Transfer arm for sputtering table

Abstract

The utility model discloses a transfer arm for a sputtering table, and relates to the technical field of physical vapor deposition equipment, the transfer arm comprises a mechanical arm, one end of the mechanical arm is fixedly provided with an adsorption type end effector, the adsorption type end effector comprises a mounting disc, a wafer adsorption assembly and a dust removal assembly, the wafer adsorption assembly is fixedly mounted on one side of the mounting disc, the dust removal assembly is fixedly mounted on one side of the wafer adsorption assembly, and the dust removal assembly comprises a dust removal air cabin. According to the utility model, the air pump pumps the filtered air into the dust removal air cabin through the air pipe, and then the air is discharged from one end of the dust removal air port on the dust removal air cabin, so that solid particles on a wafer film layer are blown away, and no solid particles enter the air cabin, thereby ensuring that the wafer adsorption assembly can stably adsorb the wafer; and meanwhile, one side of the wafer is subjected to impurity removal operation, so that the mechanical arm can directly put the wafer into the conveying mechanism, and the processing period of the wafer is shortened.

Description

Technical Field

[0001] The utility model relates to the technical field of physical vapor deposition equipment, in particular to a transfer arm for a sputtering table. Background Art

[0002] A PVD sputtering station is a wafer processing device that uses physical vapor deposition (PVD) technology. Its primary function is to perform sputtering coatings on wafer surfaces. Before the coating process begins, the wafer to be processed must be accurately placed on the coating station using a transfer arm to ensure the smooth progress of the subsequent coating process.

[0003] For example, Chinese patent publication number CN219017608U discloses a robotic arm for transferring wafers, which includes: a support part, multiple arm components and a driving part; wherein, the multiple arm components are connected to the support part in multiple layers, and each layer has multiple arm components; each arm component includes a bearing part and a connecting part, the bearing part is hinged to one end of the connecting part, and the other end of the connecting part is hinged to the supporting part, and the surface of the bearing part for placing the wafer is provided with multiple protrusion structures; the driving part is respectively connected to each arm component to drive the bearing part of each arm component to rotate compared with the connecting part, and drive the connecting part to rotate compared with the supporting part.

[0004] During the PVD process, tiny particles in the chamber, such as dust, target material particles, and particles generated by equipment wear, will adhere to one side of the wafer film layer. Using a robotic arm equipped with an adsorption-type end effector to transfer the wafer will cause the particles on the wafer film to be sucked into the interior of the air chamber, polluting the internal environment of the air chamber. Before the wafer is fine-processed, the surface of the wafer needs to be cleaned, which extends the wafer processing cycle. Utility Model Content

[0005] The purpose of the utility model is to solve the problem in the prior art that using a robotic arm equipped with an adsorption-type end effector to transfer wafers will cause particles on the wafer film to be sucked into the interior of the air chamber, polluting the internal environment of the air chamber, and before the wafer is finely processed, it is necessary to clean the surface of the wafer, thereby extending the processing cycle of the wafer. A transfer arm for a sputtering table is proposed.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a transfer arm for a sputtering table, including a robotic arm, one end of the robotic arm is fixedly mounted with an adsorption-type end effector, the adsorption-type end effector includes a mounting plate, a wafer adsorption assembly and a dust removal assembly, the wafer adsorption assembly is fixedly mounted on one side of the mounting plate, the dust removal assembly is fixedly mounted on one side of the wafer adsorption assembly, the dust removal assembly includes a dust removal air cabin, one end of the dust removal air cabin is fixedly connected to a plurality of dust removal air ports, one side of the dust removal air cabin is fixedly connected to an air pipe, and the other end of the dust removal air cabin is fixedly mounted on one side of the wafer adsorption assembly by bolts.

[0007] Preferably, the wafer adsorption assembly includes a No. 1 gas chamber and two sets of double-head adsorption assemblies, the output end of the double-head adsorption assembly is fixedly connected to the input end of the No. 1 gas chamber, and the No. 1 gas chamber is fixedly installed on one side of the mounting plate by bolts.

[0008] Preferably, the double-head adsorption assembly includes a No. 2 air cabin, a suction cup seat, a suction cup body and a mounting plate, the two suction cup seats are fixedly mounted on both ends of the mounting plate, the output ends of the two suction cup seats are fixedly connected to the input end of the No. 2 air cabin, the input ends of the two suction cup seats are fixedly connected to the output end of the suction cup body, and the output end of the No. 2 air cabin is fixedly connected to the input end of the No. 1 air cabin.

[0009] Preferably, a mounting rod is symmetrically fixedly mounted on one side of the mounting plate, and one end of the mounting rod is fixedly mounted on one side of the No. 2 air compartment by a bolt.

[0010] Preferably, one side of the No. 1 air chamber is fixedly connected to a vacuum pipe, and the vacuum pipe runs through the interior of the mounting plate.

[0011] Preferably, the air pipe runs through the interior of the mounting plate.

[0012] Compared with the prior art, the advantages and positive effects of the present invention are:

[0013] 1. In the present invention, the air pump pumps the filtered gas into the interior of the dust removal air chamber through the air pipe, and then discharges it from one end of the dust removal air port on the dust removal air chamber, blowing away the solid particles on the wafer film layer. No solid particles will enter the interior of the air chamber, ensuring that the wafer adsorption component can stably adsorb the wafer. At the same time, the impurity removal operation is performed on one side of the wafer, so that the robotic arm can directly place the wafer into the interior of the conveying mechanism, shortening the wafer processing cycle.

[0014] 2. In the present invention, the suction cup body contacts the wafer, and the gas between the suction cup body and the wafer is extracted by the vacuum pump, so that the wafer is stably adsorbed on one side of the wafer adsorption component. At the same time, two sets of double-head adsorption components are set to adsorb the wafer, and the wafer is adsorbed from four points, further improving the stability of the transferred wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The utility model provides a three-dimensional structural diagram of a transfer arm for a sputtering table;

[0016] Figure 2 This is a schematic diagram of the three-dimensional structure of a suction-type end effector in a transfer arm for a sputtering table proposed in the utility model;

[0017] Figure 3 This is a schematic diagram of the three-dimensional structure of a wafer adsorption component in a transfer arm for a sputtering table proposed in the utility model;

[0018] Figure 4 The utility model provides a three-dimensional structural schematic diagram of a dust removal component in a transfer arm for a sputtering table.

[0019] Legend: 1. Robotic arm; 2. Adsorption-type end effector; 21. Mounting plate; 211. Mounting rod; 22. Wafer adsorption assembly; 221. Air chamber No. 1; 222. Vacuum pipe; 23. Dust removal assembly; 231. Dust removal air chamber; 232. Dust removal air port; 233. Air pipe; 24. Double-head adsorption assembly; 241. Air chamber No. 2; 242. Suction cup seat; 243. Suction cup body; 244. Mounting plate. DETAILED DESCRIPTION

[0020] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described below with reference to the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features therein can be combined with each other without conflict.

[0021] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0022] Example 1: Figure 1 - Figure 4As shown, the utility model provides a transfer arm for a sputtering table, including a robotic arm 1, one end of the robotic arm 1 is fixedly mounted with an adsorption-type end effector 2, the adsorption-type end effector 2 includes a mounting plate 21, a wafer adsorption assembly 22 and a dust removal assembly 23, the wafer adsorption assembly 22 is fixedly mounted on one side of the mounting plate 21, the dust removal assembly 23 is fixedly mounted on one side of the wafer adsorption assembly 22, the dust removal assembly 23 includes a dust removal air chamber 231, one end of the dust removal air chamber 231 is fixedly connected to a plurality of dust removal air ports 232, one side of the dust removal air chamber 231 is fixedly connected to an air pipe 233, the other end of the dust removal air chamber 231 is fixedly mounted on one side of the wafer adsorption assembly 22 by bolts, and the air pipe 233 runs through the interior of the mounting plate 21.

[0023] The following is a detailed description of the specific settings and functions of this embodiment. After the sputtering table completes the sputtering coating on the wafer, the sputtering chamber is opened, and the robot arm 1 drives the adsorption end effector 2 to move to the top of the wafer. The air pump pumps the filtered clean gas into the interior of the dust removal air chamber 231 through the air pipe 233, and then discharges it from one end of the dust removal air port 232 on the dust removal air chamber 231 to blow away the solid particles on the wafer film layer, ensuring that no solid particles enter the interior of the air chamber when the wafer adsorption component 22 adsorbs the wafer, ensuring that the wafer adsorption component 22 can stably adsorb the wafer, and at the same time performing a de-impurity operation on one side of the wafer, so that the robot arm 1 can directly place the wafer into the interior of the conveying mechanism and enter the next step of the finishing process, thereby shortening the wafer processing cycle.

[0024] Example 2: Figure 1 - Figure 4As shown, a transfer arm for a sputtering table includes a robotic arm 1, one end of the robotic arm 1 is fixedly mounted with an adsorption-type end effector 2, the adsorption-type end effector 2 includes a mounting plate 21, a wafer adsorption assembly 22 and a dust removal assembly 23, the wafer adsorption assembly 22 is fixedly mounted on one side of the mounting plate 21, the dust removal assembly 23 is fixedly mounted on one side of the wafer adsorption assembly 22, the dust removal assembly 23 includes a dust removal air chamber 231, one end of the dust removal air chamber 231 is fixedly connected with a plurality of dust removal air ports 232, one side of the dust removal air chamber 231 is fixedly connected with an air pipe 233, the other end of the dust removal air chamber 231 is fixedly mounted on one side of the wafer adsorption assembly 22 by bolts, the wafer adsorption assembly 22 includes a No. 1 air chamber 221 and two groups of double-headed adsorption assemblies 24, the output end of the double-headed adsorption assembly 24 is connected to the input end of the No. 1 air chamber 221 Fixedly connected, the No. 1 air chamber 221 is fixedly installed on one side of the mounting plate 21 by bolts, and the double-head adsorption assembly 24 includes the No. 2 air chamber 241, a suction cup seat 242, a suction cup body 243 and a mounting plate 244. The two suction cup seats 242 are fixedly installed at both ends of the mounting plate 244, and the output ends of the two suction cup seats 242 are fixedly connected to the input end of the No. 2 air chamber 241, and the input ends of the two suction cup seats 242 are fixedly connected to the output ends of the suction cup body 243. The output end of the No. 2 air chamber 241 is fixedly connected to the input end of the No. 1 air chamber 221. A mounting rod 211 is symmetrically fixedly installed on one side of the mounting plate 21, and one end of the mounting rod 211 is fixedly installed on one side of the No. 2 air chamber 241 by bolts. A vacuum pipe 222 is fixedly connected to one side of the No. 1 air chamber 221, and the vacuum pipe 222 runs through the interior of the mounting plate 21.

[0025] The effect achieved by the entire embodiment is that when the wafer adsorption component 22 adsorbs the wafer, the suction cup body 243 contacts the wafer, and the gas between the suction cup body 243 and the wafer is extracted by the vacuum pump, so that the wafer is stably adsorbed on one side of the wafer adsorption component 22. At the same time, two groups of double-head adsorption components 24 are set to adsorb the wafer, and the wafer is adsorbed from four points, which further improves the stability of the transferred wafer and prevents the wafer from falling off from one end of the robotic arm 1.

[0026] The usage and working principle of this device: After the sputtering table completes the sputtering coating on the wafer, the sputtering chamber is opened, and the robotic arm 1 drives the adsorption end effector 2 to move to the top of the wafer. The air pump pumps the filtered gas into the interior of the dust removal chamber 231 through the air pipe 233, and then discharges it from one end of the dust removal air port 232 on the dust removal chamber 231 to blow away the solid particles on the wafer film layer. Then the robotic arm 1 drives the suction cup body 243 to descend and contact the wafer. The gas between the suction cup body 243 and the wafer is extracted by the vacuum pump, so that the wafer is stably adsorbed on one side of the wafer adsorption component 22. At the same time, two groups of double-head adsorption components 24 are set to adsorb the wafer, and the wafer is adsorbed from four points.

[0027] The above are only preferred embodiments of the present invention and are not intended to limit the present invention in any other form. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification of the above embodiment made according to the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A transfer arm for a sputtering table, comprising a robotic arm (1), characterized in that: An adsorption-type end effector (2) is fixedly mounted on one end of the robot arm (1), and the adsorption-type end effector (2) comprises a mounting plate (21), a wafer adsorption assembly (22), and a dust removal assembly (23). The wafer adsorption assembly (22) is fixedly mounted on one side of the mounting plate (21), and the dust removal assembly (23) is fixedly mounted on one side of the wafer adsorption assembly (22). The dust removal assembly (23) comprises a dust removal air chamber (231), one end of the dust removal air chamber (231) is fixedly connected to a plurality of dust removal air ports (232), one side of the dust removal air chamber (231) is fixedly connected to an air pipe (233), and the other end of the dust removal air chamber (231) is fixedly mounted on one side of the wafer adsorption assembly (22) by means of bolts.

2. The transfer arm for a sputtering table according to claim 1, characterized in that: The wafer adsorption assembly (22) comprises a No. 1 air chamber (221) and two sets of double-head adsorption assemblies (24), the output end of the double-head adsorption assembly (24) is fixedly connected to the input end of the No. 1 air chamber (221), and the No. 1 air chamber (221) is fixedly mounted on one side of the mounting plate (21) by means of bolts.

3. The transfer arm for a sputtering table according to claim 2, characterized in that: The double-head adsorption assembly (24) comprises a No. 2 air chamber (241), a suction cup seat (242), a suction cup body (243) and a mounting plate (244). The two suction cup seats (242) are fixedly mounted on both ends of the mounting plate (244). The output ends of the two suction cup seats (242) are fixedly connected to the input end of the No. 2 air chamber (241). The input ends of the two suction cup seats (242) are fixedly connected to the output end of the suction cup body (243). The output end of the No. 2 air chamber (241) is fixedly connected to the input end of the No. 1 air chamber (221).

4. The transfer arm for a sputtering table according to claim 3, characterized in that: A mounting rod (211) is symmetrically fixedly mounted on one side of the mounting plate (21), and one end of the mounting rod (211) is fixedly mounted on one side of the second air chamber (241) by means of a bolt.

5. The transfer arm for a sputtering table according to claim 2, characterized in that: One side of the first air chamber (221) is fixedly connected to a vacuum pipe (222), and the vacuum pipe (222) runs through the interior of the mounting plate (21).

6. The transfer arm for a sputtering table according to claim 1, characterized in that: The air pipe (233) passes through the interior of the mounting plate (21).

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