Heat dissipation device and blood oscillation equipment

Abstract

The utility model relates to the technical field of blood oscillation equipment, in particular to a heat dissipation device and blood oscillation equipment. The heat dissipation device comprises a heat dissipation water tank, a flow guide assembly and a heat pipe assembly. The radiating water tank is in contact with a heat source; the flow guide assembly comprises a mounting shell, a flow guide fan and a heat conduction piece, the mounting shell is arranged on one side of the heat dissipation water tank, the heat conduction piece is arranged in the mounting shell, and the flow guide fan covers an opening of the mounting shell; the heat pipe assembly comprises a heat dissipation pipe and a liquid pump, at least part of the heat dissipation pipe is arranged in the heat conduction piece in a penetrating mode, and the liquid pump is connected to the heat dissipation water tank and the heat dissipation pipe. According to the heat dissipation device, the heat pipe assembly is arranged to be matched with the flow guide assembly, the liquid pump can pump the liquid absorbing heat in the heat dissipation water tank to the heat conduction piece, heat dissipation can be conducted on the heat conduction piece through the flow guide fan, the cooled liquid is conveyed into the heat dissipation water tank to be circulated, and therefore heat dissipation can be conducted on a heat source.

Description

Technical Field

[0001] The utility model relates to the technical field of blood shock equipment, in particular to a heat dissipation device and a blood shock equipment. Background Art

[0002] In clinical blood testing, a blood concussion device is used to concuss blood. However, a technical problem currently exists: existing blood concussion devices are prone to overheating when processing large numbers of samples. In severe cases, this can cause the device to shut down, reducing the efficiency of blood testing.

[0003] Therefore, it is necessary to make improvements to the above problems in order to change the current situation. Utility Model Content

[0004] The utility model provides a heat dissipation device and a blood oscillation device, which are used to solve the problem in the prior art that the blood oscillation device is prone to overheating when processing a large number of samples, thereby affecting the detection efficiency.

[0005] The utility model provides a heat dissipation device, comprising:

[0006] A heat dissipation water tank, used for contact with a heat source;

[0007] A flow guide assembly, comprising a mounting shell, a flow guide fan, and a heat conducting member, wherein the mounting shell is disposed on one side of the heat dissipation water tank, the heat conducting member is disposed inside the mounting shell, and the flow guide fan cover is disposed at an opening of the mounting shell; and

[0008] The heat pipe assembly comprises a heat dissipation pipe and a liquid pump. The heat dissipation pipe is at least partially passed through the heat conducting member. The liquid pump is respectively connected to the heat dissipation water tank and the heat dissipation pipe.

[0009] According to one embodiment of the present utility model, the heat dissipation water tank, the heat dissipation pipe and the liquid pump are connected in sequence to form a closed loop; the heat dissipation pipe includes a heat conduction pipe portion and a connecting pipe portion, the connecting pipe portion is respectively connected to the heat conduction pipe portion and the liquid pump, the heat conduction pipe portion is passed through the heat conduction member, and the guide fan is arranged in contact with the heat conduction member.

[0010] According to an embodiment of the present invention, the heat conducting member includes a plurality of heat dissipating fins, which are spaced apart and arranged in parallel, and the heat conducting pipe portion is sequentially passed through the plurality of heat dissipating fins.

[0011] According to an embodiment of the present invention, the air guide assembly further includes a dustproof net, and the dustproof net cover is arranged on the outside of the air guide fan.

[0012] According to an embodiment of the present invention, the liquid pump is arranged inside the heat dissipation water tank, and the heat dissipation pipe is passed through the heat dissipation water tank and connected to the liquid pump.

[0013] According to an embodiment of the present invention, the heat pipe assembly further includes a filter cover, and the filter cover is arranged on the outside of the liquid pump.

[0014] According to one embodiment of the present utility model, the heat dissipation device also includes a heat dissipation component, which includes a heat dissipation fan and a semiconductor refrigeration plate. One side of the semiconductor refrigeration plate is in contact with the heat dissipation water tank, and the heat dissipation fan is arranged on the side of the semiconductor refrigeration plate away from the heat dissipation water tank.

[0015] According to one embodiment of the present utility model, the heat dissipation assembly further includes a heat dissipation block, which is arranged between the semiconductor refrigeration plate and the heat dissipation fan and is respectively attached to the semiconductor refrigeration plate and the heat dissipation fan, and a heat dissipation guide groove is provided on the side of the heat dissipation block facing the heat dissipation fan.

[0016] According to an embodiment of the present invention, the heat dissipation assembly further includes a safety net, and the safety net cover is arranged on the outside of the heat dissipation fan.

[0017] The utility model also provides a blood shock device, comprising:

[0018] Oscillating devices; and

[0019] In the heat dissipation device as described in any one of the above items, the heat dissipation water tank is arranged in close contact with the oscillation device.

[0020] The implementation of the present invention has the following beneficial effects:

[0021] In the heat dissipation device of this embodiment, by arranging a heat pipe assembly in conjunction with a flow guide assembly, a liquid pump can pump the liquid that absorbs heat in the heat dissipation water tank to the heat-conducting part, the heat dissipation part can be dissipated by the flow guide fan, and the cooled liquid can be transported to the heat dissipation water tank for circulation, thereby dissipating the heat source.

[0022] When this heat dissipation device is applied to a blood shock device, the heat dissipation water tank can transfer the heat generated by the shock device through the cooperation of the heat dissipation water tank and the shock device, and dissipate the heat of the shock device through the cooperation of the guide component and the heat pipe component to avoid the shock device from overheating and shutting down, thereby improving the detection efficiency of the blood shock device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] in:

[0025] Figure 1 is a three-dimensional view of a blood shock device in an embodiment of the present invention;

[0026] Figure 2 It is a structural schematic diagram of a blood shock device in an embodiment of the present utility model;

[0027] Figure 3 yes Figure 2 A magnified view of part A in the middle;

[0028] Figure 4 It is a structural diagram of the oscillation device in the embodiment of the present utility model.

[0029] Reference numerals:

[0030] 1. Blood shock equipment; 10. Heat dissipation device; 100. Heat dissipation water tank; 200. Air guide assembly; 210. Mounting shell; 220. Air guide fan; 230. Heat conduction member; 231. Heat dissipation fin; 240. Dust screen; 300. Heat pipe assembly; 310. Heat dissipation pipe; 311. Heat conduction pipe portion; 312. Connecting pipe portion; 320. Liquid pump; 330. Filter cover; 400. Heat dissipation assembly; 410. Heat dissipation fan; 420. Semiconductor refrigeration plate; 430. Heat dissipation block; 440. Safety net; 20. Shock device; 21. Bracket; 22. Drive assembly; 221. Drive motor; 23. Shock assembly; 231. Connecting member; 232. Receptacle; 24. Specimen tube. DETAILED DESCRIPTION

[0031] To make the purpose, technical solutions, and advantages of the present invention more clear, the following will be combined with the accompanying drawings to clearly and completely describe the technical solutions of the present invention. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] See Figures 1 to 3As shown, an embodiment of the present invention provides a heat dissipation device 10, which includes a heat dissipation water tank 100, a guide assembly 200 and a heat pipe assembly 300; the heat dissipation water tank 100 is used to contact a heat source; the guide assembly 200 includes a mounting shell 210, a guide fan 220 and a heat conductor 230, the mounting shell 210 is arranged on one side of the heat dissipation water tank 100, the heat conductor 230 is arranged inside the mounting shell 210, and the guide fan 220 cover is arranged at the opening of the mounting shell 210; the heat pipe assembly 300 includes a heat dissipation pipe 310 and a liquid pump 320, the heat dissipation pipe 310 is at least partially passed through the heat conductor 230, and the liquid pump 320 is respectively connected to the heat dissipation water tank 100 and the heat dissipation pipe 310.

[0033] In the heat dissipation device 10 of this embodiment, by arranging the heat pipe assembly 300 in conjunction with the guide assembly 200, the liquid pump 320 can pump the liquid that absorbs heat in the heat dissipation water tank 100 to the heat conduction member 230. The guide fan 220 can dissipate heat from the heat conduction member 230, and the cooled liquid can be transported to the heat dissipation water tank 100 for circulation, thereby dissipating heat from the heat source.

[0034] Specifically, the heat dissipation water tank 100, the heat dissipation pipe 310 and the liquid pump 320 are connected in sequence to form a closed loop; the heat dissipation pipe 310 includes a heat conduction pipe portion 311 and a connecting pipe portion 312, the connecting pipe portion 312 is respectively connected to the heat conduction pipe portion 311 and the liquid pump 320, the heat conduction pipe portion 311 is passed through the heat conduction member 230, and the guide fan 220 is arranged in close contact with the heat conduction member 230.

[0035] When the heat dissipation device 10 of this embodiment is used, the heat dissipation water tank 100 is in contact with the heat source and absorbs heat. The liquid pump 320 is activated to pump the fluid in the heat dissipation water tank 100 and transport it to the heat conduction pipe portion 311 through the connecting pipe portion 312. Since the heat conduction pipe portion 311 is arranged in the heat conduction member 230, the heat in the heat conduction pipe portion 311 can be transferred to the heat conduction member 230. The guide fan 220 is activated to drive the gas flow and dissipate the heat generated by the heat conduction member 230 into the air to dissipate heat from the heat conduction member 230. At this time, the fluid in the heat conduction pipe portion 311 is then transported to the heat dissipation water tank 100 under the driving action of the liquid pump 320 to cool the fluid in the heat dissipation water tank 100, thereby achieving the purpose of dissipating heat from the heat source.

[0036] In this embodiment, the heat conduction pipe portion 311 and the connecting pipe portion 312 can be connected using a quick-release interface. After the heat conduction pipe portion 311 and the connecting pipe portion 312 are separated, the guide assembly 200 can be separated from the heat dissipation water tank 100 to facilitate cleaning and maintenance of the interior of the heat conduction pipe portion 311.

[0037] In one embodiment, the heat conducting member 230 includes a plurality of heat dissipating fins 231 . The plurality of heat dissipating fins 231 are spaced apart and arranged in parallel. The heat conducting pipe portion 311 is sequentially disposed in the plurality of heat dissipating fins 231 .

[0038] By arranging multiple heat dissipation fins 231 to form a heat conducting member 230, the heat dissipation area of ​​the heat conducting member 230 is the sum of the surface areas of the multiple heat dissipation fins 231. In this way, the heat conducting member 230 can have a larger heat dissipation area, thereby improving the heat dissipation effect of the heat conducting member 230, and at the same time making the heat conducting member 230 have a smaller volume; the space between adjacent heat dissipation fins 231 can also facilitate air circulation, further improving the heat dissipation effect of the guide assembly 200.

[0039] At the same time, by sequentially inserting the heat conducting pipe portion 311 into a plurality of heat dissipating fins 231 , the contact range between the heat conducting pipe portion 311 and the heat dissipating fins 231 can be increased, thereby improving the heat exchange efficiency between the heat dissipating fins 231 and the heat conducting pipe portion 311 , thereby improving the heat dissipation effect of the guide assembly 200 .

[0040] Furthermore, the air guide assembly 200 further includes a dustproof net 240 , and the dustproof net 240 is covered on the outside of the air guide fan 220 .

[0041] In this embodiment, the interior of the mounting shell 210 is a cavity structure, and the guide fan 220 cover is provided at an opening on one side of the mounting shell 210, and the other side of the mounting shell 210 may also have at least one opening to facilitate air flow; at this time, by providing a dustproof net 240 on the outer side of the guide fan 220, the guide fan 220 and the heat conducting member 230 inside the mounting shell 210 can be protected from dust, and the guide fan 220 can also be shielded to prevent the operator from being injured by contact with the guide fan 220, thereby improving the safety of the use of the guide assembly 200.

[0042] See Figure 3 As shown, in one embodiment, the liquid pump 320 is disposed inside the heat dissipation water tank 100 , and the heat dissipation pipe 310 is passed through the heat dissipation water tank 100 and connected to the liquid pump 320 .

[0043] With this arrangement, the liquid pump 320 can not only pump the fluid in the heat dissipation water tank 100 and transport it along the heat dissipation pipe 310, but also, since the connecting pipe portion 312 is immersed in the fluid in the heat dissipation water tank 100, the fluid can also conduct the heat of the liquid pump 320 to cool the liquid pump 320, thereby effectively improving the durability of the liquid pump 320.

[0044] Furthermore, the heat pipe assembly 300 further includes a filter cover 330 , which is disposed on the outside of the liquid pump 320 .

[0045] In this embodiment, by disposing a filter cover 330 outside the liquid pump 320 , the filter cover 330 can filter the fluid immersed in the liquid pump 320 to prevent impurities from entering the liquid pump 320 and causing damage to the liquid pump 320 .

[0046] In a preferred embodiment, the heat dissipation device 10 also includes a heat dissipation component 400, which includes a heat dissipation fan 410 and a semiconductor refrigeration plate 420. One side of the semiconductor refrigeration plate 420 is in contact with the heat dissipation water tank 100, and the heat dissipation fan 410 is arranged on the side of the semiconductor refrigeration plate 420 away from the heat dissipation water tank 100.

[0047] Thus, when the heat dissipation device 10 is started, the surface of the heat dissipation water tank 100 can be cooled and dissipated at the same time by starting the semiconductor refrigeration plate 420, so as to cool and dissipate the fluid inside the heat dissipation water tank 100. By arranging the heat dissipation fan 410 at the hot end of the semiconductor refrigeration plate 420, the heat dissipation fan 410 can dissipate the heat emitted by the semiconductor refrigeration plate 420 after it is started, so as to ensure the normal operation of the semiconductor refrigeration plate 420, further improving the heat dissipation effect of the heat dissipation device 10, and ensuring that the overall structure of the heat dissipation device 10 is compact and occupies little space.

[0048] In one embodiment, the heat dissipation assembly 400 further includes a heat dissipation block 430, which is disposed between the semiconductor refrigeration sheet 420 and the heat dissipation fan 410 and is respectively adhered to the semiconductor refrigeration sheet 420 and the heat dissipation fan 410, and a heat dissipation guide groove is provided on the side of the heat dissipation block 430 facing the heat dissipation fan 410.

[0049] In this embodiment, by arranging a heat dissipation block 430 between the heat dissipation fan 410 and the semiconductor refrigeration plate 420, while ensuring the fit between the heat dissipation block 430 and the semiconductor refrigeration plate 420, a heat dissipation guide groove that can facilitate air flow can be provided between the heat dissipation fan 410 and the heat dissipation block 430, thereby improving the heat dissipation efficiency of the heat dissipation fan 410, thereby further improving the heat dissipation effect of the heat dissipation assembly 400.

[0050] Furthermore, the heat dissipation assembly 400 further includes a safety net 440 , which is arranged to cover the outside of the heat dissipation fan 410 .

[0051] By providing a safety net 440 on the outside of the cooling fan 410, the cooling fan 410 can be protected when the cooling fan 410 is started, not only preventing external impurities from entering the cooling fan 410 to damage the cooling fan 410, but also preventing operators from coming into contact with the cooling fan 410, thereby improving safety.

[0052] The present invention also provides a blood shock device 1, which includes a heat dissipation device 10 and an shock device 20 in any one of the above embodiments; the shock device 20 is used to accommodate a blood sample tube and perform shock detection on the blood sample tube; the heat dissipation water tank 100 is arranged in close contact with the shock device 20 and is used to assist in heat dissipation of the shock device 20.

[0053] When the heat dissipation device 10 is applied to the blood shock device 1, the heat dissipation water tank 100 can conduct the heat emitted by the shock device 20 through the cooperation of the heat dissipation water tank 100 and the shock device 20, and dissipate the heat of the shock device 20 through the cooperation of the flow guide component 200 and the heat pipe component 300 to avoid the shock device 20 from overheating and shutting down, thereby improving the detection efficiency of the blood shock device 1.

[0054] refer to Figure 4 In one embodiment, the oscillation device 20 includes a bracket 21, a drive assembly 22 mounted on the bracket 21, and an oscillation assembly 23 connected to the drive assembly 22. The drive assembly 22 drives the oscillation assembly 23. The drive assembly 22 is positioned above the heat dissipation water tank 100, and the oscillation assembly 23 is positioned above the drive assembly 22. The heat dissipation water tank 100 is in contact with the drive assembly 22 to absorb heat from the drive assembly 22.

[0055] In one specific embodiment, the drive assembly 22 includes a drive motor 221, and the oscillation assembly 23 includes a connector 231 and a receiving member 232. The rotational axis of the drive motor 221 is fixedly connected to the connector 231, and the receiving member 232 is fixedly mounted on the connector 231. The receiving member 232 defines a cavity for accommodating the specimen tube 24. The rotational axis of the drive motor 221 forms a first angle α with the vertical direction, and the first angle α is an acute angle. Because the rotational axis of the drive motor 221 is eccentrically disposed, the rotational axis of the drive motor 221 drives the connector 231 and the receiving member 231 to rotate eccentrically, thereby causing the specimen tube 24 to rotate eccentrically, achieving oscillation.

[0056] In other embodiments, a mounting plate may be provided between the heat dissipation water tank 100 and the driving assembly 22, the bracket 21 being fixed on the mounting plate, the heat dissipation water tank 100 being fitted with the mounting plate, and the mounting plate being fitted with the driving assembly to dissipate heat for the driving assembly. Preferably, the material of the mounting plate is a heat-conducting material, such as a metal material.

[0057] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0058] In the description of the embodiments of the present invention, it should be noted that, unless otherwise specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0059] In the embodiments of the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," or "above" a second feature may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below," "below," or "below" a second feature may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.

[0060] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A heat dissipation device, characterized in that: include: Radiator water tank, used for contact with heat source; A flow guide assembly, comprising a mounting shell, a flow guide fan, and a heat conducting member, wherein the mounting shell is disposed on one side of the heat dissipation water tank, the heat conducting member is disposed inside the mounting shell, and the flow guide fan cover is disposed at an opening of the mounting shell; and The heat pipe assembly comprises a heat dissipation pipe and a liquid pump. The heat dissipation pipe is at least partially passed through the heat conducting member. The liquid pump is respectively connected to the heat dissipation water tank and the heat dissipation pipe.

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation water tank, the heat dissipation pipe and the liquid pump are connected in sequence to form a closed loop; the heat dissipation pipe includes a heat conduction pipe portion and a connecting pipe portion, the connecting pipe portion is respectively connected to the heat conduction pipe portion and the liquid pump, the heat conduction pipe portion is passed through the heat conduction member, and the guide fan is arranged in contact with the heat conduction member.

3. The heat dissipation device according to claim 2, characterized in that: The heat conducting member includes a plurality of heat dissipating fins, which are spaced apart and arranged in parallel, and the heat conducting pipe portion is sequentially passed through the plurality of heat dissipating fins.

4. The heat dissipation device according to claim 1, wherein: The air guide assembly further includes a dustproof net, which is arranged on the outside of the air guide fan.

5. The heat dissipation device according to claim 1, characterized in that: The liquid pump is arranged inside the heat dissipation water tank, and the heat dissipation pipe is passed through the heat dissipation water tank and connected to the liquid pump.

6. The heat dissipation device according to claim 5, characterized in that: The heat pipe assembly further includes a filter cover, which is arranged on the outside of the liquid pump.

7. The heat dissipation device according to claim 1, wherein: The heat dissipation device also includes a heat dissipation component, which includes a heat dissipation fan and a semiconductor refrigeration plate. One side of the semiconductor refrigeration plate is in contact with the heat dissipation water tank, and the heat dissipation fan is arranged on the side of the semiconductor refrigeration plate away from the heat dissipation water tank.

8. The heat dissipation device according to claim 7, characterized in that: The heat dissipation assembly further includes a heat dissipation block, which is arranged between the semiconductor refrigeration sheet and the heat dissipation fan and is respectively attached to the semiconductor refrigeration sheet and the heat dissipation fan, and a heat dissipation guide groove is provided on the side of the heat dissipation block facing the heat dissipation fan.

9. The heat dissipation device according to claim 7, characterized in that: The heat dissipation component further includes a safety net, which is arranged on the outside of the heat dissipation fan.

10. A blood shock device, characterized in that: include: Oscillating device; as well as The heat dissipation device according to any one of claims 1 to 6, wherein the heat dissipation water tank is arranged in close contact with the oscillation device.

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