Cooling assembly and semiconductor device

Abstract

The utility model provides a cooling assembly and semiconductor equipment, and relates to the technical field of chemical vapor deposition. The cooling assembly comprises a liquid inlet pipeline, a liquid return pipeline, a bypass pipeline, a temperature detection unit and at least two cooling branches; the cooling branch is provided with a cooling branch liquid inlet end connected with the liquid inlet pipeline, a cooling branch liquid return end connected with the liquid return pipeline, a liquid inlet connector communicated with the cooling branch liquid inlet end and a liquid return connector communicated with the cooling branch liquid return end, and a branch flow valve is arranged on the cooling branch; the bypass pipeline is provided with a bypass pipeline liquid inlet end connected with the liquid inlet pipeline and a bypass pipeline liquid return end connected with the liquid return pipeline. The liquid inlet connector and the liquid return connector are connected with the to-be-cooled component, temperature information of the to-be-cooled component is obtained through the temperature detection unit, and the cooling liquid flow of the cooling branch is adjusted through the branch flow valve, so that the to-be-cooled component is evenly cooled, the product quality is not prone to being affected, and the situation that the component is scrapped is not prone to occurring.

Description

Technical Field

[0001] The utility model relates to the technical field of chemical vapor deposition, in particular to a cooling component and semiconductor equipment. Background Art

[0002] Silicon carbide (SiC) is a third-generation wide-bandgap semiconductor material, following the first-generation semiconductor materials silicon (Si) and the second-generation semiconductor materials (gallium arsenide (GaAs)). As a semiconductor material, SiC exhibits superior properties, including a wider bandgap, a high critical breakdown electric field, high thermal conductivity, and a high carrier saturation drift velocity. It holds great promise for applications in semiconductor lighting, power electronics, lasers, detectors, and other fields.

[0003] In the field of chemical vapor deposition equipment, temperature control of the equipment's quartz chamber and other parts is particularly important. In addition to precisely controlling the reaction temperature within the equipment's quartz chamber, temperature control of related components through cooling components also has a significant impact on product quality. Having good temperature control capabilities is a key condition for stable equipment operation and guaranteed deposition results.

[0004] For example, SiC epitaxial growth equipment operates at a process temperature of approximately 1600°C. To ensure stable operation of all equipment components at such high temperatures, effective temperature control is required for key components such as the quartz chamber, upstream and downstream capping flanges, upstream and downstream flanges, induction coil capacitors, and induction coils. This ensures the stable operation of components directly related to the quartz chamber.

[0005] However, the existing cooling method connects the cooling water pipes of each component in series or parallel without controlling each cooling branch, which leads to the problem of uneven cooling between different components or between different areas of the same component. When different areas of the quartz cavity, which serves as the reaction chamber, are cooled unevenly, not only will the temperature field inside the quartz cavity be uneven, which will affect the quality of the epitaxial product, causing the yield of the epitaxial product to decrease or be scrapped, affecting the performance of the equipment, but in severe cases, it will also cause the quartz cavity to break. In addition, due to the different thermal expansion coefficients of each component, when the component is heated and deformed, if the temperature between the components is uneven, it will cause the fitting clearance of the components to increase, the sealing performance of the quartz cavity to deteriorate and leak, affecting the quality of the epitaxial product, and in severe cases, even causing the component to be scrapped and the quartz cavity to break. Utility Model Content

[0006] In order to solve the problems existing in the prior art, one of the purposes of the present invention is to provide a cooling assembly.

[0007] The utility model provides the following technical solutions:

[0008] A cooling assembly comprising:

[0009] Liquid inlet pipeline;

[0010] Liquid return line;

[0011] At least two cooling branches, each having a cooling branch liquid inlet end and a cooling branch liquid return end, and further having a liquid inlet joint connected to the cooling branch liquid inlet end and a liquid return joint connected to the cooling branch liquid return end, the cooling branch liquid inlet end being connected to the liquid inlet pipeline, the cooling branch liquid return end being connected to the liquid return pipeline, the liquid inlet joint and the liquid return joint being used to connect to a component to be cooled, and a branch flow valve being provided on the cooling branch;

[0012] a bypass line, the bypass line having a bypass line liquid inlet end and a bypass line liquid return end, the bypass line liquid inlet end being connected to the liquid inlet line, and the bypass line liquid return end being connected to the liquid return line; and

[0013] A temperature detection unit is used to obtain temperature information of the component to be cooled, and the branch flow valve is used to adjust the coolant flow of the cooling branch according to the temperature information.

[0014] As a further optional solution for the cooling component, the temperature detection unit includes a branch liquid inlet temperature sensor and a branch liquid return temperature sensor arranged in the cooling branch, the branch liquid inlet temperature sensor is located between the liquid inlet end of the cooling branch and the liquid inlet joint, and the branch liquid return temperature sensor is located between the liquid return end of the cooling branch and the liquid return joint.

[0015] As a further optional solution for the cooling assembly, a bypass flow valve is provided on the bypass pipeline.

[0016] As a further optional solution for the cooling assembly, a bypass liquid inlet temperature sensor and a bypass liquid return temperature sensor are provided on the bypass pipeline.

[0017] Another object of the present invention is to provide a semiconductor device.

[0018] The utility model provides the following technical solutions:

[0019] A semiconductor device comprises the cooling assembly.

[0020] As a further optional solution for the semiconductor device, the semiconductor device further comprises a reaction chamber, a reaction chamber cooling channel is provided in a wall of the reaction chamber, and the reaction chamber cooling channel is provided corresponding to the cooling branch;

[0021] The liquid inlet joint and the liquid return joint of the cooling branch are respectively connected to the reaction chamber and communicated with the corresponding reaction chamber cooling channel.

[0022] As a further optional solution for the semiconductor device, the temperature detection unit includes a reaction chamber temperature sensor disposed in the reaction chamber.

[0023] As a further optional solution to the semiconductor device, the semiconductor device further includes a flange assembly, an induction coil, and a coil capacitor, wherein the flange assembly is disposed at one end of the reaction chamber along the axial direction, the induction coil is wound around the reaction chamber, and the coil capacitor is electrically connected to the induction coil;

[0024] The flange assembly includes a downstream flange assembly and / or an upstream flange assembly, wherein the downstream flange assembly is arranged at one end of the reaction chamber along the axial direction, and the upstream flange assembly is arranged at the other end of the reaction chamber along the axial direction relative to the downstream flange assembly;

[0025] The cooling assembly includes a reaction chamber cooling assembly and a component cooling assembly. The cooling branch of the reaction chamber cooling assembly is connected to the reaction chamber body. The cooling branch of the component cooling assembly is correspondingly arranged and connected to at least two of the flange assembly, the induction coil and the coil capacitor.

[0026] As a further optional solution for the semiconductor device, the temperature detection unit includes a flange temperature sensor provided on the flange assembly, a coil temperature sensor provided on the induction coil, and a capacitor temperature sensor provided on the coil capacitor.

[0027] As a further optional solution to the semiconductor device, the semiconductor device further includes a reaction chamber and a flange assembly;

[0028] The flange assembly includes a downstream flange assembly and / or an upstream flange assembly, wherein the downstream flange assembly is arranged at one end of the reaction chamber along the axial direction, and the upstream flange assembly is arranged at the other end of the reaction chamber along the axial direction relative to the downstream flange assembly;

[0029] The reaction chamber, the downstream flange assembly and / or the upstream flange assembly are correspondingly arranged and connected to the cooling branch.

[0030] The embodiments of the present invention have the following beneficial effects:

[0031] In the above-mentioned cooling assembly, a bypass line and at least two cooling branches are connected in parallel. When in use, the liquid inlet connector and the liquid return connector of the cooling branch are connected to the component to be cooled, and each cooling branch is respectively connected to a different component to be cooled or a different area of ​​the same component to be cooled. The coolant in the liquid inlet line flows into each cooling branch respectively, so as to cool the different components to be cooled or the different areas of the same component to be cooled, and then merges into the liquid return line. In this process, the temperature information of the component to be cooled is obtained by the temperature detection unit, and the coolant flow rate of the cooling branch is adjusted by the branch flow valve when the cooling is uneven. The excess coolant is returned to the liquid return line through the bypass line, so that the different components to be cooled or the different areas of the same component to be cooled can be cooled evenly, which is not easy to affect the product quality and is not easy to cause the component to be scrapped.

[0032] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0034] Figure 1 A schematic structural diagram of a cooling assembly provided by an embodiment of the present utility model is shown;

[0035] Figure 2 A schematic structural diagram of a semiconductor device provided by an embodiment of the present utility model is shown;

[0036] Figure 3 A schematic diagram showing the connection relationship between a downstream flange assembly, an induction coil, a coil capacitor and a cooling assembly in a semiconductor device provided by an embodiment of the present invention is shown.

[0037] Description of main component symbols:

[0038] 100 - cooling assembly; 110 - liquid inlet pipe; 120 - liquid return pipe; 130 - bypass pipe; 131 - bypass flow valve; 132 - bypass liquid inlet temperature sensor; 133 - bypass liquid return temperature sensor; 140 - cooling branch; 140a - first cooling branch; 140b - second cooling branch; 140c - third cooling branch; 141 - liquid inlet connector; 142 - liquid return connector; 143 - branch flow valve; 150 - temperature detection Unit; 151-branch inlet liquid temperature sensor; 152-branch return liquid temperature sensor; 153-flange temperature sensor; 154-coil temperature sensor; 155-capacitor temperature sensor; 200-reaction chamber; 300-downstream flange assembly; 310-downstream flange; 320-downstream capping flange; 400-induction coil; 500-coil capacitor; 600-upstream flange assembly; 610-upstream flange; 620-upstream capping flange. DETAILED DESCRIPTION

[0039] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0040] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. Conversely, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0041] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the template description herein are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0044] Example

[0045] See also Figure 1 This embodiment provides a cooling assembly 100 for use in semiconductor equipment to cool related components of the semiconductor equipment. The cooling assembly 100 includes a liquid inlet line 110, a liquid return line 120, a bypass line 130, a temperature detection unit 150, and at least two cooling branches 140.

[0046] The cooling branch 140 has a cooling branch liquid inlet and a cooling branch liquid return. The cooling branch liquid inlet is connected to the liquid inlet pipeline 110, and the cooling branch liquid return is connected to the liquid return pipeline 120. The cooling branch 140 also has a liquid inlet connector 141 connected to the cooling branch liquid inlet and a liquid return connector 142 connected to the cooling branch liquid return. The liquid inlet connector 141 and the liquid return connector 142 are arranged in the middle of the cooling branch 140 and are used to connect to the components to be cooled.

[0047] In addition, a branch flow valve 143 is provided on the cooling branch 140. Accordingly, the temperature detection unit 150 is used to obtain temperature information of the component to be cooled, and the branch flow valve 143 is used to adjust the coolant flow of the cooling branch 140 according to the temperature information.

[0048] The bypass pipeline 130 has a bypass pipeline liquid inlet end and a bypass pipeline liquid return end. The bypass pipeline liquid inlet end is connected to the liquid inlet pipeline 110 , and the bypass pipeline liquid return end is connected to the liquid return pipeline 120 .

[0049] In the cooling assembly 100, the bypass line 130 is connected in parallel to at least two cooling branches 140. During operation, the inlet connectors 141 and return connectors 142 of each cooling branch 140 are connected to the component to be cooled. Each cooling branch 140 is connected to a different component to be cooled, or to different regions of the same component. Coolant in the inlet line 110 flows into each cooling branch 140, cooling the different components to be cooled, or different regions of the same component, before merging into the return line 120.

[0050] During this process, the temperature information of the component to be cooled is obtained through the temperature detection unit 150, and when the cooling is uneven, the coolant flow of the cooling branch 140 is adjusted through the branch flow valve 143, and the excess coolant flows back to the return liquid pipeline 120 through the bypass pipeline 130, so that different components to be cooled or different areas of the same component to be cooled can be cooled evenly, which is not likely to affect product quality and is not likely to cause component scrapping.

[0051] In some embodiments, the temperature detection unit 150 includes a branch liquid inlet temperature sensor 151 and a branch liquid return temperature sensor 152 provided on the cooling branch 140. The branch liquid inlet temperature sensor 151 is located between the cooling branch liquid inlet end and the liquid inlet connector 141, and the branch liquid return temperature sensor 152 is located between the cooling branch liquid return end and the liquid return connector 142.

[0052] When in use, the branch liquid inlet temperature sensor 151 and the branch liquid return temperature sensor 152 monitor the temperature of the coolant in the cooling branch 140 before and after flowing through the component to be cooled, thereby obtaining temperature information of the component to be cooled.

[0053] In other embodiments, the temperature detection unit 150 may also be a temperature sensor provided on the component to be cooled, which can directly measure the temperature of the component to be cooled, thereby obtaining temperature information of the component to be cooled.

[0054] Specifically, the branch flow valve 143 is located between the branch liquid inlet temperature sensor 151 and the liquid inlet joint 141 .

[0055] Specifically, water is used as the coolant.

[0056] In some embodiments, a bypass flow valve 131 is provided on the bypass line 130 to adjust the coolant flow in the bypass line 130 .

[0057] Specifically, the bypass flow valve 131 and the branch flow valve 143 are both proportional valves, including but not limited to butterfly valves, gate valves, ball valves, etc. The proportional valves can be adjusted manually or automatically.

[0058] In some embodiments, a bypass liquid inlet temperature sensor 132 and a bypass liquid return temperature sensor 133 are provided on the bypass line 130 to monitor the temperature of the coolant in the bypass line 130 .

[0059] In other embodiments, only one temperature sensor may be provided on the bypass line 130 to monitor the temperature of the coolant in the bypass line 130 .

[0060] This embodiment further provides a semiconductor device, specifically a silicon carbide epitaxial device, which includes the cooling assembly 100 described above.

[0061] See also Figure 2 In some embodiments, the semiconductor device further comprises a reaction chamber 200 . A reaction chamber cooling channel is provided in the wall of the reaction chamber 200 , and the reaction chamber cooling channel is provided corresponding to the cooling branch 140 .

[0062] In addition, the liquid inlet connector 141 and the liquid return connector 142 of the cooling branch 140 are respectively connected to the reaction chamber 200 and communicated with the corresponding reaction chamber cooling channels.

[0063] Specifically, reaction chamber 200 is made of quartz, and its interior contains the chamber where the epitaxial growth reaction occurs. Reaction chamber 200 is shaped like a double-layered hollow cylinder, forming a reaction chamber cooling channel within its walls. Cooling liquid is introduced into the reaction chamber cooling channel to cool reaction chamber 200. Due to the large volume of reaction chamber 200, multiple reaction chamber cooling channels are provided, equal in number to the number of cooling branches 140, and in a one-to-one correspondence.

[0064] During operation, the coolant flows from the liquid inlet pipe 110 into the cooling branch 140, then flows through the liquid inlet connector 141 into the reaction chamber cooling channel, exchanging heat with the reaction chamber 200. The coolant, having absorbed heat from the reaction chamber 200, flows again into the cooling branch 140 through the liquid return connector 142, and finally flows back into the liquid return pipe 120.

[0065] In some embodiments, the temperature detection unit 150 includes a branch inlet temperature sensor 151 and a branch return temperature sensor 152. The branch inlet temperature sensor 151 and the branch return temperature sensor 152 monitor the temperature of different regions of the reaction chamber 200. When uneven cooling occurs, the branch flow valve 143 adjusts the coolant flow rate, thereby evenly cooling different regions of the reaction chamber 200 and avoiding problems such as product scrapping, yield reduction, and reaction chamber 200 breakage caused by uneven temperature field inside the reaction chamber 200.

[0066] In other embodiments, the temperature detection unit 150 includes a reaction chamber temperature sensor disposed on the reaction chamber 200. There are multiple reaction chamber temperature sensors, each located in different areas of the reaction chamber 200, to monitor the temperature of different areas of the reaction chamber 200 and adjust the coolant flow rate through the branch flow valve 143 when cooling is uneven.

[0067] Alternatively, the temperature detection unit 150 may also include a branch liquid inlet temperature sensor 151, a branch liquid return temperature sensor 152 and a reaction chamber temperature sensor.

[0068] Specifically, the number of reaction chamber cooling channels is three, and the cooling assembly 100 includes three cooling branches 140 , each cooling branch 140 being connected to one reaction chamber cooling channel.

[0069] Specifically, flanges are provided at both ends of the reaction chamber 200 along the axial direction, and pipes are provided on the flanges to connect to the reaction chamber cooling channel. The liquid inlet connector 141 and the liquid return connector 142 of the cooling branch 140 are respectively connected to the pipes, thereby connecting to the reaction chamber cooling channel.

[0070] In addition, the liquid inlet joint 141 is connected to the pipe at the bottom of the flange, and the liquid return joint 142 is connected to the pipe at the top of the flange. When in use, the flow direction of the coolant in the cooling channel of the reaction chamber is bottom-in and top-out, which can cool evenly.

[0071] Please also refer to Figure 2 and Figure 3 In some other embodiments, the semiconductor device further includes a reaction chamber 200, a flange assembly, an induction coil 400, and a coil capacitor 500. Accordingly, the cooling assembly 100 includes a reaction chamber cooling assembly and a component cooling assembly.

[0072] Reaction chamber cooling channels are provided within the walls of reaction chamber 200, corresponding to cooling branches 140 of the reaction chamber cooling assembly. The liquid inlet connector 141 and liquid return connector 142 of each cooling branch 140 in the reaction chamber cooling assembly are connected to reaction chamber 200 and communicate with the corresponding reaction chamber cooling channel.

[0073] In addition, the induction coil 400 is wound outside the reaction chamber 200, and the coil capacitor 500 is electrically connected to the induction coil 400. The cooling branch 140 of the component cooling assembly is correspondingly arranged and connected to at least two of the flange assembly, the induction coil 400, and the coil capacitor 500.

[0074] When in use, each cooling branch 140 of the reaction chamber cooling assembly can evenly cool different areas of the reaction chamber 200, thereby avoiding product scrapping caused by uneven temperature field inside the reaction chamber 200, which will not be elaborated here.

[0075] At the same time, each cooling branch 140 of the component cooling assembly cools at least two of the flange assembly, the induction coil 400 and the coil capacitor 500 .

[0076] It is understandable that the components to be cooled in the semiconductor device are not limited to the flange assembly, the induction coil 400 and the coil capacitor 500, but may also be other components, which are also suitable for cooling by the component cooling assembly.

[0077] Specifically, the flange assembly includes at least one of a downstream flange assembly 300 and an upstream flange assembly 600. The downstream flange assembly 300 is disposed at one end of the reaction chamber 200 along the axial direction, and the upstream flange assembly 600 is disposed at the other end of the reaction chamber 200 along the axial direction relative to the downstream flange assembly 300.

[0078] When in use, the downstream flange assembly 300 and the upstream flange assembly 600 are used to seal the reaction chamber 200 , isolating the interior of the reaction chamber 200 from the outside, so as to provide a vacuum reaction environment in the reaction chamber 200 .

[0079] In some embodiments, the flange assembly includes a downstream flange assembly 300. Accordingly, one of the cooling branches 140 of the component cooling assembly is correspondingly disposed and connected to the downstream flange assembly 300 to cool the downstream flange assembly 300.

[0080] In other embodiments, the flange assembly includes an upstream flange assembly 600. Accordingly, one of the cooling branches 140 of the component cooling assembly is correspondingly disposed and connected to the upstream flange assembly 600 to cool the upstream flange assembly 600.

[0081] In yet other embodiments, the flange assembly includes a downstream flange assembly 300 and an upstream flange assembly 600. Accordingly, one cooling branch 140 of the component cooling assembly is correspondingly disposed and connected to the downstream flange assembly 300 to cool the downstream flange assembly 300, and another cooling branch 140 of the component cooling assembly is correspondingly disposed and connected to the upstream flange assembly 600 to cool the upstream flange assembly 600.

[0082] The following description will be made using the downstream flange assembly 300 as an example.

[0083] In some embodiments, the temperature detection unit 150 of the component cooling assembly includes a branch inlet temperature sensor 151 and a branch return temperature sensor 152. The branch inlet temperature sensor 151 and the branch return temperature sensor 152 monitor the temperature of components such as the downstream flange assembly 300, the induction coil 400, and the coil capacitor 500. When the temperature of one or more components deviates from a preset range, the branch flow valve 143 adjusts the coolant flow rate to achieve precise control of the temperature of each component.

[0084] In other embodiments, the temperature detection unit 150 of the component cooling assembly includes a flange temperature sensor 153 provided on the downstream flange assembly 300, a coil temperature sensor 154 provided on the induction coil 400, and a capacitor temperature sensor 155 provided on the coil capacitor 500. The flange temperature sensor 153 directly measures the temperature of the downstream flange assembly 300, the coil temperature sensor 154 directly measures the temperature of the induction coil 400, and the capacitor temperature sensor 155 directly measures the temperature of the coil capacitor 500.

[0085] Alternatively, the temperature detection unit 150 of the component cooling assembly may also include a branch liquid inlet temperature sensor 151 , a branch liquid return temperature sensor 152 , a flange temperature sensor 153 , a coil temperature sensor 154 and a capacitor temperature sensor 155 .

[0086] For example, during the epitaxial growth reaction, the temperature of the coolant entering the downstream flange assembly 300 , the induction coil 400 , the coil capacitor 500 and other components is lower than the temperature of each component.

[0087] When the temperature of a component is too high, the branch flow valve 143 is used to proportionally increase the flow of coolant in the cooling branch 140 where the component is located according to the temperature displayed by the temperature detection unit 150 of the component cooling assembly, so that the temperature of the component is reduced to a preset temperature value or temperature range.

[0088] When the temperature of a component is too low, the branch flow valve 143 is used to proportionally reduce the flow of coolant in the cooling branch 140 where the component is located according to the temperature displayed by the temperature detection unit 150 of the component cooling assembly, so that the temperature of the component is raised to a preset temperature value or temperature range.

[0089] It can be understood that the cooling temperature of each cooling branch 140 and component is set by the host computer, and the specific temperature requirement is determined according to the process requirements.

[0090] If the process requires that the temperature difference between the cooling temperatures of two components must be maintained above a preset value, when the temperature difference between two adjacent components is less than the preset value, the flow rate of the coolant is controlled by the branch flow valve 143 to ensure that the temperature difference between the two components is greater than the preset value.

[0091] Therefore, during the operation of the semiconductor equipment, the cooling temperature of each component of the semiconductor equipment that needs to be cooled (including but not limited to the downstream flange assembly 300, the induction coil 400 and the coil capacitor 500) is adjusted, thereby avoiding deformation of the components due to unstable and large differences in cooling temperature, and further avoiding the problem of poor sealing performance of the reaction chamber 200 due to the increase in the gap between the components. The qualified sealing performance can be guaranteed over a longer period, the stability of the semiconductor equipment, the quality of the epitaxial product, and the frequency of replacement of components damaged by deformation is reduced, thereby extending the service life of the components.

[0092] Furthermore, the cooling branch 140 includes a first cooling branch 140a, a second cooling branch 140b, and a third cooling branch 140c.

[0093] A flange cooling channel is provided in the wall of the downstream flange assembly 300. The liquid inlet connector 141 and the liquid return connector 142 of the first cooling branch 140a are respectively connected to the downstream flange assembly 300 and communicate with the flange cooling channel.

[0094] Specifically, the downstream flange assembly 300 includes a downstream flange 310 and a downstream capping flange 320. The downstream flange 310 is mounted at one axial end of the reaction chamber 200. The downstream capping flange 320 contacts the downstream flange 310, sealing the reaction chamber 200 and the downstream flange 310. The downstream flange 310 and the downstream capping flange 320 are hollow, forming a flange cooling channel.

[0095] In addition, a pipe connecting the flange cooling channel is welded to the lower portion of the downstream flange 310, and the pipe is connected to the liquid inlet connector 141 of the first cooling branch 140a. A pipe connecting the flange cooling channel is welded to the upper portion of the downstream flange 310, and the pipe is connected to the liquid return connector 142 of the first cooling branch 140a.

[0096] When in use, the coolant flows in the flange cooling channel in a direction of bottom-in and top-out, enabling uniform cooling.

[0097] Similarly, the upstream flange assembly 600 includes an upstream flange 610 and an upstream capping flange 620 .

[0098] The upstream flange 610 is installed at the other end of the reaction chamber 200 along the axis direction relative to the downstream flange 310. The upstream capping flange 620 contacts the upstream flange 610 to seal the reaction chamber 200 and the upstream flange 610.

[0099] The induction coil 400 is a conductive tube. The liquid inlet connector 141 and the liquid return connector 142 of the second cooling branch 140 b are respectively connected to the conductive tube and communicate with the tube cavity of the conductive tube.

[0100] Specifically, the conductive tube is a hollow copper tube. One end of the copper tube is connected to the liquid inlet connector 141 of the second cooling branch 140b, and the other end is connected to the liquid return connector 142 of the second cooling branch 140b. When in use, coolant is passed into the copper tube for direct cooling.

[0101] A heat conducting pipe is provided in the coil capacitor 500 , and the liquid inlet connector 141 and the liquid return connector 142 of the third cooling branch 140 c are respectively connected to the heat conducting pipe and communicate with the lumen of the heat conducting pipe.

[0102] Specifically, the heat conducting pipe is also a hollow copper tube. This copper tube is fitted over the coil capacitor 500, with one end connected to the liquid inlet connector 141 of the third cooling branch 140c, and the other end connected to the liquid return connector 142 of the third cooling branch 140c. During use, coolant flows through this copper tube, which then exchanges heat with the coil capacitor 500, removing heat from the coil capacitor 500.

[0103] Please also refer to Figure 2 and Figure 3 In some further embodiments, the semiconductor device further includes a reaction chamber 200 and a flange assembly.

[0104] Specifically, the flange assembly includes at least one of a downstream flange assembly 300 and an upstream flange assembly 600. The downstream flange assembly 300 is disposed at one end of the reaction chamber 200 along the axial direction, while the upstream flange assembly 600 is disposed at the other end of the reaction chamber 200 along the axial direction relative to the downstream flange assembly 300. Furthermore, the reaction chamber 200, the downstream flange assembly 300, and / or the upstream flange assembly 600 are correspondingly disposed and connected to the cooling branch 140. The cooling assembly 100 is used to cool the reaction chamber 200 and the flange assembly.

[0105] It can be understood that since the downstream flange assembly 300 and the upstream flange assembly 600 are used to achieve sealing of the reaction chamber 200, the reaction chamber 200 and the flange assembly are uniformly cooled by the cooling assembly 100, which can ensure that the deformation of the reaction chamber 200 and the flange assembly is consistent, thereby ensuring that the reaction chamber 200 and the flange assembly always maintain a tight fit, thereby avoiding air leakage in the reaction chamber 200.

[0106] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not limiting, and thus other examples of the exemplary embodiments may have different values.

[0107] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0108] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the scope of the present invention, all of which fall within the scope of protection of the present invention.

Claims

1. A cooling assembly, characterized in that: include: Liquid inlet pipeline; Liquid return line; At least two cooling branches, each having a cooling branch liquid inlet end and a cooling branch liquid return end, and further having a liquid inlet joint connected to the cooling branch liquid inlet end and a liquid return joint connected to the cooling branch liquid return end, the cooling branch liquid inlet end being connected to the liquid inlet pipeline, the cooling branch liquid return end being connected to the liquid return pipeline, the liquid inlet joint and the liquid return joint being used to connect to a component to be cooled, and a branch flow valve being provided on the cooling branch; A bypass pipeline, the bypass pipeline having a bypass pipeline liquid inlet end and a bypass pipeline liquid return end, the bypass pipeline liquid inlet end is connected to the liquid inlet pipeline, and the bypass pipeline liquid return end is connected to the liquid return pipeline; as well as A temperature detection unit is used to obtain temperature information of the component to be cooled, and the branch flow valve is used to adjust the coolant flow of the cooling branch according to the temperature information.

2. The cooling assembly according to claim 1, wherein: The temperature detection unit includes a branch liquid inlet temperature sensor and a branch liquid return temperature sensor arranged in the cooling branch, the branch liquid inlet temperature sensor is located between the cooling branch liquid inlet end and the liquid inlet joint, and the branch liquid return temperature sensor is located between the cooling branch liquid return end and the liquid return joint.

3. The cooling assembly according to claim 1, wherein: A bypass flow valve is provided on the bypass pipeline.

4. The cooling assembly according to claim 1, wherein: The bypass pipeline is provided with a bypass liquid inlet temperature sensor and a bypass liquid return temperature sensor.

5. A semiconductor device, characterized in that: The cooling assembly comprises the cooling assembly according to any one of claims 1 to 4.

6. The semiconductor device according to claim 5, wherein The semiconductor device further comprises a reaction chamber, wherein a reaction chamber cooling channel is provided in a wall of the reaction chamber, and the reaction chamber cooling channel is provided corresponding to the cooling branch; The liquid inlet joint and the liquid return joint of the cooling branch are respectively connected to the reaction chamber and communicated with the corresponding reaction chamber cooling channel.

7. The semiconductor device according to claim 6, wherein: The temperature detection unit includes a reaction chamber temperature sensor arranged in the reaction chamber.

8. The semiconductor device according to claim 6, wherein The semiconductor device further includes a flange assembly, an induction coil and a coil capacitor, wherein the induction coil is wound around the reaction chamber, and the coil capacitor is electrically connected to the induction coil; The flange assembly includes a downstream flange assembly and / or an upstream flange assembly, wherein the downstream flange assembly is arranged at one end of the reaction chamber along the axial direction, and the upstream flange assembly is arranged at the other end of the reaction chamber along the axial direction relative to the downstream flange assembly; The cooling assembly includes a reaction chamber cooling assembly and a component cooling assembly. The cooling branch of the reaction chamber cooling assembly is connected to the reaction chamber body. The cooling branch of the component cooling assembly is correspondingly arranged and connected to at least two of the flange assembly, the induction coil and the coil capacitor.

9. The semiconductor device according to claim 8, wherein The temperature detection unit includes a flange temperature sensor provided on the flange assembly, a coil temperature sensor provided on the induction coil, and a capacitor temperature sensor provided on the coil capacitor.

10. The semiconductor device according to claim 5, wherein The semiconductor device further includes a reaction chamber and a flange assembly; The flange assembly includes a downstream flange assembly and / or an upstream flange assembly, wherein the downstream flange assembly is arranged at one end of the reaction chamber along the axial direction, and the upstream flange assembly is arranged at the other end of the reaction chamber along the axial direction relative to the downstream flange assembly; The reaction chamber, the downstream flange assembly and / or the upstream flange assembly are correspondingly arranged and connected to the cooling branch.

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