Temperature acquisition module with multiple communication modes
By introducing a retractable top cover and heat dissipation components into the temperature acquisition module, the problem of poor heat dissipation is solved, flexible heat dissipation control is achieved, and heat dissipation efficiency and effect are improved.
Patent Information
- Application Number
- CN202422754809.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-12
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-11-12
AI Technical Summary
The existing temperature acquisition module has poor heat dissipation effect, and the electronic components block air circulation, resulting in unsatisfactory heat dissipation effect.
A temperature acquisition module with multiple communication modes is designed. It adopts a liftable top cover and heat dissipation components, including a heat dissipation slot and a cooling fan. The top cover is raised and lowered by adjusting the screw and elastic connection components, expanding the air circulation path to improve the heat dissipation efficiency.
Maintain good heat dissipation effect during normal use. When the heat dissipation effect is poor, you can manually lift the top cover and separate it from the shell to expand the air intake and significantly improve the heat dissipation efficiency and effect.
Smart Images

Figure CN223376788U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of temperature acquisition modules, in particular to a temperature acquisition module with multiple communication modes. Background Art
[0002] The temperature acquisition module includes temperature acquisition products with thermocouple input, which can directly convert the thermocouple output signal into a temperature value and transmit it to the terminal through RS232 or RS485 isolation, such as PC, PLC, industrial computer, touch screen, etc.; the data can be transmitted to the cloud through the network transfer module. The temperature acquisition module is widely used in various industrial sites, ultra-low temperature or high temperature measurement applications.
[0003] A Chinese patent publication numbered CN219265528U discloses a temperature acquisition module, relating to the field of integrated circuit technology. The module comprises an upper housing, an acquisition module body, and a lower housing. The acquisition module body is removably disposed between the upper and lower housings. An air inlet is provided on one side of the upper housing, an air outlet is provided on the opposite side of the upper housing from the air inlet, a first heat dissipation fan is provided inside the air outlet, and a heat dissipation mechanism is provided at the bottom of the acquisition module body. This utility model provides good ventilation and heat dissipation for the temperature acquisition module by providing an air inlet, an air outlet, and a first heat dissipation fan on the upper housing as a normalized heat dissipation mechanism. A heat dissipation mechanism is provided at the bottom of the acquisition module body, and a heat dissipation port is provided at the bottom of the lower housing. These can be used as both a normalized heat dissipation mechanism and a rapid cooling mechanism, thereby improving the heat dissipation performance of the temperature acquisition module and further enhancing the service life and safety of the temperature acquisition module.
[0004] The temperature acquisition module involved in the above patent discharges the heat inside the temperature acquisition module shell to the outside through the heat dissipation vents on both sides. However, in fact, there are many electronic components inside the temperature acquisition module shell, which will hinder air circulation and result in poor heat dissipation effect. Therefore, we need to propose a temperature acquisition module with multiple communication methods. Utility Model Content
[0005] The purpose of the present invention is to provide a temperature acquisition module with multiple communication modes, which has the advantage of being able to open the shell when needed to improve the internal heat dissipation effect and efficiency of the temperature acquisition module, so as to solve the problems raised in the above background technology.
[0006] To achieve the above-mentioned purpose, the present invention provides a temperature acquisition module with multiple communication modes, including an acquisition module body, a shell and a top cover, the bottom of the shell is fixedly connected to a mounting assembly, the acquisition module body is fixedly installed at the bottom of the inner cavity of the shell, and one end of the acquisition module body passes through the shell and extends to the outside of the shell, the top cover is arranged at the top of the shell, and the top cover can be lifted and lowered on the top of the shell through an elastic connection assembly, the bottom of the top cover is fixedly installed with a dustproof net, the surface of the dustproof net is slidably connected to the inner wall of the shell, and a heat dissipation assembly for dissipating heat from the acquisition module body is provided between the top cover and the shell.
[0007] Preferably, the heat dissipation assembly includes heat dissipation slots opened on both sides of the shell, and two groups of heat dissipation fans are fixedly installed on the top of the top cover.
[0008] Preferably, two groups of heat dissipation holes are opened on the top of the top cover, and the two groups of heat dissipation holes are respectively arranged corresponding to the two groups of heat dissipation fans.
[0009] Preferably, the elastic connection assembly includes a connecting seat fixedly installed at the four corners of the inner cavity of the shell, and the four corners of the top of the top cover are provided with an adjusting screw. The bottom end of the adjusting screw passes through the top cover and extends to the bottom of the top cover and is threadedly connected to the top of the connecting seat. A compression spring is fixedly installed on the top of the connecting seat, and the top end of the compression spring is fixedly connected to the bottom of the top cover.
[0010] Preferably, a threaded hole adapted to the adjusting screw is provided on the top of the connecting seat, and the bottom end of the adjusting screw is threadedly connected to the inner wall of the threaded hole.
[0011] Preferably, a movable groove is provided on the surface of the dustproof net at a position corresponding to the connecting seat, and the inner wall of the movable groove is slidably connected to the surface of the connecting seat. A through hole is also provided on the surface of the top cover at a position corresponding to the adjusting screw, and the bottom end of the adjusting screw passes through the through hole and extends to the bottom of the top cover.
[0012] Preferably, the mounting assembly includes mounting brackets fixedly mounted on both sides of the bottom of the shell, and mounting holes are formed on the surfaces of the mounting brackets.
[0013] Compared with the prior art, the beneficial effects of the present invention are:
[0014] The utility model can dissipate heat for the acquisition module body during normal use through the provision of the heat dissipation component. When the heat dissipation effect of the heat dissipation component on the acquisition module body is poor, the user can raise the top cover by rotating the adjustment screw to separate the top cover from the shell, thereby increasing the air intake inside the shell and improving the air circulation on the surface of the acquisition module body inside the shell, thereby improving the heat dissipation efficiency and effect of the acquisition module body. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a structural diagram of the utility model;
[0016] Figure 2 This is a schematic diagram of the structure of the utility model when the top cover of the housing is open;
[0017] Figure 3 This is a structural diagram of the connecting seat of the utility model;
[0018] Figure 4 This is a schematic diagram of the structure of the heat dissipation hole of the utility model.
[0019] In the figure: 1. Collection module body; 2. Shell; 3. Top cover; 4. Dustproof net; 5. Heat dissipation slot; 6. Cooling fan; 7. Heat dissipation hole; 8. Connecting seat; 9. Adjusting screw; 10. Compression spring; 11. Threaded hole; 12. Moving slot; 13. Through hole; 14. Mounting bracket; 15. Mounting hole. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0021] See also Figures 1-4 The present invention provides a temperature acquisition module with multiple communication modes, comprising an acquisition module body 1, a housing 2, and a top cover 3. The bottom of the housing 2 is fixedly connected to a mounting assembly, which includes mounting brackets 14 fixedly mounted on both sides of the bottom of the housing 2. The mounting brackets 14 have mounting holes 15 formed on their surfaces. The mounting assembly allows the device to be fixed in place at the desired location. During installation, the user can secure the mounting brackets 14 to the mounting base using bolts or self-tapping screws inserted through the mounting holes 15, thereby securing the device in place at the desired location.
[0022] It should be noted that the signal transmission mode of the temperature acquisition module in this embodiment includes wired transmission and wireless transmission, wherein wired transmission transmits temperature data by laying a dedicated communication line, such as using an RS485 bus structure, while wireless transmission uses one of Bluetooth, GPRS or MODBUS. Among them, Bluetooth technology provides a convenient wireless communication solution within a short distance and is suitable for temperature monitoring in local areas. GPRS technology supports long-distance data transmission and is suitable for large-scale or remote temperature monitoring applications. MODBUS is an application layer protocol that is widely used in the field of industrial automation and supports multiple network types for data transmission.
[0023] Preferably, the acquisition module body 1 is fixedly installed at the bottom of the inner cavity of the shell 2, and one end of the acquisition module body 1 passes through the shell 2 and extends to the outside of the shell 2. The top cover 3 is arranged at the top of the shell 2, and a heat dissipation component for dissipating heat from the acquisition module body 1 is provided between the top cover 3 and the shell 2. The heat dissipation component includes heat dissipation grooves 5 opened on both sides of the shell 2, two groups of cooling fans 6 are fixedly installed on the top of the top cover 3, and two groups of cooling holes 7 are opened on the top of the top cover 3. The two groups of cooling holes 7 are respectively arranged corresponding to the two groups of cooling fans 6.
[0024] By setting up the heat dissipation component, the collection module body 1 inside the shell 2 can be cooled. Specifically, when in use, the user can extract the air inside the shell 2 through the heat dissipation fan 6, and the external air will be replenished into the interior of the shell 2 through the heat dissipation groove 5, thereby increasing the air circulation speed inside the shell 2 to achieve the purpose of heat dissipation.
[0025] Among them, the top cover 3 can be lifted and lowered on the top of the shell 2 through an elastic connecting assembly. The elastic connecting assembly includes a connecting seat 8 fixedly installed at the four corners of the inner cavity of the shell 2. The four corners of the top of the top cover 3 are provided with an adjusting screw 9. The bottom end of the adjusting screw 9 passes through the top cover 3 and extends to the bottom of the top cover 3 and is threadedly connected to the top of the connecting seat 8. A compression spring 10 is fixedly installed on the top of the connecting seat 8. The top of the compression spring 10 is fixedly connected to the bottom of the top cover 3. A threaded hole 11 adapted to the adjusting screw 9 is opened on the top of the connecting seat 8, and the bottom end of the adjusting screw 9 is threadedly connected to the inner wall of the threaded hole 11.
[0026] When it is necessary to further improve the heat dissipation effect and efficiency inside the shell 2, the user can turn the adjusting screw 9. When the adjusting screw 9 is loosened, the reaction force generated by the contraction of the compression spring 10 will push the top cover 3 upward, so that there is a certain gap between the top cover 3 and the shell 2, thereby increasing the amount of air entering the shell 2, and then improving the heat dissipation effect and efficiency inside the shell 2.
[0027] It is worth noting that a dust screen 4 is fixedly mounted on the bottom of the top cover 3, and the surface of the dust screen 4 is slidably connected to the inner wall of the shell 2. Due to the provision of the dust screen 4, when the top cover 3 is raised so that a gap exists between the top cover 3 and the shell 2, the dust screen 4 can dustproof the gap between the top cover 3 and the shell 2, preventing external dust from entering the interior of the shell 2 through the gap between the top cover 3 and the shell 2 and adhering to the surface of the acquisition module body 1.
[0028] Furthermore, a movable groove 12 is formed on the surface of the dust screen 4 at a position corresponding to the connecting base 8. The inner wall of the movable groove 12 is slidably connected to the surface of the connecting base 8. A through hole 13 is also formed on the surface of the top cover 3 at a position corresponding to the adjusting screw 9. The bottom end of the adjusting screw 9 passes through the through hole 13 and extends to the bottom of the top cover 3. The provision of the movable groove 12 can prevent the connecting base 8 from hindering the movement of the dust screen 4. The provision of the through hole 13 makes it easier for the adjusting screw 9 to pass through the top cover 3 and be threadedly connected to the threaded hole 11 at the top of the connecting base 8.
[0029] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A temperature acquisition module with multiple communication modes, comprising an acquisition module body (1), a shell (2) and a top cover (3), wherein a mounting assembly is fixedly connected to the bottom of the shell (2), and characterized in that: The acquisition module body (1) is fixedly mounted on the bottom of the inner cavity of the shell (2), and one end of the acquisition module body (1) passes through the shell (2) and extends to the outside of the shell (2); the top cover (3) is arranged on the top of the shell (2), and the top cover (3) can be lifted and lowered on the top of the shell (2) through an elastic connection component; a dustproof net (4) is fixedly mounted on the bottom of the top cover (3); the surface of the dustproof net (4) is slidably connected to the inner wall of the shell (2); a heat dissipation component for dissipating heat from the acquisition module body (1) is provided between the top cover (3) and the shell (2).
2. The temperature acquisition module with multiple communication modes according to claim 1, characterized in that: The heat dissipation assembly comprises heat dissipation slots (5) provided on both sides of the housing (2), and two groups of heat dissipation fans (6) are fixedly mounted on the top of the top cover (3).
3. The temperature acquisition module with multiple communication modes according to claim 2, characterized in that: Two groups of heat dissipation holes (7) are provided on the top of the top cover (3), and the two groups of heat dissipation holes (7) are respectively arranged corresponding to the two groups of heat dissipation fans (6).
4. The temperature acquisition module with multiple communication modes according to claim 1, characterized in that: The elastic connection assembly comprises a connection seat (8) fixedly mounted on the four corners of the inner cavity of the shell (2); the four corners of the top of the top cover (3) are provided with an adjusting screw (9); the bottom end of the adjusting screw (9) passes through the top cover (3) and extends to the bottom of the top cover (3) and is threadedly connected to the top of the connection seat (8); a compression spring (10) is fixedly mounted on the top of the connection seat (8); the top end of the compression spring (10) is fixedly connected to the bottom of the top cover (3).
5. The temperature acquisition module with multiple communication modes according to claim 4, characterized in that: A threaded hole (11) adapted to the adjusting screw (9) is provided on the top of the connecting seat (8), and the bottom end of the adjusting screw (9) is threadedly connected to the inner wall of the threaded hole (11).
6. The temperature acquisition module with multiple communication modes according to claim 4, characterized in that: A movable groove (12) is provided on the surface of the dustproof net (4) at a position corresponding to the connecting seat (8), and an inner wall of the movable groove (12) is slidably connected to the surface of the connecting seat (8). A through hole (13) is also provided on the surface of the top cover (3) at a position corresponding to the adjusting screw (9), and the bottom end of the adjusting screw (9) passes through the through hole (13) and extends to the bottom of the top cover (3).
7. The temperature acquisition module with multiple communication modes according to claim 1, characterized in that: The mounting assembly comprises mounting frames (14) fixedly mounted on both sides of the bottom of the housing (2), and mounting holes (15) are provided on the surface of the mounting frames (14).
Citation Information
Patent Citations
Temperature acquisition module
CN219265528U