Permanent magnet direct current motor
By setting a semiconductor refrigeration module at the winding assembly position and optimizing the winding support frame structure, the problem of the permanent magnet DC motor's heat dissipation being unable to be balanced with the motor size, cost and power loss is solved, achieving a heat dissipation effect with high efficiency and low energy consumption.
Patent Information
- Application Number
- CN202421629053.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-10
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-07-10
AI Technical Summary
Existing permanent magnet DC motors have the problem of not being able to balance heat dissipation with motor size, cost and power loss.
A semiconductor refrigeration module is set at the winding assembly position, utilizing its low energy consumption and high efficiency heat dissipation characteristics, combined with the optimized structure of the winding support frame and the thermal conductive metal skin to enhance the heat dissipation effect, and powered by the motor working power supply to avoid complex wiring.
Efficient heat dissipation is achieved, which avoids the increase of motor size and weight, reduces power loss and improves the heat dissipation performance of the motor.
Smart Images

Figure CN223379011U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of motor equipment, in particular to a permanent magnet DC motor. Background Art
[0002] In modern industrial production and everyday life, electric motors, as an important power source, are widely used in various devices. High-power-density DC permanent magnet motors, in particular, are widely used in the aerospace field due to their high efficiency, high power density, and excellent dynamic performance. However, as motor power density increases, motor overheating becomes increasingly serious, affecting not only efficiency and lifespan but also potentially leading to motor failure. Therefore, effectively addressing motor heat dissipation and improving its heat dissipation performance are pressing challenges in motor design and manufacturing.
[0003] Existing solutions primarily improve the motor's heat dissipation by improving its structural design, such as adding heat sinks and fans. Other solutions involve modifying the motor's materials, such as using high-thermal-conductivity materials. Conventional motors are cooled with water or oil, but the bulk of these systems inevitably increases the motor's overall weight and reduces its torque density. Furthermore, because the motor's posture is fluid and subject to change, liquid cooling is unsuitable for aerospace applications.
[0004] In addition, although existing solutions have improved the heat dissipation performance of motors to a certain extent, some problems and shortcomings still exist. First, existing solutions often require increasing the size and weight of the motor, which not only increases the manufacturing cost of the motor but also affects the portability and scope of use of the motor. Second, existing solutions often significantly increase the power consumption of the motor, which not only reduces the efficiency of the motor but also increases the operating cost of the motor. Finally, while existing solutions improve the heat dissipation performance of the motor, they often increase the noise of the motor, which affects the use environment and user experience of the motor.
[0005] In summary, existing permanent magnet DC motor equipment has the technical problem of being unable to balance heat dissipation with motor size, cost and power loss. Utility Model Content
[0006] The technical problem to be solved by the utility model is that the existing permanent magnet DC motor equipment has a technical problem that the heat dissipation and the motor size, cost and power loss cannot be taken into account at the same time.
[0007] To solve the above problems, the utility model provides a permanent magnet DC motor, comprising a permanent magnet component and a winding component coaxially arranged for relative rotation, the winding component comprising a coil winding and a winding support frame for supporting the winding of the coil winding, the winding support frame being provided with an installation groove, a semiconductor refrigeration module being provided in the installation groove, the cooling end of the semiconductor refrigeration module being adjacent to the side where the coil winding is located, the high temperature end of the semiconductor refrigeration module being towards the outer edge of the winding component, and the semiconductor refrigeration module being electrically connected to the power supply module of the motor.
[0008] The technical solution provided by the present invention provides an additional heat dissipation device at the winding assembly position of the motor. Specifically, an installation groove is provided at the winding support frame supporting the coil winding, and a semiconductor refrigeration module is provided in the installation groove. The low energy consumption and high effect characteristics of semiconductor refrigeration are utilized to generate a local low temperature zone at the coil winding position in the motor where heat is most likely to be generated, thereby absorbing a large amount of heat and producing a significant cooling effect on the coil winding position. The high temperature end of the semiconductor refrigeration module is correspondingly directed toward the outer edge of the winding assembly so that the heat can be discharged as quickly as possible through other physical heat dissipation methods. The semiconductor refrigeration module is directly powered by the working power supply of the motor, avoiding the complex and redundant wiring structure. This design utilizes new semiconductor technology to solve the heat dissipation problem of high-power permanent magnet DC motors, and can avoid adding too many conventional heat dissipation structures, avoiding a significant increase in the size and weight of the motor. The working principle of the semiconductor refrigeration itself ensures that it can provide an extremely significant local cooling effect with relatively low power consumption, effectively solving the technical problem that the heat dissipation of existing permanent magnet DC motor equipment cannot be balanced with the motor size, cost and power loss.
[0009] As a preferred solution, the winding support frame is cylindrical, and the inner edge surface of the winding support frame is provided with a wire slot structure along the axial direction of the motor, and the coil winding is positioned and installed in the wire slot structure; the installation groove is provided on the outer edge surface of the winding support frame, and the installation groove is adjacent to the position of the wire slot structure.
[0010] This design optimizes the structure of the winding support frame, which adopts a hollow cylindrical structure and optimizes the structure of the position where the inner circumference directly contacts the coil winding. A wire slot structure is used to position the coil winding; the installation slot is located near the outer edge of the winding support frame and adjacent to the wire slot structure on the inner edge of the support frame, so that the semiconductor refrigeration module is positioned as close to the coil winding as possible to ensure the heat dissipation effect.
[0011] As a preferred solution, the wire trough structure is in the shape of a straight trough and is evenly distributed on the inner edge surface of the winding support frame, and the installation groove is in the shape of a straight trough with openings at both ends and is evenly distributed on the outer edge surface of the winding support frame. The distribution of the installation groove is consistent with the distribution of the wire trough structure.
[0012] This design optimizes the structural design of the wire trough structure and the installation slot. The wire trough structure is linear, and multiple wire troughs are evenly distributed on the inner edge surface of the winding support frame at a preset circumferential distance. Similar to the distribution of the wire trough structure, the installation slot or the semiconductor refrigeration module adopts the same linear structure and circumferentially uniform distribution, ensuring the correspondence between the heat dissipation area and the concentrated area of the coil winding, ensuring the heat dissipation and cooling effect.
[0013] As a preferred solution, both ends of the semiconductor refrigeration module are provided with plug-in interface structures, and the plug-in interface structures are provided with end clips for clamping and positioning the end of the semiconductor refrigeration module with the opening position of the installation slot.
[0014] This design optimizes the way the semiconductor refrigeration module fits with the mounting slot. Plug-in interfaces are provided at both ends of the semiconductor refrigeration module for easy installation. This structure, combined with the end clips, can simply position the semiconductor refrigeration module in the mounting slot. Given the linear shape of the mounting slot itself with openings at both ends, the semiconductor refrigeration module can be inserted into the mounting slot relatively easily. After the semiconductor is loaded into the mounting slot, a limit can be formed at the end of the semiconductor refrigeration module by installing the matching end clips at both ends of the semiconductor refrigeration module, thereby ensuring that the semiconductor refrigeration module is firmly positioned and preventing the semiconductor refrigeration module from falling out of the mounting slot due to vibration during motor operation.
[0015] As a preferred solution, the end buckle is a heat-resistant plastic buckle. This design optimizes the design of the end buckle. The use of heat-resistant plastic buckle can avoid the buckle from melting or becoming brittle and breaking due to excessive temperature during heat dissipation, ensuring the end buckle is firm and durable.
[0016] As a preferred solution, the outer edge of the winding support frame is integrally connected to a thermally conductive metal skin structure. This design optimizes the structural design of the winding support frame. The metal skin structure is installed on the exterior of the structure where the semiconductor cooling module is mounted. The metal skin is composed of a metal plate with excellent thermal conductivity. This ensures that during the semiconductor cooling process in operation, heat generated by the high-temperature end of the semiconductor can be quickly dissipated to the outside through the thermally conductive metal skin, further improving the heat dissipation effect on the motor equipment.
[0017] As a preferred solution, a cooling fan is coaxially connected to the output shaft of the permanent magnet DC motor. The cooling fan is located on one side of the winding assembly and is used to actively drive the cooling fan's rotation when the motor output shaft rotates, thereby dissipating heat from the permanent magnet DC motor. This design, based on the aforementioned semiconductor cooling system, further enhances the motor's air cooling capabilities by utilizing a cooling fan coaxially positioned with the motor output shaft. This allows the cooling fan to rotate directly under the active power of the output shaft during motor operation, achieving active fan cooling synchronized with the DC motor's operating state.
[0018] As a preferred solution, a fan cover structure is provided on the outer edge of the cooling fan to protect and shield the cooling fan. The outer end surface of the fan cover structure is provided with a grid-like heat sink for heat dissipation. This design protects the cooling fan integrated with the motor. Since the cooling fan is directly mounted on the motor output shaft, it actually increases the axial dimension of the motor. To protect the cooling fan from the longitudinal direction, the fan cover structure is provided. This structure effectively protects the internal fan, and a grid-like heat sink is provided at the end of the cover to ensure heat dissipation at this location.
[0019] As a preferred solution, a heat sink housing is sheathed around the outer periphery of the heat-conducting metal skin structure at the outer edge of the winding support frame. Axially distributed heat sink grilles are installed within the heat sink housing. The ends of the heat sink grilles are opened toward the cooling fan, allowing the airflow generated by the cooling fan to pass through the heat sink grilles to remove heat. This design, in conjunction with the cooling fan structure, provides a matching heat sink housing structure at the outer edge of the winding support frame, and axially distributed heat sink grilles are installed within the heat sink housing. This allows the airflow generated by the cooling fan to pass through the heat sink grilles, effectively removing heat from the semiconductor refrigeration module. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 A schematic diagram of the structure of a winding assembly of a permanent magnet DC motor provided by the utility model;
[0021] Figure 2 for Figure 1 Schematic diagram of the exploded structure of the winding assembly;
[0022] Figure 3 The utility model provides a schematic diagram of the overall disassembled structure of a permanent magnet DC motor.
[0023] in, Figure 1-Figure 3 middle:
[0024] 1. Winding support frame; 1-1. Wire trough structure; 1-2. Mounting slot; 1-3. Thermal conductive metal skin structure; 2. Semiconductor refrigeration module; 3. Terminal clip; 4. Heat dissipation housing; 4-1. Heat dissipation grid; 5. Cooling fan; 6. Fan cover structure; 6-1. Grid-shaped heat dissipation plate. DETAILED DESCRIPTION
[0025] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.
[0026] Before explaining the working principle of the present invention in detail, the description of the present invention needs to be further explained: In the description of the present invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "two ends," "one end," "the other end," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0027] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc. should be understood in a broad sense. For example, "connected" may refer to a fixed connection, a detachable connection, or an integral connection; it may refer to a mechanical connection, a direct connection, an indirect connection via an intermediate medium, or a connection between two components by welding. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model in specific circumstances.
[0028] refer to Figure 1-Figure 3 The following examples are described, Figure 1 A schematic diagram of the structure of a winding assembly of a permanent magnet DC motor provided by the utility model; Figure 2 for Figure 1 Schematic diagram of the exploded structure of the winding assembly; Figure 3 The utility model provides a schematic diagram of the overall disassembled structure of a permanent magnet DC motor.
[0029] The permanent magnet DC motor provided in this embodiment includes a permanent magnet assembly and a winding assembly that are coaxially arranged to rotate relative to each other. The winding assembly includes a coil winding and a winding support frame 1 for supporting the coil winding. The winding support frame 1 is provided with an installation groove 1-2. A semiconductor refrigeration module 2 is provided in the installation groove 1-2. The cooling end of the semiconductor refrigeration module 2 is adjacent to the side where the coil winding is located, and the high-temperature end of the semiconductor refrigeration module 2 faces the outer edge of the winding assembly. The semiconductor refrigeration module 2 is electrically connected to the power supply module of the motor.
[0030] The technical solution provided by the present invention provides an additional heat dissipation device at the winding assembly position of the motor. Specifically, a mounting groove 1-2 is provided at the winding support frame 1 supporting the coil winding, and a semiconductor refrigeration module 2 is provided in the mounting groove 1-2. The low energy consumption and high effect characteristics of semiconductor refrigeration are utilized to generate a local low temperature zone at the coil winding position in the motor where heat is most likely to be generated, thereby absorbing a large amount of heat and having a significant cooling effect on the coil winding position. The high temperature end of the semiconductor refrigeration module 2 is correspondingly directed toward the outer edge of the winding assembly so that the heat can be discharged as quickly as possible through other physical heat dissipation methods. The semiconductor refrigeration module 2 is directly powered by the working power supply of the motor, avoiding the complex and redundant wiring structure. This design utilizes new semiconductor technology to solve the heat dissipation problem of high-power permanent magnet DC motors, and can avoid adding too many conventional heat dissipation structures, avoiding a significant increase in the size and weight of the motor. The working principle of the semiconductor refrigeration itself ensures that it can provide an extremely significant local cooling effect with relatively low power consumption, effectively solving the technical problem that existing permanent magnet DC motor equipment cannot balance heat dissipation with motor size, cost and power loss.
[0031] In the technical solution provided in this embodiment, the winding support frame 1 is cylindrical in shape. A wire slot structure 1-1 is provided on the inner edge of the winding support frame 1 along the motor's axial direction. The coil winding is positioned and installed in the wire slot structure 1-1. Mounting slots 1-2 are provided on the outer edge of the winding support frame 1, adjacent to the wire slot structure 1-1. This design optimizes the structure of the winding support frame 1, employing a hollow cylindrical structure and optimizing the structure of the inner circumference where it directly contacts the coil winding. A wire slot structure is employed to position the coil winding. Mounting slots 1-2 are located near the outer edge of the winding support frame 1, adjacent to the wire slot structure 1-1 on the inner edge of the support frame, allowing the semiconductor cooling module to be positioned as close to the coil winding as possible to ensure effective heat dissipation.
[0032] In the technical solution provided by this embodiment, the wire slot structure 1-1 is in the form of a linear slot, evenly distributed on the inner edge of the winding support frame 1. The mounting slots 1-2 are in the form of a linear slot with both ends open, evenly distributed on the outer edge of the winding support frame 1. The distribution of the mounting slots 1-2 is consistent with that of the wire slot structure 1-1. This design optimizes the structural design of the wire slot structure 1-1 and the mounting slots 1-2. The wire slot structure 1-1 is linear, and multiple wire slots are evenly distributed on the inner edge of the winding support frame 1 at predetermined circumferential intervals, similar to the distribution of the wire slot structure 1-1. The mounting slots 1-2, or the semiconductor cooling modules 2, adopt the same linear structure and uniform circumferential distribution, ensuring that the heat dissipation area corresponds to the area where the coil windings are concentrated, thereby ensuring the heat dissipation and cooling effect.
[0033] In the technical solution provided by this embodiment, a plug-in interface structure is provided at both ends of the semiconductor refrigeration module 2, and an end snap 3 is provided at the position of the plug-in interface structure to snap the end of the semiconductor refrigeration module to the opening position of the installation groove 1-2 for positioning. This design optimizes the way in which the semiconductor refrigeration module 2 cooperates with the installation groove 1-2. Plug-in interfaces are provided at both ends of the semiconductor refrigeration module 2 to facilitate installation and cooperation. This structure, in conjunction with the end snap 3, can simply realize the positioning of the semiconductor refrigeration module in the installation groove 1-2. Given the linear shape of the installation groove 1-2 with both ends open, the semiconductor refrigeration module can be relatively easily inserted into the installation groove 1-2. After the semiconductor is installed in the installation groove 1-2, the end snap 3 installed at both ends of the semiconductor refrigeration module can form a limit at the end of the semiconductor refrigeration module, ensuring the firm positioning of the semiconductor refrigeration module and preventing the semiconductor refrigeration module from falling out of the installation groove 1-2 due to vibration during motor operation.
[0034] In the technical solution provided by this embodiment, the end clip 3 is a heat-resistant plastic clip. This design optimizes the design of the end clip 3. The use of heat-resistant plastic clips can prevent the clip from melting or becoming brittle and breaking due to excessive temperatures during heat dissipation, ensuring the durability of the end clip 3.
[0035] In the technical solution provided by this embodiment, the outer edge of the winding support frame 1 is integrally connected to a thermally conductive metal skin structure 1-3. This design optimizes the structural design of the winding support frame 1. The metal skin structure is provided on the exterior of the structure where the semiconductor cooling module is mounted. The metal skin is composed of a metal plate with excellent thermal conductivity. This ensures that during the semiconductor cooling process in operation, heat generated by the high-temperature end of the semiconductor can be quickly dissipated to the outside through the thermally conductive metal skin, further improving the heat dissipation effect on the motor equipment.
[0036] In the technical solution provided by this embodiment, a cooling fan 5 is coaxially connected to the output shaft of the permanent magnet DC motor. Located on one side of the winding assembly, the cooling fan 5 is actively driven by the motor output shaft to dissipate heat from the motor. This design, building on the previously mentioned semiconductor cooling system, further enhances the motor's air cooling capabilities by placing the cooling fan 5 coaxially with the motor output shaft. This allows the fan 5 to rotate directly under the active power of the output shaft during motor operation, achieving active fan cooling synchronized with the DC motor's operating state.
[0037] In the technical solution provided in this embodiment, a fan cover structure 6 is provided on the outer edge of the cooling fan 5 to protect and shield the cooling fan 5. A grid-like heat sink 6-1 is installed on the outer end surface of the fan cover structure 6 for heat dissipation. This design protects the cooling fan 5, which is integrated with the motor. Since the cooling fan 5 is directly mounted on the motor output shaft, the motor's axial dimension is effectively increased. To protect the cooling fan 5 from the longitudinal direction, the fan cover structure is provided. This structure effectively protects the internal fan, and a grid-like heat sink 6-1 is provided at the end of the cover to ensure heat dissipation at this location.
[0038] In the technical solution provided in this embodiment, a heat sink housing 4 is sheathed around the outer periphery of the heat-conducting metal skin structure 1-3 at the outer edge of the winding support frame 1. Within this housing 4, an axially distributed heat sink grid 4-1 is disposed. The end openings of the heat sink grid 4-1 face toward the cooling fan 5, allowing the airflow generated by the cooling fan 5 to pass through the heat sink grid 4-1 and remove heat. This design, in conjunction with the structure of the cooling fan 5, provides a matching heat sink housing structure at the outer edge of the winding support frame 1, and axially distributed heat sink grids 4-1 within the heat sink housing 4. This allows the airflow generated by the cooling fan 5 to pass through the heat sink grid 4-1, effectively removing heat from the semiconductor refrigeration module.
[0039] Although the disclosure is as described above, the scope of protection of the disclosure is not limited thereto. Those skilled in the art may make various changes and modifications without departing from the spirit and scope of the disclosure, and these changes and modifications will fall within the scope of protection of the utility model.
Claims
1. A permanent magnet DC motor, comprising a permanent magnet assembly and a winding assembly coaxially arranged to rotate relative to each other, wherein the winding assembly comprises a coil winding and a winding support frame (1) for supporting the coil winding, characterized in that: The winding support frame (1) is provided with an installation groove (1-2), a semiconductor refrigeration module (2) is provided in the installation groove (1-2), a refrigeration end of the semiconductor refrigeration module (2) is adjacent to a side where the coil winding is located, a high-temperature end of the semiconductor refrigeration module (2) faces the outer edge of the winding assembly, and the semiconductor refrigeration module (2) is electrically connected to a power supply module of the motor.
2. The permanent magnet DC motor according to claim 1, characterized in that: The winding support frame (1) is cylindrical in shape, and a wire slot structure (1-1) is provided on the inner edge surface of the winding support frame (1) along the axial direction of the motor, and the coil winding is positioned and installed on the wire slot structure (1-1); the installation groove (1-2) is provided on the outer edge surface of the winding support frame (1), and the installation groove (1-2) is adjacent to the wire slot structure (1-1).
3. The permanent magnet DC motor according to claim 2, characterized in that: The wire slot structure (1-1) is in the form of a linear slot body and is evenly distributed on the inner edge surface of the winding support frame (1); the installation slot (1-2) is in the form of a linear slot body with both ends open and is evenly distributed on the outer edge surface of the winding support frame (1); the distribution mode of the installation slot (1-2) is consistent with the distribution mode of the wire slot structure (1-1).
4. The permanent magnet DC motor according to claim 3, characterized in that: Both ends of the semiconductor refrigeration module (2) are provided with plug-in interface structures, and the plug-in interface structures are provided with end buckles (3) for clamping and positioning the end of the semiconductor refrigeration module (2) with the opening position of the installation slot (1-2).
5. The permanent magnet DC motor according to claim 4, characterized in that: The end buckle (3) is a heat-resistant plastic buckle.
6. The permanent magnet DC motor according to any one of claims 2 to 5, characterized in that: The outer edge of the winding support frame (1) is integrally connected with a heat-conducting metal skin structure (1-3).
7. The permanent magnet DC motor according to claim 6, characterized in that: The output shaft of the permanent magnet DC motor is coaxially connected to a cooling fan (5), and the cooling fan (5) is located on one side of the winding assembly and is used to actively drive the rotation of the cooling fan (5) when the motor output shaft rotates, so as to dissipate heat from the permanent magnet DC motor.
8. The permanent magnet DC motor according to claim 7, characterized in that: The outer edge of the heat dissipation fan (5) is provided with a fan cover structure (6) for protecting and shielding the heat dissipation fan (5), and the outer end surface of the fan cover structure (6) is provided with a grid-shaped heat dissipation plate (6-1) for heat dissipation.
9. The permanent magnet DC motor according to claim 7, characterized in that: A heat dissipation housing (4) is provided on the outer periphery of the heat-conducting metal skin structure (1-3) at the outer edge of the winding support frame (1), and an axially distributed heat dissipation grid (4-1) is provided in the heat dissipation housing (4). The end opening of the heat dissipation grid (4-1) faces the heat dissipation fan (5) so as to allow the airflow generated by the heat dissipation fan (5) to pass through the heat dissipation grid (4-1) to remove heat.