Small-size large-current-resistant structure
Through the design of a small-size, high-current-resistant structure, the use of embedded mounting and epoxy resin glue fixation, combined with copper foil layer heat dissipation, the problems of insufficient current capacity and poor heat dissipation in the miniaturization of electronic equipment are solved, achieving the effect of miniaturization and rapid heat dissipation.
Patent Information
- Application Number
- CN202422782455.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-14
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-11-14
AI Technical Summary
The miniaturization of existing electronic devices has resulted in reduced current capabilities, making them unable to meet high operating current requirements and resulting in poor heat dissipation.
It adopts a small-size, high-current-resistant structure, including an outer rectangular manganese-zinc ferrite magnetic material, an inner rectangular manganese-zinc ferrite magnetic material, and a copper foil layer of a U-shaped electrode thick copper sheet. It is fixed by embedding and epoxy resin glue, combined with the heat dissipation design of the copper foil layer to achieve rapid heat dissipation.
It achieves miniaturization while meeting high current requirements, and improves the heat dissipation efficiency of the equipment through the heat dissipation effect of the copper foil layer.
Smart Images

Figure CN223378001U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of high current resistance improvement, in particular to a small-size high current resistance structure. Background Art
[0002] As current electronic devices are becoming increasingly miniaturized, the components of each electronic device also need to be miniaturized. However, the operating current and working environment required by electronic devices are getting higher and higher. Due to the material properties of ferrite magnetic materials, the current will be significantly reduced when the size is reduced, and it cannot bear the operating current requirements of the equipment. If the load of the equipment is to be met, the size of the product must be increased to meet the operating current. Based on the above situation, we have proposed a device that can withstand high current in a small size. Summary of the Invention
[0003] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a small-sized high-current-resistant structure that can achieve miniaturization and rapid heat dissipation.
[0004] The technical solution adopted by the utility model to solve its technical problems is:
[0005] A small-sized, high-current-resistant structure comprises an outer rectangular manganese-zinc ferrite magnetic material, an inner rectangular manganese-zinc ferrite magnetic material, and a copper foil layer of a U-shaped thick copper electrode sheet. The U-shaped thick copper electrode sheet is embedded in the inner rectangular manganese-zinc ferrite magnetic material. The inner rectangular manganese-zinc ferrite magnetic material is inserted and embedded from one side of the outer rectangular manganese-zinc ferrite magnetic material. Epoxy resin glue is then filled into the gap formed after assembly. The epoxy resin glue cools to form an adhesive layer, which adheres and fixes the outer rectangular manganese-zinc ferrite magnetic material, the inner rectangular manganese-zinc ferrite magnetic material, and the U-shaped thick copper electrode sheet. The copper foil layer is adhered to the top of the outer rectangular manganese-zinc ferrite magnetic material and the inner rectangular manganese-zinc ferrite magnetic material, and covers the U-shaped thick copper electrode sheet.
[0006] Preferably, an inner rectangular manganese-zinc ferrite magnet embedding cavity with a volume consistent with that of the inner rectangular manganese-zinc ferrite magnet is provided on one side of the outer rectangular manganese-zinc ferrite magnet corresponding to the inner rectangular manganese-zinc ferrite magnet, and a transverse embedding groove is provided in the middle of the inner side of the inner rectangular manganese-zinc ferrite magnet embedding cavity for cooperating with the positioning of the inner rectangular manganese-zinc ferrite magnet.
[0007] Preferably, transverse fillets are integrally formed on both sides of the exterior of the inner rectangular manganese-zinc ferrite magnetic material.
[0008] Preferably, an electrode thick copper sheet embedding cavity is opened on one side of the inner rectangular manganese zinc ferrite magnetic material, and the inner rectangular manganese zinc ferrite magnetic material is further integrally formed with an electrode thick copper sheet supporting block in the electrode thick copper sheet embedding cavity.
[0009] Furthermore, the upper end of the electrode thick copper sheet supporting block is set to be submerged.
[0010] The beneficial effects of the present invention are as follows: the present invention can meet the requirements of large current by inserting the inner rectangular manganese-zinc ferrite magnetic material equipped with a U-shaped electrode thick copper sheet into the outer rectangular manganese-zinc ferrite magnetic material. In addition, the heat generated during operation can be quickly dissipated by utilizing the principle of copper foil heat dissipation. Therefore, the small-size high-current resistant structure can achieve the purpose of miniaturization and rapid heat dissipation, and is suitable for large current. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 This is a structural diagram of a small-sized high-current resistant structure of the utility model;
[0012] Figure 2 for Figure 1 Bottom diagram of ;
[0013] Figure 3 for Figure 1 Side view of;
[0014] Figure 4 for Figure 1 Assembly drawing of the outer and middle rectangular manganese-zinc ferrite magnets and the inner rectangular manganese-zinc ferrite magnets;
[0015] Figure 5 for Figure 4 Exploded view of
[0016] Figure 6 for Figure 3 Sectional view of the AA plane;
[0017] Figure 7 for Figure 3 Cross-sectional view of the middle BB plane. DETAILED DESCRIPTION
[0018] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.
[0019] Example
[0020] A small size high current resistant structure, such as Figure 1-7 As shown, it includes an outer rectangular manganese-zinc ferrite magnetic material 1, an inner rectangular manganese-zinc ferrite magnetic material 2, and a copper foil layer 4 of a U-shaped electrode thick copper sheet 3. The U-shaped electrode thick copper sheet 3 is embedded in the inner rectangular manganese-zinc ferrite magnetic material 2. The inner rectangular manganese-zinc ferrite magnetic material 2 is inserted and embedded from one side of the outer rectangular manganese-zinc ferrite magnetic material 1. Then, epoxy resin glue is filled into the gap formed after assembly. The epoxy resin glue cools to form an adhesive layer so that the outer rectangular manganese-zinc ferrite magnetic material 1, the inner rectangular manganese-zinc ferrite magnetic material 2 and the U-shaped electrode thick copper sheet 3 are adhered and fixed. The copper foil layer 4 is adhered to the top of the outer rectangular manganese-zinc ferrite magnetic material 1 and the inner rectangular manganese-zinc ferrite magnetic material 2, and covers the U-shaped electrode thick copper sheet 3.
[0021] The outer rectangular manganese-zinc ferrite magnet 1 has a side corresponding to the inner rectangular manganese-zinc ferrite magnet 2, and is provided with an inner rectangular manganese-zinc ferrite magnet embedding cavity 11 with a volume consistent with the inner rectangular manganese-zinc ferrite magnet 2. The inner middle part of the inner rectangular manganese-zinc ferrite magnet embedding cavity 11 is provided with a transverse embedding groove 12 for cooperating with the positioning of the inner rectangular manganese-zinc ferrite magnet 2.
[0022] The outer sides of the inner rectangular manganese-zinc ferrite magnet 2 are integrally formed with transverse inserts 21. Specifically, when the inner rectangular manganese-zinc ferrite magnet 2 is inserted into the inner rectangular manganese-zinc ferrite magnet cavity 11 of the outer rectangular manganese-zinc ferrite magnet 1, the transverse inserts 21 cooperate with the transverse inserting grooves 12 to achieve directional insertion and prevent the inner rectangular manganese-zinc ferrite magnet 2 from vertically slipping out of the inner rectangular manganese-zinc ferrite magnet cavity 11.
[0023] It should be further explained that the method of inserting and embedding the inner rectangular manganese-zinc ferrite magnetic material 2 from one side of the outer rectangular manganese-zinc ferrite magnetic material 1 can further reduce the size of the high current resistant structure. After assembling the U-shaped electrode thick copper sheet 3, the copper foil layer 4 is used to improve the heat dissipation effect.
[0024] An electrode thick copper sheet embedding cavity 22 is opened on one side of the inner rectangular manganese zinc ferrite magnetic material 2. The inner rectangular manganese zinc ferrite magnetic material 2 also has an electrode thick copper sheet supporting block 23 integrally formed in the electrode thick copper sheet embedding cavity 22. Specifically, the U-shaped electrode thick copper sheet 3 is inverted and inserted into the electrode thick copper sheet embedding cavity 22, and is supported by the electrode thick copper sheet supporting block 23, which is convenient for filling with epoxy resin glue for pasting and fixing.
[0025] The upper end of the electrode thick copper sheet supporting block 23 is set to be sunken. Specifically, the upper end of the electrode thick copper sheet supporting block 23 is set to be sunken, so that the electrode thick copper sheet supporting block 23 forms a space reserved for assembling the U-shaped electrode thick copper sheet 3 in the electrode thick copper sheet embedding cavity 22, so that the bent end of the U-shaped electrode thick copper sheet 3 can be fully located in the electrode thick copper sheet embedding cavity 22, making it convenient for the copper foil layer 4 to fit closely with the outer rectangular manganese zinc ferrite magnetic material 1 and the inner rectangular manganese zinc ferrite magnetic material 2.
[0026] The above embodiments of the present invention are not intended to limit the scope of protection of the present invention, and the implementation methods of the present invention are not limited thereto. All other modifications, replacements or changes made to the above structure of the present invention based on the above contents of the present invention, in accordance with common technical knowledge and customary means in this field, without departing from the above basic technical ideas of the present invention, should fall within the scope of protection of the present invention.
Claims
1. A small-sized high-current resistant structure, comprising an outer rectangular manganese-zinc ferrite magnetic material, an inner rectangular manganese-zinc ferrite magnetic material, and a copper foil layer of a U-shaped electrode thick copper sheet, characterized in that: The U-shaped electrode thick copper sheet is embedded in the inner rectangular manganese zinc ferrite magnet. The inner rectangular manganese zinc ferrite magnet is inserted and embedded from one side of the outer rectangular manganese zinc ferrite magnet. Then, epoxy resin glue is filled into the gap formed after assembly. The epoxy resin glue cools to form an adhesive layer so that the outer rectangular manganese zinc ferrite magnet, the inner rectangular manganese zinc ferrite magnet and the U-shaped electrode thick copper sheet are adhered and fixed. The copper foil layer is adhered to the top of the outer rectangular manganese zinc ferrite magnet and the inner rectangular manganese zinc ferrite magnet, and covers the U-shaped electrode thick copper sheet.
2. The small-size high-current-resistant structure according to claim 1, characterized in that: An inner rectangular manganese-zinc ferrite magnetic material embedding cavity with a volume consistent with that of the inner rectangular manganese-zinc ferrite magnetic material is provided on one side of the outer rectangular manganese-zinc ferrite magnetic material corresponding to the inner rectangular manganese-zinc ferrite magnetic material to be embedded, and a transverse embedding groove is provided in the middle of the inner side of the inner rectangular manganese-zinc ferrite magnetic material embedding cavity to cooperate with the positioning of the inner rectangular manganese-zinc ferrite magnetic material.
3. The small-size high-current-resistant structure according to claim 1, characterized in that: Transverse fillets are integrally formed on both sides of the outer portion of the inner rectangular manganese-zinc ferrite magnetic material.
4. The small-size high-current-resistant structure according to claim 1, characterized in that: An electrode thick copper sheet embedding cavity is provided on one side of the inner rectangular manganese zinc ferrite magnetic material. An electrode thick copper sheet supporting block is integrally formed in the electrode thick copper sheet embedding cavity of the inner rectangular manganese zinc ferrite magnetic material.
5. The small-size high-current-resistant structure according to claim 4, characterized in that: The upper end of the electrode thick copper sheet supporting block is set to be submerged.