Temperature detection device of sputter coating machine

Abstract

The utility model provides a temperature detection device of a sputter coating machine, which comprises a clamping device and a lifting device, the clamping device is arranged above one end of the lifting device, the clamping device comprises a wafer lifting tray, a thermocouple fixing clamp is arranged at the bottom of the wafer lifting tray, a thermocouple is clamped on the thermocouple fixing clamp, one end of the thermocouple is in contact with the bottom surface of a wafer, and the other end of the thermocouple is in contact with the bottom surface of the wafer. The lifting device comprises a lifting air cylinder and a lifting base, a connecting shaft is arranged in the middle of the lifting air cylinder, the top of the connecting shaft is connected with the bottom of the lifting base, a thermocouple guiding installer is arranged on one side of the top of the lifting base, and the wire of the thermocouple winds the outer edge of the tray to one end of the thermocouple guiding installer. The thermocouple guiding installer is arranged on the lifting base, penetrates through the other end of the thermocouple guiding installer and then is downwards led out to external equipment along the lifting base, the thermocouple is directly arranged below a wafer through the fixing clamp and used for directly detecting the temperature of the wafer, and through the adapter plate and the sealing ring, the whole space is kept in a vacuum environment when a wire of the thermocouple transmits heat.

Description

Technical Field

[0001] The utility model relates to the technical field of coating, and more specifically to a temperature detection device of a sputtering coating machine. Background Art

[0002] Magnetron sputtering technology is a type of physical vapor deposition technology with the advantages of high film formation rate, good film-substrate adhesion, and the ability to achieve large-area coating. Developed since the 1970s, magnetron sputtering technology has developed into various types and is widely used in semiconductor microelectronics, optical thin films, and material surface treatment. Among them, reactive sputtering is a type of magnetron sputtering, which refers to the introduction of reactive gases such as oxygen and nitrogen during the sputtering process to react with the sputtered target atoms to deposit a compound film. Unlike conventional magnetron sputtering, reactive sputtering usually requires the substrate to be at a higher temperature because a chemical reaction is required, and the substrate temperature has a great influence on the composition of the resulting compound.

[0003] The prior art with announcement number CN 218330316 U designs a temperature detection device for magnetron sputtering coating, which limits the difference between the distance from the temperature detector to the heating device and the distance from the substrate to the heating device to a smaller range. This can effectively reduce the temperature difference radiated from the heating device to the temperature detector and the substrate, thereby improving the accuracy of temperature detection. However, the difference still causes the temperature detection accuracy to be low.

[0004] Therefore, the present application proposes a temperature detection device for a sputtering coating machine that can detect temperature more accurately. Utility Model Content

[0005] In view of this, in order to solve the above problems, the present invention proposes a temperature detection device for a sputtering coating machine, in which the thermocouple 1 is directly set under the wafer 2 through a fixing clamp, so that the temperature of the wafer 2 can be directly detected, and through the adapter plate 51 and the sealing ring 53 on the thermocouple guide mounter 5, the entire space is kept in a vacuum environment when the wire 11 of the thermocouple 1 transmits heat.

[0006] The lifting mechanism 6 is a kind of temperature detection device of sputtering coating machine, comprising a clamping device and a lifting device 6, wherein the clamping device is arranged above one end of the lifting device 6, and is characterized in that: the clamping device comprises a wafer lifting tray 3 for clamping the wafer 2, and a thermocouple fixing clamp 4 is provided at the bottom of the wafer lifting tray 3, and a thermocouple 1 is clamped on the thermocouple fixing clamp 4, and one end of the thermocouple 1 is in contact with the bottom surface of the wafer 2 for detecting the temperature of the wafer 2, and a wire 11 is provided at the other end. The lifting device 6 comprises a lifting cylinder 61 and a lifting base 62, and a connecting shaft is provided in the middle of the lifting cylinder 61, and the top of the connecting shaft is connected to the bottom of the lifting base. The wafer lifting tray 3 is controlled to rise or fall by the lifting cylinder 61, and a thermocouple guide mounter 5 is provided on one side of the top of the lifting base 62. The wire 11 of the thermocouple 1 is wrapped around the outer edge of the tray to one end of the thermocouple guide mounter 5, passes through the other end of the thermocouple guide mounter 5, and is led downward along the lifting base 62 to the external equipment.

[0007] Furthermore, one end of the wafer lifting tray 3 is connected to the lifting device 6, and the other end is in the shape of a clamp with a circular inner circle, which is convenient for fitting the shape of the wafer 2. The inner edge of the clamp end of the wafer lifting tray 3 is provided with an inward inclined surface 31, which is used to guide when placing the wafer 2 on the wafer lifting tray 3.

[0008] Furthermore, a baffle 32 is provided at the bottom of the gripping end of the wafer lifting tray 3 extending inwardly, for supporting the wafer 2 and preventing the wafer 2 from falling.

[0009] Furthermore, the lifting device 6 also includes a flange 66, which is provided at the bottom of the lifting base 62. The flange 66 is used to connect to the external heating cavity so that the equipment above the flange 66 is in the vacuum cavity.

[0010] Furthermore, the outer cover of the lifting base 62 is provided with a bellows 64 for preventing dust and isolating the air circulation inside and outside the cavity to ensure negative pressure in the cavity.

[0011] Furthermore, the thermocouple guide installer 5 includes an adapter plate 51 and a sealing ring 53. The side of the adapter plate 51 that is in contact with the lifting base 62 is arc-shaped. A first through hole 52 is provided in the center of the adapter plate 51, and a radial second through hole 63 is provided at one end where the lifting base 62 is connected to the adapter plate 51. The first through hole 52 and the second through hole 63 are correspondingly connected, and are used to pass the wire 11 of the thermocouple 1 through the first through hole 52 and the second through hole 63 and then lead it downward.

[0012] Furthermore, a cylinder stabilizing assembly 65 is provided at the connection between the bellows 64 and the lifting cylinder 61 below. The cylinder stabilizing assembly 65 includes a plurality of stabilizing disks for stabilizing the lifting cylinder 61 during lifting.

[0013] Furthermore, a temperature control box 7 is provided on the outside of the stabilizing disk, and a temperature control box 7 cover is provided at one end of the temperature control box 7, which is connected to the stabilizing disk through one end of the temperature control box 7 cover.

[0014] Furthermore, a ventilation device is provided on the outside of the lifting cylinder 61 , and the ventilation device includes an air inlet valve 81 and an air outlet valve 82 , which are used to allow air to enter and exit the lifting cylinder 61 .

[0015] Beneficial effects of the present invention: The present invention proposes a temperature detection device for a sputtering coating machine, comprising a clamping device and a lifting device 6, wherein the clamping device is arranged above one end of the lifting device 6, and is characterized in that: the clamping device comprises a wafer lifting tray 3 for clamping the wafer 2, a thermocouple fixing clamp 4 is provided at the bottom of the wafer lifting tray 3, a thermocouple 1 is clamped on the thermocouple fixing clamp 4, one end of the thermocouple 1 is in contact with the bottom surface of the wafer 2 for detecting the temperature of the wafer 2, and a wire 11 is provided at the other end, the lifting device 6 comprises a lifting cylinder 61 and a lifting base 62, a connecting shaft is provided in the middle of the lifting cylinder 61, and the connecting shaft The top is connected to the bottom of the lifting base, and the wafer lifting tray 3 is controlled to rise or fall by the lifting cylinder 61. A thermocouple guide mounter 5 is provided on one side of the top of the lifting base 62. The wire 11 of the thermocouple 1 is wrapped around the outer edge of the tray to one end of the thermocouple guide mounter 5, passes through the other end of the thermocouple guide mounter 5, and is led downward along the lifting base 62 to the external device. The thermocouple 1 is directly set under the wafer 2 through a fixed clamp, so that the temperature of the wafer 2 can be directly detected, and through the adapter plate 51 and the sealing ring 53 on the thermocouple guide mounter 5, the entire space is kept in a vacuum environment when the wire 11 of the thermocouple 1 transmits heat. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is the overall structural diagram of the temperature detection device of the sputtering coating machine of the present invention.

[0017] Figure 2 This is a bottom view of the temperature detection device of the sputtering coating machine of the present invention.

[0018] Figure 3 This is a partial structural diagram of the temperature detection device of the sputtering coating machine of the present invention.

[0019] Figure 4 This is a structural diagram of the lifting device of the temperature detection device of the sputtering coating machine of the present invention.

[0020] Description of main component symbols

[0021] Thermocouple 1, wire 11, wafer 2, wafer lifting tray 3, inclined surface 31, baffle 32, thermocouple fixing clamp 4, thermocouple guide installer 5, adapter plate 51, first through hole 52, sealing ring 53, lifting device 6, lifting cylinder 61, lifting base 62, second through hole 63, bellows 64, cylinder stabilizing assembly 65, flange 66, temperature control box 7, air inlet valve 81, air outlet valve 82.

[0022] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0023] like Figure 1 As shown in FIG, it is the overall structure diagram of the temperature detection device of the sputtering coating machine of the present invention; Figure 2 As shown, it is a bottom view of the temperature detection device of the sputtering coating machine of the present invention; Figure 3 As shown in FIG, it is a partial structural diagram of the temperature detection device of the sputtering coating machine of the present invention; Figure 4 The figure shows the structure diagram of the lifting device of the sputtering coating machine of the present invention.

[0024] Example 1:

[0025] The lifting mechanism 6 is a kind of temperature detection device of sputtering coating machine, comprising a clamping device and a lifting device 6, wherein the clamping device is arranged above one end of the lifting device 6, and is characterized in that: the clamping device comprises a wafer lifting tray 3 for clamping the wafer 2, and a thermocouple fixing clamp 4 is provided at the bottom of the wafer lifting tray 3, and a thermocouple 1 is clamped on the thermocouple fixing clamp 4, and one end of the thermocouple 1 is in contact with the bottom surface of the wafer 2 for detecting the temperature of the wafer 2, and a wire 11 is provided at the other end. The lifting device 6 comprises a lifting cylinder 61 and a lifting base 62, and a connecting shaft is provided in the middle of the lifting cylinder 61, and the top of the connecting shaft is connected to the bottom of the lifting base. The wafer lifting tray 3 is controlled to rise or fall by the lifting cylinder 61, and a thermocouple guide mounter 5 is provided on one side of the top of the lifting base 62. The wire 11 of the thermocouple 1 is wrapped around the outer edge of the tray to one end of the thermocouple guide mounter 5, passes through the other end of the thermocouple guide mounter 5, and is led downward along the lifting base 62 to the external equipment.

[0026] One end of the wafer lifting tray 3 is connected to the lifting device 6, and the other end is in the shape of a clamp with a circular inner circle, which is convenient for fitting the shape of the wafer 2. The inner edge of the clamp end of the wafer lifting tray 3 is provided with an inward inclined surface 31, which is used to guide when placing the wafer 2 on the wafer lifting tray 3.

[0027] A baffle 32 is provided at the bottom of the gripping end of the wafer lifting tray 3 to extend inwardly for supporting the wafer 2 and preventing the wafer 2 from falling.

[0028] The lifting device 6 further includes a flange 66 , which is provided at the bottom of the lifting base 62 . The flange 66 is used to connect to an external heating cavity so that the equipment above the flange 66 is in the vacuum cavity.

[0029] The outer cover of the lifting base 62 is provided with a bellows 64 for preventing dust and isolating the air circulation inside and outside the cavity to ensure negative pressure in the cavity.

[0030] The thermocouple guide installer 5 includes an adapter plate 51 and a sealing ring 53. The side of the adapter plate 51 that is in contact with the lifting base 62 is arc-shaped. A first through hole 52 is provided in the center of the adapter plate 51, and a radial second through hole 63 is provided at one end of the lifting base 62 connected to the adapter plate 51. The first through hole 52 and the second through hole 63 are correspondingly connected, and are used to pass the wire 11 of the thermocouple 1 through the first through hole 52 and the second through hole 63 and then lead it downward.

[0031] A cylinder stabilizing assembly 65 is provided at the connection between the bellows 64 and the lifting cylinder 61 . The cylinder stabilizing assembly 65 includes a plurality of stabilizing disks for stabilizing the lifting cylinder 61 during lifting.

[0032] A temperature control box 7 is provided on the outside of the stabilizing disk. A cover plate of the temperature control box 7 is provided at one end of the temperature control box 7 and is connected to the stabilizing disk via one end of the cover plate of the temperature control box 7 .

[0033] A ventilation device is further provided on the outside of the lifting cylinder 61 , and the ventilation device includes an air inlet valve 81 and an air outlet valve 82 , which are used to allow air to enter and exit the lifting cylinder 61 .

[0034] The working principle of the present utility model is: the robot transports the wafer 2 to the device, the lifting cylinder 61 lifts upward, so that the wafer lifting tray 3 supports the wafer 2, the robot retracts, and the temperature of the wafer 2 is detected by the thermocouple 1 and the temperature control box 7 and transmitted to the external device. After reaching the set temperature, the lifting cylinder 61 moves downward, so that the wafer lifting tray 3 and the wafer 2 move downward, and the wafer 2 remains on the next workstation, and the wafer lifting tray 3 is separated from the wafer 2.

[0035] Beneficial effects of the present invention: The present invention proposes a temperature detection device for a sputtering coating machine, comprising a clamping device and a lifting device 6, wherein the clamping device is arranged above one end of the lifting device 6, and is characterized in that: the clamping device comprises a wafer lifting tray 3 for clamping the wafer 2, a thermocouple fixing clamp 4 is provided at the bottom of the wafer lifting tray 3, a thermocouple 1 is clamped on the thermocouple fixing clamp 4, one end of the thermocouple 1 is in contact with the bottom surface of the wafer 2 for detecting the temperature of the wafer 2, and a wire 11 is provided at the other end, the lifting device 6 comprises a lifting cylinder 61 and a lifting base 62, a connecting shaft is provided in the middle of the lifting cylinder 61, and the connecting shaft The top is connected to the bottom of the lifting base, and the wafer lifting tray 3 is controlled to rise or fall by the lifting cylinder 61. A thermocouple guide mounter 5 is provided on one side of the top of the lifting base 62. The wire 11 of the thermocouple 1 is wrapped around the outer edge of the tray to one end of the thermocouple guide mounter 5, passes through the other end of the thermocouple guide mounter 5, and is led downward along the lifting base 62 to the external device. The thermocouple 1 is directly set under the wafer 2 through a fixed clamp, so that the temperature of the wafer 2 can be directly detected, and through the adapter plate 51 and the sealing ring 53 on the thermocouple guide mounter 5, the entire space is kept in a vacuum environment when the wire 11 of the thermocouple 1 transmits heat.

[0036] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A temperature detection device for a sputtering coating machine, comprising a clamping device and a lifting device (6), wherein the clamping device is arranged above one end of the lifting device (6), and is characterized in that: The clamping device includes a wafer lifting tray (3) for clamping the wafer (2), a thermocouple fixing clamp (4) is provided at the bottom of the wafer lifting tray (3), a thermocouple (1) is clamped on the thermocouple fixing clamp (4), one end of the thermocouple (1) contacts the bottom surface of the wafer (2) for detecting the temperature of the wafer (2), and the other end is provided with a wire (11), the lifting device (6) includes a lifting cylinder (61) and a lifting base (62), a connecting shaft is provided in the middle of the lifting cylinder (61), the top of the connecting shaft is connected to the bottom of the lifting base, and the wafer lifting tray (3) is controlled to rise or fall by the lifting cylinder (61), a thermocouple guide mounter (5) is provided on one side of the top of the lifting base (62), the wire (11) of the thermocouple (1) is wrapped around the outer edge of the tray to one end of the thermocouple guide mounter (5), passes through the other end of the thermocouple guide mounter (5), and is led downward along the lifting base (62) to the external device.

2. The temperature detection device for a sputtering coating machine according to claim 1, wherein: One end of the wafer lifting tray (3) is connected to the lifting device (6), and the other end is in the shape of a clamp with a circular inner circle. The inner edge of the clamp end of the wafer lifting tray (3) is provided with an inward inclined surface (31).

3. The temperature detection device for a sputtering coating machine according to claim 1, wherein: A baffle (32) is provided at the bottom of the gripping end of the wafer lifting tray (3) extending inwards, for supporting the wafer (2) and preventing the wafer (2) from falling.

4. The temperature detection device for a sputtering coating machine according to claim 1, wherein: The lifting base (62) is provided with a bellows (64) on its outer shell.

5. The temperature detection device for a sputtering coating machine according to claim 1, wherein: The thermocouple guide mounter (5) includes an adapter plate (51) and a sealing ring (53). The side of the adapter plate (51) that is in contact with the lifting base (62) is arc-shaped. A first through hole (52) is provided at the center of the adapter plate (51). A radial second through hole (63) is provided at one end of the lifting base (62) connected to the adapter plate (51). The first through hole (52) and the second through hole (63) are correspondingly connected and are used to lead the wire (11) of the thermocouple (1) through the first through hole (52) and the second through hole (63) and then lead it downward.

6. The temperature detection device for a sputtering coating machine according to claim 4, wherein: A cylinder stabilizing assembly (65) is provided below the bellows (64) at the connection with the lifting cylinder (61), and the cylinder stabilizing assembly (65) includes a plurality of stabilizing disks.

7. The temperature detection device for a sputtering coating machine according to claim 6, wherein: A temperature control box (7) is provided on the outside of the stabilizing disk, and a temperature control box (7) cover is provided at one end of the temperature control box (7), which is connected to the stabilizing disk via one end of the temperature control box (7) cover.

8. The temperature detection device for a sputtering coating machine according to claim 1, wherein: A ventilation device is also provided on the outside of the lifting cylinder (61), and the ventilation device includes an air inlet valve (81) and an air outlet valve (82).

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