Low-impedance contact device and electronic equipment

By setting limiting holes and elastic contact components on the circuit board, the problems of high cost and high impedance of Pogo pins are solved, low-cost and low-impedance connection is achieved, current loss is reduced and connection stability is improved.

CN223363436UActive Publication Date: 2025-09-19HUIZHOU TONLY ELECTRONICS LTD
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Patent Information

Application Number
CN202422723962.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-07
Publication Date
2025-09-19
Estimated Expiration
2034-11-07

AI Technical Summary

Technical Problem

The existing pogo pins are expensive and have large impedance, resulting in severe current loss after power is applied.

Method used

A low-impedance contact device is used, including a circuit board, an elastic contact component and a terminal. By setting limiting holes and elastic contact components on the circuit board, the elastic characteristics of the elastic contact components are utilized to connect with the circuit board, thereby reducing impedance and current loss.

Benefits of technology

It reduces equipment cost, reduces current loss, and improves connection stability and precision.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a low-impedance contact device and electronic equipment, and relates to the technical field of electronic equipment, the low-impedance contact device comprises a circuit board, an elastic contact assembly and a wiring terminal, the circuit board is provided with a spacing hole; the elastic contact assembly is arranged at the bottom of the circuit board, and the elastic contact assembly is used for abutting against the interior of the limiting hole and is connected with a circuit in the limiting hole; and the elastic contact assembly is arranged on the wiring terminal. The low-impedance contact device is applied to the electronic equipment.
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Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, in particular to a low-impedance contact device and electronic equipment. Background Art

[0002] Pogo pins (precision connectors) are commonly used for precision connections in electronic products such as mobile phones, portable electronic devices, communications, automobiles, medical devices, and aerospace. They can improve the corrosion resistance, stability, and durability of these connectors. Because pogo pins are very fine probes, their use in precision connectors can reduce the weight and appearance of the connector, making the connector more refined and beautiful.

[0003] However, Pogo pins require beveled machining, increasing costs. Furthermore, the pins are relatively skewed, resulting in significant coaxial deviation. Furthermore, products with a typical PCB height of 2.4mm to 2.8mm are suitable. Current flows in the direction of lower resistance, and during this process, the current impedance is greater than 30mohm to 60mohm. This causes heat generation and current loss when the Pogo pin is energized. Current flow is generally below 5A. Utility Model Content

[0004] The main purpose of the utility model is to provide a low-impedance contact device and electronic equipment, aiming to solve the technical problems in the prior art that the pogo pin has high cost and large impedance, resulting in current loss after power is applied.

[0005] To achieve the above objectives, the present invention provides a low-impedance contact device, comprising:

[0006] A circuit board, wherein the circuit board has a limiting hole;

[0007] an elastic contact component, the elastic contact component being disposed at the bottom of the circuit board and being used to abut against the limiting hole and be connected to the circuit in the limiting hole;

[0008] The elastic contact component is arranged on the wiring terminal.

[0009] In addition, in order to solve the above problems, the utility model also proposes an electronic device, which is applied with the low-impedance contact device as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0011] Figure 1 An exploded view of the low-impedance contact device provided by the utility model;

[0012] Figure 2 A cross-sectional view of the low-impedance contact device provided by the present invention;

[0013] Figure 3 This is a schematic structural diagram of the elastic contact assembly in the low-impedance contact device provided by the present invention;

[0014] Figure 4 This is a schematic diagram of the compression distance-elastic force ratio of the elastic part in the low-impedance contact device provided by the utility model.

[0015] Description of Figure Numbers:

[0016] 10. Circuit board; 11. Limiting hole; 20. Elastic contact assembly; 21. Elastic portion; 211. First bending surface; 212. Second bending surface; 213. Third bending surface; 214. Fourth bending surface; 22. Connecting portion; 221. Accommodating cavity; 222. Locking notch; 23. Contact bump; 30. Wiring terminal; 40. First shell; 41. Fixing plate; 411. Through hole; 50. Second shell; 51. Fixing surface; 60. Fixing part.

[0017] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0019] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0020] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0021] The utility model provides a low-impedance contact device.

[0022] See also Figure 1 In one embodiment of the utility model, the low-impedance contact device includes a circuit board 10, an elastic contact component 20 and a terminal 30. The circuit board 10 has a limiting hole 11; the elastic contact component 20 is arranged at the bottom of the circuit board 10, and the elastic contact component 20 is used to abut against the limiting hole 11 and be connected to the circuit in the limiting hole 11; the elastic contact component 20 is arranged on the terminal 30.

[0023] During assembly, the side of the circuit board 10 with the limiting hole 11 faces the elastic contact component 20, and the position of the elastic contact component 20 corresponds to the position of the limiting hole 11 so that the elastic contact component 20 can extend into the limiting hole 11 and contact the circuit in the limiting hole 11 to form a loop.

[0024] The elastic contact assembly 20 includes a connecting portion 22 and an elastic portion 21. The connecting portion 22 is disposed within the terminal block 30. The terminal block 30 is located at the bottom of the circuit board 10 and is used to support and secure the connecting portion 22. One end of the elastic portion 21 is disposed on the connecting portion 22, and the other end extends toward one side of the circuit board 10 until it abuts against the retaining hole 11.

[0025] The elastic part 21 is used to be clamped in the limiting hole 11. The size of the elastic part 21 corresponds to the size of the limiting hole 11, thereby ensuring that the elastic part 21 can be stably clamped in the limiting hole 11, preventing the elastic part 21 from moving left and right in the limiting hole 11, and ensuring the stability of the connection.

[0026] The connection terminal 30 is fixed, and the circuit board 10 is pressed toward one side of the connection terminal 30 . The elastic contact component 20 is squeezed to generate an opposite elastic force, so that the elastic contact component 20 is pressed upward against the circuit board 10 .

[0027] The connecting portion 22 is a connecting structure that is clamped in the terminal block 30. In this embodiment, the number of the connecting portion 22 can be multiple, please refer to Figure 1 and Figure 2 , a total of three connecting portions 22 are provided. The three connecting portions 22 are arranged in a straight line, and each connecting portion 22 is provided with a corresponding elastic portion 21. The circuit board 10 also has the same number of limiting holes 11. Each elastic portion 21 is engaged with the corresponding limiting hole 11. The number of connecting portions 22 and elastic portions 21 can be adjusted according to assembly requirements. It can be two, three, or even more.

[0028] The connecting portion 22 and the elastic portion 21 may be integrally formed to improve the stability and reliability of the connection therebetween.

[0029] Compared to pogo pins, the cost of using the elastic portion 21 is lower, and the connection precision requirements are lower, resulting in a lower manufacturing cost. Furthermore, the elastic portion 21 only needs to be able to fit into the retaining hole 11, and its dimensions can be adjusted as needed. Furthermore, the elastic portion 21 can be made of a more conventional 10mohm (megaohm) impedance material, effectively reducing the heat loss caused by the pogo pin's current flow by reducing impedance.

[0030] The technical solution of this utility model installs the elastic contact assembly 20 on the terminal block 30 and defines the retaining hole 11 in the circuit board 10. During assembly, the elastic contact assembly 20 is snapped into the retaining hole 11 and abuts against the circuit board 10. The use of the elastic contact assembly 20 reduces precision requirements and impedance, thereby lowering equipment costs and reducing current loss. Furthermore, the elastic properties of the elastic contact assembly 20 are utilized to press it tightly against the circuit board 10, ensuring a stable connection.

[0031] In one embodiment, see Figure 3The elastic portion 21 includes a first curved surface 211, a second curved surface 212, a third curved surface 213, and a fourth curved surface 214, which are connected in a C-shape. The side of the elastic portion 21 closer to the circuit board 10 is defined as the top, and the other side is defined as the bottom. From bottom to top, the elastic portion 21 includes the first curved surface 211, the second curved surface 212, the third curved surface 213, and the fourth curved surface 214. The first curved surface 211, the second curved surface 212, the third curved surface 213, and the fourth curved surface 214 can all be long strips made of elastic metal material. When subjected to external pressure, they generate elastic forces in opposite directions.

[0032] The first bending surface 211 is provided on the connecting portion 22 and is connected to the edge of the connecting portion 22. The third bending surface 213 and the fourth bending surface 214 are smoothly connected and convex upward at the connection position, thereby forming a contact bump 23 that protrudes toward one side of the circuit board 10. The contact bump 23 is used to abut the circuit in the limiting hole 11. The second bending surface 212 is connected between the first bending surface 211 and the third bending surface 213.

[0033] Please refer to Figure 2 The interference amount d between the circuit board 10 and the elastic contact component 20 is 0.2mm to 0.5mm. That is, the depth of the limiting hole 11 is 0.2mm to 0.5mm, so that the depth of the contact protrusion 23 extending into the limiting hole 11 is 0.2mm to 0.5mm. Please refer to Figure 4 By simulating and analyzing the elastic force corresponding to the elastic contact component 20 under different compression amounts, the depth of the limiting hole 11 is adjusted according to different needs to improve the overall compatibility.

[0034] A "C"-shaped structure is adopted. After the upper and lower ends of the elastic contact component 20 are connected to the circuit board 10 and the connecting part 22 respectively, the second bending surface 212 and the third bending surface 213 in the middle are squeezed. The second bending surface 212 and the third bending surface 213 are elastic and have upward and downward rebound forces after squeezing, respectively pressing the first bending surface 211 downward and the fourth bending surface 214 upward, so that they maintain a stable connection with the circuit board 10 and the connecting part 22.

[0035] Specifically, the elastic force of the elastic member is 0.3N to 0.65N, that is, the pressure of the first contact bump 23 pressing on the circuit board 10 is 0.3N to 0.65N.

[0036] It should be noted that the contact protrusion 23 can be in the form of a point or a strip structure with a certain width, which is the same as the width of the bending surface. The strip structure improves the connection stability between the contact protrusion 23 and the limiting hole 11.

[0037] In one embodiment, see Figure 3 The connecting portion 22 is annular, forming a circular accommodating cavity 221 at the center. Alternatively, the connecting portion 22 may be formed in other shapes, such as a square ring at the center. One end of the elastic portion 21 is connected to the top edge of the connecting portion 22, while the other end extends away from the connecting portion 22 and abuts against the circuit board 10.

[0038] In this embodiment, the connection terminal 30 is formed by injection molding. The connection portion 22 is placed in a mold, and a material such as resin is filled into the accommodating cavity 221. After cooling, an injection molding layer is formed to wrap the entire connection portion.

[0039] It should be noted that, in order to facilitate connection with other electronic components, the top of the connecting portion 22 is flush with the top surface of the injection molding layer, and the top edge of the connecting portion 22 is exposed outside the injection molding layer.

[0040] The injection molded layer only covers the connection portion, while the elastic portion 21 extends outside the injection molded layer toward the top circuit board 10. The integral injection molded layer, by encapsulating the entire connection portion 22, provides excellent protection and enhances safety during use. It also prevents the formation of gaps between the injection molded layer and the connection portion 22, achieving a good waterproofing effect.

[0041] As an example, please refer to Figure 3 The edge of the connecting portion 22 is a trumpet-shaped structure that flares outward, and the top side wall is smoothly connected, making the top edge narrower. Therefore, after the injection molding layer is formed, the connection position between the injection molding layer and the edge is not easy to crack, preventing the formation of gaps that reduce the waterproof effect.

[0042] As another example, please refer to Figure 3 The top edge of the connecting portion 22 is recessed downward, thereby forming a locking notch 222. The injection molding layer is integrally formed, so that during the filling process, the resin will flow into the entire locking notch 222 and form a whole with the external resin. When the injection molding layer cools and hardens, the injection molding layer can clamp the locking notch 222, thereby preventing the connecting portion 22 from shaking in the injection molding layer and improving the connection strength.

[0043] In one embodiment, see Figure 1 and Figure 2 The low-impedance contact device also includes a first shell 40 and a second shell 50. The first shell 40 and the second shell 50 are used to press the circuit board 10 and the elastic contact assembly 20 from the upper and lower sides, thereby ensuring that the circuit board 10 is stably pressed on the elastic part 21.

[0044] The first housing 40 is disposed on the side of the circuit board 10 away from the connection terminal 30; the second housing 50 is disposed on the side of the connection terminal 30 away from the circuit board 10. Figure 1 The first shell 40 is located at the top, the second shell 50 is located at the bottom, the circuit board 10 and the elastic contact component 20 are arranged between the first shell 40 and the second shell 50. When the first shell 40 is covered on the second shell 50, the bottom of the first shell 40 is pressed tightly against the top surface of the circuit board 10, and the top of the second shell 50 is pressed tightly against the bottom of the injection molding layer, so that the circuit board 10 is pressed tightly against the elastic contact component 20.

[0045] When the first housing 40 and the second housing 50 are connected, the gap between the first housing 40 and the second housing 50 is slightly smaller than the total height of the assembled circuit board 10, the elastic contact assembly 20, and the injection molding layer. Therefore, when the first housing 40 and the second housing 50 are closed, the circuit board 10 can be pressed against the elastic contact assembly 20.

[0046] Furthermore, the low-impedance contact device further includes a fixing member 60 , wherein the fixing portion is a screw, the top of the screw is a nut, and the bottom is a stud.

[0047] A fixing plate 41 extends outward from the edge of the first shell 40, and a fixing surface 51 is provided on the edge of the second shell 50; the fixing plate 41 has a through hole 411, and a threaded hole is provided on the fixing surface 51. The size of the nut is slightly larger than the size of the through hole 411.

[0048] When the first shell 40 is closed on the second shell 50, the fixing plate 41 abuts against the fixing surface 51, the stud passes through the through hole 411, and the stud is screwed into the threaded hole until the nut abuts against the top of the fixing plate 41, thereby pressing the first shell 40 against the second shell 50, reinforcing the first shell 40 and the second shell 50, and improving the stability of the connection between the first shell 40 and the second shell 50.

[0049] The present invention also proposes an electronic device, which includes a specific structure of the low-impedance contact device, with reference to the above embodiments. Since the electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0050] During assembly, the side of the circuit board 10 with the limiting hole 11 faces the elastic contact component 20, and the position of the elastic contact component 20 corresponds to the position of the limiting hole 11 so that the elastic contact component 20 can extend into the limiting hole 11 and contact the circuit in the limiting hole 11 to form a loop.

[0051] The elastic contact assembly 20 includes a connecting portion 22 and an elastic portion 21. The connecting portion 22 is disposed within the terminal block 30. The terminal block 30 is located at the bottom of the circuit board 10 and is used to support and secure the connecting portion 22. One end of the elastic portion 21 is disposed on the connecting portion 22, and the other end extends toward one side of the circuit board 10 until it abuts against the retaining hole 11.

[0052] The elastic part 21 is used to be clamped in the limiting hole 11. The size of the elastic part 21 corresponds to the size of the limiting hole 11, thereby ensuring that the elastic part 21 can be stably clamped in the limiting hole 11, preventing the elastic part 21 from moving left and right in the limiting hole 11, and ensuring the stability of the connection.

[0053] The connection terminal 30 is fixed, and the circuit board 10 is pressed toward one side of the connection terminal 30 . The elastic contact component 20 is squeezed to generate an opposite elastic force, so that the elastic contact component 20 is pressed upward against the circuit board 10 .

[0054] The connecting portion 22 is a connecting structure that is clamped in the terminal block 30. In this embodiment, the number of the connecting portion 22 can be multiple, please refer to Figure 1 , a total of three connecting portions 22 are provided. The three connecting portions 22 are arranged in a straight line, and each connecting portion 22 is provided with a corresponding elastic portion 21. The circuit board 10 also has the same number of limiting holes 11. Each elastic portion 21 is engaged with the corresponding limiting hole 11. The number of connecting portions 22 and elastic portions 21 can be adjusted according to assembly requirements. It can be two, three, or even more.

[0055] The connecting portion 22 and the elastic portion 21 may be integrally formed to improve the stability and reliability of the connection therebetween.

[0056] Compared to pogo pins, the cost of using the elastic portion 21 is lower, and the connection precision requirements are lower, resulting in a lower manufacturing cost. Furthermore, the elastic portion 21 only needs to be able to fit into the retaining hole 11, and its dimensions can be adjusted as needed. Furthermore, the elastic portion 21 can be made of a more conventional 10mohm (megaohm) impedance material, effectively reducing the heat loss caused by the pogo pin's current flow by reducing impedance.

[0057] The technical solution of this utility model installs the elastic contact assembly 20 on the terminal block 30 and defines the retaining hole 11 in the circuit board 10. During assembly, the elastic contact assembly 20 is snapped into the retaining hole 11 and abuts against the circuit board 10. The use of the elastic contact assembly 20 reduces precision requirements and impedance, thereby lowering equipment costs and reducing current loss. Furthermore, the elastic properties of the elastic contact assembly 20 are utilized to press it tightly against the circuit board 10, ensuring a stable connection.

[0058] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A low-impedance contact device, characterized in that: The low-impedance contact device comprises: A circuit board, wherein the circuit board has a limiting hole; an elastic contact component, the elastic contact component being disposed at the bottom of the circuit board and being used to abut against the limiting hole and be connected to the circuit in the limiting hole; The elastic contact component is arranged on the wiring terminal.

2. The low-impedance contact device according to claim 1, wherein: The elastic contact component comprises: a connecting portion, the connecting portion being arranged in the wiring terminal; An elastic portion, one end of which is connected to the connecting portion, and the other end of which extends toward one side of the circuit board until it abuts against the limiting hole.

3. The low-impedance contact device according to claim 2, wherein: The elastic portion includes a first bending surface, a second bending surface, a third bending surface and a fourth bending surface which are sequentially connected in a "C" shape; The first bending surface is connected to the edge of the connecting portion, and a contact protrusion protruding toward one side of the circuit board is formed between the third bending surface and the fourth bending surface. The contact protrusion is used to abut against the circuit in the limiting hole.

4. The low-impedance contact device according to claim 3, wherein: The elastic force of the elastic member is 0.3N to 0.65N.

5. The low-impedance contact device according to claim 2, wherein: The connecting portion has a receiving cavity, one end of the elastic portion is connected to the top edge of the connecting portion, and the other end extends along a side away from the connecting portion and abuts against the circuit board; The connection terminal is formed by an injection molding process to form an injection molding layer inside and outside the accommodating cavity to wrap the connection part, wherein the top edge of the connection part is exposed outside the injection molding layer.

6. The low-impedance contact device according to claim 5, wherein: The top edge of the connecting portion has a locking notch, and the injection molding layer fills the locking notch.

7. The low-impedance contact device according to claim 1, wherein: The low-impedance contact device further comprises: a first housing, the first housing being arranged on a side of the circuit board away from the connection terminal; a second housing, the second housing being arranged on a side of the connection terminal facing away from the circuit board; When the first shell is closed on the second shell, the circuit board is pressed against the elastic contact component.

8. The low-impedance contact device according to claim 7, wherein: The low-impedance contact device further comprises a fixing member, wherein the edge of the first housing has a raised fixing plate, and the edge of the second housing has a fixing surface; When the first shell is covered on the second shell, the fixing plate abuts against the fixing surface, and the fixing member is arranged between the fixing plate and the fixing surface to reinforce the first shell and the second shell.

9. The low-impedance contact device according to any one of claims 1 to 8, characterized in that: The interference between the circuit board and the elastic contact component is 0.2 mm to 0.5 mm.

10. An electronic device, characterized in that: The electronic device is applied with the low-impedance contact device according to any one of claims 1 to 9.