Durable solder mask carrier plate

Abstract

The utility model discloses a durable solder mask carrier plate, which comprises a thin plate carrier plate, a plurality of to-be-plugged holes for ink to enter are distributed at the upper end of the thin plate carrier plate, a release film is arranged at the lower end of the thin plate carrier plate, and a base plate is attached to the lower end of the release film. A rubber layer used for absorbing vibration is arranged at the upper end of the glass fiber layer, the base plate is placed on the bottommost portion, the release film is placed on the base plate, the thin-plate carrier plate needing hole plugging is placed on the release film, the rough-surface release film is used, the non-sticky face of the rough-surface release film faces the plate, and after ink enters the hole, the bottom needs to be relatively pre-dried. According to the technical scheme of the invention, the ink is relatively easy to separate only when the substrate is subjected to silk-screen printing, and the research purpose of the solder mask thin plate hole plugging process is that the filled to-be-plugged hole has better mechanical strength and can resist external mechanical stress and thermal stress through the to-be-plugged hole, so that the reliability and durability of the carrier plate can be improved.

Description

Technical Field

[0001] The utility model belongs to the technical field related to durable solder-resistant carrier boards, and particularly relates to a durable solder-resistant carrier board. Background Art

[0002] A durable soldermask carrier is a support tool designed specifically for the soldering of electronic components. Made of high-temperature-resistant materials, it offers excellent solder-resistant properties, preventing unwanted solder adhesion during the soldering process and ensuring soldering quality. Furthermore, its robust structure enhances its resistance to repeated soldering operations. Widely used in the assembly and production of various electronic products, it helps improve overall manufacturing efficiency and product reliability.

[0003] With the rapid development of the electronics industry, more and more products require to be thin, light and compact, especially in the field of substrates, which have higher and higher requirements for overall performance and reliability. However, thin substrates face more challenges in the substrate manufacturing process, such as the increased difficulty of solder mask plugging and the difficulty in controlling the thin substrate plugging process. Utility Model Content

[0004] The purpose of the present invention is to provide a durable solder-resistant carrier board to solve the problem raised in the above background technology that with the rapid development of the electronics industry, more and more products require to be light, thin and compact, especially in the field of carrier boards, with higher and higher requirements for overall performance and reliability. However, thin boards face more challenges in the carrier board manufacturing process, such as the increased difficulty of solder-resistant plugging and the difficulty in controlling the plugging process of thin boards.

[0005] To achieve the above-mentioned objectives, the utility model provides the following technical solutions: a durable solder-resistant carrier plate, comprising a thin plate carrier plate, wherein a plurality of plugged holes for ink to enter are distributed at the upper end position of the thin plate carrier plate, a release film is provided at the lower end position of the thin plate carrier plate, a pad is attached to the lower end position of the release film, a high-temperature resistant ceramic layer for withstanding high temperature is provided at the outermost position of the bottom of the pad plate, a glass fiber layer is provided at the upper end position of the high-temperature resistant ceramic layer, a rubber layer for absorbing vibration is provided at the upper end position of the glass fiber layer, an aluminum heat sink is installed at the lower end position of the pad plate, the pad plate is installed with the aluminum heat sink through insertion holes at the four corners of the lower end, the aluminum heat sink inserts the rubber plugs at the four corners of the upper end into the inner position of the insertion holes, an insertion plate is provided at the outer end face position of the thin plate carrier plate, and an L-shaped slot is provided at the lower right end position of the thin plate carrier plate.

[0006] Preferably, the pad is placed at the lowermost end of the solder mask carrier.

[0007] Preferably, the release film is placed at the upper end of the pad.

[0008] Preferably, the non-stick side of the release film faces the thin plate carrier.

[0009] Preferably, the holes to be plugged are evenly distributed at the upper end of the thin plate carrier.

[0010] Preferably, the thin plate carrier allows ink to enter the internal position through the hole to be plugged.

[0011] Preferably, the high temperature resistant ceramic layer can withstand the high temperature during the welding process.

[0012] Preferably, the glass fiber layer can improve the mechanical strength of the pad, and the rubber layer can absorb energy generated by vibration.

[0013] Compared with the prior art, the present invention provides a durable solder-resistant carrier board with the following beneficial effects:

[0014] 1. This device puts the pad at the bottom, puts the release film on the pad, and puts the thin plate carrier that needs to be plugged on the release film. It should be flat and fit, and use the rough release film with the non-stick side facing the board. After the ink enters the hole, the bottom should be relatively pre-dried so that the ink will be relatively easy to separate, and it should be screen-printed several times. The purpose of the research on the solder mask thin plate plugging process is to make the filled hole have better mechanical strength through the plugging, and be able to resist external mechanical stress and thermal stress, which helps to improve the reliability and durability of the carrier.

[0015] 2. The bottom pad of the durable solder mask carrier is composed of a high-temperature resistant ceramic layer, a glass fiber layer, and a rubber layer. The outermost high-temperature resistant ceramic layer can withstand the high temperatures generated during welding to prevent thermal damage and deformation. The middle glass fiber layer increases the overall strength and rigidity, effectively resisting external impact and reducing the risk of breakage. The innermost rubber layer provides elasticity and cushioning, absorbing vibration and impact. This multi-layer structure can greatly improve the performance and reliability of the durable solder mask carrier.

[0016] 3. This device is equipped with an aluminum heat sink at the lower end of the pad. The aluminum heat sink is inserted into the insertion hole in the pad through a rubber plug, which makes it easy to disassemble and assemble at any time. The aluminum heat sink has a high thermal conductivity and can effectively transfer heat from the heat source to the heat sink, which helps to dissipate heat more effectively.

[0017] 4. This device can assemble multiple thin plate carriers through L-shaped slots and insert plates. During assembly, the insert plate is connected to the inner position of the L-shaped slot in another thin plate carrier, thereby completing the assembly of two thin plate carriers. In this way, the area of ​​the thin plate carrier can be increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1This is a structural schematic diagram of a durable solder-resistant carrier board of the present utility model.

[0019] Figure 2 The utility model is a schematic diagram of the cross-sectional structure of a durable solder-resistant carrier plate pad.

[0020] Figure 3 The utility model is a schematic diagram of the cross-sectional structure of a durable solder-resistant carrier aluminum heat sink.

[0021] Figure 4 This is a schematic diagram of the assembly structure of a durable solder-resistant carrier board of the present invention.

[0022] In the figure: 1. Thin plate carrier; 2. Holes to be plugged; 3. Pad; 4. Release film; 5. Rubber layer; 6. Glass fiber layer; 7. High-temperature resistant ceramic layer; 8. Aluminum heat sink; 9. Insertion hole; 10. Rubber plug; 11. Insert plate; 12. L-shaped slot. DETAILED DESCRIPTION

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0024] The utility model provides Figure 1-4 A durable solder-resistant carrier shown in the figure includes a thin plate carrier 1, a plurality of plugged holes 2 for ink entry are distributed at the upper end of the thin plate carrier 1, a release film 4 is provided at the lower end of the thin plate carrier 1, a pad 3 is attached to the lower end of the release film 4, a high-temperature resistant ceramic layer 7 for withstanding high temperature is provided at the outermost position of the bottom of the pad 3, a glass fiber layer 6 is provided at the upper end of the high-temperature resistant ceramic layer 7, a rubber layer 5 for absorbing vibration is provided at the upper end of the glass fiber layer 6, an aluminum heat sink 8 is installed at the lower end of the pad 3, the pad 3 is installed with the aluminum heat sink 8 through the insertion holes 9 at the four corners of the lower end, and the aluminum heat sink 8 inserts the rubber plugs 10 at the four corners of the upper end into the internal position of the insertion holes 9, an insertion plate 11 is provided at the outer end face of the thin plate carrier 1, and an L-shaped slot 12 is provided at the lower right end of the thin plate carrier 1.

[0025] Put the pad 3 at the bottom, put the release film 4 on the pad 3, and put the thin plate carrier 1 that needs to be plugged on the release film 4. It should be flat and fit, use the rough release film 4, and the non-stick side of the rough release film 4 should face the board. After the ink enters the hole, the bottom should be relatively pre-dried so that the ink will be relatively easy to separate, and more silk screen printing is required.

[0026] like Figure 1 and Figure 2 As shown, the pad 3 is placed at the lower end of the solder mask carrier, the release film 4 is placed at the upper end of the pad 3, the non-stick side of the release film 4 faces the thin plate carrier 1, the holes 2 to be plugged are evenly distributed at the upper end of the thin plate carrier 1, and the thin plate carrier 1 allows the ink to enter the internal position through the holes 2 to be plugged. The high-temperature resistant ceramic layer 7 can withstand the high temperature during the welding process, the glass fiber layer 6 can improve the mechanical strength of the pad 3, and the rubber layer 5 can absorb the energy generated by vibration.

[0027] The pad 3 consists of a high-temperature resistant ceramic layer 7, a glass fiber layer 6 and a rubber layer 5. The outermost high-temperature resistant ceramic layer 7 can withstand the high temperature generated during the welding process to prevent thermal damage and deformation. The middle glass fiber layer 6 increases the overall strength and rigidity, effectively resists external impact, and reduces the risk of breakage. The innermost rubber layer 5 provides elasticity and cushioning to absorb vibration and impact.

[0028] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A durable solder mask carrier board, characterized in that: The invention comprises a thin plate carrier (1), wherein a plurality of plugging holes (2) for ink to enter are distributed at the upper end of the thin plate carrier (1), a release film (4) is provided at the lower end of the thin plate carrier (1), a pad (3) is attached to the lower end of the release film (4), a high-temperature resistant ceramic layer (7) for withstanding high temperature is provided at the outermost position of the bottom of the pad (3), a glass fiber layer (6) is provided at the upper end of the high-temperature resistant ceramic layer (7), and a glass fiber layer (6) is provided at the upper end of the glass fiber layer (6). A rubber layer (5) for absorbing vibration is provided, an aluminum heat sink (8) is installed at the lower end of the pad (3), the pad (3) is installed with the aluminum heat sink (8) through insertion holes (9) at the four corners of the lower end, the aluminum heat sink (8) inserts rubber plugs (10) at the four corners of the upper end into the inner positions of the insertion holes (9), an insertion plate (11) is provided at the outer end surface of the thin plate carrier (1), and an L-shaped card slot (12) is provided at the lower right end of the thin plate carrier (1).

2. The durable solder mask carrier according to claim 1, characterized in that: The pad (3) is placed at the lowermost end of the solder-proof carrier plate.

3. The durable solder mask carrier according to claim 1, characterized in that: The release film (4) is placed at the upper end of the pad (3).

4. The durable solder mask carrier according to claim 3, characterized in that: The non-sticky side of the release film (4) faces the thin plate carrier (1).

5. The durable solder mask carrier according to claim 1, characterized in that: The holes to be plugged (2) are evenly distributed at the upper end of the thin plate carrier (1).

6. The durable solder mask carrier according to claim 5, characterized in that: The thin plate carrier (1) allows ink to enter the inner position through the hole to be plugged (2).

7. The durable solder mask carrier according to claim 1, characterized in that: The high-temperature resistant ceramic layer (7) can withstand high temperatures during welding.

8. The durable solder mask carrier according to claim 1, characterized in that: The glass fiber layer (6) can improve the mechanical strength of the pad (3), and the rubber layer (5) can absorb energy generated by vibration.

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