Copper dissolving device and horizontal electroplating equipment

Abstract

The utility model discloses a copper dissolving device and horizontal electroplating equipment, and relates to the technical field of horizontal electroplating equipment, and the copper dissolving device comprises a cylinder body, a conveying pipeline and an overflow mechanism, a partition plate is arranged in the cylinder body and divides the cylinder body into a first cylinder body and a second cylinder body. An overflow part for communicating the first cylinder body with the second cylinder body is arranged at the upper part of the partition plate; the second cylinder body is provided with an overflow port for the electroplating solution to flow out; the second cylinder body is communicated with the first cylinder body through the conveying pipeline, so that the first cylinder body, the overflow part, the second cylinder body and the conveying pipeline are communicated to form an inner circulation loop; according to the technical scheme provided by the utility model, the overflow part is arranged in the cylinder body, so that liquid in the first cylinder body can flow into the second cylinder body through the overflow part, and liquid in the second cylinder body can flow into the first cylinder body through the conveying pipeline by arranging the conveying pipeline; therefore, liquid in the first cylinder body and the second cylinder body can flow in an internal circulation mode, and the liquid in the cylinder bodies can react with pure copper more sufficiently.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating equipment, in particular to a copper dissolving device and horizontal electroplating equipment. Background Art

[0002] A horizontal electroplating fixture is a device that clamps the plated parts horizontally in PCB horizontal electroplating equipment and sends them to the chemical tank for electroplating. Due to cost issues, most electroplating equipment currently uses titanium baskets placed directly in the main tank as electroplating anodes. To ensure sufficient reaction, a large number of titanium baskets are usually arranged widely. This method is inconvenient to operate and time-consuming. The time required for titanium basket maintenance will also increase, affecting the production efficiency of electroplated parts. In addition, there is the problem of copper powder floating in the electroplating tank. Utility Model Content

[0003] The main purpose of the present invention is to provide a copper dissolving device and a horizontal electroplating device, which are intended to make the electroplating anode reaction more complete and improve the production efficiency of electroplated parts.

[0004] To achieve the above-mentioned purpose, the copper dissolving device proposed in the present invention is used to dissolve pure copper through a reaction solution and react to produce an electroplating solution. The copper dissolving device includes: a cylinder body, a delivery pipeline and an overflow mechanism; a partition plate is provided in the cylinder body, and the partition plate divides the cylinder body into a first cylinder body and a second cylinder body, and the first cylinder body has a liquid inlet for the reaction solution to enter, and a copper particle basket for placing pure copper; the upper part of the partition plate has an overflow part connecting the first cylinder body and the second cylinder body; the second cylinder body is provided with an overflow port for the electroplating solution to flow out; the delivery pipeline connects the second cylinder body with the first cylinder body, so that the first cylinder body, the overflow part, the second cylinder body and the delivery pipeline are connected to form an internal circulation loop; the overflow mechanism is installed at the overflow port, and the overflow mechanism is used to send the liquid in the second cylinder body to the electroplating tank.

[0005] In one embodiment, the overflow portion is provided with a plurality of overflow holes, and the plurality of overflow holes are spaced apart along the extension direction of the partition plate. When the liquid level in the first cylinder reaches the overflow hole, the liquid flows from the overflow hole into the second cylinder.

[0006] In one embodiment, the overflow hole is an elongated hole, and the elongated hole is extended along the length direction of the partition plate.

[0007] In one embodiment, the delivery pipeline includes a first pipe, a second pipe and a power part; a first internal circulation port is opened at the bottom of the first cylinder body, and a second internal circulation port is opened at the bottom of the second cylinder body, one end of the second pipe is connected to the second cylinder body through the second internal circulation port, and the other end is connected to the power part; one end of the first pipe is connected to the power part, and the other end is connected to the first cylinder body through the first internal circulation port.

[0008] In one embodiment, the power component is provided with a first one-way valve, and the first one-way valve is used to guide the liquid in the delivery pipeline to control the liquid to flow from the second pipeline to the first pipeline.

[0009] In one embodiment, it also includes a guide assembly arranged in the second cylinder body, the guide assembly is correspondingly installed below the overflow part, the guide assembly includes a first guide plate and a second guide plate, the first guide plate is arranged below the second guide plate; the second cylinder body has a first inner side wall arranged opposite to the partition plate, the first guide plate extends in a horizontal direction and is inclined, the first guide plate has a first end and a second end, the height of the first end is higher than the second end, the first end is connected to the partition plate, and the second end is connected to the first inner side wall; the second guide plate has a third end and a fourth end, the height of the third end is lower than the height of the fourth end, the third end is connected to the second end through a connecting member, and the fourth end is overlapped with the partition plate.

[0010] In one embodiment, the copper dissolving device further includes a lifting mechanism, which is installed outside the cylinder body and is used to transport pure copper.

[0011] In one embodiment, the lifting mechanism includes: a bracket, a lifting device and a lifting basket; the lifting device is installed on the bracket; the lifting basket can be lifted and lowered on the lifting device, and the lifting basket is used to load pure copper to transport the pure copper to a preset height through the lifting device.

[0012] In one embodiment, the overflow mechanism includes an overflow branch pipe and an overflow main pipe. The overflow branch pipe is arranged through the overflow port. The overflow branch pipe has a liquid inlet and a liquid outlet. The liquid outlet is connected to the overflow main pipe. The height of the liquid inlet is higher than the bottom wall of the second cylinder body.

[0013] The utility model also provides a horizontal electroplating device, comprising an electroplating tank and any one of the copper dissolving devices described above, wherein the electroplating tank is connected to the overflow mechanism via a liquid inlet pipe.

[0014] The technical solution of the utility model is to separate the cylinder body into a first cylinder body and a second cylinder body by arranging a partition plate in the cylinder body, the partition plate is provided with an overflow portion, so that the liquid in the first cylinder body can flow into the second cylinder body through the overflow portion, and a delivery pipeline is further provided to connect the first cylinder body and the second cylinder body, so that the liquid in the second cylinder body can flow into the first cylinder body through the delivery pipeline, so that the liquid in the first cylinder body and the second cylinder body realizes internal circulation flow, so that the liquid in the cylinder body and the pure copper react more fully, and it is only necessary to arrange a copper particle basket in the first cylinder body to place the pure copper, without the need to widely arrange a large number of titanium baskets, thereby improving production efficiency and reducing maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0016] Figure 1 This is a front view of an embodiment of a copper dissolving device provided by the present utility model;

[0017] Figure 2 for Figure 1 A partial enlarged view of point A in the middle;

[0018] Figure 3 A side view of an embodiment of a copper dissolving device provided by the present invention;

[0019] Figure 4 This is a structural schematic diagram of an embodiment of the horizontal electroplating equipment provided by the utility model.

[0020] Description of Figure Numbers:

[0021] 100. Copper dissolving device; 1. Cylinder; 11. Partition plate; 111. Overflow hole; 12. First cylinder; 13. Second cylinder; 14. Copper granule basket; 2. Delivery pipeline; 21. First pipeline; 22. Second pipeline; 23. Power component; 3. Overflow mechanism; 31. Overflow branch pipe; 32. Overflow main pipe; 4. Guide assembly; 41. First guide plate; 42. Second guide plate; 43. Connector; 5. Lifting mechanism; 51. Bracket; 52. Lifting device; 53. Lifting basket;

[0022] 200. Horizontal electroplating equipment; 201. Electroplating tank; 202. Liquid inlet pipe.

[0023] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0025] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0026] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0027] A horizontal electroplating fixture is a device that clamps the plated parts horizontally in PCB horizontal electroplating equipment and sends them to the chemical tank for electroplating. Due to cost issues, most electroplating equipment currently uses titanium baskets placed directly in the main tank as electroplating anodes. To ensure sufficient reaction, a large number of titanium baskets are usually widely arranged. This method is inconvenient to operate and time-consuming. The time required for titanium basket maintenance will also increase, affecting the production efficiency of electroplated parts. There is also the problem of copper powder floating in the electroplating tank, which affects the electroplating quality of the final plated parts.

[0028] The present invention provides a copper dissolving device 100 .

[0029] See also Figure 1-4In one embodiment of the present invention, the copper dissolving device 100 is used to dissolve pure copper with a reaction solution and react to produce an electroplating solution. The copper dissolving device 100 includes: a cylinder 1, a delivery pipeline 2, and an overflow mechanism 3; a partition plate 11 is provided in the cylinder 1, and the partition plate 11 divides the cylinder 1 into a first cylinder 121 and a second cylinder 131. The first cylinder 121 has a liquid inlet for the reaction solution to enter, and a copper particle basket 14 for placing pure copper; an overflow portion is provided on the upper portion of the partition plate 11 to connect the first cylinder 121 with the second cylinder 131; the second cylinder 131 has an overflow port for allowing the electroplating solution to flow out; the delivery pipeline 2 connects the second cylinder 131 with the first cylinder 121, so that the first cylinder 121, the overflow portion, the second cylinder 131, and the delivery pipeline 2 are connected to form an internal circulation loop; the overflow mechanism 3 is installed at the overflow port, and the overflow mechanism 3 is used to send the liquid in the second cylinder 131 to the electroplating tank 201.

[0030] In this embodiment, the cylinder 1 is used to hold the reaction solution and perform a chemical reaction. The reaction solution and pure copper react in the cylinder 1 to produce an electroplating solution that can be used for electroplating. The delivery pipe 2 is used to draw liquid from the second cylinder 131 into the first cylinder 121. The liquid in the first cylinder 121 then flows into the second cylinder 131 through the overflow portion provided at the top of the partition plate 11. The delivery pipe 2 and the overflow portion at the top of the partition plate 11 cooperate to realize the internal circulation of the liquid in the cylinder 1. The reaction solution enters the first cylinder 121 through the liquid inlet of the first cylinder 121. When the solution level in the first cylinder 121 reaches the overflow portion, it flows through the overflow portion to the second cylinder 131. The delivery pipe is connected to the bottom of the second cylinder 131. The liquid overflowing from the first cylinder 121 to the second cylinder 131 flows back to the first cylinder 121 through the delivery pipe, thereby forming an internal circulation within the cylinder 1. The overflow mechanism 3 is used to flow the electroplating solution formed by the reaction into the electroplating tank 201 by overflow.

[0031] In this embodiment, the entire electroplating circulation system includes a copper dissolving device 100 and an electroplating tank 201. The copper dissolving device 100 consumes the Fe 3+ The reaction stock solution is added to the first cylinder 121, and the reaction stock solution dissolves pure copper to generate Fe 2+ and Cu 2 + , an internal circulation system is set in the cylinder 1 to keep the ion concentration of the liquid in the cylinder 1 balanced, thereby controlling the ion concentration of the reaction solution transported to the electroplating tank 201 to reach the preset standard; the copper dissolving device 100 and the electroplating tank 201 continuously transport the liquid containing a large amount of Fe 3+ The reaction solution and the 2+ 、Fe 2+ The electroplating solution exchange reaction is carried out so that the copper ions required for electroplating are obtained in the electroplating tank 201.

[0032] The copper melting device 100 has a copper pellet basket 14. Pure copper is added to the copper pellet basket 14. 3+ After the reaction solution reacts with pure copper in the first cylinder 121, a Fe 2+ and Cu 2+ The electroplating solution then flows from the first cylinder 121 into the copper granule dissolving cylinder 131. The first cylinder 121 and the second cylinder 131 realize internal circulation through the internal circulation mechanism. In this embodiment, pure copper is placed in the copper granule basket 14, and then the liquid inlet of the first cylinder 121 is powered by the power device to 3+ The liquid medicine is drawn and poured into the first cylinder 121. The pure copper in the first cylinder 121 and the Fe 3+ Reaction occurs, Fe 3+ The pure copper is continuously corroded to form a large amount of Fe 2+ and Cu 2+ The solution that can be used for electroplating is then passed through the overflow mechanism 3 in the second cylinder 131 to 2+ and Cu 2+ The electroplating solution overflows and is transported to the electroplating tank 201. The overflow method of flowing out the reaction solution can reduce the copper mud from entering the electroplating tank 201 and contaminating the electroplating tank 201. The internal circulation system realized by the internal circulation mechanism of the cylinder 1 can make the reaction more complete, thereby saving costs, and can balance the ion concentration in the first cylinder 121 and the second cylinder 131. The Fe 2+ and Cu 2+ The electroplating solution is transported to the electroplating tank 201, and the Cu 2+ , which is the medium required for electroplating the workpiece to be plated, and this cycle is set up until the copper plating of the workpiece to be plated is completed.

[0033] The technical solution of the present invention is to separate the cylinder body 1 into a first cylinder body 121 and a second cylinder body 131 by providing a partition plate 11 in the cylinder body 1. The partition plate 11 is provided with an overflow portion, so that the liquid in the first cylinder body 121 can flow into the second cylinder body 131 through the overflow portion. A delivery pipeline 2 is further provided to connect the first cylinder body 121 and the second cylinder body 131, so that the liquid in the second cylinder body 131 can flow into the first cylinder body 121 through the delivery pipeline 2, thereby realizing internal circulation flow of the liquid in the first cylinder body 121 and the second cylinder body 131, so that the liquid in the cylinder body 1 and the pure copper react more fully. It is only necessary to provide a copper particle basket 14 in the first cylinder body 121 to place the pure copper, without the need to widely arrange a large number of titanium baskets, thereby improving production efficiency and reducing maintenance costs.

[0034] See Figure 1 、 2In one embodiment, the overflow portion defines a plurality of overflow holes 111 spaced apart along the extending direction of the partition plate 11. When the liquid in the first cylinder 121 reaches the overflow holes 111, the liquid flows from the overflow holes 111 into the second cylinder 131. The overflow holes 111 are spaced apart on the upper portion of the partition plate 11. Using the overflow holes 111 for overflow can prevent the overflowing liquid from flowing too fast and reduce the generation of bubbles during the overflow process, thereby ensuring a more complete reaction between the reaction solution and the pure copper in the cylinder 1.

[0035] In one embodiment, the overflow hole 111 is an elongated hole extending along the length of the partition plate 11. Using an elongated hole as the overflow hole 111 can reduce the number of holes required while ensuring the overflow effect, thereby reducing the production process, saving production costs, and improving the production efficiency of the partition plate 11.

[0036] In one embodiment, the delivery pipeline 2 includes a first pipe 21, a second pipe 22, and a power member 23; a first internal circulation port is defined at the bottom of the first cylinder 121, and a second internal circulation port is defined at the bottom of the second cylinder 131. One end of the second pipe 22 is connected to the second cylinder 131 via the second internal circulation port, and the other end is connected to the power member 23; one end of the first pipe 21 is connected to the power member 23, and the other end is connected to the first cylinder 121 via the first internal circulation port. The first pipe 21 is used to connect the power member 23 and the first cylinder 121, and the second pipe 22 is used to connect the second cylinder 131 of the power member 23. The power member 23 is a device such as a pump body that can extract liquid. When the power member 23 is turned on, the liquid in the second cylinder 131 can be extracted into the first cylinder 121, thereby achieving circulation within the cylinder 1.

[0037] In one embodiment, the power member 23 is provided with a first one-way valve, which is used to guide the liquid in the delivery pipeline 2 to control the liquid flow from the second pipe 22 to the first pipe 21. The one-way valve is used to limit the flow direction of the liquid in the cylinder 1. It can prevent the liquid from flowing back from the first pipe 21 to the second pipe 22, thereby disrupting the internal circulation system in the cylinder 1.

[0038] In one embodiment, it also includes a guide assembly 4 arranged in the second cylinder body 131, and the guide assembly 4 is correspondingly installed below the overflow portion. The guide assembly 4 includes a first guide plate 41 and a second guide plate 42, and the first guide plate 41 is arranged below the second guide plate 42; the second cylinder body 131 has a first inner side wall arranged opposite to the partition plate 11, the first guide plate 41 extends in a horizontal direction and is inclined, the first guide plate 41 has a first end and a second end, the height of the first end is higher than the second end, the first end is connected to the partition plate 11, and the second end is connected to the first inner side wall; the second guide plate 42 has a third end and a fourth end, the height of the third end is lower than the height of the fourth end, the third end is connected to the second end through a connecting member 43, and the fourth end is overlapped with the partition plate 11. In this embodiment, the guide plate is used to buffer the reaction liquid. Since the overflow portion is arranged at the top of the partition plate 11, when the solution in the first cylinder 121 flows from the overflow portion to the second cylinder 131, the drop will generate a large gravitational potential energy. The setting of the guide plate can prevent the reaction solution from flowing down from too high a height to generate bubbles, which affects the concentration of the final electroplating solution, thereby adversely affecting the quality of the final workpiece to be plated.

[0039] In one embodiment, the copper dissolving apparatus 100 further includes a lifting mechanism 5, which is mounted on the outside of the cylinder 1 and is used to transport pure copper. Since the copper dissolving apparatus 100 is relatively tall and the cylinder 1 contains a relatively high liquid level of reaction solution, to prevent leakage, relatively large nozzles or openings are typically provided at the top of the apparatus. Pure copper is typically added to the first cylinder 121 through the top opening of the apparatus. The provision of the lifting mechanism 5 enables mechanical lifting of relatively large pure copper blocks or balls to the opening. When additional pure copper is required, an operator at a higher location can directly move the copper blocks from the lifting mechanism 5 to the opening, thereby facilitating the addition of the copper blocks to the copper pellet basket 14.

[0040] In one embodiment, the lifting mechanism 5 includes: a bracket 51, a lifting device 52, and a lifting basket 53; the lifting device 52 is mounted on the bracket 51; the lifting basket 53 can be lifted and lowered on the lifting device 52, and the lifting basket 53 is used to load pure copper and transport the pure copper to a preset height through the lifting device 52. The frame is connected to the support device of the cylinder body 1, so that the lifting mechanism 5 can be installed on the outer wall of the cylinder body 1 near the cylinder body 1. The lifting device 52 is a rodless cylinder, which is vertically mounted on the bracket 51 through a connecting piece 43. The rodless cylinder has a driving block that can move up and down. The lifting basket 53 is mounted on the driving block and can move up and down with the driving block. The through hole to be transported is placed in the lifting basket 53, and then it rises to the opening at the top of the cylinder body 1 through the lifting basket 53 to be added to the copper particle basket 14.

[0041] In one embodiment, the overflow mechanism 3 includes an overflow branch pipe 31 and an overflow main pipe 32. The overflow branch pipe 31 is disposed through the overflow port and has a liquid inlet and a liquid outlet. The liquid outlet is connected to the overflow main pipe 32, and the liquid inlet is higher than the bottom wall of the second cylinder 131. The overflow branch pipe 31 is used to connect to the second cylinder 131. The high height of the liquid inlet of the overflow branch pipe 31 allows the liquid in the second cylinder 131 to overflow into the overflow branch pipe 31, thereby allowing copper sludge to settle at the bottom and reducing the risk of copper sludge entering the electroplating tank 201 and contaminating it. The overflow main pipe 32 is used to collect the electroplating solution flowing out of the overflow branch pipe 31 and circulate it back to the electroplating tank 201.

[0042] See Figure 2 、 4 The present invention also provides a horizontal electroplating apparatus 200, which includes an electroplating tank 201 and a copper dissolving device 100. The specific structure of the copper dissolving device 100 is similar to the above-mentioned embodiments. Since the present horizontal electroplating apparatus 200 adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above-mentioned embodiments, which will not be described in detail here. The electroplating tank 201 is connected to the overflow mechanism 3 via a liquid inlet pipe 202. The liquid inlet pipe 202 can be configured to be tilted downward to allow the electroplating solution to flow faster under the action of gravity, thereby facilitating the flow of the electroplating solution to the electroplating tank 201. After the reaction stock solution is injected into the first cylinder 121, it reacts with the pure copper inside, and the reaction is fully carried out through the internal circulation system set in the cylinder 1, thereby obtaining an electroplating solution with an ion concentration that meets the electroplating requirements. The electroplating solution flows into the overflow main pipe 32 through the overflow branch pipe 31 in the overflow mechanism 3, and then flows into the liquid inlet pipe 202 from the overflow main pipe 32, and finally flows into the electroplating tank 201 to electroplate the electroplated parts.

[0043] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A copper dissolving device for dissolving pure copper by reaction solution and reacting to produce electroplating solution, characterized in that: The copper dissolving device comprises: A cylinder body is provided with a partition plate, which divides the cylinder body into a first cylinder body and a second cylinder body. The first cylinder body has a liquid inlet for the reaction solution to enter and a copper particle basket for placing pure copper; the upper portion of the partition plate has an overflow portion connecting the first cylinder body and the second cylinder body; the second cylinder body has an overflow port for the electroplating solution to flow out; a delivery pipeline, connecting the second cylinder body with the first cylinder body, so that the first cylinder body, the overflow portion, the second cylinder body and the delivery pipeline are connected to form an internal circulation loop; and An overflow mechanism is installed at the overflow port, and the overflow mechanism is used to send the liquid in the second cylinder to the electroplating tank.

2. The copper dissolving device according to claim 1, characterized in that The overflow portion is provided with a plurality of overflow holes, and the plurality of overflow holes are spaced apart along the extending direction of the partition plate. When the liquid level in the first cylinder reaches the overflow hole, the liquid flows from the overflow hole into the second cylinder.

3. The copper dissolving device according to claim 2, characterized in that: The overflow hole is a long strip hole, and the long strip hole is extended along the length direction of the partition plate.

4. The copper dissolving device according to claim 1, characterized in that: The delivery pipeline includes a first pipe, a second pipe and a power part; a first internal circulation port is opened at the bottom of the first cylinder body, a second internal circulation port is opened at the bottom of the second cylinder body, one end of the second pipe is connected to the second cylinder body through the second internal circulation port, and the other end is connected to the power part; one end of the first pipe is connected to the power part, and the other end is connected to the first cylinder body through the first internal circulation port.

5. The copper dissolving device according to claim 4, characterized in that: The power component is provided with a first one-way valve, which is used to guide the liquid in the delivery pipeline to control the liquid to flow from the second pipeline to the first pipeline.

6. The copper dissolving device according to claim 1, characterized in that: The invention also includes a flow guide assembly provided in the second cylinder body, the flow guide assembly is correspondingly installed below the overflow portion, the flow guide assembly includes a first flow guide plate and a second flow guide plate, and the first flow guide plate is provided below the second flow guide plate; The second cylinder body has a first inner side wall arranged opposite to the partition plate, the first guide plate extends in a horizontal direction and is arranged obliquely, the first guide plate has a first end and a second end, the height of the first end is higher than the second end, the first end is connected to the partition plate, and the second end is connected to the first inner side wall; the second guide plate has a third end and a fourth end, the height of the third end is lower than the height of the fourth end, the third end is connected to the second end through a connecting member, and the fourth end is overlapped with the partition plate.

7. The copper dissolving device according to claim 1, characterized in that: The copper dissolving device further comprises a lifting mechanism, which is installed outside the cylinder body and is used for transporting pure copper.

8. The copper dissolving device according to claim 7, characterized in that: The lifting mechanism comprises: Bracket; a lifting device mounted on the bracket; and A lifting basket can be installed on the lifting device in a lifting manner. The lifting basket is used to load pure copper so as to transport the pure copper to a preset height through the lifting device.

9. The copper dissolving device according to any one of claims 1 to 8, characterized in that: The overflow mechanism includes an overflow branch pipe and an overflow main pipe. The overflow branch pipe is arranged through the overflow port. The overflow branch pipe has a liquid inlet and a liquid outlet. The liquid outlet is connected to the overflow main pipe. The height of the liquid inlet is higher than the bottom wall of the second cylinder body.

10. A horizontal electroplating device, characterized in that: The invention comprises an electroplating tank and the copper dissolving device according to any one of claims 1 to 9, wherein the electroplating tank is connected to the overflow mechanism via a liquid inlet pipe.

Images