided in some embodiments of the present utility model is shown.
[0021] Figure 5 A schematic structural diagram of a moving component provided according to some embodiments of the present utility model is shown.
[0022] Figure 6 A schematic structural diagram of a moving component provided according to some embodiments of the present utility model is shown.
[0023] Figure 7 A schematic structural diagram of a metal dome assembly provided according to some embodiments of the present invention is shown.
[0024] Figure 8 A schematic diagram illustrating the principle of determining whether the height adjustment gears of the optional support block and the limiting structure match according to some embodiments of the present utility model is shown.
[0025] Reference numerals:
[0026] 10 Alarm module
[0027] 11 Wafer Tray
[0028] 12 moving parts
[0029] 121 Limiting structure
[0030] 122 Lateral compression rod
[0031] 123 First Metal Shrapnel
[0032] 124 Second Metal Shrapnel
[0033] 13 Optional support blocks
[0034] 14 Wiring Harness
[0035] 15 sprinkler heads
[0036] 16 Edge Ring DETAILED DESCRIPTION
[0037] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and functions of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this utility model are limited to this implementation. On the contrary, the purpose of introducing the utility model in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide an in-depth understanding of the present invention, the following description will contain many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.
[0038] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.
[0039] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood to refer to the orientations depicted in that section and the accompanying drawings. These relative terms are used solely for convenience of description and do not necessarily imply that the devices described herein must be manufactured or operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.
[0040] It is understood that although the terms "first," "second," "third," etc. may be used herein to describe various components, regions, layers, and / or portions, these components, regions, layers, and / or portions should not be limited by these terms, and these terms are merely used to distinguish different components, regions, layers, and / or portions. Thus, a first component, region, layer, and / or portion discussed below may be referred to as a second component, region, layer, and / or portion without departing from some embodiments of the present invention.
[0041] As mentioned above, after the in-cavity parts are assembled, the model and size of the in-cavity parts cannot be directly visually identified during operation of the semiconductor processing equipment. Therefore, when manually replacing the corresponding parts outside the cavity, there is a risk of operator error or recording errors, resulting in mismatched parts inside and outside the cavity. This can lead to errors in the semiconductor processing process and may even cause equipment damage or malfunction.
[0042] In order to overcome the above-mentioned defects of the prior art, the utility model provides a process chamber that can output a first signal indicating the height of an optional support block and a second signal indicating the height adjustment position of a limit structure, so as to help determine whether a collision will occur between the chamber top or the shower head and the wafer to be processed, thereby ensuring the equipment safety of the process chamber.
[0043] Please refer to the specific Figure 1 and Figures 2A to 2C . Figure 1 A schematic structural diagram of a process chamber provided according to some embodiments of the present invention is shown. Figure 2A A schematic structural diagram of an optional support block provided according to some embodiments of the present utility model is shown. Figure 2B A schematic structural diagram of an optional support block provided according to some embodiments of the present utility model is shown. Figure 2C A schematic structural diagram of an optional support block provided according to some embodiments of the present utility model is shown.
[0044] exist Figure 1 and Figures 2A to 2C In the illustrated embodiment, the process chamber provided by the present invention includes a wafer tray 11, a moving part 12 and a wiring harness 14. The wafer tray 11 can provide process gas, or provide high-temperature gas to heat the wafer to be processed, or can provide high-temperature process gas. The edge of the wafer tray 11 is clamped to one of the multiple groups of optional support blocks 13. Here, the multiple groups of optional support blocks 13 have different heights. A height-adjustable limiting structure 121 is provided on the moving part 12. Here, the limiting structure 121 has multiple height adjustment gears, and each height adjustment gear corresponds to the height of a group of optional support blocks 13. One end of the wiring harness 14 is connected to the wafer tray 11, and the other end thereof is connected to the moving part 13, and is used to output a first signal indicating the height of the optional support block 13, and a second signal indicating the height adjustment gear of the limiting structure 121.
[0045] Please refer to further Figure 3 and Figure 4 . Figure 3 A schematic structural diagram of an optional support block provided according to some embodiments of the present utility model is shown. Figure 4 A schematic diagram showing the principle of the connection between a wafer tray and an optional support block provided in some embodiments of the present utility model is shown.
[0046] like Figure 3 and Figure 4 As shown, the bottom of the optional support block 13 is provided with N+1 through-holes, and the top of the wafer tray 11 is provided with N+1 pins corresponding to the through-holes. These N+1 pins include a reference point and N connection points. Reference point D1 is connected to the high voltage VDD1, and N is the number of groups of optional support blocks 13.
[0047] Furthermore, in some embodiments, the process chamber is configured with three groups of optional support blocks 13, each optional support block 13 has four through holes at the bottom, and the top of the wafer tray 11 has four pins, including one reference point D1 and three connection points A1~C1.
[0048] Specifically, in an embodiment in which the first optional support block is clamped on the wafer tray 11, the first connection point A1 of the first optional support block is connected to the reference point D1, and a loop is formed through the first pin corresponding to the first connection point A1 and the fourth pin corresponding to the reference point D1 on the wafer tray 11 to output a first signal corresponding to the first optional support block to the wiring harness 14.
[0049] Alternatively, in an embodiment in which the second optional support block is clamped on the wafer tray 11, the second connection point B1 of the second optional support block is connected to the reference point D1, and a loop is formed through the second pin corresponding to the second connection point B1 and the fourth pin corresponding to the reference point D1 on the wafer tray 11 to output the first signal corresponding to the second optional support block to the wiring harness 14.
[0050] Alternatively, in an embodiment in which the third optional support block is clamped on the wafer tray, the third connection point C1 of the third optional support block is connected to the reference point D1, and a loop is formed through the third pin corresponding to the third connection point C1 and the fourth pin corresponding to the reference point D1 on the wafer tray 11 to output the first signal corresponding to the third optional support block to the wiring harness 14.
[0051] Please refer to Figures 5 to 7 . Figure 5 A schematic structural diagram of a moving component provided according to some embodiments of the present utility model is shown. Figure 6 A schematic structural diagram of a moving component provided according to some embodiments of the present utility model is shown. Figure 7 A schematic structural diagram of a metal dome assembly provided according to some embodiments of the present invention is shown.
[0052] exist Figures 5 to 7 In the illustrated embodiment, the limiting structure 121 is provided with N height adjustment positions, and the movable component 12 is further provided with a lateral pressure rod 122 and N metal spring groups corresponding to each height adjustment position. Each metal spring group has the same height as the corresponding height adjustment position. Each metal spring group includes a first metal spring 123 and a second metal spring 124. The first metal springs 123 are connected and connected to the reference high voltage VDD2, while the second metal springs 124 are disconnected. One end of the lateral pressure rod 122 is connected to the limiting structure 121 and moves up and down as the limiting structure 121 moves up and down. The other end of the lateral pressure rod 122 applies pressure to the first metal spring 123, connecting the first metal spring 123 with the corresponding second metal spring 124, thereby connecting the metal spring groups corresponding to each height adjustment position, thereby outputting the corresponding second signal to the wiring harness 14.
[0053] Furthermore, the first height adjustment position of the position-limiting structure 121 corresponds to the first optional support block and is equal to the height of the first metal dome group. Accordingly, in the embodiment where the position-limiting structure 121 is in the first height adjustment position, the position-limiting structure 121 connects the first metal dome 123 and the second metal dome 124 of the first metal dome group A2 via the lateral pressure rod 122, thereby outputting a second signal corresponding to the first height adjustment position to the wiring harness 14.
[0054] Similarly, the second height adjustment position of the limiting structure 121 corresponds to the second optional support block and is equal to the height of the second metal dome group. Accordingly, in the embodiment where the limiting structure 121 is in the second height adjustment position, the limiting structure 121 connects the first metal dome 123 and the second metal dome 124 of the second metal dome group B2 via the lateral pressure rod 122, thereby outputting a second signal corresponding to the second height adjustment position to the wiring harness 14.
[0055] Similarly, the third height adjustment position of the limiting structure 121 corresponds to the third optional support block and is equal to the height of the third metal dome group. Accordingly, in the embodiment where the limiting structure 121 is in the third height adjustment position, the limiting structure 121, via the lateral pressure rod 122, connects the first metal dome 123 and the second metal dome 124 of the third metal dome group C2, thereby outputting a second signal corresponding to the third height adjustment position to the wiring harness 14.
[0056] In addition, Figure 1 In the illustrated embodiment, the process chamber provided by the present invention may further include a showerhead 15 and an edge ring 16. The showerhead may be used to provide process gas to the upper surface of the wafer to be processed. The edge ring 16 may be used to support the wafer to be processed and to improve thermal conductivity and plasma distribution on the wafer to be processed, thereby enhancing deposition uniformity.
[0057] Please refer to Table 1 and Figure 8 Table 1 shows a truth table of a NOR signal provided according to some embodiments of the present invention. Figure 8 A schematic diagram showing the principle of outputting an alarm signal by an alarm module provided in some embodiments of the present utility model is shown.
[0058] Table 1 Truth table of the or-not signal
[0059]
[0060]
[0061] In addition, Figure 8 In the embodiment shown, the process chamber provided by the present invention may further include an alarm module 10. Here, the alarm module 10 is used to output an alarm signal and / or stop the moving part 12 when the first signal does not match the second signal.
[0062] As shown in Table 1, the alarm module 10 outputs an alarm signal and / or stops the moving component 12 when (AB1=AB2)∪(BC1=BC2)∪(AC1=AC2)=0. Specifically, the alarm module can calculate the OR signal of the first signal and the second signal according to Table 1:
[0063] AB1=A1 NOR B1
[0064] AB2=A2 NOR B2
[0065] BC1=B1 NOR C1
[0066] BC2=B2 NOR C2
[0067] AC1=A1 NOR C1
[0068] AC2=A2 NOR C2
[0069] Here, A1 is the first signal generated by the circuit corresponding to the first connection point of the first optional support block, and A2 is the second signal generated by the connection of the first metal dome group; B1 is the first signal generated by the circuit corresponding to the second connection point of the second optional support block, and B2 is the second signal generated by the connection of the second metal dome group; C1 is the first signal generated by the circuit corresponding to the third connection point of the third optional support block, and C2 is the second signal generated by the connection of the third metal dome group.
[0070] For example, when the first optional support block is selected and connected to the wafer tray 11, the A1 connection point is connected to the D1 reference point, and a loop is formed through the corresponding first pin and fourth pin on the wafer tray 11, that is, the A1 signal is 1. Correspondingly, the B1 signal is 0 and the C1 signal is 0. At this time, the OR signal AB1 is 0, AC1 is 0, and BC1 is 1. Correspondingly, when the limiting structure 121 is moved to the first height adjustment position that matches the first optional support block, the first metal spring group A2 is connected to the reference high level D2, that is, the A2 signal is 1. Correspondingly, the B2 signal is 0 and the C2 signal is 0. At this time, the OR signal AB2 is 0, AC2 is 0, and BC2 is 1. At this time, (AB1=AB2)∪(BC1=BC2)∪(AC1=AC2)=1, the first signal matches the second signal, and the alarm module 10 does not need to output an alarm signal.
[0071] For another example, when the second optional support block is selected and connected to the wafer tray 11, the B1 connection point and the D1 reference point are connected, and a loop is formed through the corresponding second and fourth pins on the wafer tray 11, that is, the B1 signal is 1. Correspondingly, the A1 signal is 0 and the C1 signal is 0. At this time, the NOR signal AB1 is 0, AC1 is 1, and BC1 is 0. Correspondingly, when the limiting structure 121 is moved to the second height adjustment position that matches the second optional support block, the second metal spring group B2 is connected to the reference high level D2, that is, the B2 signal is 1. Correspondingly, the A2 signal is 0 and the C2 signal is 0. At this time, the NOR signal AB2 is 0, AC2 is 1, and BC2 is 0. At this time, (AB1=AB2)∪(BC1=BC2)∪(AC1=AC2)=1, the first signal matches the second signal, and the alarm module 10 does not need to output an alarm signal.
[0072] For another example, when the third optional support block is selected and connected to the wafer tray 11, the C1 connection point and the D1 reference point are connected, and a loop is formed through the corresponding third and fourth pins on the wafer tray 11, that is, the C1 signal is 1. Correspondingly, the A1 signal is 0, and the B1 signal is 0. At this time, the NOR signal AB1 is 1, AC1 is 0, and BC1 is 0. Correspondingly, when the limit structure 121 is moved to the third height adjustment position that matches the third optional support block, the third metal spring group C2 is connected to the reference high level D2, that is, the C2 signal is 1. Correspondingly, the A2 signal is 0, and the B2 signal is 0. At this time, the NOR signal AB2 is 1, AC2 is 0, and BC2 is 0. At this time, (AB1=AB2)∪(BC1=BC2)∪(AC1=AC2)=1, the first signal matches the second signal, and the alarm module 10 does not need to output an alarm signal.
[0073] Conversely, when (AB1=AB2)∪(BC1=BC2)∪(AC1=AC2)=0, the height adjustment position of the optional support block 13 and the limiting structure 121 do not match. The alarm module 10 can output an alarm signal and / or directly control the moving parts to stop operation to prevent the chamber top or showerhead from colliding with the wafer to be processed, thereby ensuring the safety of the equipment in the process chamber. Afterwards, the technician can manually adjust the height adjustment position of the limiting structure 121 until the first signal matches the second signal, and the alarm module 10 deactivates the alarm.
[0074] In summary, the process chamber provided by the present invention can output a first signal indicating the height of the optional support block and a second signal indicating the height adjustment position of the limit structure, so as to help determine whether the chamber top or the shower head will collide with the wafer to be processed, thereby ensuring the equipment safety of the process chamber.
[0075] Although the above methods are illustrated and described as a series of acts for simplicity of explanation, it is to be understood and appreciated that these methods are not limited by the order of the acts, as some acts may occur in a different order and / or concurrently with other acts from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art according to one or more embodiments.
[0076] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A process chamber, characterized in that: include: A wafer tray, the edge of which is engaged with one of a plurality of sets of optional support blocks, wherein the plurality of sets of optional support blocks have different heights; A moving component, on which a height-adjustable limiting structure is provided, wherein the limiting structure has a plurality of height adjustment gears, each of the height adjustment gears corresponding to the height of a group of the optional support blocks; and A wiring harness, one end of which is connected to the optional support block of the wafer tray to output a first signal indicating the height of the optional support block, and the other end of which is connected to the limiting structure of the moving part to output a second signal indicating the height adjustment gear of the limiting structure.
2. The process chamber according to claim 1, wherein: The bottom of the optional support block is provided with N+1 through holes, and the top of the wafer tray is provided with N+1 pins corresponding to the through holes, wherein the N+1 pins include a reference point and N connection points, the reference point is connected to a high level, and N is the number of groups of the optional support blocks.
3. The process chamber according to claim 2, wherein: The process chamber is equipped with three sets of optional support blocks, each of which has four through holes at the bottom. The top of the wafer tray has four pins, including one reference point and three connection points. A first optional support block is clamped on the wafer tray, a first connection point of the first optional support block is connected to the reference point, and a loop is formed through a first pin corresponding to the first connection point and a fourth pin corresponding to the reference point on the wafer tray to output a first signal corresponding to the first optional support block to the wiring harness; or A second optional support block is clamped on the wafer tray, a second connection point of the second optional support block is connected to the reference point, and a loop is formed via a second pin corresponding to the second connection point and a fourth pin corresponding to the reference point on the wafer tray to output a first signal corresponding to the second optional support block to the wiring harness; or The third optional support block is clamped on the wafer tray, and the third connection point of the third optional support block is connected to the reference point, and a loop is formed through the third pin corresponding to the third connection point and the fourth pin corresponding to the reference point on the wafer tray to output a first signal corresponding to the third optional support block to the wiring harness.
4. The process chamber according to claim 3, wherein: The limiting structure is provided with N height adjustment gears, and the moving component is further provided with a lateral pressure rod and N metal spring groups corresponding to each of the height adjustment gears, wherein: The height of each metal spring group is the same as the height of the corresponding height adjustment gear. Each metal spring group includes a first metal spring and a second metal spring. The first metal springs are connected, and the second metal springs are not connected. One end of the lateral pressure rod is connected to the limiting structure and moves up and down with the up and down movement of the limiting structure, and the other end provides pressure to the first metal spring to connect the first metal spring with the corresponding second metal spring, thereby connecting the metal spring group corresponding to each height adjustment gear to output the corresponding second signal to the wiring harness.
5. The process chamber according to claim 4, wherein: The first height adjustment gear of the limiting structure corresponds to the first optional support block and is equal to the height of the first metal dome group. The limiting structure connects the first metal dome and the second metal dome of the first metal dome group via the lateral pressure rod to output a second signal corresponding to the first height adjustment gear to the wiring harness; or The second height adjustment gear of the limiting structure corresponds to the second optional support block and is equal to the height of the second metal dome group. The limiting structure connects the first metal dome and the second metal dome of the second metal dome group via the lateral pressure rod to output a second signal corresponding to the second height adjustment gear to the wiring harness; or The third height adjustment position of the limiting structure corresponds to the third optional support block and is equal to the height of the third metal dome group. The limiting structure connects the first metal dome and the second metal dome of the third metal dome group via the lateral pressure rod to output a second signal corresponding to the third height adjustment position to the wiring harness.
6. The process chamber according to claim 1, wherein: Also includes: The alarm module is used to output an alarm signal and / or stop the moving component when the first signal does not match the second signal.
7. The process chamber according to claim 6, wherein: The alarm module outputs the alarm signal and / or stops the moving component when (AB1=AB2)∪(BC1=BC2)∪(AC1=AC2)=0, wherein AB1=A1 NOR B1, AB2=A2 NOR B2, BC1=B1 NOR C1, BC2=B2 NOR C2, AC1=A1 NOR C1, AC2=A2NOR C2, A1 is a first signal generated by the circuit corresponding to the first connection point of the first optional support block, A2 is a second signal generated by the connection of the first metal dome group, B1 is a first signal generated by the circuit corresponding to the second connection point of the second optional support block, B2 is a second signal generated by the connection of the second metal dome group, C1 is a first signal generated by the circuit corresponding to the third connection point of the third optional support block, and C2 is a second signal generated by the connection of the third metal dome group.