Automatic wafer rewinding machine

Abstract

The utility model discloses an automatic wafer rewinding machine which comprises a working table, a wafer feeding and discharging box assembly, a material taking assembly, a bearing assembly, a transplanting assembly, a material pulling assembly and a feeding and discharging disc assembly, and the wafer feeding and discharging box assembly, the material taking assembly, the bearing assembly, the transplanting assembly and the feeding and discharging disc assembly are sequentially arranged on the working table. According to the utility model, automatic feeding, discharging and transplanting of wafers can be realized, the transplanting precision is ensured, the transplanting efficiency is improved, reciprocating type transplanting feeding and discharging can be realized, and the application range is widened.

Description

Technical Field

[0001] The utility model relates to an automatic wafer rewinding machine. Background Art

[0002] Wafers are silicon wafers used to make silicon semiconductor circuits. The starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form cylindrical single crystal silicon. Silicon ingots are ground, polished, and sliced ​​to form silicon wafers, also known as wafers. Domestic wafer production lines primarily focus on 8-inch and 12-inch wafers. Currently, wafer processing is typically performed in a single, one-way process, resulting in low efficiency and limited applicability. Utility Model Content

[0003] The main technical problem solved by the utility model is to provide an automatic wafer flipping machine, which can realize automatic loading and unloading and transplanting of wafers, ensure transplanting accuracy, improve transplanting efficiency, and realize reciprocating transplanting and loading and unloading, thereby increasing the scope of application.

[0004] In order to solve the above technical problems, a technical solution adopted by the present invention is: to provide an automatic wafer flipping machine, including a workbench, a wafer loading and unloading box assembly, a material picking assembly, a bearing assembly, a transfer assembly, a material pulling assembly and an loading and unloading tray assembly, the wafer loading and unloading box assembly, the material picking assembly, the bearing assembly, the transfer assembly and the loading and unloading tray assembly are arranged in sequence on the workbench, the wafer loading and unloading box assembly includes a mounting frame, a positioning seat, a material box, a loading button and a pressing cylinder, the mounting frame is arranged in an upper and lower arc-shaped structure, the positioning seat is arranged on the lower mounting frame, the material box is arranged on the positioning seat, the loading button is arranged on one side of the positioning seat, the pressing cylinder is arranged on the upper mounting frame and the driving end is fixed downward to the top of the material box, the The material picking assembly includes a first Z-axis linear module, a hollow rotating platform, a material picking table, a telescopic material picking module and a first insert. The first Z-axis linear module is arranged on the concave side of the arc-shaped structure of the mounting frame and is located below the workbench. The material picking table is horizontally distributed and has a hollow structure that penetrates horizontally. The bottom of the material picking table is arranged on the top of the first Z-axis linear module through a horizontally distributed hollow rotating platform. The telescopic material picking module is horizontally distributed in the material picking table and corresponds to the first insert that drives the horizontal distribution. The bearing assembly includes a bearing frame, a limit block, a positioning block and a correction cylinder. The bearing frame is fixed on the upper surface of the workbench. Two limit blocks are arranged at intervals, and arc-shaped concave surfaces are arranged on opposite sides of the two limit blocks. The positioning block is arranged between the two limit blocks. , a negative pressure adsorption hole is provided on the positioning block, and two correcting cylinders are transversely provided and relatively fixed on the outer sides of the two limit blocks. The transplanting assembly includes a Y-axis linear module, a transplanting platform, a second Z-axis linear module, a lifting seat, a lifting synchronization cylinder, a lifting plate, a negative pressure adsorption frame, a third Z-axis linear module, a first X-axis linear module and a second insert. The transplanting platform is arranged in a hollow structure and the top is arranged to be open. A slide is provided on the top of the transplanting platform in the X-axis direction. The bottom of the transplanting platform is fixed to the workbench through the Y-axis linear module, the second Z-axis linear module is fixed to the bottom of the transplanting platform and the driving end is provided with a lifting seat located in the transplanting platform, and the top of the lifting seat is provided with a longitudinally distributed lifting synchronization cylinder, and the top of the lifting synchronization cylinder is at A horizontally distributed jacking plate is provided in the Y-axis direction, a negative pressure adsorption frame is provided on the top of the jacking plate, the first X-axis linear module is fixed above the workbench by a bracket, the driving end of the first X-axis linear module is provided with a third Z-axis linear module, the driving end of the third Z-axis linear module is provided with a horizontally distributed second insert, the pulling assembly includes a second X-axis linear module, a jacking and picking cylinder, a picking plate and a hook, the second X-axis linear module is fixed on one side of the transplanting platform, the jacking and picking cylinder is longitudinally fixed to the driving end of the second X-axis linear module and a horizontally distributed picking plate is provided on the top, the picking plate is provided with a downwardly distributed hook on one side of the upper and lower material tray assembly, the upper and lower material tray assembly includes a fourth Z-axis linear module, a silo and a material plate,The fourth Z-axis linear module is fixed to the workbench, and the hopper is fixed to the driving end at the top of the fourth Z-axis linear module. The hopper is arranged to penetrate in the X-axis direction. Multiple sheet materials are arranged horizontally, and the multiple sheet materials are arranged horizontally in the hopper at intervals in the longitudinal direction. The surface of the sheet material is provided with multiple concave positioning grooves, and each of the positioning grooves is provided with multiple positioning holes corresponding to the negative pressure adsorption frame. The sheet material is provided with a hook hole on one side of the hook claw.

[0005] In a preferred embodiment of the present invention, the positioning seat, the material box, the loading button and the pressing cylinder are arranged in multiple groups at equal intervals on the mounting frame.

[0006] In a preferred embodiment of the present invention, the telescopic material-picking module and the first handle are provided in two groups and are staggered up and down. The telescopic material-picking module is driven by a motor-driven synchronous belt or a linear module. A suction hole connected to the airway is provided longitudinally through the end of the first handle.

[0007] In a preferred embodiment of the present invention, a plurality of the jacking synchronization cylinders are arranged in parallel in the X-axis direction, a jacking plate is provided on the top of any of the jacking synchronization cylinders, a plurality of negative pressure adsorption racks are evenly spaced and provided on the top of any of the jacking plates in the Y-axis direction, the negative pressure adsorption racks on the two adjacent jacking plates are staggered, the third Z-axis linear module, the first X-axis linear module and the second insert are arranged in two groups in the Y-axis direction and the two second inserts are staggered up and down, and the end of the second insert is also longitudinally penetrated with a suction hole connected to the airway.

[0008] In a preferred embodiment of the present invention, a limit sensor is provided on the top of the transplanting platform in the X-axis direction on one side of the bearing assembly, and a positioning assembly corresponding to the slide is provided in the Y-axis direction. The positioning assembly includes a positioning cylinder and a positioning rod, and the positioning cylinder drives the positioning rod to move in the Y-axis direction.

[0009] In a preferred embodiment of the present invention, two groups of upper and lower material tray assemblies are provided in the Y-axis direction.

[0010] The beneficial effects of the utility model are as follows: the automatic wafer flipping machine disclosed by the utility model can realize automatic loading and unloading and transplanting of wafers, ensure transplanting accuracy, improve transplanting efficiency, and realize reciprocating transplanting and loading and unloading, thereby increasing the scope of application. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work. Among them:

[0012] Figure 1 This is a top perspective view of a preferred embodiment of an automatic wafer rewinding machine of the present invention;

[0013] Figure 2 yes Figure 1 Front view of

[0014] Figure 3 This is a bottom perspective view of a preferred embodiment of an automatic wafer rewinding machine of the present invention;

[0015] Figure 4 This is another top perspective view of a preferred embodiment of the automatic wafer rewinding machine of the present invention, with part of the structure of the retrieving platform removed;

[0016] Figure 5 yes Figure 4 Top view of . DETAILED DESCRIPTION

[0017] The following is a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] See also Figure 1-Figure 5 As shown, the embodiment of the utility model includes:

[0019] A wafer automatic flipping machine includes a workbench 1, a wafer loading and unloading box assembly, a material picking assembly, a bearing assembly, a transplanting assembly, a material pulling assembly and an loading and unloading tray assembly. The wafer loading and unloading box assembly, the material picking assembly, the bearing assembly, the transplanting assembly and the loading and unloading tray assembly are sequentially arranged on the workbench 1.

[0020] Among them, the wafer loading and unloading box assembly includes a mounting frame 2, a positioning seat 3, a box 4, a loading button 5 and a pressing cylinder 6.

[0021] The mounting frame 2 is arranged in an arc-shaped structure with upper and lower layers. The positioning seat 3, the material box 4, the loading button 5 and the pressing cylinder 6 are arranged in multiple groups at equal intervals on the mounting frame 2 to realize multi-station loading and unloading.

[0022] The positioning seat 3 is arranged on the lower mounting frame 2 to provide positioning for the bottom of the material box 4.

[0023] The material box 4 is arranged on the positioning seat 3, which is convenient for quick assembly.

[0024] A plurality of wafers are arranged in the material box 4 at equal intervals in the longitudinal direction to facilitate loading and unloading.

[0025] The loading button 5 is arranged on one side of the positioning seat 3. After loading the material box 4, the staff presses the loading button 5 to confirm, which is convenient for subsequent operations.

[0026] The pressing cylinder 6 is arranged on the upper mounting frame 2 and the driving end is fixed to the top of the material box 4 downward. After confirming that the material box 4 is loaded, the pressing cylinder 6 presses down to press and fix the material box 4.

[0027] The material picking assembly includes a first Z-axis linear module 7 , a hollow rotating platform 8 , a material picking platform 9 , a telescopic material picking module 10 and a first inserter 11 .

[0028] The first Z-axis linear module 7 is disposed on the concave side of the arc-shaped structure of the mounting frame 2 and is located below the workbench 1 to provide longitudinal adjustment.

[0029] The retrieving platform 9 is horizontally distributed and has a hollow structure that runs horizontally through it. The bottom of the retrieving platform 9 is connected to the top of the first Z-axis linear module 7 through a horizontally distributed hollow rotating platform 8. The retrieving platform 9 can achieve Z-axis elevation and horizontal rotation to retrieve materials from the magazines 4 at different workstations. A sensor is installed on the top of the retrieving platform 9 to detect the wafers in the magazines, ensuring accurate material retrieval.

[0030] The telescopic material taking module 10 is horizontally distributed in the material taking platform 9 and correspondingly drives the horizontally distributed first inserter 11 . The telescopic material taking module 10 drives the first inserter 11 to the material box 4 to take the wafer.

[0031] The telescopic material taking module 10 and the first inserter 11 are provided in two groups and are staggered in an upper and lower position. The telescopic material taking module 10 is driven by a motor-driven synchronous belt or a linear module. The present application adopts a motor-driven synchronous belt drive structure.

[0032] The end of the first inserting handle 11 is longitudinally penetrated by a suction hole connected to the airway, so as to absorb the wafer by negative pressure.

[0033] In the same material box 4, one telescopic material taking module 10 drives the first inserter 11 to pick up a wafer and then moves a wafer taking position on the Z axis. The other telescopic material taking module 10 drives the first inserter 11 to pick up another wafer and then sends it to the carrying component position.

[0034] The bearing assembly includes a bearing frame 12 , a limiting block 13 , a positioning block and a deviation-correcting cylinder 14 .

[0035] The carrier frame 12 is fixed to the upper surface of the workbench 1 to provide a working station.

[0036] Two limiting blocks 13 are provided at intervals, and arc-shaped concave surfaces are provided on opposite sides of the two limiting blocks 13 to limit the wafer.

[0037] The positioning block is arranged between the two limiting blocks 13 . The positioning block is provided with negative pressure adsorption holes for fixing the adjusted wafer by negative pressure adsorption.

[0038] The two correcting cylinders 14 are arranged horizontally and relatively fixed on the outer sides of the two limit blocks 13. The wafer is placed on the positioning block through the first insert 11, clamped and positioned by the two correcting cylinders 14, and then fixed by negative pressure adsorption holes of the positioning block.

[0039] The transplanting assembly includes a Y-axis linear module 15, a transplanting platform 16, a second Z-axis linear module 17, a lifting seat 18, a lifting synchronization cylinder, a lifting plate 19, a negative pressure adsorption frame 20, a third Z-axis linear module 21, a first X-axis linear module 22 and a second insert 23.

[0040] The transplanting platform 16 is configured as a hollow structure with an opening at the top to facilitate the installation of internal components.

[0041] A limit sensor 24 is provided on the top of the transplanting platform 16 in the X-axis direction on one side of the supporting assembly for limiting the position after movement in the X-axis direction.

[0042] A slideway 25 is provided on the top of the transplanting platform 16 in the X-axis direction for horizontal movement along the slideway 25 .

[0043] The transplanting platform 16 is provided with a positioning assembly corresponding to the slide 25 in the Y-axis direction. The positioning assembly includes a positioning cylinder 26 and a positioning rod 27. The positioning cylinder 26 drives the positioning rod 27 to move in the Y-axis direction, and the positioning in the Y-axis direction is achieved by driving the positioning rod 27 by the positioning cylinder 26.

[0044] The bottom of the transplanting platform 16 is fixed on the workbench 1 through the Y-axis linear module 15, so that the transplanting platform 16 can move horizontally in the Y-axis direction.

[0045] The second Z-axis linear module 17 is fixed to the bottom of the transplanting platform 16 and a driving end is provided with a lifting seat 18 located in the transplanting platform 16 , and the lifting seat 18 is lifted and lowered by the second Z-axis linear module 17 .

[0046] The top of the jacking seat 18 is provided with a longitudinally distributed jacking synchronization cylinder (not shown in the accompanying drawings). There are multiple jacking synchronization cylinders arranged in parallel in the X-axis direction. This application provides 4 of them. The top of any of the jacking synchronization cylinders is provided with a horizontally distributed jacking plate 19 in the Y-axis direction to realize the sequential jacking operation of the jacking plate 19 in the X-axis direction.

[0047] Multiple negative pressure adsorption racks 20 are evenly spaced along the Y-axis on top of each lift plate 19. Each rack 20 is equipped with multiple longitudinally distributed negative pressure adsorption tubes for adsorbing and securing wafers, and they rise and fall synchronously under the action of the lift plate 19. The negative pressure adsorption racks 20 on two adjacent lift plates 19 are staggered. In this application, they are arranged in a 3-2-3-2 pattern to achieve an orderly and reasonable layout.

[0048] The third Z-axis linear module 21, the first X-axis linear module 22, and the second inserts 23 are arranged in two groups along the Y-axis, with the two second inserts 23 staggered vertically for alternate wafer transfer. The ends of the second inserts 23 are also longitudinally penetrated by suction holes connected to the airway for suctioning wafers.

[0049] The first X-axis linear module 22 is fixed above the workbench 1 through a bracket. The driving end of the first X-axis linear module 22 is provided with a third Z-axis linear module 21. The driving end of the third Z-axis linear module 21 is provided with a horizontally distributed second plug 23. The two groups of second plugs 23 absorb the wafer on the positioning block after adjustment in the X-axis direction and the Z-axis direction. The transfer table 16 reciprocates under the drive of the Y-axis linear module 15, corresponding to the two groups of second plugs 23 respectively, and the wafer is adsorbed and fixed by the negative pressure adsorption frame 20.

[0050] The material pulling assembly includes a second X-axis linear module, a lifting and material taking cylinder 28 , a material taking plate 29 and a hook 30 .

[0051] The second X-axis linear module (not shown) is fixed to one side of the transplanting platform 16 to provide driving for movement in the X-axis direction.

[0052] The lifting and picking cylinder 28 is longitudinally fixed to the driving end of the second X-axis linear module and a horizontally distributed picking plate 29 is set on the top. The lifting and picking cylinder 28 moves in the X-axis direction and provides the picking plate 29 with lifting and picking in the Z-axis direction.

[0053] The material taking plate 29 is provided with a downwardly distributed hook claw 30 on one side of the upper and lower material tray components, and is positioned and driven by the hook claw 30.

[0054] The upper and lower material tray assemblies are provided with two groups in the Y-axis direction to provide double-station feeding.

[0055] The upper and lower tray assembly includes a fourth Z-axis linear module 31 , a material bin 32 and a material plate 33 .

[0056] The fourth Z-axis linear module 31 is fixed on the workbench 1 , and the hopper 32 is fixed to the driving end on the top of the fourth Z-axis linear module 31 . The lifting and lowering of the hopper 32 is achieved through the fourth Z-axis linear module 31 .

[0057] The material bin 32 is arranged to penetrate in the X-axis direction, so as to facilitate unloading of materials in the X-axis direction.

[0058] The material plates 33 are horizontally distributed in a plurality, and the plurality of material plates 33 are horizontally distributed in the material bin 32 at longitudinal intervals, so as to facilitate loading and unloading operations.

[0059] The surface of the material plate 33 is provided with a plurality of concave positioning grooves for placing wafers.

[0060] Any of the positioning grooves is provided with multiple positioning holes corresponding to the negative pressure adsorption rack 20, so that the negative pressure adsorption tube of the negative pressure adsorption rack 20 passes through the positioning hole to adsorb the wafer above the positioning groove. After the negative pressure adsorption racks 20 on the same lifting plate 19 adsorb the wafer, the lifting synchronization cylinder descends to send the wafer into the positioning groove.

[0061] The sheet 33 is provided with a hook hole on one side of the hook 30. Under the action of the second X-axis linear module and the lifting and retrieving cylinder 28, the hook 30 hooks the sheet 33 from the hopper 32 and pulls the sheet 33 into the slide 25 of the transfer platform 16. It is limited to the designated position by the limit sensor 24 and positioned by the positioning assembly. After that, the second Z-axis linear module 17 drives the lifting seat 18 to rise, and the lifting synchronous cylinder drives the lifting plate 19 to rise. The negative pressure adsorption tube of the negative pressure adsorption rack 20 passes through the positioning hole of the sheet 33 to perform the adsorption operation on the wafer. After all wafers are placed in the positioning grooves of the sheet 33, the sheet 33 is sent back to the hopper 32 via the pulling assembly. The fourth Z-axis linear module 31 drives the hopper 32 to move one sheet 33 retrieving station, and the sheet 33 is pulled out again to repeat the filling operation.

[0062] Working principle:

[0063] The staff first installed the material box 4 with the wafer in place. The first Z-axis linear module 7 and the hollow rotating platform 8 cooperated to make the two sets of telescopic material-picking modules 10 drive the first inserter 11 to pick up the wafer, and then sent it to the positioning block between the limit blocks 13. It was clamped and corrected by the correction cylinder 14 and then adsorbed and fixed. On the other side, the second X-axis linear module and the lifting material-picking cylinder 28 cooperated to drive the claw 30 to hook the material plate 33 in the hopper 32 to the top of the transplanting table 16. After that, the two sets of third Z-axis linear modules 21 and the first X-axis linear module 22 respectively drove the second inserter 23 to suck the wafer. To take the wafers, the Y-axis linear module 15 drives the transfer table 16 to move on the Y-axis to adsorb the wafers on the negative pressure adsorption rack 20 respectively, and then arrange the wafers in sequence in the material plate 33. After the material plate 33 is full, the second X-axis linear module and the lifting and taking material cylinder 28 cooperate to drive the hook 30 to send the material plate 33 back to the silo 32. After the fourth Z-axis linear module 31 drives the silo 32 to move one material plate 33 station, the second X-axis linear module and the lifting and taking material cylinder 28 cooperate to drive the hook 30 to hook the material plate 33 to the top of the transfer table 16 in the silo 32, and repeat the above filling steps.

[0064] At the same time, the above structure can also work in reverse to send the wafers in the material plate 33 back into the material box 4.

[0065] The wafers and plates are positioned on both sides of the material box and the material bin through longitudinally spaced groove structures. At the same time, the telescopic material picking module and the linear modules used are all existing structures.

[0066] In summary, the automatic wafer flipping machine pointed out in the present invention can realize the automatic loading and unloading and transplanting of wafers, ensure the transplanting accuracy, improve the transplanting efficiency, and realize reciprocating transplanting and loading and unloading, thereby increasing the scope of application.

[0067] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A wafer automatic rewinding machine, characterized in that: The material picking assembly comprises a workbench, a wafer loading and unloading box assembly, a material picking assembly, a bearing assembly, a transferring assembly, a material pulling assembly and a material loading and unloading tray assembly. The wafer loading and unloading box assembly, the material picking assembly, the bearing assembly, the transferring assembly and the material loading and unloading tray assembly are sequentially arranged on the workbench. The wafer loading and unloading box assembly comprises a mounting frame, a positioning seat, a material box, a loading button and a pressing cylinder. The mounting frame is arranged in an upper and lower arc-shaped structure. The positioning seat is arranged on the lower mounting frame, the material box is arranged on the positioning seat, the loading button is arranged on one side of the positioning seat, and the pressing cylinder is arranged on the upper mounting frame and the driving end is fixed downward to the top of the material box. The material picking assembly comprises a first Z-axis linear module, a hollow rotating platform, a material picking table, a telescopic material picking module and a first hand. The first Z-axis linear module is arranged on the concave side of the arc-shaped structure of the mounting frame and is located below the workbench. The material-retrieving platform is horizontally distributed and has a hollow structure that penetrates horizontally. The bottom of the material-retrieving platform is arranged on the top of the first Z-axis linear module through a horizontally distributed hollow rotating platform. The telescopic material-retrieving module is horizontally distributed in the material-retrieving platform and corresponds to the first hand that drives the horizontal distribution. The bearing assembly includes a bearing frame, a limit block, a positioning block and a correction cylinder. The bearing frame is fixed to the upper surface of the workbench. Two limit blocks are arranged at intervals, and arc-shaped concave surfaces are arranged on opposite sides of the two limit blocks. The positioning block is arranged between the two limit blocks. A negative pressure adsorption hole is provided on the positioning block. Two correction cylinders are arranged horizontally and are relatively fixed to the two limit blocks. On the outer side, the transplanting assembly includes a Y-axis linear module, a transplanting platform, a second Z-axis linear module, a lifting seat, a lifting synchronous cylinder, a lifting plate, a negative pressure adsorption frame, a third Z-axis linear module, a first X-axis linear module and a second insert. The transplanting platform is arranged in a hollow structure and the top is arranged to be open. A slide is arranged on the top of the transplanting platform in the X-axis direction. The bottom of the transplanting platform is fixed to the workbench through the Y-axis linear module. The second Z-axis linear module is fixed to the bottom of the transplanting platform and the driving end is provided with a lifting seat located in the transplanting platform. The top of the lifting seat is provided with a longitudinally distributed lifting synchronous cylinder. The top of the lifting synchronous cylinder is provided with a horizontally distributed lifting plate in the Y-axis direction. The top of the lifting plate is provided with a negative pressure adsorption frame. The first X-axis linear The module is fixed above the workbench through a bracket, and the driving end of the first X-axis linear module is provided with a third Z-axis linear module, and the driving end of the third Z-axis linear module is provided with a horizontally distributed second handle, and the pulling assembly includes a second X-axis linear module, a lifting and picking cylinder, a picking plate and a hook, and the second X-axis linear module is fixed to one side of the transplanting platform, and the lifting and picking cylinder is longitudinally fixed to the driving end of the second X-axis linear module and a horizontally distributed picking plate is provided on the top, and the picking plate is provided with a downwardly distributed hook on one side of the upper and lower material tray assembly, and the upper and lower material tray assembly includes a fourth Z-axis linear module, a hopper and a material plate, and the fourth Z-axis linear module is fixed on the workbench, and the hopper is fixed to the driving end on the top of the fourth Z-axis linear module.The material bin is arranged through the X-axis direction, and multiple material plates are arranged horizontally. Multiple material plates are arranged horizontally in the material bin at intervals in the longitudinal direction. The surface of the material plate is provided with multiple concave positioning grooves, and each positioning groove is provided with multiple positioning holes corresponding to the negative pressure adsorption frame. The material plate is provided with a hook hole on one side of the hook claw.

2. The automatic wafer rewinding machine according to claim 1, characterized in that: The positioning seats, material boxes, feeding buttons and pressing cylinders are arranged in multiple groups at equal intervals on the mounting frame.

3. The automatic wafer rewinding machine according to claim 1, characterized in that: The telescopic material taking module and the first inserter are provided in two groups and are staggered in an upper and lower position. The telescopic material taking module is driven by a synchronous belt driven by a motor or a linear module. The end of the first inserter is longitudinally penetrated by a suction hole connected to the airway.

4. The automatic wafer rewinding machine according to claim 1, characterized in that: There are multiple lifting synchronous cylinders arranged in parallel in the X-axis direction, and a lifting plate is provided on the top of any lifting synchronous cylinder. A plurality of negative pressure adsorption racks are evenly spaced and arranged on the top of any lifting plate in the Y-axis direction. The negative pressure adsorption racks on two adjacent lifting plates are staggered. The third Z-axis linear module, the first X-axis linear module and the second insert are arranged in two groups in the Y-axis direction, and the two second inserts are staggered up and down. The end of the second insert is also longitudinally penetrated by a suction hole connected to the airway.

5. The automatic wafer rewinding machine according to claim 1, characterized in that: A limit sensor is provided on the top of the transplanting platform in the X-axis direction on one side of the bearing component, and a positioning component corresponding to the slide is provided in the Y-axis direction. The positioning component includes a positioning cylinder and a positioning rod. The positioning cylinder drives the positioning rod to move in the Y-axis direction.

6. The automatic wafer rewinding machine according to claim 1, characterized in that: The upper and lower material tray assemblies are provided with two groups in the Y-axis direction.

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