Heat dissipation structure of circuit board

Abstract

The utility model discloses a heat dissipation structure of a circuit board, which comprises a circuit board body and an electronic component arranged on the circuit board, and is characterized by further comprising at least one resistance welding windowing area which is arranged close to the electronic component. And a plurality of metal heat dissipation pieces are welded in the solder resist windowing area, so that the metal heat dissipation pieces are tightly connected with the surface of the solder resist windowing area. The circuit board at least has the following advantages: the circuit board has high heat dissipation performance, and the structural rigidity of the circuit board is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and more particularly to a heat dissipation structure of a circuit board. Background Art

[0002] The description in this section merely provides background information related to the disclosure of the present utility model and does not constitute prior art.

[0003] Printed circuit boards (PCBs) provide electrical connections for electronic components. They have a history of over 100 years; their design primarily involves layout design. The main advantage of using PCBs is that they significantly reduce wiring and assembly errors, improving automation and productivity.

[0004] Printed circuit boards are boards that hold electronic components and can be electrically connected to them. The electronic components on printed circuit boards, especially those with signal acquisition functions, release a certain amount of temperature during operation, which will continue to rise in temperature. Improper heat dissipation will affect the working efficiency of the electronic components, the working stability of the signal acquisition module, and even destroy the operation of the system.

[0005] To solve the heat dissipation problem, the current general method is to set blind holes on the circuit board and then fill the holes with electroplating to achieve heat dissipation. The heat dissipation effect of this method is limited because parameters such as current density and electrolyte temperature need to be strictly controlled during the electroplating process to ensure the quality and thickness of the electroplating layer. Therefore, this method is complicated to operate. The setting of the blind holes affects the structural rigidity of the circuit board itself to a certain extent. Therefore, it is an urgent problem to be solved by technical personnel in this field to improve the rigidity of the circuit board while maintaining high heat dissipation.

[0006] It should be noted that the above technical background is merely for the purpose of providing a clear and complete description of the technical solutions of the present invention and to facilitate understanding by those skilled in the art. It should not be assumed that the above technical solutions are well known to those skilled in the art simply because they are described in the background technology section of the present invention. Summary of the Invention

[0007] The technical problem to be solved by the utility model is to provide a heat dissipation structure of a circuit board, which not only has high heat dissipation performance but also improves the structural rigidity of the circuit board.

[0008] In order to solve the above technical problems, the utility model provides a heat dissipation structure of a circuit board, including a circuit board body and electronic components arranged on the circuit board, and also including at least one solder resist window area, wherein the solder resist window area is arranged close to the electronic components, and a plurality of metal heat sinks are welded in the solder resist window area so that the metal heat sinks are tightly connected to the surface of the solder resist window area.

[0009] As a further preference, the metal heat sink is a solid copper column.

[0010] As a further preferred embodiment, the copper column has a rectangular cross-section, a length of 2-10 mm, a width of 1-3 mm, and a height of 0.5-3 mm.

[0011] As a further preferred embodiment, there is a heat dissipation gap between two adjacent copper pillars, and the heat dissipation gap is greater than 0.5 mm.

[0012] As a further preferred embodiment, the electronic components include a power conversion chip, a power inductor, a diode and a filter capacitor.

[0013] As a further preference, the copper column has a length of 8 mm, a width of 2 mm, and a height of 1 mm.

[0014] By means of the above technical solution, the beneficial effects of the present invention are as follows:

[0015] The heat dissipation structure of the circuit board of the present invention is achieved by providing a solder mask window area near the position of the electronic components and directly soldering copper pillars to the solder mask window area. The copper pillars are in direct contact with the hot spots on the circuit board, conducting heat to the copper pillars. The copper pillars utilize their larger surface area to dissipate heat into the surrounding environment, thereby improving the ability to radiate heat. Heat is also dissipated into the surrounding environment in the form of radiation, while also improving air convection, promoting natural convection, and enhancing heat dissipation. Furthermore, soldering the copper pillars also improves the reliability of the circuit board structure and increases the overall rigidity of the circuit board. The structural design of the present application enables the copper pillars and electronic components to be formed in one piece, effectively saving processing time and improving processing efficiency. The solid copper pillars are designed to absorb and store more heat, providing more sustained heat dissipation during the heat dissipation process. Especially under high load or long-term operation, heat is more evenly transferred within the copper pillars, reducing local overheating caused by uneven heat distribution. This uniform heat distribution helps improve overall heat dissipation efficiency and protects the components being dissipated from high temperature damage. Solid copper pillars are more structurally stable and less susceptible to deformation due to external forces or temperature changes. This stability helps ensure consistent and reliable cooling, especially in applications such as circuit boards where high-precision cooling is required. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a partial schematic diagram of the circuit board of the utility model;

[0017] Figure 2 It is a schematic diagram of the utility model showing the solder resist window area.

[0018] in:

[0019] 1. Circuit board body; 2. Filter capacitor; 3. Power conversion chip; 4. Diode; 5. Power inductor; 6. Heat dissipation metal parts; 7. Solder mask window area; 8. Electronic components. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] It should be noted that, in the description of this utility model, the terms "first," "second," etc., are used solely for descriptive purposes and to distinguish similar objects. There is no order of precedence between the two, nor should they be construed as indicating or implying relative importance. Furthermore, in the description of this utility model, unless otherwise specified, "plurality" means two or more.

[0022] See attached Figure 1-2, this specification describes a heat dissipation structure of a circuit board as described in a preferred embodiment. Specifically, the circuit board is a circuit board with data acquisition function, which includes a circuit board body 1 and electronic components 8 arranged on the circuit board, and also includes at least one solder resist window area 7. The solder resist window area 7 is arranged in an idle, non-routing area on the circuit board and is close to the electronic components 8 that are prone to heat. The solder resist window area 7 is formed by removing the green oil covering layer to expose the surface copper foil. Each solder resist window area 7 is welded with a plurality of metal heat sinks so that the metal heat sink is tightly connected to the surface of the solder resist window area 7. Direct contact can directly transfer heat to the metal heat sink, which is beneficial to heat conduction. Specifically, the metal heat sink is preferably a solid copper column. The structural design of the present application can realize the one-time molding of the copper column and the electronic component 8, effectively saving processing time and improving processing efficiency. The cross section of the copper pillars of the present application is arranged in a rectangular shape, with a length of 2-10mm, a width of 1-3mm, and a height of 0.5-3mm. Specifically, different specifications are set according to the size of the actual idle area. In one embodiment, the length of the copper pillar is 8mm, the width is 2mm, and the height is 1mm. The length of the copper pillar in another embodiment is 3.5mm, the width is 2mm, and the height is 0.5mm. In other embodiments, the length of the copper pillar is 6mm, the width is 2mm, and the height is 2mm. In order to promote natural convection and improve the heat dissipation effect, it is preferred that there is a heat dissipation gap between two adjacent copper pillars, and the heat dissipation gap is greater than 0.5mm. Thus, the present application can utilize the larger surface area of ​​the copper pillars to dissipate heat into the surrounding environment, realize the ability to improve thermal radiation, and dissipate heat into the surrounding environment in the form of radiation. The setting of the solid copper pillars can not only absorb and store more heat, but also provide a more lasting heat dissipation capacity during the heat dissipation process. Especially in the case of high load or long-term operation, heat is more evenly transferred inside the copper pillars, reducing the local overheating caused by uneven heat distribution. This uniform heat distribution helps improve overall cooling efficiency and protects the components being cooled from high-temperature damage. Solid copper pillars are structurally more stable and less susceptible to deformation due to external forces or temperature fluctuations. This stability helps ensure consistent and reliable cooling, especially in applications such as circuit boards that require high-precision heat dissipation. It also improves the reliability of the board structure and increases its overall rigidity.

[0023] The electronic components 8 of the present application include a power conversion chip 3, a power inductor 5, a diode 4 and a filter capacitor 2. The power conversion chip 3 of the present application converts a 24-volt power supply into a 5-volt power supply. This type of power conversion chip 3 generally generates serious heat. Overheating will lead to a decrease in power conversion efficiency and reduce component performance. We use the copper foil connected to the power conversion chip 3 on the circuit board to open a window, and weld heat dissipation copper pillars in the solder mask window area 7 to dissipate heat for the circuit board. The chip heat is transferred to the copper foil through the pins, and heat dissipation copper pillars are welded in the solder mask window area 7. The excellent thermal conductivity of copper is utilized to expand the heat dissipation area, and the heat is taken away through air flow, thereby improving the performance of the components and increasing the working stability of the signal acquisition module.

[0024] The power inductor 5, the power inductor 5 of the DC-DC step-down circuit, cooperates with the filter capacitor 2 to form a filter circuit, which filters the power waveform output by the power conversion chip 3 into a smooth DC power, thereby reducing the power ripple. Some heat will be generated in the working state, and arranging a heat dissipation copper column near it can achieve a good heat dissipation effect.

[0025] The diode 4 is a Schottky diode 4, which is used to provide a freewheeling path for the power inductor 5 to prevent the power inductor 5 from emitting an extremely high induced voltage that damages the subsequent load when the power is suddenly cut off. The induced voltage forms a loop and returns to the inductor through the Schottky diode 4. In this way, the induced voltage generated by the power inductor 5 due to power outage can be consumed after a few round trips. It will generate some heat in the working state, and arranging a heat dissipation copper column near it can achieve a good heat dissipation effect.

[0026] The above-described embodiments are merely preferred embodiments for the purpose of fully illustrating the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are within the scope of protection of the present invention. The scope of protection of the present invention shall be subject to the claims.

Claims

1. A heat dissipation structure of a circuit board, comprising a circuit board body and electronic components arranged on the circuit board, characterized in that: It also includes at least one solder resist window area, which is arranged close to the electronic components. The solder resist window area is welded with multiple metal heat sinks to ensure that the metal heat sinks are tightly connected to the surface of the solder resist window area.

2. The heat dissipation structure of a circuit board according to claim 1, characterized in that: The metal heat sink is a solid copper column.

3. The heat dissipation structure of the circuit board according to claim 2, characterized in that: The copper column has a rectangular cross section, a length of 2-10 mm, a width of 1-3 mm, and a height of 0.5-3 mm.

4. The heat dissipation structure of a circuit board according to claim 2, characterized in that: There is a heat dissipation gap between two adjacent copper pillars, and the heat dissipation gap is greater than 0.5 mm.

5. The heat dissipation structure of a circuit board according to claim 1, characterized in that: The electronic components include a power conversion chip, a power inductor, a diode and a filter capacitor.

6. The heat dissipation structure of a circuit board according to claim 3, characterized in that: The copper column has a length of 8 mm, a width of 2 mm, and a height of 1 mm.

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