Three-dimensional flow channel, circuit assembly and power supply module

Abstract

The utility model provides a three-dimensional flow channel, a circuit assembly and a power module. The three-dimensional flow channel comprises a cooling plate and a base. The cooling plate is provided with an accommodating cavity, the accommodating cavity is used for accommodating a circuit board, the cooling plate is provided with a cooling groove, and the cooling groove is used for exchanging heat with the circuit board through a cooling medium; the base is connected with the cooling plate, the base is provided with a flow channel opening corresponding to the cooling groove, and the flow channel opening is communicated with the cooling groove and the outside. The three-dimensional flow channel provided by the utility model can wrap the circuit board, so that cooling and heat dissipation of the circuit board are realized.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a three-dimensional flow channel, a circuit component, and a power supply module. Background Art

[0002] As the integration of new energy vehicles increases, the size and weight of products are shrinking, and the requirements for parameters such as current and power are becoming more and more stringent. The heat dissipation requirements of power electronic products are also increasing. Liquid cooling has gradually replaced traditional air cooling and become the current mainstream heat dissipation method due to its higher heat dissipation efficiency. The runner is the core component of the liquid cooling structure. In related technologies, the runner is die-cast as an integral part of the shell and then sealed with a runner cover. This type of runner poses great challenges and requirements to the die-casting process. The integral die-cast runner is prone to shrinkage holes, and the installation of screw columns can easily lead to cooling water leakage, which has a significant impact on the installation freedom, stability, and quality of the runner. Utility Model Content

[0003] The technical problem to be solved by the implementation method of the present application is that the flow channel and the shell of the existing liquid cooling structure are die-cast as one body, which easily produces shrinkage holes and causes cooling water leakage. A three-dimensional flow channel, circuit components and power supply module are provided, which reduce the production difficulty of the product while ensuring the heat dissipation efficiency and improve the production quality of the product.

[0004] In a first aspect, the present application provides a three-dimensional flow channel, comprising:

[0005] A cooling plate, the cooling plate having a receiving cavity for receiving a circuit board, the cooling plate having a cooling groove for exchanging heat with the circuit board via a cooling medium; and

[0006] The base is connected to the cooling plate, and the base has a flow channel opening and a connecting hole. The flow channel opening connects the cooling tank and the outside world, and the connecting hole is used to cooperate with a fixing part to connect the three-dimensional flow channel to the supporting part.

[0007] The three-dimensional flow channel provided in the embodiment of the present application includes a cooling plate and a base. The cooling plate has a receiving cavity, which can accommodate a circuit board to cool and dissipate heat from the circuit board; the cooling plate has a cooling groove, which is used to pass a cooling medium, thereby realizing heat exchange between the cooling medium and the circuit board. The base is connected to the cooling plate and is used to provide support for the circuit board; the base has a connecting hole, which is used to cooperate with a fixing part to realize the connection between the three-dimensional flow channel and the carrier, thereby further avoiding the die-casting shrinkage cavity generated by the integral die-casting of the three-dimensional flow channel and the carrier in the related art, which affects the production quality and cooling efficiency of the flow channel; the base has a flow channel opening corresponding to the cooling groove, and the flow channel opening connects the cooling groove and the outside world. The flow channel opening can be used to pass the cooling medium outside the three-dimensional flow channel to the cooling groove, and to pass the cooling medium that has undergone heat exchange in the cooling groove to the outside of the three-dimensional flow channel.

[0008] In some embodiments, the cooling plate comprises:

[0009] a liquid inlet portion, the liquid inlet portion being connected to the cooling tank;

[0010] a heat exchange portion, one end of which is in communication with the liquid inlet portion, and comprising a plurality of heat exchange sub-portions connected in a bent manner, wherein the plurality of heat exchange sub-portions form the receiving cavity; and

[0011] A liquid outlet portion is communicated with the other end of the heat exchange portion.

[0012] The three-dimensional flow channel provided in the embodiment of the present application comprises a cooling plate including a liquid inlet, a heat exchange portion and a liquid outlet. The liquid inlet can pass the cooling medium outside the three-dimensional flow channel into the cooling tank inside the cooling plate. The two ends of the heat exchange portion are respectively connected to the liquid inlet and the liquid outlet, and the cooling medium can be used to cool the circuit board; the heat exchange portion comprises a plurality of heat exchange sub-parts connected in a bent manner, and the plurality of heat exchange sub-parts form the receiving chamber for receiving the circuit board. The liquid outlet can pass the cooling medium that has undergone heat exchange to the outside of the three-dimensional flow channel.

[0013] In some embodiments, the base has an upper surface facing the cooling plate;

[0014] The liquid inlet portion has:

[0015] a first inner surface, the first inner surface facing the receiving cavity;

[0016] a first end surface, the first end surface being connected to the first inner surface by a bending motion;

[0017] a first outer surface, wherein the first outer surface is connected to the first end surface by a bend, and the first outer surface is disposed opposite to the first inner surface;

[0018] The liquid outlet portion has:

[0019] a second inner surface, the second inner surface facing the receiving cavity;

[0020] a second end surface, the second end surface being connected to the second inner surface by a bending motion;

[0021] a second outer surface, the second outer surface being connected to the second end surface by a bend, and the second outer surface being disposed opposite to the second inner surface;

[0022] Wherein, the included angle between the first end surface and the upper surface is an acute angle; the included angle between the second end surface and the upper surface is also an acute angle.

[0023] In an embodiment of the present application, the three-dimensional flow channel provided by the present application comprises a base having an upper surface, a liquid inlet having a first inner surface, a first end surface, and a first outer surface, and a liquid outlet having a second inner surface, a second end surface, and a second outer surface. The angle between the first end surface and the upper surface is acute, allowing the cooling medium entering the cooling tank through the liquid inlet to quickly enter the heat exchange portion; and the angle between the second end surface and the upper surface is acute, allowing the cooling medium, after heat exchange in the cooling tank, to smoothly pass through the liquid outlet to the exterior of the three-dimensional flow channel.

[0024] In some embodiments, the three-dimensional flow channel further comprises:

[0025] a connector, one end of which is connected to the base and the other end of which is used to be fixed to the circuit board; and

[0026] a support plate, wherein the support plate and the cooling plate jointly define the receiving cavity;

[0027] The support plate comprises:

[0028] a first supporting portion, the first supporting portion being fixedly connected to a position of the cooling plate near the liquid inlet portion;

[0029] a second supporting portion, the second supporting portion being fixedly connected to a position of the cooling plate near the liquid outlet; and

[0030] A supporting bottom is fixedly connected to the base.

[0031] The three-dimensional flow channel provided in an embodiment of the present application further includes a connector and a support plate. One end of the connector is connected to the base, and the other end is used to fix to the circuit board, thereby realizing a fixed connection between the three-dimensional flow channel and the circuit board. When the three-dimensional flow channel is used to cool the circuit board, the support plate is used to support the circuit board. The support plate includes a first support portion, a second support portion and a support bottom, the first support portion and the second support portion realize a fixed connection between the support plate and the cooling plate, and the support bottom realizes a fixed connection between the support plate and the base.

[0032] In a second aspect, the present application provides a circuit assembly, comprising:

[0033] Three-dimensional flow channel; and

[0034] A circuit board is accommodated in the accommodating cavity of the three-dimensional flow channel, and the circuit board is fixedly connected to the three-dimensional flow channel.

[0035] The circuit assembly provided in the embodiment of the present application includes a three-dimensional flow channel and a circuit board, wherein the circuit board is accommodated in a receiving cavity of the three-dimensional flow channel. The three-dimensional flow channel is used to exchange heat with the circuit board through a cooling medium, thereby achieving cooling and heat dissipation of the circuit board.

[0036] The circuit assembly provided in the embodiment of the present application includes a circuit board and a three-dimensional flow channel, wherein the circuit board is accommodated in a receiving cavity of the three-dimensional flow channel. The three-dimensional flow channel is used to exchange heat with the circuit board through a cooling medium, thereby achieving cooling and heat dissipation of the circuit board.

[0037] In a third aspect, the present application provides a power supply module, comprising:

[0038] circuit components; and

[0039] A bearing member is fixedly connected to the base, and the bearing member has a liquid cooling groove facing the bottom surface, and the liquid cooling groove and the cooling groove jointly define a sealed cooling cavity.

[0040] The power module provided in embodiments of the present application includes a circuit assembly and a carrier. The carrier is fixedly connected to the base of the three-dimensional flow channel, thereby supporting the circuit assembly. The carrier has a liquid cooling groove facing the bottom surface. The liquid cooling groove and the cooling groove together define a sealed cooling cavity, thereby sealing the cooling groove of the three-dimensional flow channel.

[0041] In some embodiments, the carrier further comprises:

[0042] a liquid inlet, the liquid inlet being connected to the cooling cavity and being used for passing a cooling medium into the cooling cavity; and

[0043] A liquid outlet is connected to the cooling cavity and is used to pass the cooling medium that has undergone heat exchange to the outside of the carrier.

[0044] In the power module provided in an embodiment of the present application, the carrier further comprises a liquid inlet and a liquid outlet. The liquid inlet communicates with the cooling chamber, thereby allowing external cooling medium to enter the cooling chamber to cool and dissipate heat from the circuit components. The liquid outlet communicates with the cooling chamber, thereby allowing the cooling medium, which has undergone heat exchange within the cooling chamber, to pass to the exterior of the power module.

[0045] In some embodiments, the carrier further comprises:

[0046] a bottom plate, the bottom plate being spaced apart from the base;

[0047] A peripheral side plate, the peripheral side plate comprising a plurality of peripheral side sub-plates that are bent and connected in sequence, the peripheral side sub-plates being bent and connected to the periphery of the bottom plate, the plurality of peripheral side sub-plates and the bottom plate cooperating to form the liquid cooling tank, wherein one of the plurality of peripheral side sub-plates has the water inlet and the water outlet; and

[0048] An isolation plate has one end connected to one of the plurality of peripheral sub-plates and is further connected to the bottom plate to divide the liquid cooling tank into two communicating sub-liquid cooling tanks.

[0049] In the power supply module provided in an embodiment of the present application, the carrier further comprises a bottom plate, a peripheral side plate, and an isolation plate. The peripheral side plate comprises a plurality of peripheral side sub-plates that are bent and connected in sequence, and the peripheral side sub-plates are bent and connected to the periphery of the bottom plate. The plurality of peripheral side sub-plates and the bottom plate together form the liquid cooling tank, thereby accommodating the cooling medium. One of the plurality of peripheral side sub-plates has the water inlet and the water outlet, and one end of the isolation plate is connected to the one of the plurality of peripheral side sub-plates and to the bottom plate; the isolation plate divides the liquid cooling tank into two connected sub-liquid cooling tanks. When the power module is in working state, the cooling medium enters the sub-liquid cooling tank adjacent to the water inlet from the water inlet, and then enters the cooling tank from the sub-liquid cooling tank adjacent to the water inlet; the cooling medium after heat exchange enters the sub-liquid cooling tank adjacent to the water outlet from the cooling tank, and then flows out of the power module from the water outlet, thereby realizing the cooling medium circulating around the isolation plate in the cooling cavity to cool and dissipate heat to the circuit components.

[0050] In some embodiments, the power module further includes:

[0051] a sealing member, the sealing member being located between the base and the peripheral side plate; and

[0052] A fastener secures the base to the peripheral side panel.

[0053] The power module provided in an embodiment of the present application further includes a seal and a fastener. The fastener secures the base to the peripheral side plate, thereby achieving a fixed connection between the three-dimensional flow channel and the support member, further enabling the cooling groove of the three-dimensional flow channel and the liquid cooling groove of the support member to define the cooling cavity. The seal is located between the base and the peripheral side plate to seal the three-dimensional flow channel and the support member, further ensuring that the cooling cavity is a sealed cavity.

[0054] In some embodiments, the carrier further comprises:

[0055] A peripheral side wall, the peripheral side wall being arranged on the outer peripheral side of the circuit assembly and connected to the peripheral side plate;

[0056] The power module also includes:

[0057] A cover plate is located on a side of the circuit assembly facing away from the base plate, and the cover plate is connected to the peripheral side wall. The carrier and the cover plate jointly define a sealed receiving cavity, and the receiving cavity receives the circuit assembly.

[0058] In the power module provided in the embodiment of the present application, the carrier also includes a peripheral side wall, and the power module also includes a cover plate. The peripheral side wall, the peripheral side plate and the bottom plate of the carrier, together with the cover plate of the power module, define a sealed storage cavity to accommodate the circuit assembly and seal the circuit assembly, thereby isolating the circuit assembly from the outside of the power module and preventing the circuit assembly from being contaminated. The carrier and the cover plate can also isolate the circuit assembly from the outside of the power module, thereby reducing heat transfer between the power module and the outside world and improving the heat exchange efficiency of the three-dimensional water channel and the circuit assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the implementation methods or the description of the prior art. Obviously, the drawings described below are only some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0060] Figure 1 This is a schematic diagram of a three-dimensional structure of a three-dimensional flow channel according to one embodiment of the present application;

[0061] Figure 2This is a bottom-up structural schematic diagram of a three-dimensional flow channel according to one embodiment of the present application;

[0062] Figure 3 yes Figure 1 A schematic cross-sectional structure diagram of a three-dimensional flow channel along line AA is shown;

[0063] Figure 4 This is another schematic diagram of the three-dimensional structure of the three-dimensional flow channel according to one embodiment of the present application;

[0064] Figure 5 yes Figure 1 Another cross-sectional structural diagram of the three-dimensional flow channel along line AA is shown;

[0065] Figure 6 yes Figure 4 The schematic diagram of the cross-sectional structure of the three-dimensional flow channel along line BB is shown;

[0066] Figure 7 yes Figure 4 The schematic diagram of the cross-sectional structure of the three-dimensional flow channel along the CC line is shown;

[0067] Figure 8 is a schematic diagram of the three-dimensional structure of a circuit assembly according to an embodiment of the present application;

[0068] Figure 9 This is a schematic diagram of the three-dimensional structure of a circuit board according to one embodiment of the present application;

[0069] Figure 10 This is a schematic diagram of the three-dimensional structure of a power module according to one embodiment of the present application;

[0070] Figure 11 yes Figure 10 The cross-sectional structure diagram of the power module shown along line DD;

[0071] Figure 12 This is a schematic diagram of the three-dimensional structure of a power module in a separated state according to an embodiment of the present application;

[0072] Figure 13 is a schematic diagram of the three-dimensional structure of a carrier according to one embodiment of the present application;

[0073] Figure 14 yes Figure 13 The cross-sectional structure diagram of the carrier along line EE is shown;

[0074] Figure 15 yes Figure 11 The diagram shows a partial enlarged schematic diagram of the power module I.

[0075] Description of labels:

[0076] Power module 1, circuit assembly 10, carrier 20, cover 30, seal 40, fastener 50, cooling chamber 100, three-dimensional flow channel 11, cooling plate 111, receiving chamber 111a, cooling groove 111b, base 112, flow channel opening 112a, connecting hole 112b, upper surface 112c, connecting member 113, support plate 114, liquid inlet portion 1111, first inner surface 1111a, first outer surface 1111b, first end surface 1111c, heat exchange portion 1112, third inner surface 1112a, third outer surface 1112b, first transition surface 1112c, second transition surface 1112d, heat exchange sub-portion 11120, first heat exchange sub-portion 11120a, second heat exchange sub-portion 11120b, The third heat exchange sub-section 11120c, the liquid outlet portion 1113, the second inner surface 1113a, the second outer surface 1113b, the second end face 1113c, the first connecting portion 1121, the first supporting portion 1141, the supporting bottom 1142, the second supporting portion 1143, the circuit board 12, the electronic component 121, the substrate 122, the connecting hole 122a, the packaging part 123, the bottom plate 21, the peripheral side plate 22, the isolation plate 23, the peripheral side wall 24, the peripheral side sub-plate 220, the liquid cooling groove 201, the sub-liquid cooling groove 201a, the storage groove 202, the storage cavity 202a, the second connecting portion 211, the connecting blind hole 211a, the connecting groove 211b, the liquid inlet nozzle 221, the liquid inlet 221a, the liquid outlet nozzle 222, the liquid outlet 222a. DETAILED DESCRIPTION

[0077] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0078] The terms "first," "second," and the like in the specification, claims, and drawings of this application are used to distinguish between different objects rather than to describe a specific order. In addition, the terms "include," "include," and "have," and any variations thereof, are intended to cover non-exclusive inclusions.

[0079] References herein to "embodiments" or "implementations" mean that a particular feature, structure, or characteristic described in connection with the embodiment or implementation may be included in at least one implementation of the present application. The appearance of such phrases in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0080] See also Figure 1 、 Figure 2 and Figure 3 , Figure 1 This is a schematic diagram of a three-dimensional structure of a three-dimensional flow channel according to one embodiment of the present application; Figure 2 This is a bottom-up structural schematic diagram of a three-dimensional flow channel according to one embodiment of the present application; Figure 3 yes Figure 1 A schematic diagram of a cross-sectional structure of a three-dimensional flow channel along line AA is shown. One embodiment of the present application provides a three-dimensional flow channel 11, and the three-dimensional flow channel 11 includes a cooling plate 111 and a base 112. The cooling plate 111 has a receiving cavity 111a, and the receiving cavity 111a is used to receive a circuit board. The cooling plate 111 has a cooling groove 111b, and the cooling groove 111b is used to exchange heat with the circuit board 12 through a cooling medium. The base 112 is connected to the cooling plate 111, and the base 112 has a flow channel opening 112a and a connecting hole 112b, and the flow channel opening 112a connects the cooling groove 111b and the outside world, and the connecting hole 112b is used to cooperate with a fixing member to connect the three-dimensional flow channel 11 to a carrier.

[0081] It is understandable that the embodiment of the present application is illustrated and explained by taking the three-dimensional flow channel 11 as an example of a water-cooled heat dissipation device. In other words, the cooling medium of the three-dimensional flow channel 11 is water. It is understandable that in other embodiments, the cooling medium of the three-dimensional flow channel 11 can also be oil, gas, etc. The embodiment of the present application does not limit the cooling medium in the three-dimensional flow channel 11. It is understandable that the receiving cavity 111a of the three-dimensional flow channel 11 is used to receive the circuit board 12, and the three-dimensional flow channel 11 is used to cool and dissipate heat from the circuit board 12. Among them, the three-dimensional flow channel 11 can be used in power supply devices of new energy vehicles, buses, trains, airplanes, ships and submarines, and can also be used in portable power supply devices, fixed power stations and stationary generator devices to dissipate heat for the charger of the power supply device or the circuit components in the voltage conversion device. The above are examples of application scenarios of the three-dimensional flow channel 11 provided in the present application, and should not be understood as limitations on the application scenarios of the three-dimensional flow channel 11 provided in the embodiment of the present application.

[0082] The base 112 is connected to the cooling plate 111, and the cooling plate 111 has a cooling groove 111b, and the cooling groove 111b is used to exchange heat with the circuit board 12 through a cooling medium. Optionally, the cooling plate 111 and the base 112 are integrally formed to reduce production costs. In an optional embodiment, the cooling plate 111 is connected to the base 112 vertically or approximately vertically, and the base 112 has a surface facing the receiving cavity 111a. The base 112 is connected to the cooling plate 111, and the base 112 and the cooling plate 111 jointly define the receiving cavity 111a. When the three-dimensional flow channel 11 is used to cool and dissipate heat for the circuit board 12, the cooling plate 111 is close to the three sides of the circuit board 12 to exchange heat with the circuit board 12. The above is an example of the structure of the cooling plate 111 provided in the present application, and should not be understood as a limitation on the structure of the cooling plate 111 provided in the embodiment of the present application.

[0083] The cooling plate 111 has a cooling groove 111b, and the cooling groove 111b is used to exchange heat with the circuit board 12 through a cooling medium. The base 112 has a flow channel 112a corresponding to the cooling groove 111b, and the flow channel 112a connects the cooling groove 111b and the outside. Optionally, the projection of the cooling groove 111b on the base 112 and the projection of the flow channel 112a on the base 112 are the same or similar. It can be understood that when the three-dimensional flow channel 11 is used to cool and dissipate heat for the circuit board 12, the cooling medium enters the cooling groove 111b from the flow channel 112a, and exchanges heat with the circuit board 12 accommodated in the accommodation cavity 111a in the cooling groove 111b. The cooling medium that has undergone heat exchange flows from the cooling groove 111b through the flow channel 112a to the outside of the three-dimensional flow channel 11.

[0084] In an optional embodiment, the base 112 is a rectangular plate or a substantially rectangular plate, and has a connection hole 112b located in a portion of the base 112 away from the receiving cavity 111a. The connection hole 112b is used to pass a fixing member through the fixing member to connect the three-dimensional flow channel 11 and the supporting member, thereby supporting the three-dimensional flow channel 11 and sealing the cooling groove 111b. The fixing member may be, but is not limited to, a screw, a screw and a nut, or other fastening components.

[0085] In summary, the three-dimensional flow channel 11 provided in the embodiments of the present application includes a cooling plate 111 and a base 112. The cooling plate 111 has a receiving cavity 111a, which can accommodate the circuit board 12 to cool and dissipate heat from the circuit board 12; the cooling plate 111 has a cooling groove 111b, which is used to pass a cooling medium, thereby achieving heat exchange between the cooling medium and the circuit board 12. The base 112 is connected to the cooling plate 111 and is used to provide support for the circuit board 12; the base 112 has a connecting hole 112b, and the connecting hole 112b is used to cooperate with the fixing part to realize the connection between the three-dimensional flow channel 11 and the carrier, thereby further avoiding the die-casting shrinkage cavity generated by the integral die-casting of the three-dimensional flow channel 11 and the carrier in the related technology, which affects the production quality and cooling efficiency of the flow channel; the base 112 has a flow channel opening 112a corresponding to the cooling groove 111b, and the flow channel opening 112a connects the cooling groove 111b and the outside world. The flow channel opening 112a can be used to pass the cooling medium outside the three-dimensional flow channel 11 to the cooling groove 111b, and to pass the cooling medium that has undergone heat exchange in the cooling groove 111b to the outside of the three-dimensional flow channel 11.

[0086] Please refer again Figure 2 Also see Figure 4 、 Figure 5 and Figure 6 , Figure 4 This is another schematic diagram of the three-dimensional structure of the three-dimensional flow channel according to one embodiment of the present application; Figure 5 yes Figure 1 Another cross-sectional structural diagram of the three-dimensional flow channel along line AA is shown; Figure 6 yes Figure 4 The schematic diagram of the cross-sectional structure of the three-dimensional flow channel along line BB is shown. Furthermore, in one embodiment, the cooling plate 111 includes a liquid inlet 1111, a heat exchange portion 1112, and a liquid outlet 1113. The liquid inlet 1111 is connected to the cooling tank 111b; one end of the heat exchange portion 1112 is connected to the liquid inlet 1111, and the heat exchange portion 1112 includes a plurality of heat exchange sub-portions 11120 connected in a bent manner, and the plurality of heat exchange sub-portions 11120 form the receiving chamber 111a; the liquid outlet 1113 is connected to the other end of the heat exchange portion 1112.

[0087] In an optional embodiment, the heat exchange portion 1112 includes a first heat exchange sub-portion 11120a, a second heat exchange sub-portion 11120b, and a third heat exchange sub-portion 11120c. One end of the first heat exchange sub-portion 11120a is connected to the liquid inlet portion 1111, and the other end is connected to one end of the second heat exchange sub-portion 11120b in a bent manner. The other end of the second heat exchange sub-portion 11120b is connected to one end of the third heat exchange sub-portion 11120c in a bent manner, and the other end of the third heat exchange sub-portion 11120c is connected to the liquid outlet portion 1113. The above is an example of the structure of the heat exchange portion 1112 provided in the present application and should not be understood as limiting the structure of the heat exchange portion 1112 provided in the embodiments of the present application.

[0088] When the three-dimensional flow channel 11 is used to cool and dissipate heat from the circuit board 12, the cooling medium enters the cooling groove 111b corresponding to the liquid inlet portion 1111 from the flow channel opening 112a, passes through the cooling groove 111b corresponding to the first heat exchange sub-section 11120a, the cooling groove 111b corresponding to the second heat exchange sub-section 11120b, and the cooling groove 111b corresponding to the third heat exchange sub-section 11120c, exchanges heat with the circuit board 12 in the receiving cavity 111a, and then passes through the cooling groove 111b corresponding to the liquid outlet portion 1113 and the flow channel opening 112a to the outside of the three-dimensional flow channel 11. The above is an example of the structure of the cooling plate 111 provided in the present application and should not be understood as limiting the structure of the cooling plate 111 provided in the embodiments of the present application.

[0089] In summary, the three-dimensional flow channel 11 provided in the embodiment of the present application, the cooling plate 111 includes a liquid inlet 1111, a heat exchange portion 1112 and a liquid outlet 1113. The liquid inlet 1111 can realize the passage of the cooling medium outside the three-dimensional flow channel 11 into the cooling groove 111b inside the cooling plate 111. The two ends of the heat exchange portion 1112 are respectively connected to the liquid inlet 1111 and the liquid outlet 1113, and can realize the passage of the cooling medium for cooling the circuit board 12; the heat exchange portion 1112 includes a plurality of heat exchange sub-portions 11120 connected in a bent manner, and the plurality of heat exchange sub-portions 11120 form the accommodating cavity 111a for accommodating the circuit board 12. The liquid outlet 1113 can realize the passage of the cooling medium that has undergone heat exchange to the outside of the three-dimensional flow channel 11.

[0090] Please refer again Figure 1 、 Figure 4 、 Figure 5 and Figure 6 , and see Figure 7 , Figure 7 yes Figure 4The schematic cross-sectional structure diagram of the three-dimensional flow channel along line CC is shown. Furthermore, in some embodiments, the base 112 has an upper surface 112c facing the cooling plate 111; the liquid inlet portion 1111 has a first inner surface 1111a, a first end surface 1111c, and a first outer surface 1111b, wherein the first inner surface 1111a faces the receiving cavity 111a, the first end surface 1111c is connected to the first inner surface 1111a by a bend, the first outer surface 1111b is connected to the first end surface 1111c by a bend, and the first outer surface 1111b is disposed opposite to the first inner surface 1111a. The liquid outlet portion 1113 has a second inner surface 1113a, a second end surface 1113c, and a second outer surface 1113b. The second inner surface 1113a faces the receiving cavity 111a, the second end surface 1113c is connected to the second inner surface 1113a by a bend, and the second outer surface 1113b is connected to the second end surface 1113c by a bend, with the second outer surface 1113b and the second inner surface 1113a facing away from each other. The angle between the first end surface 1111c and the upper surface 112c is acute, and the angle between the second end surface 1113c and the upper surface 112c is also acute.

[0091] In an optional embodiment, the heat exchange portion 1112 has a third inner surface 1112a facing the receiving cavity 111a and a third outer surface 1112b facing away from the receiving cavity 111a. The heat exchange portion 1112 further has a first transition surface 1112c, which is bent and connected to the third inner surface 1112a and the third outer surface 1112b, respectively. The first transition surface 1112c is also bent and connected to the first end surface 1111c, and the angle between the first transition surface 1112c and the first end surface 1111c is an obtuse angle. The heat exchange portion 1112 also has a second transition surface 1112d, which is respectively connected to the third inner surface 1112a and the third outer surface 1112b by bending, and the second transition surface 1112d is also connected to the second end surface 1113c by bending, and the angle between the second transition surface 1112d and the second end surface 1113c is an obtuse angle.

[0092] In summary, the three-dimensional flow channel provided in the embodiment of the present application comprises: the base 112 having an upper surface 112c; the liquid inlet 1111 having a first inner surface 1111a, a first end surface 1111c, and a first outer surface 1111b; and the liquid outlet 1113 having a second inner surface 1113a, a second end surface 1113c, and a second outer surface 1113b. The angle between the first end surface 1111c and the upper surface 112c is acute, allowing the cooling medium entering the cooling tank from the liquid inlet 1111 to quickly enter the heat exchange portion 1112; and the angle between the second end surface 1113c and the upper surface 112c is acute, allowing the cooling medium that has undergone heat exchange in the cooling tank to smoothly pass through the liquid outlet 1113 to the outside of the three-dimensional flow channel 11.

[0093] Please refer again Figure 4 and Figure 5 . Furthermore, in one embodiment, the three-dimensional flow channel 11 also includes a connecting member 113 and a support plate 114. One end of the connecting member 113 is connected to the base 112, and the other end is used to be fixed to the circuit board 12; the support plate 114 and the cooling plate 111 jointly define the accommodating cavity 111a. Wherein, the support plate 114 includes a first support portion 1141, a second support portion 1143 and a support bottom 1142. The first support portion 1141 is fixedly connected to the position of the cooling plate 111 near the liquid inlet portion 1111; the second support portion 1143 is fixedly connected to the position of the cooling plate 111 near the liquid outlet portion 1113; the support bottom 1142 is fixedly connected to the base 112.

[0094] In an optional embodiment, the heat exchange portion 1112 includes a first heat exchange sub-section 11120a, a second heat exchange sub-section 11120b, and a third heat exchange sub-section 11120c. One end of the first heat exchange sub-section 11120a is connected to the liquid inlet portion 1111, and the other end is connected to one end of the second heat exchange sub-section 11120b in a bent manner. The other end of the second heat exchange sub-section 11120b is connected to one end of the third heat exchange sub-section 11120c in a bent manner, and the other end of the third heat exchange sub-section 11120c is connected to the liquid outlet portion 1113. The first heat exchange sub-section 11120a is arranged parallel to the third heat exchange sub-section 11120c, and the support plate 114 is arranged parallel to the second heat exchange sub-section 11120b. When the three-dimensional flow channel 11 is used to cool and dissipate heat for the circuit board 12, the support plate 114, the heat exchange part 1112, and the base 112 jointly define the accommodating cavity 111a; optionally, the support plate 114, the heat exchange part 1112 and the base 112 are arranged in contact with or close to the circuit board 12 to improve the heat exchange efficiency of the three-dimensional flow channel 11 and the circuit board 12, thereby enhancing the cooling effect of the three-dimensional flow channel 11.

[0095] In an optional embodiment, the connecting member 113 is a connecting column arranged perpendicular to the base 112; optionally, the connecting member 113 is arranged in contact with or close to the cooling plate 111; optionally, the connecting member 113 is arranged in contact with or close to the support plate 114. It is understandable that the connecting member 113 can be in contact with or close to the surface of the cooling plate 111 facing the receiving cavity 111a, and can also be in contact with or close to the surface of the cooling plate 111 facing away from the receiving cavity 111a; it is understandable that the connecting member 113 can be in contact with or close to the surface of the support plate 114 facing the receiving cavity 111a, and can also be in contact with or close to the surface of the support plate 114 facing away from the receiving cavity 111a. Optionally, the connecting member 113 has a first height in a direction perpendicular to the base 112, and the cooling plate 111 has a second height in a direction perpendicular to the base 112, the first height is greater than the second height, and the portion of the connecting member 113 that is higher than the cooling plate 111 is used to pass through the circuit board 12, thereby achieving fixation with the circuit board 12.

[0096] It can be understood that the number of the connecting parts 113 can be one or more. In an optional embodiment, the heat exchange section 1112 includes a first heat exchange sub-section 11120a, a second heat exchange sub-section 11120b and a third heat exchange sub-section 11120c that are bent and connected to each other, the first heat exchange sub-section 11120a is parallel to the third heat exchange sub-section 11120c, and the support plate 114 is parallel to the second heat exchange sub-section 11120b; and the three-dimensional flow channel 11 includes 6 connecting parts 113. Among them, four connecting members 113 are disposed within the receiving cavity 111a and are respectively disposed corresponding to the connection between the first heat exchange sub-section 11120a and the second heat exchange sub-section 11120b, the connection between the second heat exchange sub-section 11120b and the third heat exchange sub-section 11120c, the connection between the first heat exchange sub-section 11120a and the support plate 114, and the connection between the third heat exchange sub-section 11120c and the support plate 114. Among them, two connecting members 113 are disposed outside the receiving cavity 111a and are respectively disposed in contact with the middle position of the second heat exchange sub-section 11120b and the middle position of the support plate 114.

[0097] In summary, the three-dimensional flow channel 11 provided in the embodiment of the present application further includes a connector 113 and a support plate 114. One end of the connector 113 is connected to the base 112, and the other end is used to be fixed to the circuit board 12, thereby realizing a fixed connection between the three-dimensional flow channel 11 and the circuit board 12. When the three-dimensional flow channel 11 is used to cool the circuit board, the support plate 114 is used to support the circuit board. The support plate 114 includes a first support portion 1141, a second support portion 1143 and a support bottom 1142. The first support portion 1141 and the second support portion 1143 realize a fixed connection between the support plate 114 and the cooling plate 111, and the support bottom 1142 realizes a fixed connection between the support plate 114 and the base 112.

[0098] Please refer again Figure 4 , and see Figure 8 and Figure 9 , Figure 8 is a schematic diagram of the three-dimensional structure of a circuit assembly according to an embodiment of the present application; Figure 9 Schematic diagram of a three-dimensional structure of a circuit board according to one embodiment of the present application. One embodiment of the present application provides a circuit assembly 10, comprising a three-dimensional flow channel 11 and a circuit board 12. The circuit board 12 is received in a receiving cavity 111a of the three-dimensional flow channel 11.

[0099] In one possible embodiment, the circuit board 12 includes an electronic component 121 and a substrate 122; the electronic component 121 is electrically connected to the substrate 122, and the electronic component 121 is accommodated in the accommodating cavity 111a to exchange heat with the cooling plate 111 of the three-dimensional flow channel 11, so as to achieve temperature control of the electronic component 121. The substrate 122 is also connected to the three-dimensional flow channel 11, thereby achieving a fixed connection between the three-dimensional flow channel 11 and the circuit board 12. Optionally, the cooling plate 111 and the support plate 114 of the three-dimensional flow channel 11 are configured to correspond to the shape and size of the electronic component 121, and the cooling plate 111, the support plate 114 and the base 112 are attached to or close to the electronic component 121, thereby improving the heat exchange efficiency of the three-dimensional flow channel 11.

[0100] It can be understood that the end of the connector 113 of the three-dimensional flow channel 11 facing away from the base 112 is connected to the substrate 122 to achieve the connection and fixation between the circuit board 12 and the three-dimensional flow channel 11. Optionally, the substrate 122 has a connection hole 122a, and the number of the connection holes 122a can be one or more. The position, shape and size of the connection holes 122a correspond to the connector 113 of the three-dimensional flow channel 11; the end of the connector 113 facing away from the base 112 passes through the connection hole 122a from the substrate 122 toward the end of the electronic component 121, thereby achieving the connection between the circuit board 12 and the three-dimensional flow channel 11. Optionally, the connector 113 and the substrate 122 are welded to achieve the connection between the circuit board 12 and the three-dimensional flow channel 11. The welding method can be, but is not limited to, selective soldering or reflow soldering. Optionally, the connecting member 113 and the base plate 122 are fixed by screws or snaps, thereby achieving the connection between the circuit board 12 and the three-dimensional flow channel 11.

[0101] In an optional embodiment, the circuit board 12 further includes a package 123, which is attached to the side of the substrate 122 facing the three-dimensional flow channel and is arranged corresponding to the third outer surface 1112b. One side of the package 123 is electrically connected to the substrate 122, and the other side faces the third outer surface 1112b. It is understandable that the number of the packages 123 can be one or more. In an optional embodiment, the circuit assembly 10 further includes an insulating member, which is located between the package 123 and the third outer surface 1112b; the insulating member can achieve insulation between the circuit board 12 and the three-dimensional flow channel 11. Optionally, the insulating member is a ceramic insulating sheet. It is understandable that the number of the insulating members can be one or more.

[0102] In summary, the circuit assembly 10 provided in the embodiment of the present application includes a three-dimensional flow channel 11 and a circuit board 12, wherein the circuit board 12 is accommodated in the receiving cavity 111a of the three-dimensional flow channel 11. The three-dimensional flow channel 11 is used to exchange heat with the circuit board 12 through a cooling medium, thereby achieving cooling and heat dissipation of the circuit board 12.

[0103] Please refer again Figure 4 and Figure 8 , and see Figure 10 、 Figure 11 and Figure 12 , Figure 10 This is a schematic diagram of the three-dimensional structure of a power module according to one embodiment of the present application; Figure 11 yes Figure 10 The cross-sectional structure diagram of the power module shown along line DD; Figure 12 FIG2 is a schematic diagram of a three-dimensional structure of a power module 1 in a separated state according to one embodiment of the present application. The present application provides a power module 1, comprising a circuit assembly 10 and a carrier 20. The carrier 20 is fixedly connected to the base 112 and has a liquid cooling groove 201 facing the bottom surface. The liquid cooling groove 201 and the cooling groove 111b together define a sealed cooling chamber 100.

[0104] In one possible embodiment, the base 112 of the three-dimensional flow channel 11 includes a first connecting portion 1121, the first connecting portion 1121 is located at the portion of the base 112 away from the accommodating cavity 111a, the connecting hole 112b is provided in the first connecting portion 1121, and the carrier 20 has a second connecting portion 211, and the second connecting portion 211 is provided corresponding to the first connecting portion 1121. The second connecting portion 211 is sealedly connected to the first connecting portion 1121, so that the liquid cooling tank 201 and the cooling tank 111b jointly define a sealed cooling cavity 100. The sealed connection can be, but is not limited to, welding or screw connection. The welding can be, but is not limited to, reflow soldering or rotary friction welding. The above is an example of the connection method of the circuit assembly 10 and the carrier 20 in the embodiment of the present application, and should not be understood as a limitation of the connection method in the embodiment of the present application.

[0105] In summary, the power module 1 provided in the embodiments of the present application includes a circuit assembly 10 and a carrier 20. The carrier 20 is fixedly connected to the base 112 of the three-dimensional flow channel 11, thereby supporting the circuit assembly 10. The carrier 20 has a liquid cooling groove 201 facing the bottom surface. The liquid cooling groove 201 and the cooling groove 111b together define a sealed cooling cavity 100, thereby sealing the cooling groove 111b of the three-dimensional flow channel 11.

[0106] Please refer again Figure 10 、 Figure 11 and Figure 12 , and see Figure 13 and Figure 14 , Figure 13 is a schematic diagram of the three-dimensional structure of a carrier according to one embodiment of the present application; Figure 14 yes Figure 13 The cross-sectional structure of the support member along line EE is shown. Furthermore, in one embodiment, the support member 20 further comprises a liquid inlet 221a and a liquid outlet 222a. The liquid inlet 221a connects the cooling chamber 100 with the outside world, allowing the cooling medium to pass through the cooling chamber 100. The liquid outlet 222a connects the cooling chamber 100 with the outside world, allowing the cooling medium to pass through the heat exchange process to the exterior of the support member 20.

[0107] Optionally, the liquid inlet 221a is disposed on the carrier 20 near the liquid inlet portion 1111, and the liquid inlet 221a is disposed on the carrier 20 near the liquid outlet portion 1113. When a cooling medium passes through the three-dimensional flow channel 11 of the power module 1 to cool the circuit board 12 of the power module 1, the cooling medium enters the cooling cavity 100 through the liquid inlet 221a, and enters the cooling groove 111b corresponding to the heat exchange portion 1112 of the three-dimensional flow channel 11 through the liquid inlet 1111 of the three-dimensional flow channel 11; the cooling medium that exchanges heat with the circuit board 12 in the cooling groove 111b flows through the liquid outlet portion 1113 and flows to the outside of the power module 1 through the liquid outlet 222a.

[0108] In an optional embodiment, the carrier 20 further includes a liquid inlet nozzle 221, which is provided corresponding to the liquid inlet 221a and is located on a side of the carrier 20 facing away from the liquid cooling tank 201 and connected to the carrier 20. The carrier 20 further includes a liquid outlet nozzle 222, which is provided corresponding to the liquid outlet 222a and is located on a side of the carrier 20 facing away from the liquid cooling tank 201 and connected to the carrier 20. The liquid inlet nozzle 221 and the liquid outlet nozzle 222 are used to connect to a cooling medium circulation device outside the power module 1 to assist in the circulation of the cooling medium within the cooling chamber 100 of the power module 1.

[0109] In summary, in the power module 1 provided in the embodiments of the present application, the carrier 20 further comprises a liquid inlet 221a and a liquid outlet 222a. The liquid inlet 221a communicates with the cooling chamber 100, thereby allowing external cooling medium to pass into the cooling chamber 100 to cool and dissipate heat from the circuit assembly 10. The liquid outlet 222a communicates with the cooling chamber 100, thereby allowing the cooling medium, which has undergone heat exchange within the cooling chamber 100, to pass to the exterior of the power module 1.

[0110] Please refer again Figure 11 、 Figure 12 、 Figure 13 and Figure 14 . Furthermore, in one embodiment, the carrier 20 also includes a bottom plate 21, a circumferential side plate 22 and an isolation plate 23. The bottom plate 21 is spaced apart from the base 112; the circumferential side plate 22, the circumferential side plate 22 includes a plurality of circumferential side sub-plates 220 that are bent and connected in sequence, the circumferential side sub-plates 220 are bent and connected to the periphery of the bottom plate 21, and the plurality of circumferential side sub-plates 220 cooperate with the bottom plate 21 to form the liquid cooling tank 201, wherein one of the plurality of circumferential side sub-plates 220 has the water inlet and the water outlet; the isolation plate 23, one end of the isolation plate 23 is connected to the one of the plurality of circumferential side sub-plates 220, and the isolation plate 23 is also connected to the bottom plate 21 to divide the liquid cooling tank 201 into two connected sub-liquid cooling tanks 201a.

[0111] In an optional embodiment, the bottom plate 21 is rectangular or approximately rectangular, and the peripheral side plate 22 includes four circumferential side sub-plates 220 that are bent and connected in sequence, corresponding to the four sides of the rectangle. It is understood that the water inlet and outlet are located on the peripheral side sub-plates 220 near the water inlet and outlet of the three-dimensional flow channel 11. The above is an example of the structure of the carrier 20 in the embodiment of the present application and should not be construed as limiting the structure of the carrier 20 in the embodiment of the present application.

[0112] When the three-dimensional flow channel 11 of the power module 1 passes through the cooling medium to cool the circuit board 12 of the power module 1, the cooling medium enters the sub-liquid cooling tank 201a near the liquid inlet 221a from the liquid inlet 221a, and enters the cooling tank 111b corresponding to the heat exchange part 1112 of the three-dimensional flow channel 11 from the liquid inlet part 1111 of the three-dimensional flow channel 11; the cooling medium after heat exchange flows through the liquid outlet part 1113 and the sub-liquid cooling tank 201a near the liquid outlet 222a, and passes through the liquid outlet 222a to the outside of the power module 1.

[0113] In summary, the power module 1 provided in the embodiment of the present application, the carrier 20 further includes a bottom plate 21, a circumferential side plate 22 and an isolation plate 23. The circumferential side plate 22 includes a plurality of circumferential side sub-plates 220 that are bent and connected in sequence, and the circumferential side sub-plates 220 are bent and connected to the periphery of the bottom plate 21. The plurality of circumferential side sub-plates 220 and the bottom plate 21 together form the liquid cooling tank 201, thereby achieving the accommodation of the cooling medium. One of the plurality of circumferential side sub-plates 220 has the water inlet and the water outlet, and one end of the isolation plate 23 is connected to the one of the plurality of circumferential side sub-plates 220 and the bottom plate 21; the isolation plate 23 divides the liquid cooling tank 201 into two connected sub-liquid cooling tanks 201a. When the power module 1 is in working state, the cooling medium enters the sub-liquid cooling tank 201a adjacent to the water inlet from the water inlet, and then enters the cooling tank 111b from the sub-liquid cooling tank 201a adjacent to the water inlet; the cooling medium after heat exchange enters the sub-liquid cooling tank 201a adjacent to the water outlet from the cooling tank 111b, and then flows out of the power module 1 from the water outlet, thereby realizing the cooling medium circulating around the isolation plate 23 in the cooling cavity 100 to cool and dissipate heat to the circuit component 10.

[0114] Please refer again Figure 11 and Figure 13 , and see Figure 15 , Figure 15 yes Figure 11 FIG2 is a partial enlarged schematic diagram of a power module 1. Furthermore, in one embodiment, the power module 1 further includes a seal 40 and a fastener 50. The seal 40 is located between the base 112 and the peripheral side plate 22, and the fastener 50 secures the base 112 to the peripheral side plate 22.

[0115] In an optional embodiment, the base 112 of the three-dimensional flow channel 11 includes a first connecting portion 1121, located in a portion of the base 112 facing away from the receiving cavity 111a. The connecting hole 112b is located in the first connecting portion 1121. The carrier 20 includes a second connecting portion 211, corresponding to the first connecting portion 1121. The second connecting portion 211 has a connecting groove 211b facing the first connecting portion 1121. The sealing member 40 is disposed within the connecting groove 211b to achieve a sealed connection between the circuit assembly 10 and the carrier 20, thereby further sealing the cooling cavity 100. Optionally, the sealing member 40 is a silicone sealing ring; alternatively, the sealing member 40 is a rubber sealing ring. The above is an example of the sealing member 40 in the embodiment of the present application and should not be construed as limiting the sealing member 40 in the embodiment of the present application. The sealing member 40 may also be other elastically deformable sealing components.

[0116] It is understood that the second connection portion 211 has at least one blind connection hole 211a corresponding to the connection hole 112b. The fastener 50 is sequentially inserted into the connection hole 112b and the blind connection hole 211a to achieve a sealed connection between the circuit assembly 10 and the carrier 20. The fastener 50 may be, but is not limited to, a screw, a bolt, or other fastening component. It is understood that the component composition of the fastener 50 should not limit the power module 1 provided in this embodiment. The number of fasteners 50 can be one or more.

[0117] In summary, the power module 1 provided in the embodiments of the present application further includes a seal 40 and a fastener 50. The fastener 50 secures the base 112 to the peripheral side plate 22, thereby achieving a fixed connection between the three-dimensional flow channel 11 and the carrier 20, thereby further enabling the cooling groove 111b of the three-dimensional flow channel 11 and the liquid cooling groove 201 of the carrier 20 to define the cooling cavity 100. The seal 40 is located between the base 112 and the peripheral side plate 22 to seal the three-dimensional flow channel 11 and the carrier 20, thereby further ensuring that the cooling cavity 100 is a sealed cavity.

[0118] Please refer again Figure 11 、 Figure 12 、 Figure 13 and Figure 14Furthermore, in one embodiment, the carrier 20 further includes a peripheral sidewall 24, and the power module 1 further includes a cover plate 30. The peripheral sidewall 24 is disposed on the outer periphery of the circuit assembly 10 and is connected to the peripheral side plate 22; the cover plate 30 is located on the side of the circuit assembly 10 facing away from the bottom plate 21 and is connected to the peripheral sidewall 24. The carrier 20 and the cover plate 30 jointly define a sealed storage cavity 202a, which accommodates the circuit assembly 10.

[0119] Optionally, the peripheral sidewalls 24, the peripheral side panels 22, the isolation panel 23, and the bottom panel 21 are integrally formed. It is understood that the peripheral sidewalls 24, the peripheral side panels 22, and the bottom panel 21 collectively define an open receiving slot 202, which accommodates the circuit assembly 10. It is understood that the cover plate 30 seals the receiving slot 202, forming the sealed receiving cavity 202a. It is understood that the cover plate 30 is sealed to the peripheral sidewalls 24.

[0120] In summary, the power module 1 provided in the embodiment of the present application comprises the carrier 20 further comprising a peripheral side wall 24, and the power module 1 further comprising a cover plate 30. The peripheral side wall 24, the peripheral side plate 22, and the bottom plate 21 of the carrier 20, together with the cover plate 30 of the power module 1, define a sealed storage chamber 202a, thereby accommodating the circuit assembly 10 and sealing the circuit assembly 10, thereby isolating the circuit assembly 10 from the outside of the power module 1. The carrier 20 and the cover plate 30 can also isolate the circuit assembly 10 from the outside of the power module 1, thereby reducing heat transfer between the power module 1 and the outside world and improving the heat exchange efficiency of the three-dimensional water channel and the circuit assembly 10.

[0121] References to "embodiments" and "implementations" in this application mean that the specific features, structures, or characteristics described in conjunction with the implementations may be included in at least one implementation of the present application. The appearance of the phrases in various places in the specification does not necessarily refer to the same implementation, nor does it refer to independent or alternative implementations that are mutually exclusive with other implementations. It is explicitly and implicitly understood by those skilled in the art that the implementations described in the present invention can be combined with other implementations. In addition, it should be understood that the features, structures, or characteristics described in the various implementations of the present application can be arbitrarily combined to form another implementation without departing from the spirit and scope of the technical solution of the present invention, provided that there is no contradiction between them.

[0122] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model and are not limiting. Although the utility model has been described in detail with reference to the above preferred embodiments, ordinary technicians in this field should understand that the technical solution of this application can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model.

Claims

1. A three-dimensional flow channel, characterized in that: The three-dimensional flow channel includes: A cooling plate, the cooling plate having a receiving cavity for receiving a circuit board, the cooling plate having a cooling groove for exchanging heat with the circuit board via a cooling medium; and The base is connected to the cooling plate, and the base has a flow channel opening and a connecting hole. The flow channel opening connects the cooling tank and the outside world, and the connecting hole is used to cooperate with a fixing part to connect the three-dimensional flow channel to the supporting part.

2. The three-dimensional flow channel according to claim 1, characterized in that: The cooling plate comprises: a liquid inlet portion, the liquid inlet portion being connected to the cooling tank; a heat exchange portion, one end of which is in communication with the liquid inlet portion, and comprising a plurality of heat exchange sub-portions connected in a bent manner, wherein the plurality of heat exchange sub-portions form the receiving cavity; and A liquid outlet portion is communicated with the other end of the heat exchange portion.

3. The three-dimensional flow channel according to claim 2, characterized in that: The base has an upper surface facing the cooling plate; The liquid inlet portion has: a first inner surface, the first inner surface facing the receiving cavity; a first end surface, the first end surface being connected to the first inner surface by a bending motion; and a first outer surface, wherein the first outer surface is connected to the first end surface by a bend, and the first outer surface is disposed opposite to the first inner surface; The liquid outlet portion has: a second inner surface, the second inner surface facing the receiving cavity; a second end surface, the second end surface being connected to the second inner surface by a bending motion; and a second outer surface, the second outer surface being connected to the second end surface by a bend, and the second outer surface being disposed opposite to the second inner surface; Wherein, the included angle between the first end surface and the upper surface is an acute angle; the included angle between the second end surface and the upper surface is also an acute angle.

4. The three-dimensional flow channel according to claim 2, characterized in that: The three-dimensional flow channel also includes: a connector, one end of which is connected to the base and the other end of which is used to be fixed to the circuit board; and a support plate, wherein the support plate and the cooling plate jointly define the receiving cavity; The support plate comprises: a first supporting portion, the first supporting portion being fixedly connected to a position of the cooling plate near the liquid inlet portion; a second supporting portion, the second supporting portion being fixedly connected to a position of the cooling plate near the liquid outlet; and A supporting bottom is fixedly connected to the base.

5. A circuit assembly, characterized in that: The circuit assembly comprises: The three-dimensional flow channel according to any one of claims 1 to 4; and A circuit board is accommodated in the accommodating cavity of the three-dimensional flow channel, and the circuit board is fixedly connected to the three-dimensional flow channel.

6. A power supply module, characterized in that: The power module includes: The circuit assembly according to claim 5; and A bearing member is fixedly connected to the base, the bearing member has a liquid cooling groove, the opening of the liquid cooling groove faces the base, and the liquid cooling groove and the cooling groove jointly define a sealed cooling cavity.

7. The power module according to claim 6, wherein: The carrier also has: a liquid inlet, the liquid inlet being connected to the cooling cavity and being used for passing a cooling medium into the cooling cavity; and A liquid outlet is connected to the cooling cavity and is used to pass the cooling medium that has undergone heat exchange to the outside of the carrier.

8. The power module according to claim 7, wherein: The carrier also includes: a bottom plate, the bottom plate being spaced apart from the base; A peripheral side plate, the peripheral side plate comprising a plurality of peripheral side sub-plates that are bent and connected in sequence, the peripheral side sub-plates being bent and connected to the periphery of the bottom plate, the plurality of peripheral side sub-plates and the bottom plate cooperating to form the liquid cooling tank, wherein one of the plurality of peripheral side sub-plates has the liquid inlet and the liquid outlet; and An isolation plate has one end connected to one of the plurality of peripheral sub-plates and is further connected to the bottom plate to divide the liquid cooling tank into two communicating sub-liquid cooling tanks.

9. The power module according to claim 8, wherein: The power module further includes: a sealing member, the sealing member being located between the base and the peripheral side plate; and A fastener passes through the connection hole to fix the base to the peripheral side plate.

10. The power module according to claim 9, wherein: The carrier also includes: A peripheral side wall, the peripheral side wall being arranged on the outer peripheral side of the circuit assembly and connected to the peripheral side plate; The power module also includes: A cover plate is located on a side of the circuit assembly facing away from the base plate, and the cover plate is connected to the peripheral side wall. The carrier and the cover plate jointly define a sealed receiving cavity, and the receiving cavity receives the circuit assembly.

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