Wafer clamping device and semiconductor equipment

Abstract

According to the wafer clamping device and the semiconductor equipment, when the wafer clamping device works, in the direction perpendicular to the surface of a wafer, a suction cup provides suction force for the wafer and is used for bearing the wafer; in the direction parallel to the surface of the wafer, the driving mechanism applies force to the clamping element, and the clamping element moves in the radial direction of the wafer, so that the vertical surface of the clamping element abuts against the side wall of the wafer. Therefore, the wafer clamping device exerts force on the wafer in the direction perpendicular to the surface of the wafer and the direction parallel to the surface of the wafer at the same time, so that the wafer clamping device can fasten the wafer, the wafer is easily in a stable posture all the time in the process of carrying out process treatment on the wafer, and even if the wafer rotates at a high speed, the wafer cannot be damaged. And the wafer is not easy to collide with other parts, so that the quality of wafer process treatment is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wafer clamping device and semiconductor equipment. Background Art

[0002] Wafer processing is a critical step in semiconductor manufacturing. To ensure wafers are precisely positioned and protected during various manufacturing processes, wafer clamping devices must not only ensure wafer stability but also minimize contamination and damage to the wafer surface.

[0003] Currently, wafer clamping is primarily achieved using mechanical clamping devices. Specifically, spring clamping and gear clamping achieve fixation by directly contacting the wafer edge. The following problems exist when using mechanical clamping devices to clamp wafers: First, the clamping elements in the mechanical clamping device use inclined surfaces for clamping, which exerts downward pressure on the wafer, affecting its overall posture and stability. Second, during high-speed rotation, the wafer's slight wobble increases, causing the wafer to collide with other components and reducing the quality of the wafer processing.

[0004] Therefore, there is an urgent need for a new clamping device that can keep the wafer in a stable posture. Utility Model Content

[0005] The problem solved by the embodiments of the present invention is to provide a wafer clamping device and a semiconductor device for keeping the wafer in a stable posture.

[0006] To solve the above problems, an embodiment of the present invention provides a wafer clamping device, comprising: a suction cup for carrying a wafer; a clamping element comprising a vertical surface, the vertical surface being used to abut against the side wall of the wafer; and a driving mechanism arranged at the edge of the suction cup, for applying force to the clamping element to move the clamping element in the radial direction of the wafer.

[0007] Optionally, the vertical surface of the clamping element has a curvature in a horizontal plane, and the curvature is used to cooperate with the curved edge of the wafer.

[0008] Optionally, the wafer clamping device also includes: a guiding element, the guiding element includes a slide groove extending along the radial direction of the wafer, the number of the guiding elements is multiple, and the multiple guiding elements are arranged at intervals on the circumferential side wall of the suction cup; the clamping element is slidably arranged in the slide groove.

[0009] Optionally, the suction cup includes: a Bernoulli suction cup, used to generate airflow to suspend and fix the wafer above the Bernoulli suction cup; and the driving mechanism is arranged at the edge of the Bernoulli suction cup.

[0010] Optionally, the Bernoulli suction cup includes: a main body structure; an air outlet channel located in the main body structure, the air outlet channel including: a main air channel; a plurality of branch air channels connected to the main air channel, the branch air channels being located at the top of the main air channel; a nozzle located at the end of the branch air channel, the nozzle facing outward along the radial direction of the wafer.

[0011] Optionally, the main airway is located at the center of the main body structure.

[0012] Optionally, the branch airway includes: a first airway connected to the top of the main airway; a second airway connected to the end of the first airway away from the main airway, and the second airway is arranged vertically or obliquely upward; a third airway connected to the end of the second airway away from the first airway, and the nozzle is located at the end of the third airway.

[0013] Optionally, the Bernoulli suction cup also includes: an adsorption hole, located at the top of the main body structure corresponding to the third air channel, the adsorption hole is arranged in a vertical direction to connect the third air channel with the outside, the number of the adsorption holes is multiple, and they are arranged along the radial direction of the wafer.

[0014] Optionally, the nozzle is located on the top side wall of the main body structure.

[0015] Optionally, the driving mechanism includes a spring, one end of which is connected to the side wall of the suction cup, and the other end of the spring is connected to the clamping element; or, the driving mechanism includes a cylinder or a hydraulic cylinder, and the output end of the cylinder or the hydraulic cylinder applies force to the clamping element.

[0016] The utility model also provides a semiconductor device, comprising the wafer clamping device of the above embodiment.

[0017] Compared with the prior art, the technical solution of the embodiment of the utility model has the following advantages:

[0018] The wafer clamping device provided in an embodiment of the present invention includes a suction cup for carrying a wafer; a clamping element including a vertical surface for abutting against a side wall of the wafer; and a driving mechanism disposed at an edge of the suction cup for applying a force to the clamping element so that the clamping element moves in a radial direction of the wafer. When the wafer clamping device provided by the present invention is in operation, the suction cup provides suction to the wafer in a direction perpendicular to the wafer surface to carry the wafer; and the driving mechanism applies a force to the clamping element in a direction parallel to the wafer surface, causing the clamping element to move in a radial direction of the wafer so that the vertical surface of the clamping element abuts against the side wall of the wafer. Therefore, the wafer clamping device applies force to the wafer in a direction perpendicular to the wafer surface and in a direction parallel to the wafer surface simultaneously, so that the wafer clamping device can tighten the wafer, so that during the process of processing the wafer, the wafer is easily kept in a stable posture. Even at high speed, the wafer is not easily collided with other components, which is conducive to improving the quality of wafer processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic structural diagram of a wafer clamping device according to an embodiment of the present invention when clamping a wafer;

[0020] Figure 2 This is a schematic structural diagram of a wafer clamping device according to an embodiment of the present invention;

[0021] Figure 3 This is a schematic structural diagram of a suction cup according to an embodiment of the present utility model;

[0022] Figure 4 It is a cross-sectional schematic diagram of the suction cup according to an embodiment of the present utility model;

[0023] Figure 5 This is a partial schematic diagram of a wafer clamping device clamping a wafer according to an embodiment of the present utility model;

[0024] Figure 6 This is a schematic structural diagram of a wafer clamping element according to an embodiment of the present utility model;

[0025] Figure 7 It is a schematic diagram of the connection between the clamping element, the driving mechanism and the suction cup in an embodiment of the present utility model. DETAILED DESCRIPTION

[0026] As can be seen from the background art, currently, wafer clamping mainly uses mechanical clamping devices. Specifically, spring clamping and gear clamping achieve fixation by directly contacting the edge of the wafer. The following problems exist when clamping wafers with mechanical clamping devices: First, the clamping elements in the mechanical clamping device use inclined surfaces for clamping, which exerts downward pressure on the wafer, affecting the overall posture and stability of the wafer; second, when rotating at high speeds, the wafer's shaking amplitude increases, causing the wafer to contact the bottom of the wafer clamping device, reducing the quality of the wafer processing.

[0027] In order to solve the above technical problems, the wafer clamping device provided in an embodiment of the present invention includes: a suction cup for carrying the wafer in a contactless manner; a clamping element including a vertical surface, which is used to abut against the side wall of the wafer; and a driving mechanism arranged at the edge of the suction cup for applying force to the clamping element to move the clamping element in the radial direction of the wafer.

[0028] When the wafer clamping device provided by the present invention is in operation, the suction cup provides suction to the wafer in a direction perpendicular to the wafer surface, thereby supporting the wafer. In a direction parallel to the wafer surface, the drive mechanism applies force to the clamping element, causing the clamping element to move in the radial direction of the wafer, so that the vertical surface of the clamping element abuts against the side wall of the wafer. Therefore, the wafer clamping device simultaneously applies force to the wafer in directions perpendicular to and parallel to the wafer surface, enabling the wafer clamping device to secure the wafer. This allows the wafer to remain in a stable position during processing, and even at high speeds, the wafer is less likely to collide with other components, thereby improving the quality of wafer processing.

[0029] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0030] refer to Figure 1 and Figure 2 , showing a schematic structural diagram of the wafer clamping device of the present invention.

[0031] The wafer clamping device comprises: a suction cup 100 for carrying a wafer; a clamping element 200 comprising a vertical surface 201 (such as Figure 7 As shown), the vertical surface 201 is used to abut against the side wall of the wafer; the driving mechanism 300 (as shown Figure 2 ), which is arranged at the edge of the suction cup 100 and is used to apply force to the clamping element 200 so that the clamping element 200 moves in the radial direction of the wafer.

[0032] When the wafer clamping device provided by the present invention is in operation, the suction cup 100 provides suction to the wafer in a direction perpendicular to the wafer surface, thereby supporting the wafer. In a direction parallel to the wafer surface, the drive mechanism 300 applies force to the clamping element 200, causing the clamping element 200 to move in the radial direction of the wafer, so that the vertical surface 201 of the clamping element 200 abuts against the side wall of the wafer. Therefore, the wafer clamping device simultaneously applies force to the wafer in a direction perpendicular to the wafer surface and in a direction parallel to the wafer surface, enabling the wafer clamping device to secure the wafer. This allows the wafer to remain in a stable position during processing, and even at high speeds, the wafer is less likely to collide with other components, thereby improving the quality of wafer processing.

[0033] The suction cup 100 is used to carry the wafer, thereby providing support for the wafer in a direction perpendicular to the surface of the wafer.

[0034] In this embodiment, the suction cup 100 includes a Bernoulli suction cup, which is used to generate airflow to suspend and fix the wafer above the Bernoulli suction cup.

[0035] During the wafer clamping process, the Bernoulli chuck generates airflow, leveraging the Bernoulli effect to create a low-pressure area that suspends the wafer above the chuck. This contactless loading method effectively reduces mechanical contact and potential damage to the wafer surface, helping to maintain wafer surface cleanliness during semiconductor manufacturing and improving the quality and reliability of wafer processing.

[0036] refer to Figure 3 and Figure 4 The Bernoulli suction cup includes: a main body structure 101; an air outlet channel 102 (such as Figure 4 As shown in the figure), it is located in the main body structure 101, and the air outlet channel 102 includes: a main air channel 1021; a plurality of branch air channels 1022, which are connected to the main air channel 1021, and the branch air channels 1022 are located at the top of the main air channel 1021; a nozzle (not shown in the figure), which is located at the top of the main body structure 101 and also at the end of the branch air channel 1022, and the nozzle faces outward along the radial direction of the wafer.

[0037] The main body structure 101 provides a structural basis and spatial location for the air outlet channel 102 and the nozzle.

[0038] In this embodiment, the main body structure 101 is a cylindrical structure. In other embodiments, the main body structure 101 can also be a rectangular parallelepiped structure.

[0039] The air outlet channel 102 provides an air flow channel for the Bernoulli suction cup, thereby achieving contactless loading and fixation of the wafer, which can significantly reduce mechanical stress and potential contamination on the wafer surface, while improving stability and reliability during wafer processing.

[0040] Specifically, the air outlet channel 102 includes: a main air channel 1021; and a plurality of branch air channels 1022 that are in communication with the main air channel 1021. The branch air channels 1022 are located at the top of the main air channel 1021.

[0041] In this embodiment, the main air channel 1021 is located at the center of the main structure 101 and serves as an airflow input channel. The main air channel 1021 is located at the center of the main structure 101, which facilitates the uniform distribution of airflow to each branch air channel 1022, ensuring balanced force on all parts of the wafer.

[0042] The connection between multiple branch air channels 1022 and the main air channel 1021 can achieve uniform flow distribution of airflow on the surface of the wafer, ensuring that the wafer is stably and evenly supported on the Bernoulli suction cup, which helps to improve the stability of wafer suspension.

[0043] Specifically, the branch airway 1022 includes: a first airway 1022a, connected to the top of the main airway; a second airway 1022b, connected to the end of the first airway 1022a away from the main airway, and the second airway 1022b is arranged vertically or obliquely upward; a third airway 1022c, connected to the end of the second airway 1022b away from the first airway 1022a, and the nozzle is located at the end of the third airway 1022c.

[0044] In this embodiment, the first air channel 1022 a is connected to the top of the main air channel 1021 .

[0045] The first air channel 1022a is used to connect the main air channel 1021 and the subsequent branch air channels 1022 to achieve airflow distribution and guidance, so that the airflow can be evenly distributed from the main air channel 1021 to each branch air channel 1022, thereby achieving stable suspension and fixation of the wafer.

[0046] In this embodiment, the first air channel 1022a is horizontally arranged in the main body structure 101 to facilitate smooth airflow. In other embodiments, the first air channel 1022a can also be arranged obliquely upward.

[0047] In this embodiment, the second air channel 1022b is connected to the end of the first air channel 1022a away from the main air channel 1021, and the second air channel 1022b is vertically arranged.

[0048] The second air channel 1022b, the first air channel 1022a and the third air channel 1022c together constitute a complete branch air channel 1022. The vertical or inclined upward setting of the second air channel 1022b provides an upward path for the airflow, which cooperates with the third air channel 1022c to ultimately enable the airflow to be ejected from the nozzle.

[0049] In this embodiment, the third air channel 1022c is connected to the end of the second air channel 1022b away from the first air channel 1022a, and the nozzle is located at the end of the third air channel 1022c.

[0050] The third air channel 1022c, together with the second air channel 1022b and the first air channel 1022a, forms a complete air flow channel, ensuring that the gas can flow smoothly from the main air channel 1021 to the nozzle.

[0051] In this embodiment, the extension direction of the third air channel 1022c is parallel to the wafer surface, that is, the third air channel 1022c is horizontally arranged.

[0052] Specifically, the number of the third air channels 1022c is six.

[0053] In this embodiment, the nozzle is located at the top of the main structure 101 and at the end of the branch air channel 1022 , and the nozzle faces outward along the radial direction of the wafer.

[0054] The nozzle is the terminal end of the Bernoulli chuck outlet channel 102 and is used to guide and spray gas from the branch gas channel 1022 onto the wafer surface, thereby forming a stable airflow field between the wafer and the chuck 100. This airflow field can produce a Bernoulli effect, causing the wafer to float above the chuck 100, achieving contactless loading.

[0055] At the same time, since the nozzle faces outward in the radial direction of the wafer, it can also form an outward airflow at the edge of the wafer, forming a stable airflow barrier, which helps prevent the wafer from contacting the suction cup 100 and further improves the stability and safety of wafer clamping.

[0056] It should be noted that although the nozzle is primarily responsible for contactless loading, it also works in conjunction with the clamping element 200 to achieve stable wafer clamping. Specifically, the nozzle provides vertical support force, while the clamping element 200 provides horizontal fixing force.

[0057] In this embodiment, there are multiple nozzles, which are evenly distributed along the circumference of the main body structure 101 to ensure uniformity of airflow.

[0058] Specifically, the nozzle is located on the top side wall of the main body structure 101 .

[0059] As an example, the nozzle may have a conical or trumpet shape to optimize airflow velocity and direction.

[0060] The Bernoulli suction cup further includes: an adsorption hole 103 (such as Figure 3 As shown), it is located at the top of the main body structure 101 corresponding to the third air channel, and the adsorption hole 103 is arranged in the vertical direction to connect the third air channel with the outside. The number of the adsorption holes 103 is multiple and arranged along the radial direction of the wafer.

[0061] When the Bernoulli suction cup is operating, air flows through the third air channel 1022c at high speed. According to the Bernoulli principle, this creates a low-pressure area in the third air channel 1022c. Adsorption holes 103 connect this low-pressure area to the bottom surface of the wafer, generating an adsorption force on the bottom surface of the wafer. This adsorption force helps to precisely support and position the wafer while avoiding direct contact with the wafer surface, reducing contamination and damage to the wafer. During the wafer processing process, the wafer is easily maintained in a stable position and is less likely to collide with other components even at high speeds, which helps improve the quality of the wafer processing.

[0062] In this embodiment, the adsorption holes 103 are located at the top of the Bernoulli chuck body structure 101, corresponding to the third air channel 1022c. They are arranged in a vertical direction, which ensures that the airflow can directly act on the bottom surface of the wafer.

[0063] In this embodiment, there are multiple adsorption holes 103 , which are arranged along the radial direction of the wafer, which is beneficial for uniform adsorption of the wafer.

[0064] It should also be noted that the suction holes 103 and the nozzles complement each other. Specifically, the nozzles are located on the top sidewall of the main structure 101 and face outward along the radial direction of the wafer, which helps provide suction to the edges of the wafer. The corresponding suction holes 103 are located near the center of the wafer, which helps provide suction to the center of the wafer. The nozzles and suction holes 103 work together to achieve uniform and stable suction of the wafer.

[0065] like Figure 5 As shown, the clamping element 200 includes a vertical surface 201, and the vertical surface 201 is used to abut against the side wall of the wafer.

[0066] The clamping element 200 is used to provide lateral support and positioning during the wafer clamping process. Through the abutment of its vertical surface 201 with the side wall of the wafer, it is beneficial to stabilize the wafer in the horizontal direction and prevent the wafer from lateral displacement during the processing; and the clamping element 200 cooperates with the suction cup 100 to fix the wafer in both vertical and horizontal directions to form a complete wafer clamping device, so that even when the wafer is rotating at high speed, the wafer clamping device still provides additional support force to prevent the wafer from shaking or colliding with other components.

[0067] It should be noted that the vertical surface 201 of the clamping element 200 works in conjunction with the suction cup 100. The Bernoulli suction cup provides contactless load-bearing force in the vertical direction, while the vertical surface 201 provides clamping force in the horizontal direction. This combination can minimize mechanical stress on the wafer while ensuring wafer stability.

[0068] like Figure 6 As shown, in this embodiment, the vertical surface 201 of the clamping element 200 has an arc in the horizontal plane, and the arc is used to cooperate with the arc edge of the wafer.

[0069] The vertical surface 201 of the clamping element 200 has an arc in the horizontal plane, which enables the clamping element 200 to cooperate with the curved edge of the wafer, thereby achieving a more stable and uniform radial clamping force, improving the reliability of the clamping, and minimizing stress concentration on the edge of the wafer, reducing the risk of wafer damage.

[0070] In this embodiment, the vertical surface 201 of the clamping element 200 is arc-shaped, and the radius of curvature of the arc matches the edge curvature of the wafer to be clamped, which is conducive to obtaining the maximum contact area between the clamping element 200 and the wafer edge, thereby avoiding local stress concentration.

[0071] The driving mechanism 300 is disposed at the edge of the suction cup 100 and is used to apply force to the clamping element 200 to move the clamping element 200 in the radial direction of the wafer.

[0072] The drive mechanism 300 is used to provide power to the clamping element 200, enabling the clamping element 200 to move radially relative to the wafer, thereby firmly clamping the wafer. The drive mechanism 300 enables the wafer clamping device to adapt to wafers of different sizes, improving the versatility and flexibility of the device.

[0073] In this embodiment, the driving mechanism 300 is disposed on the edge of the Bernoulli suction cup.

[0074] The drive mechanism 300 effectively transmits force to the clamping element 200 without interfering with the non-contact support provided by the suction cup 100. By applying force to the clamping element 200, the drive mechanism 300 causes the vertical surface 201 of the clamping element 200 to abut against the sidewall of the wafer, thereby providing additional securing force parallel to the wafer surface. This stabilizes the wafer during high-speed rotation and other processing steps, making it less likely to collide with other components, thereby improving the quality of wafer processing.

[0075] In this embodiment, the drive mechanism 300 includes a spring, one end of which is connected to the side wall of the suction cup 100, and the other end of which is connected to the clamping element 200. The spring has a simple structure and is easy to maintain and replace. The elasticity of the spring allows the drive mechanism 300 to adapt to wafers of different sizes. Moreover, compared to rigid clamping, the flexible clamping force provided by the spring can reduce potential damage to the wafer edge.

[0076] The drive mechanism 300 transmits force to the clamping element 200 via a spring, pushing the clamping element 200 toward the center of the wafer. This force causes the vertical surface 201 of the clamping element 200 to abut against the sidewalls of the wafer, thereby achieving stable clamping of the wafer. This achieves a combination of mechanical clamping and Bernoulli suspension, ensuring wafer stability while minimizing mechanical stress on the wafer.

[0077] In other embodiments, the driving mechanism 300 may further include a pneumatic cylinder or a hydraulic cylinder, and an output end of the pneumatic cylinder or the hydraulic cylinder applies force to the clamping element 200 .

[0078] like Figure 7 As shown, the wafer clamping device also includes: a guide element 400, the guide element 400 includes a slide groove 401 extending along the radial direction of the wafer, the number of the guide elements 400 is multiple, and the multiple guide elements 400 are arranged at intervals on the circumferential side wall of the suction cup 100.

[0079] The guide element 400 is used to define the motion trajectory of the clamping element 200 and provide support for the clamping element 200. By disposing multiple guide elements 400 at intervals on the circumferential sidewalls of the suction cup 100, the clamping element 200 can move smoothly along the radial direction of the wafer, thereby achieving precise positioning and clamping of the wafer.

[0080] In this embodiment, the clamping element 200 is slidably disposed within the slide groove 401. This structure restricts the movement of the clamping element 200 to a predetermined path, ensuring that it can properly clamp the wafer. Although the guide element 400 is not directly connected to the drive mechanism 300, it provides a track for the clamping element 200 to move when pushed by the drive mechanism 300.

[0081] An embodiment of the present invention further provides a semiconductor device, which includes the wafer clamping device.

[0082] During wafer processing, the Bernoulli suction cup, drive mechanism 300, and clamping element 200 in the wafer clamping device work together to achieve precise positioning and stable clamping of the wafer. The Bernoulli suction cup provides contactless support through airflow, reducing contamination and mechanical damage. At the same time, under the action of the drive mechanism 300, the clamping element 200 moves in the radial direction of the wafer, abutting against the side wall of the wafer through the vertical surface 201, providing additional stability. As a result, during the wafer processing process, the wafer is easily kept in a stable posture. Even at high-speed rotation, the wafer is not likely to collide with other components, which is conducive to improving the quality of wafer processing.

[0083] Although the present invention is disclosed as above, it is not limited thereto. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope defined by the claims.

Claims

1. A wafer clamping device, characterized in that: include Suction cup, used to hold the wafer; a clamping element comprising a vertical surface, the vertical surface being adapted to abut against a side wall of the wafer; A driving mechanism is provided at the edge of the suction cup and is used to apply force to the clamping element so as to move the clamping element in the radial direction of the wafer.

2. The wafer clamping device according to claim 1, wherein: The vertical surface of the clamping element has a curvature in a horizontal plane, and the curvature is used to match the curved edge of the wafer.

3. The wafer clamping device according to claim 1, wherein: The wafer clamping device further includes: a guide element, the guide element including a slide groove extending in the radial direction of the wafer, the guide element being in a plurality, and the plurality of guide elements being spaced apart and arranged on the circumferential side wall of the suction cup; The clamping element is slidably arranged in the sliding groove.

4. The wafer clamping device according to claim 1, wherein: The suction cup comprises: A Bernoulli chuck is used to generate airflow to suspend and fix the wafer above the Bernoulli chuck; The driving mechanism is arranged on the edge of the Bernoulli suction cup.

5. The wafer clamping device according to claim 4, wherein: The Bernoulli suction cup comprises: Body structure; An air outlet channel is located in the main body structure, and the air outlet channel includes: a main air channel; a plurality of branch air channels connected to the main air channel, and the branch air channels are located on the top of the main air channel; The nozzle is located at the end of the branch air channel, and the nozzle faces outward along the radial direction of the wafer.

6. The wafer clamping device according to claim 5, wherein: The main air channel is located at the center of the body structure.

7. The wafer clamping device according to claim 5, wherein: The branch airway comprises: a first airway connected to the top of the main airway; a second air channel connected to an end of the first air channel away from the main air channel, the second air channel being arranged vertically or obliquely upward; The third air channel is connected to the end of the second air channel away from the first air channel, and the nozzle is located at the end of the third air channel.

8. The wafer clamping device according to claim 7, wherein: The Bernoulli suction cup also includes: an adsorption hole located at the top of the main body structure corresponding to the third air channel, the adsorption hole is arranged in a vertical direction to connect the third air channel with the outside, the number of the adsorption holes is multiple, and they are arranged along the radial direction of the wafer.

9. The wafer clamping device according to claim 5, wherein: The nozzle is located on the top side wall of the body structure.

10. The wafer clamping device according to claim 1, wherein: The driving mechanism includes a spring, one end of the spring is connected to the side wall of the suction cup, and the other end of the spring is connected to the clamping element; Alternatively, the driving mechanism comprises a pneumatic cylinder or a hydraulic cylinder, and an output end of the pneumatic cylinder or the hydraulic cylinder applies a force to the clamping element.

11. A semiconductor device, characterized in that: The wafer clamping device comprises the wafer clamping device according to any one of claims 1 to 10.

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