Plug-in type electronic module

Abstract

The utility model relates to the technical field of electronic components, in particular to a plug-in type electronic module, which overcomes the problems of large occupied space, poor stability, easy poor contact of conductive pins and high cost of the existing shell-mounted product, and adopts the scheme that the plug-in type electronic module comprises at least one electronic element, the electronic component is provided with a base, pins of the electronic component extend out of the bottom face of the base, the electronic component is provided with a positioning protrusion, the positioning protrusion is located on the outer side wall of the base, the electronic component is provided with a heat-shrinkable sleeve, and the heat-shrinkable sleeve wraps the positioning protrusion and wraps at least part of an electronic component body. According to the utility model, the base and the heat-shrinkable sleeve capable of firmly fixing the electronic element on the base are arranged, so that in a vibration environment, due to a structure with a low gravity center and stable contact, the element cannot be separated, the anti-vibration effect is exerted, and compared with a shell-shaped module, the temperature of the electronic element body is reduced by at least 20%.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic components, in particular to a plug-in type electronic module. Background Art

[0002] For example, an inrush current limiter (ICL), commonly found in plug-in on-board chargers for hybrid or electric vehicles, is designed to suppress the transient high current, or inrush current, generated at the moment electrical equipment starts up. This inrush current typically occurs in circuits containing inductive components (such as transformers, motors, and capacitors). When the power is first turned on, the inductive component's magnetic field builds or the capacitor charges, temporarily requiring a current much greater than that required during normal operation. When using a ceramic positive temperature coefficient thermistor (CPTC), due to its characteristics, when excessive current flows, it generates heat, causing its resistance to increase dramatically, thereby limiting the further increase in current and protecting the circuit. Its rated power typically reaches several kilowatts. Currently, when selecting a CPTC, customers generally require a compact and low-body temperature CPTC due to design space and PCB operating temperature constraints.

[0003] There are two main structures for this type of product. Both structures are required by users for easy installation and large contact surface. First, using shell packaging technology, the welded CPTC is encapsulated in a plastic shell and potted with insulating glue, such as the structure disclosed in patent publication No. CN2840282Y. The disadvantage of this structure is that the shell packaging requires a large volume. To solve the heat dissipation problem, it is necessary to further increase the internal space, which may cause customers to encounter difficulties in space design and is also costly. Second, using shell assembly technology, the CPTC chip is connected via metal spring sheets and assembled in the shell, such as the structures disclosed in patent publication No. JP2582422Y2 or CN201387777Y. The disadvantage of this structure is that the shell assembly technology does not use a welding process, and close contact cannot be formed between the chip and the conductive terminal. Under high voltage and high power applications, discharge between the metal spring sheet and the chip tip may occur, causing product failure. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a plug-in electronic module to overcome the problems of existing shell-mounted products such as large space occupation, poor stability, poor contact of conductive pins and high cost.

[0005] The technical solution adopted by the present invention to solve the technical problem is: a plug-in electronic module, including at least one electronic component, wherein the electronic component has a body and pins extending from the body, and is characterized by:

[0006] A base is provided, and pins of the electronic component extend from the bottom surface of the base;

[0007] A positioning protrusion is provided, and the positioning protrusion is located on the outer side wall of the base;

[0008] A heat shrink tubing is provided, which wraps the positioning protrusion and at least a portion of the electronic component body.

[0009] Specifically, in order to facilitate the processing of the base and the wrapping of the positioning protrusion with the heat shrink tubing, and to prevent the heat shrink tubing from exceeding the bottom surface of the base, the positioning protrusion is an annular flange integrally provided above the outer side wall of the base.

[0010] Specifically, there are two or more electronic components, and adjacent electronic components are arranged at intervals.

[0011] Specifically, the base has a blocking portion extending to the gap between adjacent electronic component bodies.

[0012] Specifically, in order to improve the fixing effect of the heat shrink tubing on the electronic component body and improve the heat exchange effect between the electronic component body and the outside air, the heat shrink tubing is shrunk above the electronic component body and has an opening.

[0013] Specifically, since the circuit board may be uneven, in order to improve the stability of the base on the circuit board, supporting protrusions are distributed on the bottom surface of the base.

[0014] Specifically, the electronic components included are single or multiple positive temperature coefficient thermistors, negative temperature coefficient thermistors, varistors, ceramic capacitors or varistors.

[0015] Specifically, the electronic components included are two or more of a positive temperature coefficient thermistor, a negative temperature coefficient thermistor, a varistor, a ceramic capacitor or a varistor.

[0016] Specifically, the heat shrink tube is a PE tube, a PET tube, a PTFE tube, an EVA tube or a silicone tube.

[0017] Specifically, the base is a ceramic base or a plastic base.

[0018] The beneficial effects of the utility model are:

[0019] First, by providing a base and a heat shrink tubing that can firmly fix the electronic component on the base, the center of gravity of the electronic component is firstly lowered (the head of the electronic component is large and the pin part is small, so the center of gravity is relatively high). Secondly, the electronic component and the base are connected in a wrapped manner by the heat shrink piece. Such a connection is equivalent to making the electronic component and the base into an integrated part. In addition, the base is placed stably on the circuit board. In a vibration environment, due to the low center of gravity and stable contact structure, the component will not fall off, and the anti-vibration effect is exerted. The utility model uses the heat shrink tubing generally used for explosion-proof protection and waterproof protection in the field to fix the parts;

[0020] Second, using heat shrink tubing instead of plastic shell can effectively reduce the working temperature. The heat exchange between electronic components and the working environment is more sufficient, and the body temperature is reduced by at least 20% under the same conditions.

[0021] 3. Using heat shrink tubing to replace the current shell products can reduce costs;

[0022] 4. The pins of electronic components do not need to be in the form of metal spring sheets to avoid poor electrical contact of the pins. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below with reference to the accompanying drawings and implementation examples.

[0024] Figure 1 This is a perspective view of Example 1 of the present utility model without the heat shrink tubing;

[0025] Figure 2 It is a three-dimensional embodiment of the present invention Figure 1 ;

[0026] Figure 3 It is a three-dimensional embodiment of the present invention Figure 2 ;

[0027] Figure 4 It is a cross-sectional view of Example 1 of the present utility model;

[0028] Figure 5 It is a cross-sectional view of Example 2 of the present utility model;

[0029] Figure 6 This is a comparison chart of the body temperature of the module of the utility model and the existing shell package module.

[0030] In the figure, 1 is the electronic component, 1-1 is the body, 1-2 is the pin;

[0031] 2. Base, 2-1. Positioning protrusion, 2-2. Blocking portion, 2-3. Supporting protrusion;

[0032] 3. Heat shrink tubing, 3-1. Opening. DETAILED DESCRIPTION

[0033] The present invention will now be described in further detail with reference to the accompanying drawings and preferred embodiments. These drawings are simplified schematic diagrams that only illustrate the basic structure of the present invention in a schematic manner, and therefore only show components related to the present invention.

[0034] Example 1:

[0035] As attached Figure 2 A plug-in electronic module, combined with an attached display showing the internal shape Figure 1 , including two electronic components 1, the electronic component 1 has a body 1-1 and a pin 1-2 extending from the body 1-1, and has a base 2. The pin 1-2 of the electronic component 1 extends from the bottom surface of the base 2 and has a positioning protrusion 2-1. The positioning protrusion 2-1 is located on the outer wall of the base 2. The positioning protrusion 2-1 is an annular flange integrally provided above the outer wall of the base 2. The heat shrinkable sleeve 3 is wrapped around the positioning protrusion 2-1 and the body 1-1 of the electronic component 1. The wrapped structure is as shown in the attached Figure 4 As shown, the heat shrinkable tube 3 is shrunk above the body 1-1 of the electronic component 1 and has an opening 3-1. The shape of the opening 3-1 is as shown in the attached figure. Figure 3 shown.

[0036] Combined with attachment Figure 1 and attached Figure 4 The two electronic components 1 are spaced apart, and the base 2 has a blocking portion 2 - 2 extending to the gap between the bodies 1 - 1 of the adjacent electronic components 1 .

[0037] The main body 1-1 of the electronic component 1 is oblate, or square, etc. The horizontal cross-sectional shape of the supporting part of the base 2 used is a rectangle with excessively rounded corners. The horizontal cross-sectional shape of the supporting part of the base 2 can also be circular, elliptical, etc. as needed.

[0038] In addition, four supporting protrusions 2 - 3 are distributed on the bottom surface of the base 2 .

[0039] In this embodiment, although the two electronic components 1 have the same shape and size, they may be the same type of electronic components or different types of electronic components.

[0040] Example 2:

[0041] As attached Figure 5 As shown, another structure uses two electronic components 1 with different shapes and sizes. Therefore, the shape of the heat shrinkable tube 3 after heat shrinkage is slightly different from that of the first embodiment. The two electronic components 1 with different shapes and sizes can be the same type of electronic components or different types of electronic components.

[0042] Each electronic component 1 included in the above exemplary module can be a positive temperature coefficient thermistor, a negative temperature coefficient thermistor, a varistor, a ceramic capacitor or a varistor.

[0043] The heat shrink tubing 3 in the above example module is a PE tube, a PET tube, a PTFE tube, an EVA tube or a silicone tube. The heat shrink tubing 3 can be added with fillers, such as flame retardants, such as magnesium hydroxide, aluminum hydroxide, nitrogen-phosphorus flame retardants or triphenyl phosphate, etc., and pigments can also be added as needed.

[0044] The base 2 in the above-mentioned example module is a ceramic base or a plastic base. The ceramic base of the ceramic base can be an oxide, such as aluminum oxide, beryllium oxide, cerium oxide or zirconium oxide, or a non-oxide, such as carbide, boride, nitride or silicide; the plastic of the plastic base is a thermosetting plastic or a thermoplastic plastic, wherein the melting point of the thermoplastic plastic must be greater than 120°C, such as: polyphenylene sulfide (PPS), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polypropylene (PP), polyoxymethylene (POM) or polybutylene terephthalate (PBT), and the thermosetting plastic is, for example, polyamide (PA); the base 2 can also be added with fillers, for example, the ceramic base can be added with MgO+SiO2, and the thermoplastic base can be added with fillers such as glass fiber or carbon fiber to increase the mechanical strength.

[0045] In the above example, the base 2 has not only a through hole for the pin 1 - 2 , but also a shallow groove for accommodating a portion of the body 1 - 1 .

[0046] The assembly process of the plug-in electronic module of the present invention is as follows: the electronic component 1 is plugged into the base 2, the pins 1-2 extend downward from the base 2, and the heat shrink tubing 3 is put on so that the lower end of the heat shrink tubing 3 is between the bottom surface of the base 2 and the positioning protrusion 2-1. The heat shrink tubing 3 is heated to shrink, and the body 1-1 is fixed to the base 2 by the heat shrink tubing 3. The upper end of the heat shrink tubing 3 is preferably higher than the body 1-1. In this way, after heat shrinkage, a shrinkage-shaped opening 3-1 is formed, which not only increases the wrapping force but also allows the body 1-1 to contact the external atmosphere.

[0047] The temperature rise of the electronic module of the present invention is shown in Table 1. The same electronic components are encapsulated in the housing for comparison. The two electronic modules are set in the same circuit and tested every 5 minutes for 500 minutes.

[0048] Table 1: Comparison of temperature rise between the present invention and the shell-packed product

[0049]

[0050]

[0051]

[0052] The test results show that the average temperature of the electronic module with heat shrinkable fixing sleeve is 96.1℃, which is 28% lower than the average temperature of the shell product of 133.4℃. Figure 6 It can be seen from the above that during the test period, the temperature of the present invention remained basically unchanged, while the temperature of the shelled product increased slowly.

[0053] The test results of the resistance change of the electronic module of the present invention under vibration conditions of 10 to 1000 Hz are shown in Table 2. The test standard is AEC-Q200; the frequency range is 10 to 1000 Hz; the acceleration is 5 g's; the direction is 3 mutually perpendicular directions; the duration is 12 hours (3×4 hours); and the number of samples is 30.

[0054] Table 2: Resistance change under 10-1000Hz vibration

[0055]

[0056]

[0057] The resistance value change rate of the utility model under the vibration condition of 10-1000 Hz is only 3.50% on average, while the resistance value change rate of the shell-mounted parts is larger, averaging 10.10%.

[0058] The test results of the resistance change of the electronic module of the present invention under vibration conditions of 10 to 2000 Hz are shown in Table 3. The test standard is AEC-Q200; the frequency range is 10 to 2000 Hz; the acceleration is 5 g's; the direction is 3 mutually perpendicular directions; the duration is 12 hours (3×4 hours); and the number of samples is 30.

[0059] Table 3: Resistance change under 10-2000Hz vibration

[0060]

[0061] The resistance value change rate of the utility model under the vibration condition of 10-2000 Hz is only 4.70% on average, while the resistance value change rate of the shell-mounted parts is larger, averaging 11.10%.

[0062] The above description only describes the specific implementation methods of the utility model. Various examples do not limit the essential content of the utility model. Ordinary technicians in the relevant technical field can make modifications or deformations to the specific implementation methods described above after reading the description without departing from the essence and scope of the utility model.

Claims

1. A plug-in electronic module comprising at least one electronic component (1), wherein the electronic component (1) comprises a body (1-1) and pins (1-2) extending from the body (1-1), and wherein: A base (2) is provided, and pins (1-2) of the electronic component (1) extend from the bottom surface of the base (2); A positioning protrusion (2-1) is provided, wherein the positioning protrusion (2-1) is located on the outer side wall of the base (2); A heat shrink tubing (3) is provided, wherein the heat shrink tubing (3) wraps the positioning protrusion (2-1) and wraps at least a portion of the electronic component (1) body (1-1).

2. The plug-in electronic module according to claim 1, wherein: The positioning protrusion (2-1) is an annular flange integrally arranged above the outer side wall of the base (2).

3. The plug-in electronic module according to claim 1, wherein: There are two or more electronic components (1), and adjacent electronic components (1) are arranged at intervals.

4. The plug-in electronic module according to claim 3, wherein: The base (2) has a blocking portion (2-2) extending to the gap between the adjacent electronic component (1) bodies (1-1).

5. The plug-in electronic module according to claim 1, wherein: The heat shrink tubing (3) is shrunk above the electronic component (1) body (1-1) and has an opening (3-1).

6. The plug-in electronic module according to claim 1, wherein: Supporting protrusions (2-3) are distributed on the bottom surface of the base (2).

7. The plug-in electronic module according to claim 1, wherein: The included electronic components (1) are single or multiple positive temperature coefficient thermistors, negative temperature coefficient thermistors, varistors, ceramic capacitors or varistors.

8. The plug-in electronic module according to claim 1, wherein: The included electronic components (1) are two or more of a positive temperature coefficient thermistor, a negative temperature coefficient thermistor, a varistor, a ceramic capacitor or a varistor.

9. The plug-in electronic module according to claim 1, wherein: The heat shrink tubing (3) is a PE tube, a PET tube, a PTFE tube, an EVA tube or a silicone tube.

10. The plug-in electronic module according to claim 1, characterized in that: The base (2) is a ceramic base or a plastic base.

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