Packaging structure of pressure-sensitive chip

Abstract

The utility model discloses a packaging structure of a pressure-sensitive chip, which comprises a substrate carrier, the pressure-sensitive chip, a sensing medium and a protective cover, and is characterized in that the substrate carrier is provided with a mounting groove and a grating part, a conductive through hole is formed in the substrate carrier, the pressure-sensitive chip is provided with a cavity and a pressure sensing film, the pressure sensing film is arranged in the mounting groove, and the grating part is arranged in the cavity. The sensing medium covers the pressure sensing film, and the protective cover covers the surface of one side, close to the sensing medium, of the substrate carrier and at least covers the sensing medium; the grating part is located between the mounting grooves and separates two adjacent pressure-sensitive chips and two adjacent sensing media, so that pressure conduction between the sensing media is blocked, the anti-interference performance between the pressure-sensitive chips is improved, and the pressure point position density is further improved; the pressure-sensitive chips are electrically connected with the substrate carrier through the conductive through holes so as to transmit pressure-sensitive signals, a gold wire bonding method is replaced, the risk that gold wires are broken due to extrusion is avoided, and the distance between the pressure-sensitive chips is reduced.

Description

Technical Field

[0001] The present application relates to the field of pressure sensors, and in particular to a packaging structure of a pressure-sensitive chip. Background Art

[0002] In order to meet the medical industry's demand for disposable pressure sensor products, such as blood pressure monitors and pulse pressure detectors, the packaging design of pressure sensors has developed towards miniaturization and flexibility. Generally, the pressure sensor chip is placed on the PCB, and then gold wire bonding and peripheral glue potting are performed. In this packaging structure, since the chip and the PCB are bonded by gold wire, when the overall structure is over-extruded, the gold wire or chip may be damaged. In addition, during the peripheral glue potting, in addition to the gold wire, multiple sensing media are also covered together. The sensing media may be interconnected as a whole, causing interference between the pressure sensor chips. In order to minimize interference and to leave space for gold wire bonding, the distance between the chips is large, and the pressure point density is not high. Therefore, how to increase the packaging structure's ability to resist extrusion and improve the pressure point density in a miniaturized design has become an urgent problem to be solved. Utility Model Content

[0003] An embodiment of the present application provides a packaging structure for a pressure-sensitive chip to improve the anti-interference performance between pressure-sensitive chips.

[0004] To solve the above technical problems, an embodiment of the present application discloses the following technical solution: a packaging structure for a pressure-sensitive chip, comprising: a substrate carrier having a first surface and a second surface along a thickness direction thereof, the substrate carrier being provided with at least two spaced-apart mounting slots, the space between two adjacent mounting slots forming a grid portion; a pressure-sensitive chip being stacked in each mounting slot, the pressure-sensitive chip having a cavity therein, the cavity being in close proximity to a side surface of the pressure-sensitive chip parallel to and close to the first surface, a pressure-sensitive membrane being formed between the side surface and the cavity, and a space for accommodating a sensing medium being provided between the pressure-sensitive membrane and a plane where the first surface is located; a sensing medium being stacked on each pressure-sensitive chip in the mounting slot, covering each pressure-sensitive membrane, and the sensing media on two adjacent pressure-sensitive chips being independent of each other; a protective cover being provided on the first surface and covering at least the sensing medium; a conductive through-hole being provided in the substrate carrier at a position corresponding to the mounting slot, the pressure-sensitive chip transmitting a pressure-sensitive signal through the conductive through-hole.

[0005] Furthermore, the mounting groove is opened on the second surface, the groove opening of the mounting groove is located on the second surface, the distance between the second surface and the groove bottom of the mounting groove is equal to the thickness of the pressure sensitive chip, the groove bottom is opened with a through hole that passes through to the first surface, the pressure sensitive chip is embedded in the mounting groove, and the pressure sensing film is exposed in the through hole, and the sensing medium is filled in the through hole to cover the pressure sensing film.

[0006] Furthermore, the substrate carrier includes a first substrate and a second substrate stacked on the first substrate, the surface of the first substrate facing away from the second substrate is the second surface, and the surface of the second substrate facing away from the first substrate is the first surface; the first substrate is provided with a plurality of first through holes penetrating its own thickness, and the second substrate is provided with a plurality of second through holes penetrating its own thickness, the first through holes correspond to the second through holes one by one, and the corresponding first through holes are connected to the second through holes, the thickness of the first substrate is equal to the thickness of the pressure-sensitive chip, the pressure-sensitive chip is embedded in the first through hole, and the pressure-sensing film is exposed in the second through hole, and the sensing medium is filled in the second through hole to cover the pressure-sensing film.

[0007] Furthermore, it also includes a bottom protection body, which is arranged on the second surface and covers at least each of the installation grooves.

[0008] Furthermore, an electrical connection point is provided on a surface of one side of the pressure-sensitive chip facing the bottom of the groove, and the conductive through hole is provided at a corresponding position of the electrical connection point and is electrically connected to the electrical connection point.

[0009] Furthermore, the second surface of the substrate carrier 1 is provided with peripheral connection points, and the interior of the substrate carrier is provided with peripheral through holes at positions corresponding to the peripheral connection points.

[0010] Furthermore, the mounting groove is opened on the first surface, the groove opening of the mounting groove is located on the first surface, and the groove depth is greater than the thickness of the pressure sensitive chip; the side surface of the pressure sensitive chip facing away from the pressure sensing membrane is fitted with the bottom of the mounting groove and embedded in the mounting groove; the sensing medium is filled on the pressure sensitive chip to cover the pressure sensing membrane and does not exceed the first surface.

[0011] Furthermore, an electrical connection point is provided on one side surface of the pressure-sensitive chip that is in contact with the bottom of the groove, and a chip via is provided in the pressure-sensitive chip at a position corresponding to the electrical connection point; the conductive through-hole is arranged at a position corresponding to the electrical connection point in the substrate carrier; and the pressure-sensitive signal is transmitted along the chip via, the electrical connection point and the conductive through-hole.

[0012] Furthermore, the sensing medium is a silicone oil medium; and an oil-proof film is provided on a surface of the substrate carrier facing the protective cover, covering all the notches.

[0013] Furthermore, the protective cover includes a plurality of separation covers, which respectively cover the pressure-sensitive chip and the sensing medium; the separation covers completely cover the sensing medium and are completely separated by the grid portion.

[0014] The above-mentioned technical solutions have at least the following advantages or beneficial effects: the substrate carrier separates multiple pressure-sensitive chips and the sensing medium corresponding to each pressure-sensitive chip by setting the installation groove and the grid part, and blocks the interference that may occur during the pressure transmission process in the form of a physical grid, thereby further improving the pressure point density. At the same time, the substrate carrier and the pressure-sensitive chip are electrically connected through conductive through-holes, replacing the gold wire bonding connection method, avoiding the risk of gold wire breakage of the pressure sensor during the extrusion process, and since the gold wire is eliminated, there is no need to reserve the space required for gold wire bonding between the pressure-sensitive chips in the packaging structure, which can further improve the pressure point density.

[0015] In the above technical solution, the first substrate and the second substrate are drilled to form the mounting grooves, which can also simplify the manufacturing process of the mounting grooves; the packaging structure of the separation cover can further block the pressure interference occurring in the protective cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The following detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings will make the technical solutions and other beneficial effects of the present application apparent.

[0017] Figure 1 It is an overall three-dimensional view of the packaging structure in this application;

[0018] Figure 2 This is a structural diagram of Example 1;

[0019] Figure 3 A three-dimensional view of the substrate carrier 1 in this application;

[0020] Figure 4 for Figure 1 A three-dimensional view of the middle protective cover 4 facing downwards;

[0021] Figure 5 This is a structural diagram of Example 2;

[0022] Figure 6 This is a structural diagram of Example 3;

[0023] Figure 7 This is a schematic structural diagram of Example 4;

[0024] Figure 8 This is a structural diagram of Example 5.

[0025] Description of reference numerals:

[0026] 1. Substrate carrier; 101. Mounting slot; 1011. Notch; 1012. Slot bottom; 1013. Through-hole; 102. Grid portion; 103. Peripheral connection point; 104. Conductive through hole; 105. Peripheral through hole;

[0027] 11. First substrate; 111. First through hole; 12. Second substrate; 121. Second through hole;

[0028] 2. Pressure-sensitive chip; 201. Cavity; 202. Pressure-sensitive membrane; 203. Electrical connection point; 204. Chip via;

[0029] 3. Sensing medium; 4. Protective cover; 41. Separation cover; 5. Bottom protection body; 6. Oil-proof film. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and beneficial effects of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described in this specification are only for explaining the utility model and are not intended to limit this application.

[0031] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, the meaning of "multiple" refers to two or more, unless otherwise clearly and specifically defined.

[0032] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, direct connections, or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0033] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0034] The embodiment 1 provided in this application includes a substrate carrier 1, a pressure-sensitive chip 2, a sensing medium 3 and a protective cover 4. Figure 1 This is an overall three-dimensional view of the packaging structure in this application, such as Figure 1 As shown, the protective cover 4 completely covers the substrate carrier 1 . Figure 2 This is a structural diagram of the first embodiment, as shown in FIG. Figure 2 As shown, in the first embodiment, the substrate carrier 1 has a first surface and a second surface along its thickness direction, the side surface covered by the protective cover 4 is the first surface, and the side surface away from the protective cover 4 is the second surface, the second surface is provided with at least two mounting grooves 101, and a grid portion 102 is formed between two adjacent mounting grooves 101, and a pressure-sensitive chip 2 is stacked in the mounting groove 101; a cavity 201 is provided in the pressure-sensitive chip 2, and the cavity 201 is parallel to the pressure-sensitive chip 2 and close to a side surface close to the first surface, and a pressure-sensitive film 202 is formed between the side surface and the cavity 201, and a space for accommodating a sensing medium 3 is provided between the pressure-sensitive film 202 and the plane where the first surface is located; the sensing medium 3 is stacked on each pressure-sensitive chip 2 in the mounting groove 101, covering each pressure-sensitive film 202, and the sensing media 3 on two adjacent pressure-sensitive chips 2 are independent of each other. The sensing medium 3 in this embodiment is formed as shown in the figure. Figure 2The portion shown is concave; a protective cover 4 is disposed on the first surface of the substrate carrier 1 and covers the sensing medium 3; a conductive through-hole 104 is provided within the substrate carrier 1 at a position corresponding to the mounting slot 101. The conductive through-hole 104 is filled with a conductive material, and the pressure-sensitive chip 2 transmits a pressure-sensitive signal through the conductive through-hole 104. When the protective cover 4 is squeezed, the pressure is transmitted to the sensing medium 3 through the colloid material forming the protective cover 4, and then transmitted to the pressure-sensitive membrane 202 through the sensing medium 3. The pressure difference created by the pressure difference with the internal pressure of the cavity 201 causes the pressure-sensitive membrane 202 to deform. The deformation of the pressure-sensitive membrane 202 changes the impedance of the four-sided bridge, and the changed electrical signal is the pressure-sensitive signal.

[0035] Figure 3 This is a three-dimensional view of the substrate carrier 1 in this application, combined with Figure 2 As can be seen from the structure shown, the grid portion 102 in the substrate carrier 1 separates two adjacent pressure-sensitive chips 2 and, at the same time, separates adjacent sensing media 3, thereby blocking the pressure conduction between the sensing media 3 and eliminating interference between the pressure-sensitive chips 2. That is, when the protective cover 4 is subjected to pressure at a position corresponding to a certain pressure-sensitive chip 2, the pressure will not be transmitted to the pressure-sensing membrane 202 of other pressure-sensitive chips 2 through the adjacent sensing media 3. In the exemplary packaging structure disclosed in this embodiment, the number of pressure-sensitive chips 2 and sensing media 3 is 4, that is, the number of pressure points in the pressure-sensitive chip packaging structure is 4, but it should be understood that Figure 2 and Figure 3 The number of pressure-sensitive chips 2, mounting grooves 101 and sensing media 3 shown in the figure should not be used as a limitation on the scope of protection of the claims. For example, those skilled in the art may also make only one grille portion 102 and two mounting grooves 101 on the substrate carrier 1 based on the exemplary packaging structure shown in this embodiment, or make multiple grille portions 102 and mounting grooves 101 according to the number of pressure points.

[0036] Figure 4 for Figure 1 The three-dimensional view of the middle protective cover 4 facing downward is used to explain the shape and structure of the mounting groove 101 in the first embodiment in detail. Figure 4 Part of the pressure-sensitive chip 2 and part of the sensing medium 3 are hidden. Figure 2From the cross section of the mounting groove 101, it can be seen that the groove opening 1011 of the mounting groove 101 is located on the side surface of the substrate carrier 1 away from the protective cover 4, i.e., the second surface. The groove depth is equal to the thickness of the pressure sensitive chip 2. A through-hole 1013 is provided at the center of the groove bottom 1012. The area of ​​the through-hole 1013 is slightly larger than the area of ​​the pressure sensing film 202. The distance between the edge of the pressure sensing film 202 and the inner wall of the through-hole 1013 should be greater than or equal to the safe mounting distance of the pressure sensing film 202, which is generally 0.05 mm. The sensing medium 3 is filled in the through-hole 1013 to cover the pressure sensing film 202. Figure 2 and Figure 4 The substrate carrier 1 is provided with a conductive through-hole 104 at a position corresponding to the groove bottom 1012 inside, and the pressure-sensitive chip 2 has an electrical connection point 203 on one side surface with a pressure-sensitive membrane 202; in addition, the second surface of the substrate carrier 1 is provided with a peripheral connection point 103, and the interior of the substrate carrier 1 is provided with a peripheral through-hole 105 at a position corresponding to the peripheral connection point 103, and the peripheral through-hole 105 is also filled with a conductive material. The conductive through-hole 104 and the peripheral through-hole 105 transmit electrical signals through the substrate surface circuit (not shown in the figure), and the pressure-sensitive chip 2 has a pressure-sensitive membrane 202 on one side surface that is in contact with the groove bottom 1012 of the mounting groove 101, so that the electrical connection point 203 is electrically connected to the conductive through-hole 104. Compared with the packaging structure using gold wire bonding, there is no need to set an additional gap between the pressure-sensitive chip 2 and the substrate carrier 1 to leave space for the gold wire, thereby reducing the spacing between adjacent pressure-sensitive chips 2, increasing the pressure point density, and avoiding the risk of gold wire breaking when the packaging structure is over-extruded.

[0037] The packaging structure of Example 2 provided in the present application is roughly the same as that of Example 1, except that, in Example 2, the substrate carrier 1 includes a first substrate 11 and a second substrate 12 stacked on the first substrate 11, wherein the side surface of the first substrate 11 facing away from the second substrate 12 is the second surface, and the side surface of the second substrate 12 facing away from the first substrate 11 is the first surface. Figure 5 This is a structural diagram of the second embodiment, as shown in FIG. Figure 5As shown, the first substrate 11 is provided with a plurality of first through holes 111 penetrating the thickness thereof, and the second substrate 12 is provided with second through holes 121 corresponding to the first through holes 111 one by one. The pressure sensitive chip 2 is embedded in the first through holes 111. The opening area of ​​the second through holes 121 is slightly larger than the area of ​​the pressure sensing film 202 and leaves a safe mounting distance for the pressure sensing film 202. The first through holes 111 are connected to the corresponding second through holes 121 to form the mounting groove 10 1, that is, the opening of the mounting groove 101 is located on the second surface of the substrate carrier 1, the thickness of the first substrate 11 is the depth of the mounting groove 101, which is equal to the thickness of the pressure-sensitive chip 2, and the second substrate 12 serves as the bottom of the mounting groove 101; the side surface of the pressure-sensitive chip 2 having the pressure-sensing membrane 202 is bonded to the bottom of the mounting groove 101, i.e., the second substrate 12, and exposed in the second through-hole 121; the sensing medium 3 is filled in the second through-hole 121. This embodiment is a preferred embodiment, and its preferred feature is that the substrate carrier 1 is composed of the first substrate 11 and the second substrate 12, which can eliminate the step of forming the bottom of the mounting groove 101 during the production process. The drilling operations of the first through-hole 111 and the second through-hole 121 can be performed independently. In contrast, the production of a mounting groove with a bottom opening on the same substrate requires first digging and grinding the bottom, and then drilling the bottom. The method of assembling the first substrate 11 and the second substrate 12 to form the mounting groove 101 in this embodiment is more convenient.

[0038] The packaging structure of the third embodiment provided in the present application is substantially the same as that of the first embodiment, except that, in the third embodiment, the pressure-sensitive chip 2 and the sensing medium 3 are separately covered by a plurality of separation covers 41 . Figure 6 This is a schematic diagram of the structure of the third embodiment, as shown in FIG. Figure 6 As shown, the separation cover 41 is completely separated by the grille portion 102, and each separation cover 41 separately covers a pressure-sensitive chip 2 and a sensing medium 3. Compared with the protective cover 4 in Example 1 or Example 2, the separate separation cover 41 directly blocks the transmission of pressure in the protective cover material, and further eliminates the interference between different pressure-sensitive chips 2.

[0039] Reference Figures 1 to 6In the first, second and third embodiments provided in this application, the pressure-sensitive chip 2 is electrically connected to the substrate carrier 1 through a flip-chip bonding process, and the electrical connection points 203 of the pressure-sensitive chip 2 are all on the side surface having the pressure-sensing film 202. During the packaging process, after the mounting groove 101 of the substrate carrier 1 is completed, the pressure-sensitive chip 2 is first implanted with connecting solder balls or solder points as electrical connection points 203, and then flip-chip soldered to the mounting groove 101 of the substrate carrier 1, and the electrical connection points 203 are correspondingly connected to the conductive through-holes 104; after completing the flip-chip soldering, the bottom protective body 5 can be covered on the side surface of the substrate carrier 1 away from the protective cover 4, that is, the second surface, to strengthen the connection between the pressure-sensitive chip 2 and the substrate carrier 1 and stabilize the flip-chip soldering structure. The bottom protective body 5 should at least cover each mounting groove 101; after the pressure-sensitive chip 2 is firmly connected to the substrate carrier 1, the sensing medium 3 is filled to fully cover the pressure sensing membrane 202; the protective cover 4 or the separation cover 41 is covered on the sensing medium 3 through a glue coating operation to complete the sealing.

[0040] The packaging structures of the fourth and fifth embodiments provided in this application are roughly the same as those of the above embodiments, except that the pressure-sensitive chip 2 is electrically connected to the substrate carrier 1 through a positive mounting process, providing a packaging structure compatible with the technical solution of this application for the tube core with TSV process. Figure 7 This is a structural diagram of Example 4. Figure 8 This is a structural diagram of the fifth embodiment, referring to Figure 7 and Figure 8 The electrical connection point 203 of the pressure-sensitive chip 2 is disposed on a surface facing away from the pressure-sensing membrane 202, and a chip via 204 is provided at the location of the electrical connection point 203. The chip via 204 is filled with a conductive material. In the fourth and fifth embodiments, the mounting groove 101 of the substrate carrier 1 is provided on the first surface, i.e., the notch of the mounting groove 101 is located on the side of the substrate carrier 1 facing the protective cover 4. The groove depth is greater than the thickness of the pressure-sensitive chip 2. Conductive through-holes 104 are provided at the edges or corners of the groove bottom to connect to the electrical connection point 203. The sensing medium 3 is filled in the mounting groove 101 and covers the pressure-sensing membrane 202. After the pressure-sensing membrane 202 is deformed, the pressure-sensitive signal is first transmitted to the electrical connection point 203 through the chip via 204 in the pressure-sensitive chip 2, and then transmitted to the peripheral connection point 103 through the conductive through-hole 104 at the groove bottom along the substrate surface circuit (not shown).

[0041] like Figure 8As shown, in embodiment five, the sensing medium 3 is a silicone oil medium, and the surface of the substrate carrier 1 facing the protective cover 4 is further provided with an oil-proof film 6, which covers all the notches to prevent the silicone oil medium from overflowing and mixing with the colloid material of the protective cover 4.

[0042] In the fourth and fifth embodiments, the substrate carrier 1 does not need to have through holes at the positions of the peripheral connection points 103 , and the overall structural strength of the edge positions of the substrate carrier 1 is better.

[0043] The above steps are only intended to help understand the method, structure, and core concept of this application. Those skilled in the art may make improvements and modifications to the technical solution of this application without departing from the technical principles of this application, and such improvements and modifications also fall within the scope of protection of the claims of this application.

Claims

1. A packaging structure for a pressure-sensitive chip, characterized in that: include: A substrate carrier having a first surface and a second surface along a thickness direction thereof, wherein the substrate carrier is provided with at least two mounting grooves arranged at intervals, and a space between two adjacent mounting grooves forms a grid portion; A pressure-sensitive chip is stacked and disposed in each mounting groove, and has a cavity therein. The cavity is parallel to a side surface of the pressure-sensitive chip and close to the first surface, and a pressure-sensitive membrane is formed between the side surface and the cavity. A space for accommodating a sensing medium is also defined between the pressure-sensitive membrane and the plane where the first surface is located. The sensing medium is stacked on each pressure-sensitive chip in the mounting groove, covering each of the pressure-sensitive films, and the sensing media on two adjacent pressure-sensitive chips are independent of each other; a protective cover, disposed on the first surface and at least covering the sensing medium; A conductive through hole is provided inside the substrate carrier at a position corresponding to the mounting groove, and the pressure-sensitive chip transmits a pressure-sensitive signal through the conductive through hole.

2. The packaging structure according to claim 1, wherein: The mounting groove is opened on the second surface, the groove opening of the mounting groove is located on the second surface, the distance between the second surface and the groove bottom of the mounting groove is equal to the thickness of the pressure sensitive chip, the groove bottom is opened with a through-hole that passes through to the first surface, the pressure sensitive chip is embedded in the mounting groove, and the pressure sensing membrane is exposed in the through-hole, and the sensing medium is filled in the through-hole to cover the pressure sensing membrane.

3. The packaging structure according to claim 2, wherein: The substrate carrier includes a first substrate and a second substrate stacked on the first substrate, a surface of the first substrate facing away from the second substrate is the second surface, and a surface of the second substrate facing away from the first substrate is the first surface; The first substrate is provided with a plurality of first through holes penetrating the first substrate's thickness, and the second substrate is provided with a plurality of second through holes penetrating the second substrate's thickness. The first through holes correspond to the second through holes one by one, and the corresponding first through holes are connected to the second through holes. The thickness of the first substrate is equal to the thickness of the pressure-sensitive chip. The pressure-sensitive chip is embedded in the first through holes, and the pressure-sensitive film is exposed in the second through holes. The sensing medium is filled in the second through holes to cover the pressure-sensitive film.

4. The packaging structure according to claim 2 or 3, characterized in that: Also includes: The bottom protection body is disposed on the second surface and at least covers each of the installation grooves.

5. The packaging structure according to claim 2 or 3, characterized in that: An electrical connection point is provided on a surface of the pressure-sensitive chip on one side facing the bottom of the groove, and the conductive through hole is arranged at a corresponding position of the electrical connection point and is electrically connected to the electrical connection point.

6. The packaging structure according to claim 2 or 3, characterized in that: The second surface of the substrate carrier is provided with peripheral connection points, and the interior of the substrate carrier is provided with peripheral through holes at positions corresponding to the peripheral connection points.

7. The packaging structure according to claim 1, wherein: The mounting groove is formed on the first surface, the opening of the mounting groove is located on the first surface, and the groove depth is greater than the thickness of the pressure-sensitive chip; The surface of the pressure-sensitive chip facing away from the pressure-sensitive film is in contact with the bottom of the mounting groove and is embedded in the mounting groove; The sensing medium is filled on the pressure-sensitive chip and covers the pressure-sensitive film, and does not exceed the first surface.

8. The packaging structure according to claim 7, wherein: An electrical connection point is provided on the surface of the pressure-sensitive chip that is in contact with the bottom of the groove, and a chip via is provided in the pressure-sensitive chip at a position corresponding to the electrical connection point; The conductive through-hole is provided in the substrate carrier at a position corresponding to the electrical connection point; The pressure-sensitive signal is transmitted along the chip vias, electrical connection points and conductive through holes.

9. The packaging structure according to claim 7, wherein: The sensing medium is silicone oil; An oil-proof film is provided on one side of the substrate carrier facing the protective cover, covering all the notches.

10. The packaging structure according to claim 1, wherein: The protective cover includes a plurality of separation covers, which respectively cover the pressure-sensitive chip and the sensing medium; The separation cover completely covers the sensing medium and is completely separated by the grid portion.

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