Temperature sensing structure and electronic equipment

Abstract

The utility model discloses a temperature sensing structure and an electronic device. The temperature sensing structure comprises a housing, a temperature sensing member, a temperature sensor, a heat conduction member and a controller. Wherein the shell and the temperature sensing piece are of an integrally-formed structure, one side of the temperature sensing piece is located outside the shell to make contact with the outside, and the other side of the temperature sensing piece is located inside the shell. The temperature sensor, the heat conduction part and the controller are located in the shell, the heat conduction part is arranged on the other side of the temperature sensing part and makes contact with the temperature sensor, the controller is electrically connected with the temperature sensor, and the temperature sensor transmits temperature signals to the controller. According to the utility model, the temperature sensor can quickly sense the external temperature, so that the controller can quickly execute control, and the working efficiency of the product is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature sensing, in particular to a temperature sensing structure and electronic equipment. Background Art

[0002] In the related art, the temperature sensor located inside the shell senses the external temperature by transmitting the external temperature of the shell to the temperature sensor through the FPC attached to the inside of the shell. However, the sensitivity and time control delay of this method are relatively long, and the temperature sensor cannot quickly sense the external temperature, resulting in low efficiency in controlling the temperature of certain components. Utility Model Content

[0003] The technical problem to be solved by the present invention is to provide a temperature sensing structure and an electronic device in response to at least one defect of the related technology mentioned in the above background technology: the temperature sensor located inside the shell cannot quickly sense the external temperature.

[0004] The technical solution adopted by the utility model to solve the technical problem is to construct a temperature sensing structure, including:

[0005] A housing and a temperature sensing element, wherein the housing and the temperature sensing element are integrally formed, one side of the temperature sensing element is located outside the housing to contact the outside world, and the other side of the temperature sensing element is located inside the housing;

[0006] a temperature sensor, the temperature sensor being located inside the housing;

[0007] a heat conducting member, the heat conducting member being located inside the housing, the heat conducting member being provided on the other side of the temperature sensing member and being in contact with the temperature sensor; and

[0008] A controller is located inside the housing, the controller is electrically connected to the temperature sensor, and the temperature sensor transmits a temperature signal to the controller.

[0009] In some embodiments, the temperature sensing element is a component made of a hard and temperature-sensitive material.

[0010] In some embodiments, the housing and the temperature sensing element are an integral injection-molded structure.

[0011] In some embodiments, a groove is provided on the other side of the temperature sensing element, and the heat conducting element is fixed in the groove.

[0012] In some embodiments, the heat conducting element is an element made of elastic and heat conducting material.

[0013] In some embodiments, a side of the heat conducting element facing away from the temperature sensing element is in close contact with the temperature sensor.

[0014] In some embodiments, the temperature sensing structure further comprises:

[0015] A circuit board, the temperature sensor is arranged on the circuit board, an adhesive layer is provided on the shell at the outer periphery of the other side of the temperature sensing component, the circuit board is attached to the adhesive layer, and the controller is electrically connected to the temperature sensor through the circuit board.

[0016] In some embodiments, the housing, the temperature sensing element, the heat conducting element, the temperature sensor, and the circuit board constitute a modular unit.

[0017] The utility model also constructs an electronic device, which includes any of the temperature sensing structures described above.

[0018] In some embodiments, the electronic device further comprises:

[0019] A heater is electrically connected to the controller, and the controller is used to control the heater to perform heating.

[0020] By implementing the utility model, the following beneficial effects are achieved:

[0021] The utility model makes one side of the temperature sensing element directly contact with the outside world, and uses the heat conductive element to transfer the external heat energy to the temperature sensor inside the shell, so that the temperature sensor can quickly sense the external temperature, and then the controller can quickly execute control, thereby improving the working efficiency of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0023] Figure 1 A first structural diagram of an embodiment of a temperature sensing structure of the present invention is shown;

[0024] Figure 2 A second structural diagram of an embodiment of the temperature sensing structure of the present invention is shown;

[0025] Figure 3 A first exploded view of an embodiment of the temperature sensing structure of the present invention is shown;

[0026] Figure 4 It shows a schematic structural diagram of a temperature sensing element and a heat conducting element in an embodiment of a temperature sensing structure of the present invention;

[0027] Figure 5 A second exploded view of an embodiment of the temperature sensing structure of the present invention is shown;

[0028] Figure 6An exploded view of an embodiment of an electronic device of the present invention is shown;

[0029] Figure 7 A schematic structural diagram of an embodiment of an electronic device of the present utility model is shown;

[0030] The accompanying drawings are numerals as follows:

[0031] Temperature sensing structure 1; housing 11; temperature sensing element 12; groove 121; temperature sensor 13; heat conducting element 14; circuit board 15; connector 16; adhesive layer 17; host 2; scanning head lens 3. DETAILED DESCRIPTION

[0032] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation methods of the present invention are now described in detail with reference to the accompanying drawings.

[0033] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein can be combined with each other.

[0034] In the description of the utility model, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the utility model, unless otherwise specified, "multiple" means two or more.

[0035] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "located at," and "located at" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections, chemical connections, direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0036] like Figures 1 to 5As shown, some embodiments of the present invention disclose a temperature sensing structure 1, including a housing 11, a temperature sensing element 12, a temperature sensor 13, a heat conducting element 14 and a controller (not shown), specifically as follows:

[0037] like Figure 1 、 Figure 3 and Figure 5 As shown, the shell 11 and the temperature sensing element 12 are an integrally formed structure. The temperature sensing element 12 has two opposite sides. One side of the temperature sensing element 12 is located outside the shell 11 to directly contact the outside world and sense the external temperature. The other side of the temperature sensing element 12 is located inside the shell 11.

[0038] like Figure 2 、 Figure 3 and Figure 5 As shown, the temperature sensor 13, the heat conductor 14 and the controller are respectively located inside the shell 11. The heat conductor 14 is arranged on the other side of the temperature sensing element 12 and contacts the temperature sensor 13. The controller is electrically connected to the temperature sensor 13, and the temperature sensor 13 transmits a temperature signal to the controller.

[0039] In this embodiment, one side of the temperature sensing element 12 is in direct contact with the outside world, and the heat conducting element 14 is used to transfer the heat energy from the outside world to the temperature sensor 13 inside the shell 11, so that the temperature sensor 13 can quickly sense the outside temperature, and then the controller can quickly execute control, thereby improving the working efficiency of the product.

[0040] In some embodiments, the temperature sensing element 12 is made of a rigid and temperature-sensitive material. For example, the temperature sensing element 12 is made of a metal or ceramic material. The metal material may be copper, for example. Copper has the characteristics of fast heat transfer and low heat loss. The metal, ceramic, and copper mentioned here are merely examples and are not intended to limit the present application.

[0041] In some embodiments, the housing 11 and the temperature sensor 12 are integrally injection molded. Specifically, the temperature sensor 12 is disposed within a housing mold, and during injection molding, the thermoplastic resin is injection-molded around the temperature sensor 12. This injection molding method is for illustrative purposes only and is not intended to limit the present application.

[0042] However, if the temperature sensing structure 1 is used in a usage scenario such as a cold chain where there is alternating hot and cold, there may be a tiny gap between the temperature sensing element 12 and the shell 11 due to thermal expansion and contraction, allowing water vapor to penetrate into the interior of the machine. Therefore, the temperature sensing structure 1 also includes a seal (not shown), and a seal is provided at the connection between the temperature sensing element 12 and the shell 11. For example, the seal is a sealing rubber ring. The sealing rubber ring here is only an example and is not intended to limit the present application.

[0043] In some embodiments, such as Figure 1As shown, in order to improve the integrity, the outer surface of one side of the temperature sensing element 12 is flush with the outer surface of the housing 11 .

[0044] In some embodiments, such as Figure 4 As shown, a groove 121 is provided on the other side of the temperature sensing element 12, and the heat conducting element 14 is fixed in the groove 121. Specifically, when the heat conducting element 14 is made of an elastic and heat-conductive material, the heat conducting element 14 can be embedded in the groove 121, with the outer wall surface of the heat conducting element 14 closely contacting the inner wall surface of the groove 121. For example, the heat conducting element 14 can be made of silicone grease or liquid metal. The silicone grease and liquid metal mentioned here are merely examples and are not intended to limit the present application.

[0045] In some other embodiments, when the heat conductor 14 is an element made of a hard and heat-conductive material, the heat conductor 14 is fixed in the groove 121. For example, the heat conductor 14 is an element made of a metal material, and the metal material can be copper, etc., and then it can be fixed by welding, etc. The metal, copper and welding method here are only examples and are not intended to limit the present application.

[0046] In some embodiments, in order to improve the heat transfer effect, the side of the heat conducting element 14 facing away from the temperature sensing element 12 is in close contact with the temperature sensor 13 .

[0047] Among them, such as Figure 3 and Figure 5 As shown, the temperature sensing structure 1 also includes a circuit board 15, the temperature sensor 13 is arranged on the circuit board 15, and an adhesive layer 17 is provided on the shell 11 at the outer periphery of the other side of the temperature sensing element 12. The circuit board 15 is attached to the adhesive layer 17, and the controller is electrically connected to the temperature sensor 13 through the circuit board 15.

[0048] In some embodiments, such as Figure 6 As shown, in order to optimize the layout, the temperature sensing structure 1 further includes a connector 16, and the controller can be electrically connected to the circuit board 15 through the connector 16. For example, the connector 16 is an FPC. The FPC here is only an example and is not intended to limit the present application.

[0049] In some embodiments, such as Figure 2 and Figure 6 As shown, in order to improve assembly efficiency, the housing 11 , the temperature sensing element 12 , the heat conducting element 14 , the temperature sensor 13 and the circuit board 15 form a modular unit for integral installation on the host 2 having the controller and the connector 16 .

[0050] Some embodiments of the present invention further disclose an electronic device, such as a handheld smart terminal PDA, a smart POS (point of sale) terminal, or a tablet computer, which includes any of the temperature sensing structures 1 described above. The temperature sensing structure 1 is not described in detail here. The housing 11 of the temperature sensing structure 1 is the bottom housing of the electronic device.

[0051] In some embodiments, the electronic device further comprises a heater (not shown), the heater being electrically connected to the controller, and the controller being configured to control the heater to perform heating according to the received temperature signal. Figure 6 and Figure 7 As shown, the electronic device further includes a scanning head lens 3, and a heater is provided on the scanning head lens 3. When the controller detects that the external temperature is lower than a threshold value, the heater is controlled to heat and defog the scanning head lens 3.

[0052] In some embodiments, such as Figure 6 and Figure 7 As shown, the electronic device also includes a host 2, a controller and a connector 16 are arranged on the host 2, and a modular unit consisting of a shell 11, a temperature sensing component 12, a heat conducting component 14, a temperature sensor 13 and a circuit board 15 is installed on the host 2 and fixed by screws. The screw fixation here is only an example and is not intended to limit the present application.

[0053] By implementing the utility model, the following beneficial effects are achieved:

[0054] The present invention allows one side of the temperature sensing element 12 to be in direct contact with the outside world, and utilizes the heat conducting element 14 to transfer the heat energy from the outside world to the temperature sensor 13 inside the shell 11, so that the temperature sensor 13 can quickly sense the outside temperature, and then the controller can quickly execute control, thereby improving the working efficiency of the product.

[0055] It is understandable that the above embodiments only express some of the implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be understood as limiting the scope of the patent of the present invention. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present invention, the above embodiments or technical features can be freely combined, and several deformations and improvements can be made, all of which fall within the scope of protection of the present invention, that is, the embodiments described in "some embodiments" can be freely combined with any of the above and below embodiments. Therefore, all equivalent changes and modifications made to the scope of the claims of the present invention should fall within the scope of coverage of the claims of the present invention.

Claims

1. A temperature sensing structure, characterized in that: include: A housing (11) and a temperature sensing element (12), wherein the housing (11) and the temperature sensing element (12) are an integrally formed structure, one side of the temperature sensing element (12) is located outside the housing (11) to be in contact with the outside world, and the other side of the temperature sensing element (12) is located inside the housing (11); a temperature sensor (13), the temperature sensor (13) being located inside the housing (11); a heat conducting member (14), the heat conducting member (14) being located inside the housing (11), the heat conducting member (14) being provided on the other side of the temperature sensing member (12) and being in contact with the temperature sensor (13); and A controller is located inside the housing (11), the controller is electrically connected to the temperature sensor (13), and the temperature sensor (13) transmits a temperature signal to the controller.

2. The temperature sensing structure according to claim 1, characterized in that: The temperature sensing element (12) is a component made of a hard and temperature-sensitive material.

3. The temperature sensing structure according to claim 1, characterized in that: The housing (11) and the temperature sensing element (12) are an integral injection-molded structure.

4. The temperature sensing structure according to claim 1, characterized in that: A groove (121) is provided on the other side of the temperature sensing element (12), and the heat conducting element (14) is fixed in the groove (121).

5. The temperature sensing structure according to claim 1, characterized in that: The heat conducting element (14) is an element made of elastic and heat conducting material.

6. The temperature sensing structure according to claim 1, characterized in that: The side of the heat conducting member (14) facing away from the temperature sensing member (12) is in close contact with the temperature sensor (13).

7. The temperature sensing structure according to claim 1, characterized in that: The temperature sensing structure further includes: A circuit board (15), the temperature sensor (13) is arranged on the circuit board (15), an adhesive layer (17) is provided on the housing (11) at the outer periphery of the other side of the temperature sensing element (12), the circuit board (15) is attached to the adhesive layer (17), and the controller is electrically connected to the temperature sensor (13) through the circuit board (15).

8. The temperature sensing structure according to claim 7, characterized in that: The housing (11), the temperature sensing element (12), the heat conducting element (14), the temperature sensor (13) and the circuit board (15) constitute a modular unit.

9. An electronic device, characterized in that: The invention comprises the temperature sensing structure according to any one of claims 1 to 8.

10. The electronic device according to claim 9, wherein: The electronic device further comprises: A heater is electrically connected to the controller, and the controller is used to control the heater to perform heating.

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