MEMS device, microphone and electronic product

Abstract

The utility model discloses an MEMS device, a microphone and an electronic product, and the MEMS device comprises a substrate which is provided with a sound guide hole penetrating along the thickness direction of the substrate; the shell is arranged on the substrate, the shell and the substrate are matched to define an accommodating cavity for accommodating components, and a sound leakage hole is formed in the shell; and the air leakage structural member is arranged in the sound leakage hole, and the air leakage structural member can be opened or closed so as to balance the pressure inside and outside the shell. According to the MEMS device provided by the utility model, the shell is provided with the sound leakage hole, and the air leakage structural member is arranged in the sound leakage hole, so that when the air pressure in the MEMS device is greater than the air pressure of the external environment, the air leakage structural member can be opened and release the pressure in the accommodating cavity, thereby timely and effectively ensuring the air pressure balance inside and outside the shell, and improving the acoustic performance of the device; and the reliability of the device is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of micro-electromechanical systems, and more specifically, to a MEMS device, a microphone and an electronic product. Background Art

[0002] As consumer electronics demand increased resistance to acoustic pressure surges, the need for products with air release and pressure reduction capabilities has become increasingly important. Traditional MEMS devices lack the ability to release air in response to external sound pressure fluctuations, preventing them from effectively releasing pressure within the device. This leads to imbalanced sound pressure inside and outside the device, impacting the device's acoustic performance. Utility Model Content

[0003] One purpose of the present utility model is to provide a new technical solution for MEMS devices, microphones and electronic products, which can at least solve the problem in the prior art that MEMS devices cannot release the pressure inside the device in a timely and effective manner, resulting in the inability to balance the sound pressure inside and outside the device, thereby affecting the acoustic performance of the device.

[0004] In a first aspect of the present invention, a MEMS device is provided, comprising: a substrate, the substrate being provided with a sound-conducting hole extending through the substrate in a thickness direction thereof; a shell, the shell being provided on the substrate, the shell and the substrate cooperating to define a housing cavity for accommodating components, the shell being provided with a sound leakage hole; and an air leakage structure, the air leakage structure being provided in the sound leakage hole, the air leakage structure being able to be opened or closed to balance the pressure inside and outside the shell.

[0005] Optionally, the air leakage structure includes: a mounting part, which is arranged on the side wall of the sound leakage hole; a adapter, which is connected to the mounting part and is movable relative to the mounting part; a first opening and closing piece, which is connected to the adapter; and a second opening and closing piece, which is arranged on the other side wall of the sound leakage hole, and the first opening and closing piece and the second opening and closing piece can be buckled or opened with each other to balance the pressure inside and outside the shell.

[0006] Optionally, the first opening and closing piece and the second opening and closing piece are arc-shaped pieces respectively, and a portion of the first opening and closing piece can be buckled onto the second opening and closing piece.

[0007] Optionally, the first opening and closing piece and the second opening and closing piece are rubber gaskets respectively.

[0008] Optionally, at a position where the first opening and closing piece and the second opening and closing piece are buckled with each other, surfaces of the first opening and closing piece and the second opening and closing piece that contact each other form a serrated contact surface.

[0009] Optionally, the mounting member is a mounting seat, and the adapter is a bearing, a spring or a spring.

[0010] Optionally, the substrate is connected to the shell by bonding or soldering.

[0011] Optionally, the MEMS device further includes: a MEMS chip, which is arranged on the substrate, located in the accommodating cavity, and corresponds to the sound guide hole; an ASIC chip, which is arranged on the substrate, located in the accommodating cavity, and connected to the MEMS chip via a gold wire.

[0012] A second aspect of the present invention provides a microphone, comprising the MEMS device described in the above embodiment.

[0013] A third aspect of the present invention provides an electronic product comprising the microphone described in the above embodiment.

[0014] The MEMS device of the present invention is provided with a sound leakage hole on the shell, and by arranging an air leakage structure in the sound leakage hole, when the air pressure inside the MEMS device is greater than the external environmental pressure, the air leakage structure can open to release the pressure in the accommodating cavity, thereby timely and effectively ensuring the air pressure balance inside and outside the shell, improving the acoustic performance of the device, and ensuring the reliability of the device.

[0015] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0017] Figure 1 1 is a schematic structural diagram of a MEMS device according to an embodiment of the present utility model;

[0018] Figure 2 yes Figure 1 A partial enlarged view of area A in the middle.

[0019] Reference numerals:

[0020] Base plate 10; sound guide hole 11;

[0021] Shell 20; Accommodation cavity 21; Sound leakage hole 22;

[0022] Deflating structure 30; mounting member 31; adapter 32; first opening and closing piece 33; second opening and closing piece 34;

[0023] MEMS chip 41; ASIC chip 42; gold wire 43. DETAILED DESCRIPTION

[0024] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0025] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present invention, its application, or uses.

[0026] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0027] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0028] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0029] In the specification and claims of this utility model, references to features using the terms "first" or "second" may explicitly or implicitly include one or more of these features. In the description of this utility model, unless otherwise specified, "plurality" means two or more. Furthermore, in the specification and claims, "and / or" refers to at least one of the connected items, and the character " / " generally indicates an "or" relationship between the connected items.

[0030] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0031] In the description of this utility model, it should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, removable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal connections between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0032] The MEMS device according to the embodiment of the present invention is described in detail below with reference to the accompanying drawings.

[0033] like Figure 1 and Figure 2 As shown, the MEMS device according to the embodiment of the present invention includes a substrate 10 , a housing 20 and a degassing structure 30 .

[0034] Specifically, the substrate 10 is provided with a sound-conducting hole 11 extending through its thickness. A housing 20 is disposed on the substrate 10. The housing 20 and the substrate 10 cooperate to define a cavity 21 for accommodating components. The housing 20 is also provided with a sound leakage hole 22. An air leakage structure 30 is disposed within the sound leakage hole 22. The air leakage structure 30 can be opened or closed to balance the pressure inside and outside the housing 20.

[0035] In other words, if Figure 1 As shown, the MEMS device (Micro-Electro-Mechanical System) according to the embodiment of the present invention is mainly composed of a substrate 10, a shell 20 and an air leakage structure 30. Among them, a sound guide hole 11 is provided on the substrate 10, and the sound guide hole 11 passes through the thickness direction of the substrate 10, and the external air flow can be introduced into the MEMS device through the sound guide hole 11. The shell 20 is installed on the substrate 10, and the shell 20 has an inner cavity. The shell 20 and the substrate 10 cooperate to define a accommodating cavity 21 that can be used to accommodate components. A sound leakage hole 22 is provided on the shell 20, and the air flow in the accommodating cavity 21 can be discharged through the sound leakage hole 22. As shown Figure 1 and Figure 2 As shown, the air release structure 30 is installed in the sound leakage hole 22 and can be opened or closed. When the air pressure in the accommodating chamber 21 is greater than the air pressure of the external environment, the air release structure 30 can open and release the pressure in the accommodating chamber 21, thereby promptly and effectively ensuring the air pressure balance inside and outside the housing 20, improving the acoustic performance of the device and ensuring the reliability of the device. When the air pressure in the accommodating chamber 21 is less than or equal to the air pressure of the external environment, the air release structure 30 can close, thus ensuring the air pressure balance inside and outside the housing 20.

[0036] In the present invention, the MEMS device is easy to operate and has a simple structure. The venting structure 30 can be directly applied to the MEMS device housing 20. Of course, those skilled in the art can flexibly design the size, shape, and number of the venting structure 30 based on the specific size and shape of the sound vent hole 22, and this will not be described in detail in the present invention.

[0037] Therefore, according to the MEMS device of the embodiment of the present invention, a sound leakage hole 22 is provided on the shell 20, and by providing an air leakage structure 30 in the sound leakage hole 22, when the air pressure inside the MEMS device is greater than the external environmental pressure, the air leakage structure 30 can be opened to release the pressure in the accommodating cavity 21, thereby timely and effectively ensuring the air pressure balance inside and outside the shell 20, improving the acoustic performance of the device, and ensuring the reliability of the device.

[0038] According to an embodiment of the present invention, the deflation structure 30 includes a mounting member 31 , an adapter 32 , a first opening and closing piece 33 , and a second opening and closing piece 34 .

[0039] Specifically, a mounting member 31 is disposed on a side wall of the sound leakage hole 22. An adapter 32 is connected to the mounting member 31 and is movable relative to the mounting member 31. A first opening and closing piece 33 is connected to the adapter 32, and a second opening and closing piece 34 is disposed on the other side wall of the sound leakage hole 22. The first opening and closing piece 33 and the second opening and closing piece 34 can be engaged or disengaged to balance the pressure inside and outside the housing 20.

[0040] That is to say, if Figure 2 As shown, the air-deflating structure 30 is mainly composed of a mounting part 31, an adapter 32, a first opening and closing piece 33 and a second opening and closing piece 34. The air-deflating structure 30 can be set as a mechanical buckling structure, wherein the mounting part 31 is installed on the side wall of the sound leakage hole 22. The adapter 32 is connected to the mounting part 31, and the adapter 32 is movable relative to the mounting part 31. The first opening and closing piece 33 is connected to the adapter 32, and the second opening and closing piece 34 is installed on the other side wall of the sound leakage hole 22. The first opening and closing piece 33 and the second opening and closing piece 34 can be buckled or opened with each other. When the air pressure in the accommodating chamber 21 is greater than the air pressure of the external environment, the first opening and closing piece 33 and the second opening and closing piece 34 open to each other. At this time, the air-deflating structure 30 opens, releasing the pressure in the accommodating chamber 21, thereby timely and effectively ensuring the air pressure balance inside and outside the shell 20, improving the acoustic performance of the device, and ensuring the reliability of the device. When the air pressure in the accommodating cavity 21 is less than or equal to the air pressure of the external environment, the first opening and closing piece 33 and the second opening and closing piece 34 are engaged with each other. At this time, the air release structure 30 is closed, thereby increasing the sealing performance of the MEMS device and ensuring the air pressure balance inside and outside the shell 20.

[0041] According to an embodiment of the present invention, the first opening and closing piece 33 and the second opening and closing piece 34 are arc-shaped pieces, and a portion of the first opening and closing piece 33 can be buckled onto the second opening and closing piece 34 .

[0042] In other words, see Figure 2 The first opening and closing piece 33 and the second opening and closing piece 34 can be respectively set as arc-shaped pieces, and the end of the first opening and closing piece 33 facing the second opening and closing piece 34 can be buckled on the second opening and closing piece 34, so that the air release structure 30 is constructed into an openable or closed air release structure, thereby timely and effectively ensuring the air pressure balance inside and outside the shell 20, improving the acoustic performance of the device, and ensuring the reliability of the device.

[0043] According to one embodiment of the present invention, the first opening and closing piece 33 and the second opening and closing piece 34 are respectively rubber gaskets. That is, the first opening and closing piece 33 and the second opening and closing piece 34 are respectively rubber gaskets. The rubber gaskets have a certain elasticity, which facilitates the opening or closing of the first opening and closing piece 33 and the second opening and closing piece 34 under the action of air pressure, effectively releasing the air pressure within the housing 20, thereby improving the acoustic performance of the MEMS device and increasing the reliability of the device. Of course, the first opening and closing piece 33 and the second opening and closing piece 34 may also adopt other types of springs or press disc structures, which will not be described in detail in this utility model.

[0044] According to an embodiment of the present invention, at the position where the first opening and closing piece 33 and the second opening and closing piece 34 are engaged with each other, the contact surfaces of the first opening and closing piece 33 and the second opening and closing piece 34 form a serrated contact surface.

[0045] In other words, at the location where the first opening and closing piece 33 and the second opening and closing piece 34 interlock, the contact surface between the first opening and closing piece 33 and the second opening and closing piece 34 can be configured as a serrated contact surface. By providing a serrated contact surface between the first opening and closing piece 33 and the second opening and closing piece 34, the sealing of the MEMS device can be further enhanced, which is conducive to further improving the acoustic performance of the device.

[0046] According to an embodiment of the present invention, the mounting member 31 is a mounting seat, and the adapter 32 is a bearing, a spring, or a spring.

[0047] That is to say, if Figure 2 As shown, the mounting member 31 can be configured as a mounting seat, and the adapter 32 can be a bearing, spring, or spring structure. The movement of the adapter 32 facilitates the opening or closing of the first opening and closing piece 33 relative to the second opening and closing piece 34, thereby effectively opening or closing the deflation structure 30. The deflation structure 30 of the present invention is a mechanical structure that effectively realizes the snap-fit ​​of the deflation structure. This mechanical structure includes but is not limited to bearings, springs, or pressure plates, and will not be described in detail in this utility model.

[0048] According to one embodiment of the present invention, the substrate 10 is bonded or soldered to the housing 20. Figure 1 As shown, the substrate 10 and the housing 20 can be connected by bonding or soldering to ensure the stability and sealing of the connection between the substrate 10 and the housing 20.

[0049] According to an embodiment of the present invention, the MEMS device further includes a MEMS chip 41 and an ASIC chip 42 .

[0050] Specifically, MEMS chip 41 is provided on substrate 10, located in cavity 21 and corresponding to acoustic guide hole 11. ASIC chip 42 is provided on substrate 10, located in cavity 21, and connected to MEMS chip 41 via gold wire 43.

[0051] In other words, see Figure 1 The MEMS device also includes a MEMS chip 41 and an ASIC chip 42. The MEMS chip 41 is mounted on the substrate 10 and is located in the accommodating cavity 21. The MEMS chip 41 corresponds to the position of the sound guide hole 11. The MEMS chip 41 can sense the sound (or sound pressure) introduced by the sound guide hole 11 and convert it into an electrical signal. The ASIC chip 42 (ASIC, Application Specific Integrated Circuit) is mounted on the substrate 10 and is located in the accommodating cavity 21. The ASIC chip 42 and the MEMS chip 41 can be connected by a gold wire 43.

[0052] The capacitance of the MEMS chip 41 will change accordingly with the changes in the incoming sound, and then the ASIC chip 42 will be used to process and output the changed capacitance signal to achieve the pickup of the sound. The ASIC chip 42 and the MEMS chip 41 are arranged side by side on the substrate 10. The MEMS chip 41 and the ASIC chip 42 are electrically connected by a gold wire 43. The ambient sound is introduced into the accommodating cavity 21 through the sound leakage hole 22. The MEMS chip 41 senses the sound waves in the accommodating cavity 21 and stably converts the sensed sound waves into electrical signals. The capacitance of the MEMS chip 41 will change accordingly with the different input sound signals, and then the ASIC chip 42 will be used to process and output the changed capacitance signal to the circuit board to achieve the pickup of the sound.

[0053] In summary, according to the MEMS device of the embodiment of the present invention, a sound leakage hole 22 is provided on the shell 20, and by providing an air leakage structure 30 in the sound leakage hole 22, when the air pressure inside the MEMS device is greater than the external environmental pressure, the air leakage structure 30 can be opened to release the pressure in the accommodating cavity 21, thereby timely and effectively ensuring the air pressure balance inside and outside the shell 20, improving the acoustic performance of the device, and ensuring the reliability of the device.

[0054] Of course, for those skilled in the art, other structures and working principles of MEMS devices are understandable and achievable, and will not be described in detail in this utility model.

[0055] According to a second aspect of the present application, a microphone is provided, comprising the MEMS device of the aforementioned embodiment. Since the MEMS device of the embodiment of the present invention has the aforementioned technical effects, the microphone of the embodiment of the present invention should also have corresponding technical effects. That is, the microphone of the present invention, which utilizes the MEMS device of the embodiment, can promptly and effectively maintain air pressure balance inside and outside the housing 20, thereby improving the acoustic performance of the microphone and ensuring its reliability.

[0056] Of course, for those skilled in the art, other structures and working principles of the microphone are understandable and achievable, and will not be described in detail in the present invention.

[0057] According to a third aspect of the present application, an electronic product is provided, comprising the microphone of the aforementioned embodiment. The electronic product of the present application comprises a housing and the microphone of the aforementioned embodiment disposed within the housing. The electronic product may be a mobile phone, tablet computer, headset, or other product with a microphone.

[0058] Since the microphone according to the embodiment of the present invention has the above-mentioned technical effects, the electronic product according to the embodiment of the present invention should also have corresponding technical effects, that is, the electronic product of the present invention adopts the microphone in the above-mentioned embodiment, which can timely and effectively ensure the air pressure balance inside and outside the shell 20, improve the acoustic performance of the electronic product, and ensure the reliability of the electronic product.

[0059] Of course, for those skilled in the art, other structures and working principles of electronic products are understandable and achievable, and will not be described in detail in this utility model.

[0060] Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art will appreciate that the above examples are for illustration only and are not intended to limit the scope of the present invention. Those skilled in the art will appreciate that modifications may be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A MEMS device, characterized in that: include: A substrate (10), wherein the substrate (10) is provided with a sound guide hole (11) penetrating along the thickness direction thereof; A housing (20), the housing (20) being arranged on the substrate (10), the housing (20) cooperating with the substrate (10) to define a receiving cavity (21) for receiving components, and a sound leakage hole (22) being provided on the housing (20); An air-deflating structure (30) is provided in the sound-deflating hole (22), and the air-deflating structure (30) can be opened or closed to balance the pressure inside and outside the shell (20).

2. The MEMS device according to claim 1, wherein: The deflated structural member (30) comprises: A mounting member (31), the mounting member (31) being arranged on a side wall of the sound leakage hole (22); an adapter (32), the adapter (32) being connected to the mounting member (31), and the adapter (32) being movable relative to the mounting member (31); a first opening and closing piece (33), the first opening and closing piece (33) being connected to the adapter (32); A second opening and closing piece (34) is provided on the other side wall of the sound leakage hole (22); the first opening and closing piece (33) and the second opening and closing piece (34) can be engaged with or opened to balance the pressure inside and outside the shell (20).

3. The MEMS device according to claim 2, wherein: The first opening and closing piece (33) and the second opening and closing piece (34) are arc-shaped pieces respectively, and a portion of the first opening and closing piece (33) can be buckled onto the second opening and closing piece (34).

4. The MEMS device according to claim 2, wherein: The first opening and closing piece (33) and the second opening and closing piece (34) are respectively rubber gaskets.

5. The MEMS device according to claim 2, wherein: At the position where the first opening and closing piece (33) and the second opening and closing piece (34) are buckled with each other, the surfaces of the first opening and closing piece (33) and the second opening and closing piece (34) that contact each other form a serrated contact surface.

6. The MEMS device according to claim 2, wherein: The mounting member (31) is a mounting seat, and the adapter (32) is a bearing, a spring or a spring.

7. The MEMS device according to claim 1, wherein: The substrate (10) is connected to the housing (20) by bonding or soldering.

8. The MEMS device according to claim 1, wherein: Also includes: A MEMS chip (41), the MEMS chip (41) being provided on the substrate (10), the MEMS chip (41) being located in the accommodating cavity (21) and corresponding to the sound guide hole (11); An ASIC chip (42) is provided on the substrate (10), and the ASIC chip (42) is located in the accommodating cavity (21), and the ASIC chip (42) is connected to the MEMS chip (41) via a gold wire (43).

9. A microphone, characterized in that: A MEMS device comprising any one of claims 1-8.

10. An electronic product, characterized in that: Comprising the microphone according to claim 9.

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