Power device packaging structure

Abstract

The utility model provides a power device packaging structure, which comprises a packaging shell and a packaging cover body, the packaging cover body is vertically connected with the packaging shell in an inserting manner, and the end part of the packaging cover body is buckled with the outer side of the packaging shell; the two ends of the packaging cover body are fixedly connected with buckling strips, and the lower ends of the buckling strips are connected with the bottom of the packaging shell in a buckling mode. The sealing performance between the packaging cover body and the packaging shell is improved through a sealing ring; the packaging cover body comprises a heat dissipation assembly, a limiting structure is additionally arranged between the heat dissipation assembly and the packaging cover body, and heat-conducting glue is adopted for fixing the heat dissipation assembly and the packaging cover body. According to the utility model, on one hand, through the cooperation design of the packaging housing and the packaging cover body, the device can be installed more quickly, so that the power device can be packaged conveniently, and the power device has good anti-falling performance; and on the other hand, through the structural design of the heat dissipation assembly, the device can conduct heat in the packaging shell and the packaging cover outwards, so that the heat dissipation effect in the device is achieved, and the phenomenon of heat accumulation is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit component packaging, in particular to a power device packaging structure. Background Art

[0002] Power devices are core components of power electronics systems and are widely used in renewable energy power generation, electric vehicles, industrial frequency conversion, smart grids, and other fields. As power electronics systems develop toward higher power density, higher frequency, and higher temperature, traditional power device packaging structures are unable to conveniently package power semiconductor devices, resulting in a long and inefficient process. The packaging is prone to detachment, and the sealing performance needs to be further improved. Furthermore, the power semiconductor devices located in the center of the packaging structure, as well as the wires between them, release a large amount of heat during operation. If this heat cannot be dissipated in a timely manner, it will not only cause device warping and deformation, but also lead to performance degradation or even complete failure. It may even cause the device to short-circuit, resulting in serious production accidents.

[0003] To this end, the present application proposes a power device packaging structure to provide a new technical solution to solve the technical problems mentioned above. Utility Model Content

[0004] The utility model provides a power device packaging structure, which is used to improve the sealing performance and anti-falling performance of the existing power device packaging structure.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: a power device packaging structure, comprising a packaging shell and a packaging cover; pins are provided at both ends of the packaging shell for electrical connection with the outside world; the packaging cover is vertically plugged into the packaging shell, and the end of the packaging cover is buckled with the outer side of the packaging shell; buckle strips are fixedly connected to both ends of the packaging cover, and the lower end of the buckle strip is buckled with the bottom of the packaging shell.

[0006] Furthermore, an inserting frame is fixedly connected to the periphery of the lower end of the packaging cover, a sealing ring is fixedly connected to the upper outer side of the inserting frame, the inserting frame is vertically plugged into the packaging shell, and the sealing ring is used to seal the gap between the inserting frame and the packaging shell.

[0007] Furthermore, a slope is provided at the upper inner side of the packaging shell and at a position corresponding to the sealing ring. After the packaging cover is plugged into the packaging shell through the insertion frame, the slope presses the lower end of the sealing ring to improve the performance of the sealing ring in sealing the gap between the insertion frame and the packaging shell.

[0008] Furthermore, the package cover also includes a heat dissipation component, which is fixed to the package cover with thermally conductive adhesive; the lower part of the heat dissipation component is located inside the package cover, and the upper end passes through the package cover and extends to the outside of the package cover.

[0009] Furthermore, the heat dissipation component is a double-comb-shaped long-teeth metal structural part with equal tooth pitch; a gap corresponding to the long teeth of the heat dissipation component is opened on the cover plate of the packaging cover body, and the upper teeth of the heat dissipation component extend out of the packaging cover body through the gap on the cover plate of the packaging cover body; limiting bosses are respectively provided at both ends of the cover plate of the packaging cover body, and the limiting bosses limit the upward insertion process of the heat dissipation component, so that a fixed space is maintained between the flat metal plate between the upper and lower teeth of the heat dissipation component and the cover plate of the packaging cover body to fill with thermal conductive glue.

[0010] The package cover further includes one or more limiting protrusions, which are fixed to the inner side of the package cover and extend into the spaces between the teeth of the lower comb teeth of the heat dissipation component to limit the downward movement of the installed heat dissipation component.

[0011] The utility model provides a power device packaging structure, which has the following advantages:

[0012] The power device packaging structure provided by the utility model enables the device to be installed faster through the coordinated design of the connection structure of the packaging shell and the packaging cover, thereby enabling the power semiconductor device to be conveniently packaged and having good anti-falling performance.

[0013] The power device packaging structure provided by the utility model enables the device to conduct heat from the inside of the packaging shell and the packaging cover to the outside through the structural design of the heat dissipation component, thereby achieving a heat dissipation effect inside the device and reducing the occurrence of heat accumulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of the power device packaging structure provided by the utility model;

[0015] Figure 2 A schematic structural diagram of the packaging shell and packaging cover of the power device packaging structure provided by the present invention;

[0016] Figure 3 This is a schematic diagram of a partial cross-section of the packaging shell and the packaging cover in the power device packaging structure provided by the present invention;

[0017] Figure 4 This is a schematic diagram of the structure of the heat dissipation component of the power device packaging structure provided by the utility model;

[0018] Figure 5 The power device packaging structure provided by the utility model Figure 4 A in the enlarged view.

[0019] The markings in the figure are as follows:

[0020] 1. Package shell; 2. Package cover; 3. Pins; 4. Insertion frame; 5. Sealing ring; 6. Buckle strip; 7. Heat dissipation component; 8. Bevel; 10. Thermal conductive adhesive; 11. Limiting bump; 12. Limiting boss. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention. Example 1

[0022] like Figure 1 、 2 As shown, a power device packaging structure includes:

[0023] The packaging shell 1 and the packaging cover 2; both ends of the packaging shell 1 are provided with pins 3 for electrical connection with the outside world;

[0024] The package cover 2 is connected to the package shell 1 by vertical plugging, and the end of the package cover 2 is buckled with the outer side of the package shell 1; the two ends of the package cover 2 are fixedly connected with buckle strips 6, and the lower end of the buckle strips 6 is buckled with the bottom of the package shell 1. Figure 1 、 2 It can be seen that the packaging protection of the power device can be achieved through the cooperation of the packaging shell 1 and the packaging cover 2.

[0025] The package cover 2 further includes a heat dissipation component 7 , which is fixed to the package cover 2 using a thermally conductive adhesive 10 ; the lower portion of the heat dissipation component 7 is located inside the package cover 2 , and the upper end passes through the package cover 2 and extends to the outside of the package cover 2 .

[0026] The heat dissipation component 7 is a double-comb-shaped metal structural part with long comb teeth and equal tooth pitch; a gap corresponding to the long comb teeth of the heat dissipation component 7 is opened on the cover plate of the packaging cover body 2, and the upper comb teeth of the heat dissipation component 7 extend out of the packaging cover body 2 through the gap on the cover plate of the packaging cover body 2; limiting bosses 12 are respectively provided at both ends of the cover plate of the packaging cover body 2, and the limiting bosses 12 limit the upward insertion process of the heat dissipation component 7, so that a fixed space is maintained between the flat metal plate between the upper and lower comb teeth of the heat dissipation component 7 and the cover plate of the packaging cover body 2 to fill the thermal conductive glue 10.

[0027] The heat inside the packaging shell 1 and the packaging cover 2 can be conducted outward through the heat dissipation component 7, thereby achieving heat dissipation inside the packaging shell 1 and the packaging cover 2 and reducing the phenomenon of heat accumulation. In addition, the thermal conductive glue 10 filled between the packaging cover 2 and the heat dissipation component 7 can effectively improve the waterproof effect of the entire packaging structure. Example 2

[0028] The anti-falling power device packaging structure provided in the first embodiment is further optimized. Specifically, Figure 4-Figure 5 As shown, the inner walls of both ends of the package cover 2 are fixedly connected to limit projections 11 for limiting the movement of the heat sink 7 after installation. The inner walls of both sides of the package cover 2 are provided with limit bosses 12, which extend between the teeth of the lower comb of the heat sink 7 to limit the downward movement of the heat sink 7 after installation.

[0029] Through the above-mentioned structural design, before the heat dissipation component 7 is installed, the thermal conductive adhesive 10 is filled at the top inner side of the packaging cover 2. After the thermal conductive adhesive 10 is filled, the heat dissipation component 7 is inserted upward from the bottom inner side of the packaging cover 2. The insertion of the heat dissipation component 7 is limited by the limiting boss 12, so that the upper end of the heat dissipation component 7 can extend out of the outside of the packaging cover 2, while avoiding the heat dissipation component 7 from fitting with the top inner side of the packaging cover 2, thereby reserving sufficient accommodation space for the thermal conductive adhesive 10, and the upward movement of the heat dissipation component 7 is limited by the limiting boss 12, and the downward movement of the installed heat dissipation component 7 is limited by the limiting protrusion 11, thereby realizing the overall limitation of the heat dissipation component 7, thereby completing the assembly of the heat dissipation component 7 and the packaging cover 2. Example 3

[0030] The anti-falling power device packaging structure provided in the first embodiment is further optimized. Specifically, Figure 3 As shown, the lower edge of the packaging cover 2 is fixedly connected to an insert frame 4, and a sealing ring 5 is fixedly connected to the upper outer portion of the insert frame 4. The insert frame 4 is vertically plugged into the packaging shell 1, and the sealing ring 5 is used to improve the seal between the insert frame 4 and the packaging shell 1. Furthermore, a bevel 8 is provided at the upper inner portion of the packaging shell 1, corresponding to the sealing ring 5. After the packaging cover 2 is plugged into the packaging shell 1 through the insert frame 4, the bevel 8 squeezes the lower end of the sealing ring 5.

[0031] Through the above structural design, the initial connection between the packaging cover 2 and the packaging shell 1 can be facilitated by the insertion frame 4, and the gap between the insertion frame 4 and the packaging shell 1 can be sealed by the sealing ring 5. After the packaging shell 1 and the packaging cover 2 are buckled together, the bottom of the sealing ring 5 is squeezed by the inclined surface 8 set on the inner side of the packaging shell 1, thereby effectively improving the sealing between the sealing ring 5 and the packaging shell 1, thereby further improving the waterproof effect.

[0032] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A power device packaging structure, comprising a packaging shell (1) and a packaging cover (2); pins (3) are provided at both ends of the packaging shell (1) for electrical connection with the outside world; the packaging cover (2) is vertically plug-connected to the packaging shell (1), and the end of the packaging cover (2) is buckled with the outer side of the packaging shell (1); buckle strips (6) are fixedly connected to both ends of the packaging cover (2), and the lower end of the buckle strip (6) is buckled with the bottom of the packaging shell (1); It is characterized in that The lower periphery of the packaging cover (2) is fixedly connected to an insertion frame (4), the upper outer portion of the insertion frame (4) is fixedly connected to a sealing ring (5), the insertion frame (4) and the packaging shell (1) are vertically plug-connected, and the sealing ring (5) is used to seal the gap between the insertion frame (4) and the packaging shell (1).

2. The power device packaging structure according to claim 1, wherein: An inclined surface (8) is provided at an upper portion of the inner side of the packaging shell (1) and at a position corresponding to the sealing ring (5). After the packaging cover (2) is plugged into the packaging shell (1) through the plug-in frame (4), the inclined surface (8) presses the lower end of the sealing ring (5) to improve the performance of the sealing ring (5) sealing the gap between the plug-in frame (4) and the packaging shell (1).

3. The power device packaging structure according to claim 1, wherein: The package cover (2) further comprises a heat dissipation component (7), and the heat dissipation component (7) and the package cover (2) are fixed with a thermally conductive adhesive (10); the lower portion of the heat dissipation component (7) is located inside the package cover (2), and the upper end thereof passes through the package cover (2) and extends to the outside of the package cover (2).

4. The power device packaging structure according to claim 3, characterized in that: The heat dissipation component (7) is a double-comb-shaped metal structural component with long comb teeth and equal tooth pitch; a gap corresponding to the long comb teeth of the heat dissipation component (7) is opened on the cover plate of the packaging cover body (2), and the upper comb teeth of the heat dissipation component (7) extend out of the outside of the packaging cover body (2) through the gap on the cover plate of the packaging cover body (2); limiting bosses (12) are respectively provided at both ends of the cover plate of the packaging cover body (2), and the limiting bosses (12) limit the upward insertion process of the heat dissipation component (7), so that a fixed space is maintained between the flat metal plate between the upper and lower comb teeth of the heat dissipation component (7) and the cover plate of the packaging cover body (2) to fill the thermal conductive glue (10).

5. The power device packaging structure according to claim 4, characterized in that: The package cover (2) further comprises one or more limiting protrusions (11), which are fixed to the inner side of the package cover (2) and extend into the spaces between the teeth of the lower comb of the heat dissipation component (7) to limit the downward movement of the installed heat dissipation component (7).

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