Mould pressing inductor

By designing a molded inductor with a flat lead structure, the direction of the magnetic field at the center of the inductor coil is made parallel to the bottom plane, which solves the problem of the vertical magnetic field at the center of the traditional molded inductor and improves the performance of the inductor.

CN223378004UActive Publication Date: 2025-09-23SHENZHEN HUALUO ELECTRONICS CO LTD
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Patent Information

Application Number
CN202422671004.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-01
Publication Date
2025-09-23
Estimated Expiration
2034-11-01

AI Technical Summary

Technical Problem

When the traditional molded inductor is powered on, the center magnetic field direction is perpendicular to the bottom plane of the inductor, which cannot meet the needs of some electronic devices.

Method used

A molded inductor is designed with a flat lead structure so that the long side of the flat part of the flat lead in the Y-axis direction is parallel to the center line of the coil. The coil is wrapped with a magnetic shell and pressed into shape to form an inductor product.

Benefits of technology

The direction of the magnetic field at the center of the inductor coil is made parallel to the plane at the bottom of the inductor, which reduces the cutting of the magnetic lines by the flat lead and improves the Q value.

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Abstract

The embodiment of the utility model discloses a mould pressing inductor which comprises a coil, a magnetic shell and a flat lead, and the coil is wrapped by the magnetic shell; the flat lead comprises a flat main line, the flat main line is connected with the coil and extends out of the magnetic shell in the direction opposite to the coil, and the long edge of the section, in the Y-axis direction, of the flat part of the flat main line is parallel to the center line of the coil. According to the scheme, the magnetic field direction of the inductance coil center is parallel to the inductor bottom plane.
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Description

Technical Field

[0001] The embodiments of the present application relate to the field of inductor technology, and specifically to a molded inductor. Background Art

[0002] In the field of electronics, inductors, as a fundamental circuit component, are widely used in circuits for filtering, resonance, voltage regulation, and oscillation. With the rapid development of electronics, the performance requirements for inductors are becoming increasingly stringent. The stability and reliability of their performance are crucial to the operation of the entire circuit system.

[0003] However, the structure and manufacturing method of traditional inductors can no longer meet some special needs to a certain extent. For example, the direction of the central magnetic field generated by traditional molded inductors after the chip is energized is perpendicular to the bottom plane of the inductor, which cannot meet the requirement of some electronic devices that the direction of the central magnetic field of the inductor coil is parallel to the bottom plane. Utility Model Content

[0004] The embodiments of the present application provide a molded inductor, which can make the magnetic field direction at the center of the inductor coil parallel to the bottom plane of the inductor.

[0005] An embodiment of the present application provides a molded inductor, comprising:

[0006] Coil;

[0007] a magnetic shell, the magnetic shell wrapping the coil;

[0008] A flat lead includes a flat main wire connected to the coil and extending in a direction away from the coil until it extends out of the magnetic shell, and the long side of the cross-section of the flat portion of the flat main wire in the Y-axis direction is parallel to the center line of the coil.

[0009] In the molded inductor provided in the embodiment of the present application, the flat lead further includes a flat extension line, the flat extension line is connected to the flat main line, and the flat extension line is extended and bent on the surface of the magnetic shell according to a preset scheme.

[0010] In the molded inductor provided in the embodiment of the present application, the flat lead is a copper wire, and at least a portion of the copper wire is flat.

[0011] In the molded inductor provided in an embodiment of the present application, the flat main line includes a lead and a flat terminal, one end of the lead is connected to the coil, and the other end of the lead is connected to the flat terminal, and the long side of the cross-section of the flat terminal in the Y-axis direction is parallel to the center line of the coil.

[0012] In the molded inductor provided in the embodiment of the present application, the lead is a copper wire.

[0013] In the molded inductor provided in the embodiment of the present application, the flat terminal is a copper sheet terminal.

[0014] In the molded inductor provided in the embodiment of the present application, a gap is provided between the flat extension line and the magnetic shell.

[0015] In the molded inductor provided in the embodiment of the present application, the coil is a single-layer coil or a multi-layer coil.

[0016] In summary, the molded inductor provided in the embodiments of the present application includes a coil, a magnetic shell, and a flat lead. The magnetic shell encases the coil; the flat lead includes a flat main wire connected to the coil and extending away from the coil until it protrudes from the magnetic shell. The long side of the flat portion of the flat main wire, along the Y-axis, is parallel to the centerline of the coil. This solution ensures that the magnetic field at the center of the inductor coil is parallel to the plane of the inductor's bottom surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1-Figure 2 Schematic diagram of the intermediate component structure in the manufacturing process of the molded inductor provided in an embodiment of the present application.

[0019] Figure 3 Schematic diagram of the structure of the molded inductor provided in an embodiment of the present application.

[0020] Figure 4-Figure 5 This is a schematic diagram of another intermediate component structure in the manufacturing process of the molded inductor provided in an embodiment of the present application.

[0021] Figure 6 This is another structural diagram of the molded inductor provided in the embodiment of the present application. DETAILED DESCRIPTION

[0022] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0023] Unless otherwise defined, all technical and scientific terms used in this application have the same meanings as those commonly understood by those skilled in the art to which this application belongs. The terms used in this application and in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" as used in this application includes any and all combinations of one or more of the relevant listed items.

[0024] It should be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" another element or layer, it can be directly on, adjacent to, connected to, or coupled to the other element or layer, or there can be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used solely to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion and are not to be understood as indicating or implying relative importance.

[0025] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," "above," "below," "upper," "lower," "upper," "lower," etc., may be used herein for convenience of description to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, the spatially relative terms are intended to also include different orientations of the device in use and operation. For example, if the device in the drawings is turned over, then the elements or features described as "under the other elements" or "under it" or "under it" will be oriented as "on" the other elements or features. Thus, the exemplary terms "under" and "under" can include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or in other orientations) and the spatial descriptors used herein are interpreted accordingly. In addition, terms such as "first," "second," etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance.

[0026] To a certain extent, the structure and manufacturing method of traditional inductors can no longer meet some special needs. For example, the direction of the central magnetic field generated by traditional molded inductors after the chip is energized is perpendicular to the bottom plane of the inductor, which cannot meet the requirement of some electronic devices that the direction of the central magnetic field of the inductor coil is parallel to the bottom plane.

[0027] Based on this, the embodiment of the present application provides a molded inductor. The technical solution shown in the present application will be described in detail below through specific embodiments. It should be noted that the order of description of the following embodiments does not limit the priority order of the embodiments.

[0028] See also Figure 3 or Figure 6 The molded inductor provided in this application may include a coil 10 , a magnetic shell 20 and a flat lead 30 .

[0029] Among them, the magnetic shell 20 wraps the coil 10; the flat lead 30 includes a flat main wire 21, which is connected to the coil 10 and extends in the direction away from the coil 10 until it protrudes out of the magnetic shell 20, and the long side of the cross-section of the flat part of the flat main wire 21 in the Y-axis direction is parallel to the center line of the coil 10.

[0030] It can be understood that since the long side of the cross section of the flat portion of the flat main line in the Y-axis direction is parallel to the center line of the coil 10, the magnetic field direction at the center of the inductor coil 10 is parallel to the bottom plane of the inductor.

[0031] In the embodiment of the present application, the flat lead 30 further includes a flat extension line 22 . The flat extension line 22 is connected to the flat main line 21 . The flat extension line 22 extends and bends on the surface of the magnetic shell 20 according to a preset scheme.

[0032] It is understood that the extension and bending direction of the flat extension line 22 can be designed according to actual needs and are not limited in the present embodiment. In some embodiments, a gap is provided between the flat extension line 22 and the magnetic shell 20 to improve the heat dissipation of the inductor.

[0033] It can be understood that the coil 10 in the embodiment of the present application can be a single-layer coil or a multi-layer coil.

[0034] In the specific implementation process, there are two ways to form the flat lead 30, as follows:

[0035] The first method: flatten the copper wire and pass it through the lead barrel and tension mechanism, clamp the copper wire with the clamp on the winding mechanism and fix it, wind it according to the designed number of layers and turns, then bend the copper wire, bend the two copper leads into a "one" shape, and the connecting line of the two copper leads and the center line of the coil are on the same plane, and then use a mechanical mechanism to flatten at least a part of the lead to obtain a flat lead, so that the long side of the cross-section of the flat part of the lead in the Y-axis direction is parallel to the center line of the copper coil. Finally, the flat part of the lead is tinned to obtain the following Figure 1 or Figure 4 The structure shown.

[0036] That is, in some embodiments, the flat lead 30 is a copper wire, and at least a portion of the copper wire is flat.

[0037] The second method: pull the copper wire flat and pass it through the lead barrel and tension mechanism, clamp the copper wire with the clamp on the winding mechanism and fix it, wind it according to the designed number of layers and turns, then bend the copper wire to bend the two copper leads into a "one" shape, finally, place the coil on the fixing fixture and weld the two copper leads to the copper sheet terminal, and make the long side of the cross section of the copper sheet terminal in the Y-axis direction parallel to the center line of the copper coil, so as to obtain the following Figure 1 or Figure 4 The structure shown.

[0038] That is, in some embodiments, the flat main wire 21 includes a lead wire and a flat terminal. One end of the lead wire is connected to the coil 10, and the other end of the lead wire is connected to the flat terminal. The long side of the flat terminal's cross-section in the Y-axis direction is parallel to the centerline of the coil 10. The lead wire is a copper wire, and the flat terminal is a copper sheet terminal.

[0039] In getting Figure 1 or Figure 4 After the structure shown, you can Figure 1 or Figure 4 The structure shown is placed in the mold cavity, filled with magnetic powder, and then pressed under a certain pressure into the following Figure 2 or Figure 5 It should be noted that the magnetic powder is a high-performance soft magnetic powder.

[0040] In the formation of Figure 2 or Figure 5 After the structure shown in FIG. 1 is formed, the flat lead 30 can be bent to form Figure 3 or Figure 6 Inductor products shown.

[0041] In summary, the molded inductor provided in the embodiment of the present application includes a coil 10, a magnetic shell 20, and a flat lead 30, wherein the magnetic shell 20 wraps the coil 10; the flat lead 30 includes a flat main wire 21, the flat main wire 21 is connected to the coil 10 and extends in a direction away from the coil 10 until it protrudes from the magnetic shell 20, and the long side of the cross-section of the flat portion of the flat main wire 21 in the Y-axis direction is parallel to the center line of the coil 10. Since the long side of the cross-section of the flat portion of the flat main wire 21 in the Y-axis direction is parallel to the center line of the coil 10, this solution can make the magnetic field direction at the center of the inductor coil 10 parallel to the bottom plane of the inductor, thereby reducing the cutting of the magnetic lines of force by the flat lead 30 and obtaining a better Q value.

[0042] The molded inductor provided in this application is introduced in detail above. Specific examples are used in this application to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the core idea of ​​this application. At the same time, for those skilled in the art, based on the ideas of this application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting this application.

Claims

1. A molded inductor, characterized in that: include: Coil; a magnetic shell, the magnetic shell wrapping the coil; A flat lead includes a flat main wire connected to the coil and extending in a direction away from the coil until it extends out of the magnetic shell, and the long side of the cross-section of the flat portion of the flat main wire in the Y-axis direction is parallel to the center line of the coil.

2. The molded inductor according to claim 1, wherein: The flat lead also includes a flat extension line, which is connected to the flat main line. The flat extension line is extended and bent on the surface of the magnetic shell according to a preset scheme.

3. The molded inductor according to claim 1, wherein: The flat lead is a copper wire, and at least a portion of the copper wire is flat.

4. The molded inductor according to claim 1, wherein: The flat main line includes a lead and a flat terminal, one end of the lead is connected to the coil, the other end of the lead is connected to the flat terminal, and the long side of the cross section of the flat terminal in the Y-axis direction is parallel to the center line of the coil.

5. The molded inductor according to claim 4, wherein: The lead wire is a copper wire.

6. The molded inductor according to claim 4, wherein: The flat terminal is a copper sheet terminal.

7. The molded inductor according to claim 2, wherein: A gap is formed between the flat extension line and the magnetic shell.

8. The molded inductor according to claim 1, wherein: The coil is a single-layer coil or a multi-layer coil.