IC packaging structure

Abstract

The utility model provides an IC packaging structure, and relates to the technical field of IC packaging, the IC packaging structure comprises a packaging pedestal, the middle area of the upper part of the packaging pedestal is provided with a placing groove used for placing an IC chip, the top end of the chip is fixedly provided with heat-conducting glue, two sides of the interior of the packaging pedestal are uniformly provided with pins in a penetrating manner, and the top end of the packaging pedestal is provided with a packaging cover. According to the utility model, the detachable structure is arranged, the sealing ring is extruded to deform, the sealing performance between the packaging base and the packaging cover is enhanced under the action of the sealing ring, the packaging cover and the packaging base can be fixed or detached conveniently under the matching action of the clamping block and the clamping groove, and the packaging cover is pulled through the groove, so that the packaging base and the packaging cover can be conveniently detached. When the IC packaging structure is in use, the packaging cover is separated from the clamping block, so that the assembling time is saved, the device is convenient to fix and disassemble, and the applicability of the IC packaging structure in use is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of IC packaging, in particular to an IC packaging structure. Background Art

[0002] IC packaging is the process of wrapping semiconductor chips in a protective shell through a specific process, thereby isolating air impurities and mechanical damage, preventing chip corrosion or electrical performance degradation. Therefore, an IC packaging structure is used;

[0003] To this end, the patent with announcement number CN221885100U discloses an IC packaging structure, including a packaging base, a first groove is formed on the bottom surface of the packaging base, and a first heat conducting sheet is provided in the first groove; a second groove is formed on the top surface of the packaging base, a third groove is formed on the inner bottom surface of the second groove, and a fourth groove is formed on the inner bottom surface of the third groove; a heat conducting resin is laid on the inner bottom surface of the fourth groove, and a second heat conducting sheet is provided in the fourth groove above the heat conducting resin and bonded to the heat conducting resin; an IC chip is provided in the third groove above the second heat conducting sheet and bonded to the second heat conducting sheet; pins located on the outer side of the packaging base are connected to the left and right sides of the IC chip; a packaging shell is provided in the second groove; the packaging base and the packaging shell, the IC chip and the pins connected thereto are all sealed by packaging glue; the IC packaging structure is not only small in size, but also has good heat dissipation performance, effectively ensuring the stability of the operation of the IC chip;

[0004] Although the IC packaging structure mentioned above is not only small in size but also has good heat dissipation performance when in use, effectively ensuring the stability of the IC chip operation, it is inconvenient to disassemble during use and it is inconvenient to save assembly time, making it less applicable when in use. Utility Model Content

[0005] The purpose of the utility model is to provide an IC packaging structure to solve the defect that the existing IC packaging structure is inconvenient to disassemble.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0007] An IC packaging structure includes a packaging base, a packaging cover and a heat dissipation structure;

[0008] A placement groove for placing the IC chip is provided in the middle area of ​​the upper portion of the package base, and pins are provided on the side of the package base that penetrate into the placement groove;

[0009] The heat dissipation structure includes a heat-conducting aluminum plate, heat-dissipating fins, and a heat-dissipating port; the heat-dissipating fins are fixed above the heat-conducting aluminum plate, and the heat-dissipating port is fixed below the heat-conducting aluminum plate; the heat-conducting aluminum plate is fixed to the upper end surface of the packaging cover by fixing bolts, and a heat-conducting silicone pad is provided between the heat-conducting aluminum plate and the upper end surface of the packaging cover; after the IC chip is placed in the placement slot, a heat-conducting adhesive is filled between the heat-dissipating port and the IC chip;

[0010] The contact surfaces of the packaging base and the packaging cover are snap-connected by a mutually cooperating detachable snap-fit ​​structure; the detachable snap-fit ​​structure includes a snap-fit ​​groove and a snap-fit ​​block, and a reserved groove is provided inside the snap-fit ​​block; when the snap-fit ​​block begins to extend into the snap-fit ​​groove, due to the pressure from the snap-fit ​​groove notch and its own reserved groove, the snap-fit ​​block shrinks inward and smoothly extends into the snap-fit ​​groove. After the snap-fit ​​block is in place, due to the disappearance of the pressure from the snap-fit ​​groove notch, the snap-fit ​​block naturally snaps into the snap-fit ​​groove to achieve a snap-fit ​​connection.

[0011] The IC package structure, with its detachable snap-fit ​​structure, facilitates both snap-fit ​​connection and detachability, thereby improving its usability. The heat dissipation structure facilitates heat dissipation, extending its service life. The thermally conductive adhesive rapidly transfers heat away from the chip, while the thermally conductive silicone pad prevents any gaps between the heat dissipation structure and the package cover, thereby improving heat transfer efficiency.

[0012] In the above technical solution, the snap-fit ​​groove is arranged on the upper end surface of the packaging base, and the snap-fit ​​block is arranged on the lower end surface of the packaging cover; it can also be that the snap-fit ​​groove is arranged on the lower end surface of the packaging cover, and the snap-fit ​​block is arranged on the upper end surface of the packaging base.

[0013] In the above technical solution, a sealing structure is further provided between the contact surfaces of the package base and the package cover. The sealing structure includes a sealing mounting groove and a sealing ring, which is positioned within the sealing mounting groove. The sealing ring deforms under compression, thereby enhancing the seal between the package base and the package cover.

[0014] Furthermore, the sealing installation groove may be provided on the upper end surface of the packaging base, or on the lower end surface of the packaging cover.

[0015] Preferably, the heat dissipation fins are evenly spaced on the top of the heat-conducting aluminum plate. The evenly spaced heat dissipation fins increase the contact area with the air, thereby facilitating heat dissipation of the chip.

[0016] Preferably, grooves are formed on both sides of the package cover, and the outer surface of the pin has an anti-oxidation layer. Under the action of the anti-oxidation layer, impurities in the air can be isolated to prevent corrosion of the pin.

[0017] The IC packaging structure provided by the present invention has the following advantages:

[0018] By providing a detachable snap-fit ​​connection structure, the packaging structure is easy to snap-fit ​​and detachable, thereby improving the applicability of the IC packaging structure when in use; by providing a sealing structure, the sealing between the packaging base and the packaging cover is enhanced; by providing a heat dissipation structure, under the action of the thermal conductive glue, heat is quickly transferred from the chip, and under the action of the thermal conductive silicone pad, a gap between the thermal conductive silicone pad and the packaging cover is avoided, thereby improving the heat transfer efficiency, and under the action of the thermal conductive aluminum plate, heat can be transferred to the heat dissipation fins, and under the action of the equally spaced heat dissipation fins, the contact area with the air is increased, thereby facilitating the heat dissipation of the chip, realizing the function of the device to facilitate heat dissipation, and thus extending the service life of the IC packaging structure when in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0020] Figure 2 This is one of the schematic diagrams of the cross-section three-dimensional structure of the present utility model;

[0021] Figure 3 For the utility model Figure 2 A in the middle is an enlarged structural diagram;

[0022] Figure 4 This is the second schematic diagram of the cross-sectional three-dimensional structure of the utility model;

[0023] Figure 5 This is the third schematic diagram of the cross-sectional three-dimensional structure of the present invention.

[0024] Explanation of the reference numerals in the figure: 1. Package base; 2. Package cover; 3. Heat dissipation structure; 301. Thermal conductive silicone pad; 302. Thermal conductive aluminum plate; 303. Heat dissipation fin; 304. Heat dissipation port; 305. Fixing bolt; 4. Pin; 5. Placement slot; 6. IC chip; 7. Thermal conductive glue; 8. Removable snap-fit ​​structure; 801. Snap-fit ​​slot; 802. Snap-fit ​​block; 803. Reserved slot; 804. Sealing ring installation slot; 805. Sealing ring. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] See also Figure 1-Figure 5 The present invention provides an IC packaging structure, comprising a packaging base 1, a packaging cover 2 and a heat dissipation structure 3; a placement groove 5 for placing an IC chip 6 is opened in the upper middle area of ​​the packaging base 1, and a pin 4 is provided on the side of the packaging base 1 that penetrates into the placement groove 5; the heat dissipation structure 3 comprises a heat-conducting aluminum plate 302, heat dissipation fins 303 and a heat dissipation port 304; the heat dissipation fins 303 are fixed above the heat-conducting aluminum plate 302, and the heat dissipation port 304 is fixed below the heat-conducting aluminum plate 302; the heat-conducting aluminum plate 302 is fixed to the upper end surface of the packaging cover 2 by fixing bolts 305, and a heat-conducting silicone pad 301 is provided between the heat-conducting aluminum plate 302 and the upper end surface of the packaging cover 2; after the IC chip 6 is placed in the placement groove 5, a heat-conducting adhesive 7 is filled between the heat dissipation port 304 and the IC chip.

[0027] The contact surfaces of the packaging base 1 and the packaging cover 2 are snap-connected by a mutually cooperating detachable snap-fit ​​structure 8; the detachable snap-fit ​​structure 8 includes a snap-fit ​​groove 801 and a snap-fit ​​block 802, and a reserved groove 803 is provided inside the snap-fit ​​block 802; when the snap-fit ​​block 802 begins to extend into the snap-fit ​​groove 801, due to the pressure from the notch of the snap-fit ​​groove 801 and its own reserved groove 803, the snap-fit ​​block 802 shrinks inward and smoothly extends into the inside of the snap-fit ​​groove 801. After the snap-fit ​​block 802 is in place, due to the disappearance of the pressure from the notch of the snap-fit ​​groove 801, the snap-fit ​​block 802 is naturally snapped into the snap-fit ​​groove 801 to achieve a snap-fit ​​connection.

[0028] In the above technical solution, the snap-fit ​​groove 801 is arranged on the upper end surface of the packaging base 1, and the snap-fit ​​block 802 is arranged on the lower end surface of the packaging cover 2; it can also be that the snap-fit ​​groove 801 is arranged on the lower end surface of the packaging cover 2, and the snap-fit ​​block 802 is arranged on the upper end surface of the packaging base 1.

[0029] In the above technical solution, a sealing structure is further provided between the contact surfaces of the packaging base 1 and the packaging cover 2 ; the sealing structure comprises a sealing ring mounting groove 804 and a sealing ring 805 ; the sealing ring 805 is disposed in the sealing ring mounting groove 804 .

[0030] The sealing ring installation groove 804 is provided on the upper end surface of the packaging base 1 , and may also be provided on the lower end surface of the packaging cover 2 .

[0031] Reference Figure 2 and Figure 3 As shown, the packaging cover 2 is moved so that the bottom end of the snap-in groove 801 contacts the top end of the snap-in block 802. The packaging cover 2 is pressed. Under the action of the reserved groove 803, the snap-in block 802 will move to the inside of the snap-in groove 801, thereby fixing the packaging base 1 and the packaging cover 2 to each other. At this time, the bottom end of the sealing ring 805 contacts the top end of the packaging base 1, and the sealing ring 805 is squeezed and deformed. Under the action of the sealing ring 805, the sealing between the packaging base 1 and the packaging cover 2 is enhanced. The packaging cover 2 is pulled out through the groove, and the packaging cover 2 is separated from the snap-in block 802, thereby saving assembly time. Grooves are provided on both sides of the packaging cover 2, and an anti-oxidation layer is fixed to the outside of the pin 4. Under the action of the anti-oxidation layer, impurities in the air can be isolated to prevent corrosion of the pin 4.

[0032] A heat dissipation structure 3 is installed on the top of the packaging cover 2, and the heat dissipation structure 3 includes a thermally conductive silicone pad 301, a thermally conductive aluminum plate 302, heat dissipation fins 303, a heat dissipation port 304 and a fixing bolt 305. The heat dissipation port 304 is evenly penetrated into the interior of the packaging cover 2, and a thermally conductive silicone pad 301 is provided on the top of the packaging cover 2 above the heat dissipation port 304. A thermally conductive aluminum plate 302 is provided on the top of the thermally conductive silicone pad 301, and heat dissipation fins 303 are evenly fixed on the top of the thermally conductive aluminum plate 302. Fixing bolts 305 are evenly penetrated on both sides of the thermally conductive aluminum plate 302 and the thermally conductive silicone pad 301. The heat dissipation fins 303 are evenly distributed on the top of the thermally conductive aluminum plate 302, and the thermally conductive aluminum plate 302 and the packaging cover 2 are fixedly connected by fixing bolts 305.

[0033] Reference Figure 2 and Figure 4 As shown, under the action of the thermal conductive glue 7, heat is quickly transferred from the IC chip 6, and the heat is transferred to the thermal conductive silicone pad 301 through the heat dissipation port 304. Under the action of the thermal conductive silicone pad 301, a gap is avoided between the thermal conductive silicone pad 301 and the packaging cover 2, thereby improving the heat transfer efficiency. Under the action of the thermal conductive aluminum plate 302, the heat can be conducted to the heat dissipation fins 303. Under the action of the equally spaced heat dissipation fins 303, the contact area with the air is increased, thereby facilitating the heat dissipation of the IC chip 6.

[0034] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An IC packaging structure, comprising a packaging base (1), a packaging cover (2) and a heat dissipation structure (3); A placement groove (5) for placing an IC chip (6) is provided in the upper middle area of ​​the package base (1), and a pin (4) is provided on the side of the package base (1) and extends into the placement groove (5); The heat dissipation structure (3) includes a heat-conducting aluminum plate (302), heat-dissipating fins (303) and a heat-dissipating port (304); the heat-dissipating fins (303) are fixed above the heat-conducting aluminum plate (302), and the heat-dissipating port (304) is fixed below the heat-conducting aluminum plate (302); the heat-conducting aluminum plate (302) is fixed to the upper end surface of the packaging cover (2) via fixing bolts (305), and a heat-conducting silica gel pad (301) is provided between the heat-conducting aluminum plate (302) and the upper end surface of the packaging cover (2); after the IC chip (6) is placed in the placement groove (5), a heat-conducting glue (7) is filled between the heat-dissipating port (304) and the IC chip; It is characterized by: The contact surfaces of the packaging base (1) and the packaging cover (2) are engaged with each other through a mutually cooperating detachable engaging structure (8); the detachable engaging structure (8) comprises a engaging groove (801) and a engaging block (802), and a reserved groove (803) is provided inside the engaging block (802); when the engaging block (802) begins to extend into the engaging groove (801), due to the pressure from the notch of the engaging groove (801) and the reserved groove (803) thereof, the engaging block (802) contracts inwards and smoothly extends into the engaging groove (801); after the engaging block (802) is in place, due to the disappearance of the pressure from the notch of the engaging groove (801), the engaging block (802) is naturally engaged in the engaging groove (801) to achieve an engaging connection.

2. The IC packaging structure according to claim 1, wherein: The clamping groove (801) is provided on the upper end surface of the packaging base (1), and the clamping block (802) is provided on the lower end surface of the packaging cover (2).

3. The IC packaging structure according to claim 1, wherein: The clamping groove (801) is provided on the lower end surface of the packaging cover (2), and the clamping block (802) is provided on the upper end surface of the packaging base (1).

4. The IC packaging structure according to any one of claims 1 to 3, wherein: A sealing structure is also provided between the contact surfaces of the packaging base (1) and the packaging cover (2); the sealing structure comprises a sealing ring installation groove (804) and a sealing ring (805); the sealing ring (805) is arranged in the sealing ring installation groove (804).

5. The IC packaging structure according to claim 4, wherein: The sealing ring installation groove (804) is provided on the upper end surface of the packaging base (1).

6. The IC packaging structure according to claim 4, wherein: The sealing ring installation groove (804) is provided on the lower end surface of the packaging cover (2).

7. The IC packaging structure according to claim 1, 2, 3, 5 or 6, wherein: The heat dissipation fins (303) are distributed at equal intervals on the top of the heat-conducting aluminum plate (302).

8. The IC packaging structure according to claim 1, 2, 3, 5 or 6, wherein: Grooves are provided on both sides of the packaging cover (2).

9. The IC packaging structure according to claim 1, 2, 3, 5 or 6, wherein: The outer surface of the pin (4) has an anti-oxidation layer.

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