Electronic component heat dissipation assembly

Abstract

The utility model discloses an electronic component heat dissipation assembly which comprises an installation shell installed on the top of an installation plate, heat dissipation fins are fixedly installed in an inner cavity of the installation shell, a heat dissipation fan is fixedly installed on the tops of the heat dissipation fins, and the heat dissipation fan is installed on the top of the inner cavity of the installation shell. Four heat dissipation copper pipes are arranged on the surface of the heat dissipation fin and symmetrically installed on the periphery of the heat dissipation fin, and the opposite sides of the heat dissipation copper pipes extend to an inner cavity of the heat dissipation fin. The bottoms of the heat dissipation copper pipes extend to the bottom of the mounting plate, heat at the bottom of the mounting plate can be transmitted to the surfaces of the heat dissipation fins, heat dissipation is conducted on the heat dissipation fins through the heat dissipation fan, double-face heat dissipation is conducted on electronic components of the mounting plate, the mounting height of the mounting shell is adjusted through the threaded cylinder, and the heat dissipation efficiency is improved. Therefore, airflow at the top of the mounting plate flows, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation fans, in particular to an electronic element heat dissipation assembly. Background Art

[0002] Electronic components generate heat when working, causing the overall temperature to rise, which may cause the electrical components to burn out. Usually, electronic components have heat dissipation components.

[0003] Current heat dissipation components basically use heat dissipation fans for heat dissipation, that is, heat dissipation fans are assembled on electronic components, and the heat dissipation fans are used to drive the air flow around the components to achieve the heat dissipation effect. However, when the electronic components are working on the surface of the mounting plate, the air on both sides of the mounting plate will be heated up at the same time. The heat dissipation fans are generally only installed on one side of the electronic components, and it is impossible to achieve synchronous heat dissipation on the back of the mounting plate. Moreover, when the heat dissipation fans are directly installed on the surface of the electronic components, the surface airflow of the electronic components is weak, resulting in poor heat dissipation effect. Therefore, it is necessary to design an electronic component heat dissipation component to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide an electronic component heat dissipation assembly, which has the advantages of double-sided heat dissipation and improved air flow, so as to solve the above-mentioned background technical problems.

[0005] The technical solution of the utility model for solving the above technical problems is as follows: an electronic component heat dissipation assembly, which includes a mounting shell installed on the top of a mounting plate, the inner cavity of the mounting shell is fixedly installed with heat dissipation fins, the top of the heat dissipation fins is fixedly installed with a heat dissipation fan, the heat dissipation fan is installed on the top of the inner cavity of the mounting shell, four heat dissipation copper tubes are provided on the surface of the heat dissipation fins, the four heat dissipation copper tubes are symmetrically installed around the heat dissipation fins, the opposite sides of the heat dissipation copper tubes extend to the inner cavity of the heat dissipation fins, the bottom of the heat dissipation copper tube passes through the inner cavity of the mounting shell and extends to the bottom of the mounting plate, the surface of the lower end of the heat dissipation copper tube is threadedly connected to a threaded barrel, and the threaded barrel is threadedly connected to the top of the mounting plate.

[0006] Preferably, a copper core is detachably installed in the inner cavity of the heat dissipation fin, the copper core is plugged into the center of the inner cavity of the heat dissipation fin, and an anti-dropping sheet is provided on the top of the copper core.

[0007] Preferably, a convex groove is provided on the upper end of the outer surface of the threaded barrel.

[0008] Preferably, a heat dissipation copper seat is provided at the bottom of the mounting plate, the bottom of the heat dissipation copper tube is plugged into the inner cavity of the heat dissipation copper seat, and the bottom of the threaded barrel is threadedly connected to the surface of the heat dissipation copper seat.

[0009] Preferably, heat dissipation holes are provided on all four sides of the surface of the mounting shell.

[0010] Preferably, an insulating layer is provided on the bottom of the copper core and the top of the heat dissipating copper seat.

[0011] The beneficial effects of the utility model are:

[0012] 1. This utility model extends the bottom of the heat dissipation copper tube to the bottom of the mounting plate, which can transfer the heat from the bottom of the mounting plate to the surface of the heat dissipation fins. The heat is then dissipated by the heat dissipation fan, achieving double-sided heat dissipation for the electronic components on the mounting plate. The height of the mounting housing can be adjusted by the threaded barrel, so that the air flow at the top of the mounting plate can flow, thereby improving the heat dissipation efficiency.

[0013] 2. The utility model can quickly absorb the heat at the bottom of the mounting plate through the setting of the heat dissipation copper seat, and then transfer the heat to the surface of the heat dissipation fins through the heat dissipation copper tube for heat dissipation, thereby improving the heat dissipation efficiency of the bottom of the mounting plate;

[0014] 3. The utility model can improve the fluidity of the air inside and outside the installation shell through the provision of heat dissipation holes, so that the heat dissipation fan can better drive the air flow and improve the heat dissipation effect of the heat dissipation component; BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or other advantages of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings. These drawings are only illustrative and do not limit the present invention, wherein:

[0016] Figure 1 This is a three-dimensional schematic diagram of an embodiment of the utility model;

[0017] Figure 2 This is a bottom-view stereoscopic diagram of an embodiment of the utility model;

[0018] Figure 3 This is a three-dimensional disassembled schematic diagram of an embodiment of the utility model.

[0019] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0020] 1. Mounting plate, 2. Mounting shell, 3. Heat sink fins, 4. Cooling fan, 5. Heat sink copper tube, 6. Threaded barrel, 7. Copper core, 8. Embossed groove, 9. Heat sink copper seat, 10. Heat dissipation hole. DETAILED DESCRIPTION

[0021] Hereinafter, embodiments of the electronic component heat dissipation assembly of the present invention will be described with reference to the accompanying drawings.

[0022] Figure 1-3The electronic component heat dissipation assembly of an embodiment of the present invention is shown, which includes a mounting shell 2 mounted on the top of a mounting plate 1, a heat dissipation fin 3 fixedly mounted on the inner cavity of the mounting shell 2, a heat dissipation fan 4 fixedly mounted on the top of the heat dissipation fin 3, and the heat dissipation fan 4 mounted on the top of the inner cavity of the mounting shell 2, and four heat dissipation copper tubes 5 are provided on the surface of the heat dissipation fin 3, and the four heat dissipation copper tubes 5 are symmetrically mounted around the heat dissipation fin 3, and the opposite sides of the heat dissipation copper tube 5 extend to the inner cavity of the heat dissipation fin 3, and the bottom of the heat dissipation copper tube 5 passes through the inner cavity of the mounting shell 2 and extends to the bottom of the mounting plate 1, and the surface of the lower end of the heat dissipation copper tube 5 is threadedly connected with a threaded barrel 6, and the upper end of the outer surface of the threaded barrel 6 is provided with a convex groove 8, and the threaded barrel 6 is threadedly connected to the top of the mounting plate 1, and the inner cavity of the heat dissipation fin 3 is detachably mounted with a copper core 7. The copper core 7 is inserted in the center of the inner cavity of the heat sink 3. The top of the copper core 7 is provided with an anti-slip sheet. The bottom of the mounting plate 1 is provided with a heat dissipation copper seat 9. The bottom of the heat dissipation copper tube 5 is inserted in the inner cavity of the heat dissipation copper seat 9. Through the setting of the heat dissipation copper seat 9, the heat at the bottom of the mounting plate 1 can be quickly absorbed, and then the heat is transferred to the surface of the heat dissipation fin 3 through the heat dissipation copper tube 5 for heat dissipation, thereby improving the heat dissipation efficiency of the bottom of the mounting plate 1. The bottom of the threaded cylinder 6 is threadedly connected to the surface of the heat dissipation copper seat 9. Heat dissipation holes 10 are provided around the surface of the mounting shell 2. Through the setting of the heat dissipation holes 10, the fluidity of the air in the inner cavity of the mounting shell 2 and its outside can be improved, so that the heat dissipation fan 4 can better drive the air flow, thereby improving the heat dissipation effect of the heat dissipation assembly. The bottom of the copper core 7 and the top of the heat dissipation copper seat 9 are both provided with an insulating layer.

[0023] Working principle: When using the present invention, the user sets the heat dissipation copper seat 9 at the bottom of the mounting plate 1, and passes the bottom of the heat dissipation copper tube 5 through the inner cavity of the mounting plate 1 and inserts it into the inner cavity of the heat dissipation copper seat 9, and then rotates the convex groove 8 to drive the threaded cylinder 6 to be threadedly connected to the inner cavity of the mounting plate 1 and the top of the heat dissipation copper seat 9, thereby locking the mounting shell 2 on the top of the mounting plate 1, and connecting the heat dissipation copper tube 5 and the heat dissipation copper seat 9. After installation, the bottom of the heat dissipation copper tube 5 extends to the bottom of the mounting plate 1 and is connected to the heat dissipation copper seat 9, which can transfer the heat from the bottom of the mounting plate 1 to the surface of the heat dissipation fins 3, and then dissipate it through the heat dissipation fan 4, thereby realizing double-sided heat dissipation of the electronic components of the mounting plate 1. By rotating the threaded cylinder 6, the position of the threaded cylinder 6 at the lower end of the heat dissipation copper tube 5 is adjusted, thereby adjusting the installation height of the mounting shell 2, so that the airflow at the bottom of the mounting shell 2 and the top of the mounting plate 1 flows, thereby improving the heat dissipation efficiency.

[0024] To sum up: this electronic component heat dissipation assembly, by extending the bottom of the heat dissipation copper tube 5 to the bottom of the mounting plate 1, can transfer the heat at the bottom of the mounting plate 1 to the surface of the heat dissipation fins 3, and then dissipate the heat through the heat dissipation fan 4, thereby achieving double-sided heat dissipation of the electronic components on the mounting plate 1, and adjusting the installation height of the mounting shell 2 through the threaded tube 6, so that the air flow at the top of the mounting plate 1 flows, thereby improving the heat dissipation efficiency.

Claims

1. An electronic component heat dissipation assembly, characterized in that: The invention comprises a mounting shell (2) mounted on the top of a mounting plate (1), wherein a heat dissipation fin (3) is fixedly mounted in the inner cavity of the mounting shell (2), a heat dissipation fan (4) is fixedly mounted on the top of the heat dissipation fin (3), and the heat dissipation fan (4) is mounted on the top of the inner cavity of the mounting shell (2), and four heat dissipation copper tubes (5) are arranged on the surface of the heat dissipation fin (3), and the four heat dissipation copper tubes (5) are symmetrically mounted around the heat dissipation fin (3), and opposite sides of the heat dissipation copper tubes (5) extend to the inner cavity of the heat dissipation fin (3), and the bottom of the heat dissipation copper tube (5) passes through the inner cavity of the mounting shell (2) and extends to the bottom of the mounting plate (1), and the surface of the lower end of the heat dissipation copper tube (5) is threadedly connected to a threaded barrel (6), and the threaded barrel (6) is threadedly connected to the top of the mounting plate (1).

2. The electronic component heat dissipation assembly according to claim 1, characterized in that: A copper core (7) is detachably mounted in the inner cavity of the heat dissipation fin (3), the copper core (7) being plugged into the center of the inner cavity of the heat dissipation fin (3), and an anti-dropping sheet being provided on the top of the copper core (7).

3. The electronic component heat dissipation assembly according to claim 2, characterized in that: The upper end of the outer surface of the threaded barrel (6) is provided with a convex groove (8).

4. The electronic component heat dissipation assembly according to claim 3, characterized in that: A heat dissipation copper seat (9) is provided at the bottom of the mounting plate (1), the bottom of the heat dissipation copper tube (5) is plugged into the inner cavity of the heat dissipation copper seat (9), and the bottom of the threaded barrel (6) is threadedly connected to the surface of the heat dissipation copper seat (9).

5. The electronic component heat dissipation assembly according to claim 4, characterized in that: Heat dissipation holes (10) are provided on all four sides of the surface of the mounting shell (2).

6. The electronic component heat dissipation assembly according to claim 5, characterized in that: The bottom of the copper core (7) and the top of the heat dissipation copper seat (9) are both provided with an insulating layer.

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