Wafer-based transmission and transfer device

Abstract

The utility model discloses a transmission and transfer device based on wafers. The transmission and transfer device comprises a bearing assembly, a correction assembly, a transmission assembly and a loading assembly. The correction assembly comprises a detection camera, a positioning table and a first rotating mechanism, the wafer is transferred to the positioning table to be borne through the transmission assembly, the detection camera is used for shooting the borne wafer, and then the first rotating mechanism located below the positioning table rotates to achieve centering operation on the borne wafer; the transmission assembly comprises a second rotating mechanism located at the bottom, a horizontal displacement mechanism in the horizontal direction and a bearing fork, the bearing fork is used for bearing the bottoms of the wafers, meanwhile, the horizontal displacement mechanism achieves movement of the bearing fork bearing the wafers in the horizontal direction, and the second rotating mechanism achieves overall rotation of the horizontal displacement mechanism. The correction assembly, the transmission assembly and the loading assembly adopted by the whole device are matched with one another, effective transfer of the wafers can be achieved, and the transfer accuracy is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer processing equipment, and in particular relates to a wafer-based transmission and transfer device. Background Art

[0002] Wafer sputtering is a sophisticated process in semiconductor manufacturing, mainly used to deposit thin films on silicon wafers. The high-energy ions generated by the sputtering source bombard the target material, causing atoms or molecules on the surface of the target material to be built and deposited on the base material to form a thin film.

[0003] Magnetron sputtering involves applying a high voltage between the target and substrate under vacuum conditions to ionize argon gas and generate plasma. Electrons, under the influence of electric and magnetic fields, collide with and ionize argon atoms. The generated positive ions, accelerated by the electric field, bombard the target, ejecting atoms or molecules from the target surface and ultimately forming a thin film on the substrate.

[0004] Before wafer processing, the wafer needs to be transferred into the chamber. The vacuum system of the transfer arm, located on the carrier fork, is used to absorb the wafer for transfer. The transfer arm transfers the wafer to the loading arm. The vacuum system of the transfer arm is first turned on to transfer the wafer. After reaching a specific position, the vacuum system is turned off. The vacuum system of the loading arm is turned on, and the wafer is absorbed and the next step of transfer begins. However, the vacuum system of the previous process was switched back and forth between the transfer arm vacuum system and the loading arm vacuum system, which easily caused wafer drop. Utility Model Content

[0005] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a wafer-based transmission and transfer device to solve the above-mentioned technical problems existing in the prior art.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] A wafer-based transmission and transfer device includes a carrying component, a correction component, a transmission component, and a loading component.

[0008] The carrying assembly is used to carry the stack of multiple groups of wafers;

[0009] The calibration assembly includes a detection camera, a positioning platform, and a first rotating mechanism. The wafer is transferred to the positioning platform for loading via the transmission assembly. The detection camera is used to photograph the loaded wafer, and then rotates via the first rotating mechanism located below the positioning platform to achieve centering of the loaded wafer.

[0010] The transmission assembly includes a second rotating mechanism located at the bottom, a horizontal displacement mechanism in the horizontal direction, and a carrying fork. The carrying fork is used to support the bottom of the wafer. At the same time, the horizontal displacement mechanism enables the carrying fork that carries the wafer to move horizontally. The second rotating mechanism enables the entire horizontal displacement mechanism to rotate, so that the carrying fork can move the wafer from the carrying assembly to the correction assembly.

[0011] The loading assembly includes two groups of symmetrically arranged suction cups, a third rotating mechanism and a deflection assembly. The two groups of suction cups form independent support and adsorption of the wafers. The third rotating mechanism realizes the direction switching of the two groups of suction cups. The deflection assembly realizes the horizontal deflection displacement of the entire loading assembly carrying the wafers.

[0012] Furthermore, a front claw is extended forward from the front end of the carrying fork, and when the wafer is carried, the bottom center of the wafer is exposed downward.

[0013] Furthermore, a second negative pressure adsorption hole is provided at the contact position between the carrying fork and the wafer, and the second negative pressure adsorption hole passes through the middle through hole where the carrying fork is located and is connected to an external vacuum generator.

[0014] Furthermore, the area where the second negative pressure adsorption hole protrudes from the upper surface of the supporting fork is set as an annular protrusion, and the area formed by the annular protrusion wraps the periphery of the protruding second negative pressure adsorption hole.

[0015] Furthermore, a first negative pressure adsorption hole facing downward is opened in the middle of the positioning platform, and negative pressure adsorption is formed on the wafer through the first negative pressure adsorption hole.

[0016] Furthermore, an annular light source is provided on the annular periphery where the positioning platform is located, and the height of the annular light source is lower than the height of the upper surface where the positioning platform is located.

[0017] Furthermore, a plurality of groups of outwardly protruding limiting members are provided on the outer side of the suction cup member, and the height of the limiting members is lower than the height of the suction cup member.

[0018] Furthermore, a buffer member is provided at the lower portion where the suction cup member is located.

[0019] Furthermore, a recovery component is provided on the other side of the carrying component, and the unqualified wafers detected by the correction component are recovered and carried by the recovery component.

[0020] Beneficial effects of the utility model:

[0021] 1. The correction component, transmission component and loading component used in this device cooperate with each other to achieve effective transfer of wafers, and ensure the accuracy of the transfer process during the transfer link.

[0022] 2. The bottom of the carrying fork of the transmission component used in this device is provided with a second negative pressure adsorption hole, which can be independently controlled. This independent control method can effectively realize the adsorption of the wafer, ensuring that the wafer is not prone to relative position displacement during the transmission process.

[0023] 3. The loading assembly adopted in this device and the suction cup can form a flipping operation under the action of the third rotating mechanism. This flipping method can meet the simultaneous adsorption of two wafers, and after adsorption, the wafers can be independently transferred to the sputtering unit for sputtering operation, ensuring the smoothness of the transfer process. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for describing the embodiments or the prior art.

[0025] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the utility model;

[0026] Figure 2 This is a schematic structural diagram of a correction component according to an embodiment of the present utility model;

[0027] Figure 3 This is a schematic diagram of the transmission component structure of an embodiment of the utility model;

[0028] Figure 4 This is a schematic diagram of the load-bearing fork structure of an embodiment of the utility model;

[0029] Figure 5 This is a schematic diagram of the cross-sectional structure of the load-bearing fork according to an embodiment of the present utility model;

[0030] Figure 6 It is a schematic structural diagram of a loading assembly according to an embodiment of the present utility model. DETAILED DESCRIPTION

[0031] The following is a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0032] like Figure 1 As shown, an embodiment of the present invention provides a wafer-based transmission and transfer device, including a carrying component 1, a correction component 2, a transmission component 3, and a loading component 4.

[0033] The carrier assembly 1 is used to support multiple stacked wafers and transfer the wafers one by one via the transfer assembly 3. A recovery assembly 5 is located on the other side of the carrier assembly 1. At this time, the recovery assembly 5 and the carrier assembly 1 are on the same horizontal plane. Wafers that fail the inspection by the calibration assembly 2 are recovered and loaded by the recovery assembly 5.

[0034] like Figure 2 As shown, the calibration assembly 2 includes a detection camera 21, a positioning platform 22, and a first rotating mechanism 23. The wafer is transferred to the positioning platform 22 for loading via the transmission assembly 3. The detection camera 21 is used to photograph the loaded wafer, and then the first rotating mechanism 23 located below the positioning platform 22 rotates to achieve centering of the loaded wafer (i.e., rotating about a center point of the wafer). A downward first negative pressure adsorption hole 201 is provided in the middle of the positioning platform 22. Negative pressure adsorption is formed on the wafer through the first negative pressure adsorption hole 201, which can achieve stable loading of the wafer.

[0035] An annular light source 24 is also located around the positioning platform 22, and its height is lower than the upper surface of the positioning platform 22, thereby preventing interference between the carrier fork 33 of the transport assembly 3 and the silicon wafer 3 when moving over the positioning platform 22. The light source is generated by an annular lamp 25, and the surrounding light source is arranged outside the positioning platform 22 to ensure that the inspection camera 21 captures clear and effective images, improving the accuracy of the wafer position recognition.

[0036] like Figure 3-Figure 5 As shown, the transmission component 3 includes a second rotating mechanism 32 located at the bottom, a horizontal displacement mechanism 31 in the horizontal direction, and a carrying fork 33. The carrying fork 33 is used to carry the bottom of the wafer. The front end of the carrying fork 33 extends forward with front claws (located on the left and right sides to form support for the bottom of the wafer during transportation). When carrying the wafer, the bottom center of the wafer is exposed downward, and the center bottom of the wafer is placed at the center position of the positioning table 22 of the correction component 2.

[0037] In order to ensure stable loading of the carrying fork 33 during wafer transportation, a second negative pressure adsorption hole 301 is opened at the contact position between the carrying fork 33 and the wafer. At the same time, the second negative pressure adsorption hole 301 passes through the central through hole where the carrying fork 33 is located and is connected to an external vacuum generator (or negative pressure generator). Through the vacuum generator, the second negative pressure adsorption hole 301 and the contact end of the wafer can form a negative pressure adsorption effect. Of course, in order to increase the contact area between the second negative pressure adsorption hole 301 and the wafer, the area where the second negative pressure adsorption hole 301 protrudes from the upper surface of the carrying fork 33 is set as an annular protrusion 331, and the area formed by the annular protrusion 331 wraps the outer periphery of the protruding second negative pressure adsorption hole 301. At this time, the area surrounded by the annular protrusion 331 and the upper surface of the carrying fork 33 forms a negative pressure contact part, which increases the contact area with the bottom surface of the wafer, thereby further increasing the adsorption force.

[0038] At the same time, the horizontal displacement mechanism 31 realizes the horizontal movement of the carrying fork 33 carrying the wafer, and the second rotation mechanism 32 realizes the overall rotation of the horizontal displacement mechanism 31, so that the carrying fork 33 can move the wafer from the carrying component 1 to the correction component.

[0039] like Figure 6 As shown, the loading assembly 4 includes two groups of suction cups 41 symmetrically arranged, a third rotating mechanism 42 and a deflection assembly 43. The two groups of suction cups 41 form independent support and adsorption of the wafers (the suction cups 41 can independently adsorb the wafers without affecting each other), the third rotating mechanism 42 realizes the direction switching of the two groups of suction cups 41, and the deflection assembly 43 realizes the deflection displacement of the loading assembly 4 carrying the wafers in the horizontal direction as a whole.

[0040] Several groups of outwardly protruding limit members 411 are arranged on the outside of the suction cup member 41, and the height of the limit members 411 is lower than the height of the suction cup member 41. At the same time, a buffer member 412 is arranged at the lower part of the suction cup member 41. When the wafer adsorbed by the suction cup member 41 is flipped over by the third rotating mechanism 42, the other group of suction cup members 41 (the side without adsorbed wafer) will rotate synchronously in the opposite direction, and then the third rotating mechanism 42 and the suction cup member 41 will be deflected as a whole through the deflection assembly 43, so that the suction cup member 41 with the wafer adsorbed is attached to the sputtering equipment surface as a whole. The buffer member 412 can slow down the pressure loss on the wafer surface caused by the extrusion surface of the suction cup member 41 when it is attached. At the same time, the limit member 411 can further achieve when attaching the wafer.

[0041] During specific use, the wafer carried on the carrying component 1 is lifted and supported by the carrying fork 33 of the transmission component 3, and then the wafer is transferred to the positioning table 22 of the correction component 2 through the second rotation mechanism 32 at the bottom and the horizontal displacement mechanism 31 in the horizontal direction. The wafer is then centered by the rotation of the detection camera 21 and the positioning table 22. At the same time, when the detection camera 21 detects contamination on the surface of the wafer, the wafer is then transferred to the recovery component 5 by the carrying fork 33 of the transmission component 3.

[0042] When the qualified wafer is transferred to the suction cup 41 of the loading assembly 4 by the carrying fork 33, the suction cup 41 is now facing upward under the action of the third rotating mechanism 42. When the wafer is adsorbed, the suction cup 41 with the wafer adsorbed is flipped by the third rotating mechanism 42. Therefore, in the whole transport link, the wafer is completely adsorbed on the suction cup 41. This adsorption method can form a

[0043] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention as claimed.

Claims

1. A wafer-based transmission and transfer device, comprising a carrying component (1), a correction component (2), a transmission component (3), and a loading component (4), characterized in that: The carrying assembly (1) is used for carrying stacked layers of multiple groups of wafers; The calibration component (2) comprises a detection camera (21), a positioning platform (22) and a first rotating mechanism (23); the wafer is transferred to the positioning platform (22) for loading via the transmission component (3); the detection camera (21) is used to photograph the loaded wafer, and then rotates via the first rotating mechanism (23) located below the positioning platform (22) to achieve centering of the loaded wafer; The transmission component (3) comprises a second rotating mechanism (32) located at the bottom, a horizontal displacement mechanism (31) in the horizontal direction, and a carrying fork (33), wherein the carrying fork (33) is used to carry the bottom of the wafer, and the horizontal displacement mechanism (31) enables the carrying fork (33) carrying the wafer to move in the horizontal direction, and the second rotating mechanism (32) enables the overall rotation of the horizontal displacement mechanism (31) to enable the carrying fork (33) to transport the wafer from the carrying component (1) to the correction component; The loading assembly (4) comprises two groups of suction cups (41) symmetrically arranged with respect to each other, a third rotating mechanism (42) and a deflection assembly (43). The two groups of suction cups (41) are used to independently carry and adsorb the wafers. The third rotating mechanism (42) switches the directions of the two groups of suction cups (41). The deflection assembly (43) deflects and displaces the loading assembly (4) carrying the wafers in the horizontal direction as a whole.

2. The wafer-based transport and transfer device according to claim 1, characterized in that: The front end of the carrying fork (33) is provided with a front claw extending forward, and when the wafer is carried, the bottom center of the wafer is exposed downward.

3. The wafer-based transport and transfer device according to claim 2, characterized in that: A second negative pressure adsorption hole (301) is provided at the position where the carrying fork (33) contacts the wafer, and the second negative pressure adsorption hole (301) passes through the middle through hole where the carrying fork (33) is located and is connected to an external vacuum generator.

4. The wafer-based transport and transfer device according to claim 3, characterized in that: The area where the second negative pressure adsorption hole (301) protrudes from the upper surface of the bearing fork (33) is located is set as an annular protrusion (331), and the area formed by the annular protrusion (331) wraps the outer periphery of the protruding second negative pressure adsorption hole (301).

5. The wafer-based transport and transfer device according to claim 1, characterized in that: A first negative pressure adsorption hole (201) facing downwards is provided in the middle of the positioning platform (22), and negative pressure adsorption of the wafer is formed through the first negative pressure adsorption hole (201).

6. The wafer-based transport and transfer device according to claim 5, characterized in that: An annular light source (24) is provided on the annular outer periphery of the positioning platform (22), and the height of the annular light source (24) is lower than the height of the upper surface of the positioning platform (22).

7. The wafer-based transport and transfer device according to claim 1, characterized in that: A plurality of groups of outwardly protruding limiting members (411) are provided on the outer side of the suction cup member (41), and the height of the limiting members (411) is lower than the height of the suction cup member (41).

8. The wafer-based transport and transfer device according to claim 7, characterized in that: A buffer member (412) is provided at the lower portion of the suction cup member (41).

9. The wafer-based transport and transfer device according to claim 1, characterized in that: A recovery component (5) is provided on the other side of the carrying component (1), and wafers detected as unqualified by the correction component (2) are recovered and carried by the recovery component (5).

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