Alloy material cooling mold

Abstract

The utility model discloses an alloy material cooling mold which comprises a pouring mold, a cooling liquid inlet and a cooling liquid outlet are fixedly installed on one side of a lower mold in the pouring mold, a base plate is fixedly installed on the lower portion of the outer surface of one side of the pouring mold, and a cooling assembly is fixedly installed on the outer surface of the upper end of the base plate. According to the alloy material cooling mold, through the arrangement of the semiconductor chilling plate, liquid can be cooled through the refrigeration effect of one face of the semiconductor chilling plate, the cooling efficiency is improved, through the arrangement of the heat conduction plate, the liquid is prevented from making direct contact with the semiconductor chilling plate, the semiconductor chilling plate is protected, and the service life of the semiconductor chilling plate is prolonged. And through arrangement of a bent heat conduction plate, the liquid retention time can be prolonged, and the liquid cooling effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of molds, in particular to an alloy material cooling mold. Background Art

[0002] The lifespan of alloy molds is dozens of times or even dozens of times that of steel molds. Carbide molds are characterized by high hardness, high strength, corrosion resistance, high temperature resistance and small expansion coefficient, and are generally made of tungsten-cobalt carbide.

[0003] In the prior art, water cooling channels are generally provided on the casting mold. Mold water cooling can significantly improve production efficiency. By lowering the mold temperature, the molding speed of the product will be accelerated, thereby shortening the entire production cycle and improving production efficiency.

[0004] However, in the prior art, when the cooling water is pumped to the casting mold position through an external water pump, it absorbs heat and heats up, thereby reducing the cooling efficiency.

[0005] To this end, we propose an alloy material cooling mold. Utility Model Content

[0006] (1) Technical problems solved

[0007] In response to the shortcomings of the existing technology, the utility model provides an alloy material cooling mold, which installs the cooling component on one side of the casting mold and uses semiconductor refrigeration plates to cool the liquid, thereby improving the cooling efficiency and other advantages, which can effectively solve the problems in the background technology.

[0008] (2) Technical solution

[0009] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: an alloy material cooling mold, including a casting mold, a coolant inlet and a water outlet are fixedly installed on one side of the lower mold in the casting mold, a base plate is fixedly installed on the lower part of the outer surface of one side of the casting mold, and a cooling component is fixedly installed on the upper outer surface of the base plate, the cooling component includes a shell, a partition, a semiconductor refrigeration plate, a heat conducting plate, a bent heat conducting plate, a water pump, a water suction pipe, a water outlet pipe, heat dissipation fins, an air outlet, a radiator, a guide plate and a liquid inlet, and the shell is fixedly installed on the upper outer surface of the base plate, the radiator is fixedly installed on the outer surface of one end of the shell away from the casting mold, and the water pump is fixedly installed on the lower part of the outer surface of one end of the shell close to the casting mold.

[0010] Preferably, the water suction pipe is fixedly installed on the outer surface of one end of the water pump, and the water suction pipe extends into the lower part of the shell cavity near one end of the water pump, and the water outlet pipe is fixedly installed between the water pump and the coolant inlet.

[0011] Preferably, the partition is fixedly installed in the middle of the inner cavity of the shell, and the semiconductor refrigeration plate is fixedly installed in the middle of the partition.

[0012] Preferably, the heat conducting plate is installed on a side of the inner cavity of the shell close to the casting mold, and the heat conducting plate is fixedly installed on the cooling surface of the semiconductor refrigeration plate, and the bent heat conducting plate is fixedly installed on one outer surface of the heat conducting plate.

[0013] Preferably, the guide plate is fixedly mounted on the upper portion of the inner cavity of the shell near one end of the casting mold, the liquid inlet is located on the upper portion of the guide plate, and the liquid inlet is opened on the outer surface of the upper end of the shell.

[0014] Preferably, the heat dissipation fins are fixedly mounted on the heating surface of the semiconductor refrigeration plate, and the air outlets are opened on one end of the outer surface of both sides of the shell away from the casting mold.

[0015] (3) Beneficial effects

[0016] Compared with the prior art, the present invention provides an alloy material cooling die with the following beneficial effects:

[0017] 1. The alloy material cooling mold is provided with a semiconductor refrigeration plate, which facilitates the use of the semiconductor refrigeration plate to cool the liquid and improve the cooling efficiency.

[0018] 2. This alloy material cooling mold avoids direct contact between liquid and semiconductor refrigeration plate by setting a heat conduction plate, which protects the semiconductor refrigeration plate. The bent heat conduction plate can increase the residence time of the liquid and improve the cooling effect of the liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the overall structure of an alloy material cooling mold of the utility model.

[0020] Figure 2 This is a schematic diagram of the partial structure of an alloy material cooling mold of the utility model.

[0021] Figure 3 This is a side sectional view of a cooling component in an alloy material cooling mold of the utility model.

[0022] Figure 4 This is a front view of a heat conducting plate and a bent heat conducting plate in an alloy material cooling mold of the utility model.

[0023] In the figure: 1. Casting mold; 2. Base plate; 3. Cooling assembly; 4. Coolant inlet; 5. Water outlet; 6. Shell; 7. Partition; 8. Semiconductor refrigeration plate; 9. Heat conduction plate; 10. Bent heat conduction plate; 11. Water pump; 12. Suction pipe; 13. Water outlet pipe; 14. Heat dissipation fin; 15. Air outlet; 16. Radiator; 17. Guide plate; 18. Liquid inlet. DETAILED DESCRIPTION

[0024] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0025] This embodiment is an alloy material cooling mold.

[0026] like Figure 1-4 As shown, it includes a casting mold 1, a cooling liquid inlet 4 and a water outlet 5 are fixedly installed on one side of the lower mold in the casting mold 1, a base plate 2 is fixedly installed on the lower part of the outer surface of one side of the casting mold 1, and a cooling component 3 is fixedly installed on the upper outer surface of the base plate 2. The cooling component 3 includes a shell 6, a partition 7, a semiconductor refrigeration plate 8, a heat conducting plate 9, a bent heat conducting plate 10, a water pump 11, a water suction pipe 12, a water outlet pipe 13, a heat dissipation fin 14, an air outlet 15, a radiator 16, a guide plate 17 and a liquid inlet 18, and the shell 6 is fixedly installed on the upper outer surface of the base plate 2, the radiator 16 is fixedly installed on the outer surface of the shell 6 away from the casting mold 1, and the water pump 11 is fixedly installed on the lower part of the outer surface of the shell 6 close to the casting mold 1.

[0027] The water suction pipe 12 is fixedly installed on the outer surface of one end of the water pump 11, and the water suction pipe 12 extends into the lower part of the inner cavity of the shell 6 near the end of the water pump 11, and the water outlet pipe 13 is fixedly installed between the water pump 11 and the coolant inlet 4; the partition 7 is fixedly installed in the middle of the inner cavity of the shell 6, and the semiconductor refrigeration plate 8 is fixedly installed in the middle of the partition 7; the heat conducting plate 9 is installed on one side of the inner cavity of the shell 6 close to the casting mold 1, and the heat conducting plate 9 is fixedly installed on the cooling surface of the semiconductor refrigeration plate 8, and the bent heat conducting plate 10 is fixedly installed on the outer surface of one side of the heat conducting plate 9; the guide plate 17 is fixedly installed on the upper part of the inner cavity of the shell 6 close to one end of the casting mold 1, the liquid inlet 18 is located on the upper part of the guide plate 17, and the liquid inlet 18 is opened on the outer surface of the upper end of the shell 6; the heat dissipation fins 14 are fixedly installed on the heating surface of the semiconductor refrigeration plate 8, and the air outlet 15 is opened on the outer surface of both sides of the shell 6 away from the casting mold 1.

[0028] It should be noted that the present invention is a cooling mold for alloy materials. The casting mold 1, cooling assembly 3 and coolant inlet 4 described in the article all belong to the prior art. External coolant enters the interior of the casting mold 1 through the coolant inlet 4 to cool the workpiece and improve the molding efficiency. This is effectively known to technicians in the relevant technical field and will not be described in detail. The cooling assembly 3 is fixed on the upper outer surface of the base plate 2. The cooling assembly 3 is set on one side of the casting mold 1 to shorten the distance between the coolant after cooling and conveying, thereby avoiding the coolant absorbing heat and heating up too quickly and improving the cooling efficiency. During operation, the external coolant is introduced into the interior of the shell 6 through the liquid inlet 18 and is passed through the guide plate 17. After diversion, the liquid flows to the bent heat conduction plate 10, and the heat conduction plate 9 is fixed on the cooling surface of the semiconductor refrigeration plate 8. The heat conduction plate 9 is set to avoid direct contact between the liquid and the semiconductor refrigeration plate 8, thereby protecting the semiconductor refrigeration plate 8. In addition, the bent heat conduction plate 10 is set to increase the residence time of the liquid and improve the cooling effect of the liquid. The cooled liquid is sent to the position of the coolant inlet 4 by the water pump 11 and then enters the cooling water channel inside the casting mold 1. After cooling, it is discharged through the water outlet 5. In order to ensure the normal operation of the semiconductor refrigeration plate 8, the heating side of the semiconductor refrigeration plate 8 is cooled by the radiator 16. The heat dissipation fins 14 are set to increase the contact area with the air and improve the cooling efficiency.

[0029] It should be noted that, in this document, relational terms such as first and second (number one, number two), etc., are used solely to distinguish one entity or operation from another, and do not necessarily require or imply any actual relationship or order between these entities or operations. Furthermore, the terms "include," "comprise," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus that includes a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "includes a..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0030] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements shall fall within the scope of the present invention as claimed.

Claims

1. An alloy material cooling mold, comprising a casting mold (1), wherein a cooling liquid inlet (4) and a water outlet (5) are fixedly mounted on one side of a lower mold in the casting mold (1), characterized in that: A base plate (2) is fixedly mounted on the lower portion of the outer surface of one side of the casting mold (1), and a cooling assembly (3) is fixedly mounted on the upper outer surface of the base plate (2). The cooling assembly (3) comprises a shell (6), a partition (7), a semiconductor refrigeration plate (8), a heat conducting plate (9), a bent heat conducting plate (10), a water pump (11), a water pump pipe (12), a water outlet pipe (13), a heat dissipation fin (14), an air outlet (15), a radiator (16), a guide plate (17) and a liquid inlet (18), and the shell (6) is fixedly mounted on the upper outer surface of the base plate (2), the radiator (16) is fixedly mounted on the outer surface of one end of the shell (6) away from the casting mold (1), and the water pump (11) is fixedly mounted on the lower portion of the outer surface of one end of the shell (6) close to the casting mold (1).

2. The alloy material cooling mold according to claim 1, characterized in that: The water pumping pipe (12) is fixedly mounted on the outer surface of one end of the water pump (11), and the water pumping pipe (12) extends into the lower part of the inner cavity of the housing (6) near one end of the water pump (11), and the water outlet pipe (13) is fixedly mounted between the water pump (11) and the coolant inlet (4).

3. The alloy material cooling mold according to claim 2, characterized in that: The partition (7) is fixedly mounted in the middle of the inner cavity of the shell (6), and the semiconductor refrigeration plate (8) is fixedly mounted in the middle of the partition (7).

4. The alloy material cooling mold according to claim 3, characterized in that: The heat conducting plate (9) is mounted on a side of the inner cavity of the shell (6) close to the casting mold (1), and the heat conducting plate (9) is fixedly mounted on the cooling surface of the semiconductor refrigeration plate (8), and the bent heat conducting plate (10) is fixedly mounted on an outer surface of one side of the heat conducting plate (9).

5. The alloy material cooling mold according to claim 4, characterized in that: The guide plate (17) is fixedly mounted on the upper portion of the inner cavity of the shell (6) near one end of the casting mold (1), the liquid inlet (18) is located on the upper portion of the guide plate (17), and the liquid inlet (18) is opened on the outer surface of the upper end of the shell (6).

6. The alloy material cooling mold according to claim 5, characterized in that: The heat dissipation fins (14) are fixedly mounted on the heating surface of the semiconductor refrigeration plate (8), and the air outlets (15) are opened on the outer surfaces of both sides of the shell (6) at one end away from the casting mold (1).

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