Wafer transfer unit and wafer processing equipment

Abstract

The embodiment of the utility model provides a wafer transfer unit and wafer processing equipment. The wafer transfer unit provided by the embodiment of the utility model comprises a bottom plate; the wafer storage part is fixed on the top surface of the bottom plate; the wafer bearing part is used for bearing a wafer, the wafer bearing part is located above the wafer storage part, and a storage cavity is formed between the wafer bearing part and the wafer storage part; and the wafer detection parts are located at the two ends of the bottom plate, scanning parts are arranged on the wafer detection parts, the scanning range of the scanning parts covers the plane area of the wafer, and when scanned wafer plane data indicate that the wafer deforms, the wafer located on the wafer bearing part is indicated to be placed in the storage cavity. According to the technical scheme provided by the embodiment of the invention, the wafer on the wafer bearing part is scanned and detected through the wafer detection part arranged in the wafer transfer unit, so that alarm and operation interruption of semiconductor manufacturing equipment caused by wafer deformation are avoided, and the production efficiency is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor manufacturing, and specifically to a wafer transfer unit and wafer processing equipment. Background Art

[0002] In semiconductor device manufacturing, wafer quality, as the substrate for semiconductor devices, is crucial to the entire manufacturing process. Surface flatness, in particular, significantly impacts device performance and reliability. Deformations such as wafer warping can affect the consistency of subsequent processes and reduce the yield of semiconductor devices. Wafer inspection during the manufacturing process can promptly identify and eliminate potential process issues, preventing deformed wafers from causing semiconductor manufacturing equipment failures and potentially interrupting the manufacturing process.

[0003] Wafer transfer units are crucial for transferring wafers to other process units within semiconductor manufacturing equipment. If a deformed wafer is transferred to a subsequent process unit and triggers an alarm, the semiconductor manufacturing equipment will halt operations and generate an alarm, impacting production efficiency. Therefore, improving machine production efficiency has become a pressing technical challenge for those skilled in the art. Utility Model Content

[0004] In order to solve the above technical problems, an embodiment of the present application provides a wafer transfer unit and a wafer processing device.

[0005] In a first aspect, an embodiment of the present application provides a wafer transfer unit, comprising:

[0006] base plate;

[0007] a wafer storage portion, fixed on the top surface of the base plate;

[0008] A wafer carrying portion, used for carrying wafers, the wafer carrying portion is located above the wafer storage portion, and a storage cavity is formed between the wafer carrying portion and the wafer storage portion;

[0009] The wafer detection part is located at both end portions of the base plate. A scanning component is provided on the wafer detection part. The scanning range of the scanning component covers the plane area of ​​the wafer. When the scanned wafer plane data indicates that the wafer is deformed, it indicates that the wafer located on the wafer supporting part is placed in the storage cavity.

[0010] In a second aspect, an embodiment of the present application provides a wafer processing device, comprising the wafer transfer unit as described in the first aspect.

[0011] The wafer transfer unit provided in the embodiment of the present application is provided with a wafer storage unit and a wafer detection unit. The wafer on the wafer support unit is scanned and detected by the scanning unit of the wafer detection unit. Since the scanning range of the scanning unit covers the planar area of ​​the wafer, the scanning unit can obtain all the planar data of the wafer. Therefore, when the scanned wafer planar data indicates that the wafer is deformed, the wafer on the wafer support unit is instructed to be placed in the storage cavity, preventing the deformed wafer from entering the subsequent process flow, thereby avoiding alarms and operation interruptions caused by wafer deformation in semiconductor manufacturing equipment, and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0013] Figure 1 This is a schematic diagram of a wafer transfer unit provided in this application.

[0014] Figure 2 This is another schematic diagram of a wafer transfer unit provided in this application.

[0015] Figure 3 This is a partial schematic diagram of a wafer transfer unit provided in this application.

[0016] Figure 4 This is another schematic diagram of a wafer transfer unit provided in this application.

[0017] Figure 5 This is another partial schematic diagram of a wafer transfer unit provided in this application.

[0018] Figure 6 This is a flow chart of a wafer transfer method provided by this application. DETAILED DESCRIPTION

[0019] In semiconductor manufacturing, a track is a device used for processes such as photoresist coating and development. A track typically consists of multiple process modules (blocks), each with at least one process cell used to perform different processes or treatments. During semiconductor manufacturing, wafers need to be transferred between different process modules or cells for different processes or treatments, and wafers must be placed in specific cells between some steps.

[0020] As mentioned in the background technology section, the wafer serves as the substrate of semiconductor devices, and its quality is key to the entire manufacturing process. In particular, surface flatness has a significant impact on the performance and reliability of the device. Moreover, when the wafer is transferred between different process modules or between different process units, if the wafer flatness is poor, for example, if the wafer is warped or deformed, it may cause the device used to transfer the wafer to be unable to transfer the wafer stably, thereby causing the semiconductor manufacturing equipment to interrupt operation and alarm, affecting production efficiency.

[0021] To this end, the present application provides a wafer transfer unit, comprising:

[0022] base plate;

[0023] a wafer storage portion, fixed on the top surface of the base plate;

[0024] A wafer carrying portion, used for carrying wafers, the wafer carrying portion is located above the wafer storage portion, and a storage cavity is formed between the wafer carrying portion and the wafer storage portion;

[0025] The wafer detection part is located at both end portions of the base plate and is provided with a scanning component. The scanning range of the scanning component covers the plane area of ​​the wafer. When the scanned wafer plane data indicates that the wafer is deformed, it instructs the wafer located on the wafer supporting part to be placed in the storage cavity.

[0026] The wafer transfer unit provided in the embodiment of the present application is provided with a wafer storage unit and a wafer detection unit. The wafer on the wafer support unit is scanned and detected by the scanning unit of the wafer detection unit. Since the scanning range of the scanning unit covers the planar area of ​​the wafer, the scanning unit can obtain all the planar data of the wafer. Therefore, when the scanned wafer planar data indicates that the wafer is deformed, the wafer on the wafer support unit is instructed to be placed in the storage cavity, preventing the deformed wafer from entering the subsequent process flow, thereby avoiding alarms and operation interruptions caused by wafer deformation in semiconductor manufacturing equipment, and improving production efficiency.

[0027] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0028] Figure 1 This is a schematic diagram of a wafer transfer unit provided by this application. Figure 1As shown, the wafer transfer unit includes: a base plate 1; a wafer storage part 21, fixed on the top surface of the base plate 1; a wafer supporting part 22, for supporting a wafer 3, the wafer supporting part 22 is located above the wafer storage part 21, and forms a storage cavity between the wafer supporting part 22 and the wafer storage part 21; a wafer detection part, located at both end portions of the base plate, a scanning component is provided on the wafer detection part, and the scanning range of the scanning component covers the plane area of ​​the wafer. When the scanned wafer plane data indicates that the wafer is deformed, it is indicated to place the wafer 3 located on the wafer supporting part 22 in the storage cavity.

[0029] The wafer storage unit 21 is used to store deformed wafers to prevent them from entering subsequent process flows, which could cause the semiconductor manufacturing equipment to interrupt operation and trigger an alarm. In some embodiments, after the process module where the wafer transfer unit is located completes other process flows, the deformed wafers can be manually removed from the semiconductor manufacturing equipment (storage chamber).

[0030] In some embodiments, as Figure 1 As shown, the wafer storage part 21 includes: a wafer storage support plate 210, fixed on the top surface of the base plate 1 and located between the wafer detection parts; a support column 211, located on the top surface of the wafer storage support plate 210, wherein each support column is provided with a plurality of wafer supports 212, and the wafer supports 212 arranged at corresponding positions on different support columns are located on the same horizontal plane.

[0031] Among them, since the wafer detection part is arranged at both ends of the base plate 1, and the wafer storage support plate 210 is arranged between the wafer detection parts, the internal space occupied by the wafer transfer unit can be reduced. The wafer support member 212 is used to support the wafer, and its shape is not limited, as long as it can achieve the placement of the wafer 3 in the storage cavity between the wafer carrying part 22 and the wafer storage support plate 210. In some specific embodiments, four support columns 211 are provided to ensure that deformed wafers can be stably placed in the storage cavity.

[0032] The wafer support portion 22 is used to support the wafer, so that the wafer inspection unit can inspect the wafer 3 in the wafer transfer unit. The method of supporting the wafer 3 is not limited here. For example, the wafer 3 can be suspended on the wafer support portion 22 by spraying gas from the bottom of the wafer 3 toward the wafer 3, thereby enabling the wafer inspection unit to inspect the wafer 3.

[0033] In some embodiments, as Figure 1As shown, the wafer supporting part 22 includes: a wafer supporting platform 220, which is fixedly connected to the top of the wafer storage part 21; at least three wafer supporting feet 221, which are fixed on the wafer supporting platform 220 and are used to support the wafer 3. The wafer supporting feet 221 are in contact with the wafer 3. The wafer supporting part 22 does not use gas suspension to support the wafer, which can avoid the introduction of additional gas into the semiconductor manufacturing equipment to affect the manufacturing process and improve the stability of the process. There is no specific limit to the number of the wafer supporting feet 221, as long as they can provide support for the wafer and ensure that the wafer 3 can be stably placed on the wafer supporting part 22 when the wafer detection part detects the wafer 3.

[0034] In some specific embodiments, the wafer supporting feet 221 are arranged in an equilateral triangle on the top surface of the wafer supporting platform 220, and the width of the contact surface between the wafer supporting feet 221 and the wafer 3 is less than or equal to 5 mm. Arranging the wafer supporting feet 221 in an equilateral triangle can provide stable support for the wafer 3, while avoiding too many wafer supporting feet 221, which affects the effect of the wafer detection unit on the detection of the wafer 3. Furthermore, since the contact surface between the wafer supporting feet 221 and the wafer 3 will affect the scanning results during the wafer detection process, if the contact surface is too large, the detection signal will be blocked, thereby affecting the accuracy of the detection results. Therefore, the contact surface between the wafer supporting feet 221 and the wafer 3 is controlled so that the width of the contact surface is less than or equal to 5 mm, which can improve the scanning detection accuracy.

[0035] The wafer inspection unit scans the wafer 3 on the wafer support portion 22 using a scanning component provided thereon. The scanned wafer plane data is processed by a data processing module connected to the scanning component. When the data processing module detects that the scanned wafer plane data indicates wafer deformation, it indicates that the wafer has warped or deformed. Thus, the wafer inspection unit is used to detect whether the wafer has deformed.

[0036] It can be seen that the wafer transfer unit provided in the embodiment of the present application is provided with a wafer storage unit and a wafer detection unit in the wafer transfer unit, and the wafer on the wafer supporting unit is scanned and detected by the scanning unit of the wafer detection unit. Since the scanning range of the scanning unit covers the plane area of ​​the wafer, the scanning unit can obtain all the plane data of the wafer. Therefore, when the scanned wafer plane data indicates that the wafer is deformed, it is instructed to place the wafer on the wafer supporting unit in the storage cavity to prevent the deformed wafer from entering the subsequent process flow, thereby avoiding the alarm and operation interruption caused by wafer deformation in the semiconductor manufacturing equipment, thereby improving production efficiency.

[0037] In some embodiments, as Figure 1As shown, two slide rails 230 are provided on both end portions of the top surface of the base plate 1; the wafer detection portion is a mobile detection portion; the mobile detection portion includes: a transmitting arm 231 and a receiving arm 232, the bottom ends of the transmitting arm 231 and the receiving arm 232 are respectively located in the two slide rails 230, and the scanning component includes: a signal transmitter 240 arranged on the transmitting arm 231, and a signal receiver (not shown) arranged on the receiving arm 232, and the transmitting arm 231 and the receiving arm 232 move synchronously in the slide rail 230, driving the signal transmitter 240 and the signal receiver (not shown) to scan the wafer, so that when the scanned data indicates that the wafer is deformed, the wafer 3 located on the wafer supporting portion 22 is placed in the storage cavity.

[0038] Since wafer deformation may occur on any part of the wafer plane, wafer inspection requires inspection of the entire wafer surface. In order to reduce the number of electronic units set up in the scanning component, when there are a small number of scanning components, the detection range of the scanning component is limited. Therefore, the scanning component can be moved by setting a mobile detection unit to ensure that the scanning range of the scanning component can cover the plane area of ​​the wafer, thereby improving the accuracy of inspection and preventing the deformed wafer from affecting the normal process. Further, as Figure 2 As shown, the transmitting arm 231 and the receiving arm 232 can move synchronously in the slide rail 230 along the AA' direction, which can ensure that the signal emitted by the signal transmitter 240 set on the transmitting arm is received by the signal transmitter 241 set on the receiving arm 232, thereby realizing the detection of the wafer 3.

[0039] In some specific embodiments, such as Figure 3 As shown, there are two signal transmitters 240 and two signal receivers 241; the plane where one group of signal transmitters 240 and signal receivers 241 are located is flush with the upper surface of the wafer 3, and the plane where the other group of signal transmitters 240 and signal receivers 241 are located is flush with the lower surface of the wafer, and the distance between each group of signal transmitters 240 and signal receivers 241 and the wafer 3 does not exceed the preset scanning distance.

[0040] The preset scanning distance is 1 to 10 mm, for example, 1 mm, 3 mm, 5 mm, and 10 mm. The preset scanning distance can be adjusted according to the size of the wafer 3. For example, for a 12-inch wafer, the preset scanning distance can be 5 mm. For an 8-inch wafer, the preset scanning distance can be smaller, for example, 3 mm.

[0041] Since scanning and detecting both the upper and lower surfaces of the wafer is beneficial to improving the accuracy of detection and avoiding missing deformed wafers, multiple scanning components can be set to simultaneously detect the upper and lower surfaces of the wafer. Specifically, two pairs of signal transmitters 240 and signal receivers 241 can be set to achieve simultaneous detection of the upper and lower surfaces of the wafer. The detection signal is emitted from the signal transmitter 240 and received by the signal receiver 241. By analyzing the received signal, when the received signal exceeds the normal range, it indicates that the wafer is deformed or warped. In some embodiments, the signal can be analyzed by a data processing module connected to the signal transmitter 240 and the signal receiver 241. For example, when the signal strength received by the data processing module is attenuated by more than 3dB, it indicates that the wafer is deformed or warped.

[0042] It can be seen that the wafer transfer unit provided in the present application improves the detection accuracy and reduces the internal space occupied by the wafer detection part by setting a wafer storage part and a wafer detection part in the wafer transfer unit, and scanning and detecting the wafer on the wafer supporting part through two pairs of signal transmitters and signal receivers set on the mobile detection part; when the scanned wafer plane data indicates that the wafer is deformed, it is instructed to place the wafer located on the wafer supporting part in the storage cavity to avoid the deformed wafer from entering the subsequent process flow, thereby avoiding alarms and operation interruptions of semiconductor manufacturing equipment due to wafer deformation, and improving production efficiency.

[0043] In some embodiments, as Figure 4 As shown, the wafer detection part is a detection side wall, including a first detection side wall 400 and a second detection side wall 401, the first detection side wall 400 is located at one end of the base plate 1, and the second detection side wall 401 is located at the other end of the base plate 1; the scanning component includes a signal transmitter 250 arranged on the first detection side wall, and a signal receiver (not shown) arranged on the second detection side wall 401.

[0044] Since the movement of the mobile detection part requires external power, such as a motor driving a belt to move the mobile detection part in a slide rail, and the external power needs to occupy the external space of the wafer transfer unit, in some embodiments, the wafer detection part is a detection side wall, and the detection side wall is fixedly arranged at both ends of the base plate 1, while ensuring the scanning detection accuracy, avoiding additional occupation of the external space of the wafer transfer unit.

[0045] In some specific embodiments, such as Figure 4 and Figure 5As shown, the number of the signal transmitters 250 and the number of the signal receivers 251 are both 8. The signal transmitters 250 and the signal receivers 251 are all located on the same horizontal plane, and the distance between the horizontal plane and the wafer 3 does not exceed the preset scanning distance. The preset scanning distance is 1 to 10 mm, for example, 1 mm, 3 mm, 5 mm, and 10 mm. The preset scanning distance can be adjusted according to the size of the wafer. For example, for a 12-inch wafer, the preset scanning distance can be 5 mm. For an 8-inch wafer, the preset scanning distance can be smaller, for example, 3 mm.

[0046] Since the signal transmitter 250 and the signal receiver 251 are respectively arranged on the first detection side wall 400 and the second detection side wall 401, in order to ensure the scanning detection accuracy, multiple pairs of signal transmitters 250 and signal receivers 251 are arranged, for example Figure 5 The eight pairs of signal transmitters 250 and signal receivers 251 shown ensure that the scanning range covers the planar area of ​​the wafer, avoiding missing deformed wafers. Detection signals are emitted from the signal transmitters 250 and received by the signal receivers 251. The received signals are analyzed. If the received signals exceed the normal range, it indicates that the wafer is deformed or warped.

[0047] It can be seen that the wafer transfer unit provided in the present application scans and detects the wafers on the wafer carrying part by setting a wafer storage part and a wafer detection part in the wafer transfer unit, and through the signal transmitter and signal receiver fixed on the detection side walls at both ends of the bottom plate, so as to avoid additional occupation of the external space of the wafer transfer unit while ensuring the scanning and detection accuracy; further, 8 pairs of signal transmitters 250 and signal receivers 251 are set to ensure that the scanning range covers the plane area of ​​the wafer and avoid missing deformed wafers; when the scanned wafer plane data indicates that the wafer is deformed, it is instructed to place the wafer located on the wafer carrying part in the storage cavity to avoid the deformed wafer from entering the subsequent process flow, thereby avoiding alarms and operation interruptions caused by wafer deformation in semiconductor manufacturing equipment, thereby improving production efficiency.

[0048] An embodiment of the present application also provides a wafer transfer method, which can be applied to the wafer transfer equipment provided in any of the aforementioned embodiments.

[0049] like Figure 6 As shown, the wafer transfer method provided in the embodiment of the present application includes the following steps:

[0050] Step S10: providing a base plate, wherein the base plate includes a wafer storage portion fixed thereon, and a wafer supporting portion located above the wafer storage portion, forming a storage cavity between the base plate and the wafer storage portion.

[0051] In order to implement wafer inspection, the wafer may be transferred to a wafer carrying portion of a wafer transfer unit.

[0052] The wafer carrying portion is used to carry wafers, so that the wafer detection portion can detect the wafers in the wafer transfer unit. In some specific embodiments, the wafer carrying portion includes: a wafer carrying table fixedly connected to the top of the wafer storage portion; and at least three wafer carrying feet fixed to the wafer carrying table for supporting the wafer. In this case, transferring the wafer to the wafer carrying portion of the wafer transfer unit includes: transferring the wafer to the wafer carrying feet of the wafer carrying portion of the wafer transfer unit.

[0053] After the wafer is transferred to the wafer carrying portion of the wafer transfer unit, step S20 is continued.

[0054] Step S20: Scanning the wafer carried by the wafer carrying portion using scanning components of the wafer detection portion located at both ends of the bottom plate, wherein the scanning range of the scanning component covers the plane area of ​​the wafer.

[0055] In order to detect a deformed wafer, it is necessary to scan the plane of the wafer by a scanning component on the wafer detection part of the wafer transfer unit.

[0056] In some embodiments, two slide rails are provided on both ends of the top surface of the bottom plate; the wafer detection part is a mobile detection part;

[0057] The method comprises: scanning the wafer carried by the wafer carrying part by using the scanning components of the wafer detection part located at both ends of the bottom plate, comprising:

[0058] The transmitting arm and the receiving arm of the mobile detection part are moved, and the signal transmitter provided on the transmitting arm and the signal receiver provided on the receiving arm are controlled to scan the wafer.

[0059] The bottom ends of the transmitting arm and the receiving arm are respectively located in two slide rails, and the signal transmitter arranged on the transmitting arm and the signal receiver arranged on the receiving arm are the scanning components.

[0060] The transmitting and receiving arms move synchronously within the slide rails, driving the signal transmitter and signal receiver to scan the wafer. When the scanned data indicates wafer deformation, the wafer on the wafer support is placed into the storage cavity. There are two signal transmitters and two signal receivers. The lines connecting the signal transmitters and signal receivers are located below the lower surface and above the upper surface of the wafer, respectively, and their distance from the wafer does not exceed a preset scanning distance. The preset scanning distance is 1 to 10 mm, for example, 1 mm, 3 mm, 5 mm, or 10 mm. The preset scanning distance can be adjusted according to the size of the wafer.

[0061] In other embodiments, the wafer detection portion is a detection side wall, including a first detection side wall and a second detection side wall, the first detection side wall is located at one end of the bottom plate, and the second detection side wall is located at the other end of the bottom plate; the scanning component includes a signal transmitter provided on the first detection side wall, and a signal receiver provided on the second detection side wall. In some specific embodiments, the number of the signal transmitters and signal receivers is 8, and the signal transmitters and signal receivers are all located in the same horizontal plane, and the distance between the horizontal plane and the wafer does not exceed a preset scanning distance. The preset scanning distance is 1 to 10 mm, for example, 1 mm, 3 mm, 5 mm, 10 mm. The preset scanning distance can be adjusted according to the size of the wafer.

[0062] After scanning the plane of the wafer, the process proceeds to step S30 .

[0063] Step S30: Determine whether the scanned wafer plane data indicates wafer deformation.

[0064] If the scanned data of the wafer plane indicates that the wafer is deformed, step S41 is performed.

[0065] Step S41: placing the wafer on the wafer supporting portion into the storage cavity of the wafer transfer unit.

[0066] In some specific embodiments, the wafer storage part includes: a wafer storage support plate, fixed on the top surface of the wafer storage support plate and located between the wafer detection parts; a support column, located on the top surface of the wafer storage support plate, wherein each support column is provided with a plurality of wafer supports, and the wafer supports provided on different support columns are all located in the same horizontal plane; under the above premise, placing the wafer located on the wafer supporting part in the storage cavity of the wafer transfer unit includes: placing the wafer located on the wafer supporting part on the wafer support.

[0067] It can be seen that the wafer transfer unit provided in the embodiment of the present application is provided with a wafer storage unit and a wafer detection unit in the wafer transfer unit, and the wafer on the wafer supporting unit is scanned and detected by the scanning unit of the wafer detection unit. Since the scanning range of the scanning unit covers the plane area of ​​the wafer, the scanning unit can obtain all the plane data of the wafer. Therefore, when the scanned wafer plane data indicates that the wafer is deformed, it is instructed to place the wafer on the wafer supporting unit in the storage cavity to prevent the deformed wafer from entering the subsequent process flow, thereby avoiding the alarm and operation interruption of the semiconductor manufacturing equipment due to wafer deformation, thereby improving production efficiency.

[0068] In some embodiments, after scanning the plane of the wafer, it is determined whether the data of the scanned wafer plane indicates that the wafer is deformed. If the data of the scanned wafer plane indicates that the wafer is not deformed, step S42 is executed.

[0069] Step S42: transferring the wafer on the wafer supporting portion to leave the wafer transfer unit.

[0070] The data of the scanned wafer plane indicates that the wafer is not deformed, which means that the wafer can normally undergo subsequent processes. Therefore, for the undeformed wafer, the wafer located on the wafer supporting part is transferred out of the wafer transfer unit for subsequent processes.

[0071] An embodiment of the present application further provides a wafer processing device, which includes the wafer transfer unit as described in the above embodiment.

[0072] In some embodiments, the wafer processing equipment further includes: a wafer moving fork, configured to place the deformed wafer into the storage cavity.

[0073] Although the present application is disclosed as above, the present application is not limited thereto. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined by the claims.

Claims

1. A wafer transfer unit, characterized in that: include: base plate; a wafer storage portion, fixed on the top surface of the base plate; A wafer carrying portion, used for carrying wafers, the wafer carrying portion is located above the wafer storage portion, and a storage cavity is formed between the wafer carrying portion and the wafer storage portion; The wafer detection part is located at both end portions of the base plate. A scanning component is provided on the wafer detection part. The scanning range of the scanning component covers the plane area of ​​the wafer. The scanning component is used to instruct the wafer located on the wafer supporting part to be placed in the storage cavity when the scanned wafer plane data indicates that the wafer is deformed.

2. The wafer transfer unit according to claim 1, wherein: Two slide rails are provided on both ends of the top surface of the bottom plate; the wafer detection part is a mobile detection part; The movement detection part includes: a transmitting arm and a receiving arm, wherein the bottom ends of the transmitting arm and the receiving arm are respectively located in two slide rails; The scanning component includes: a signal transmitter arranged on the transmitting arm, and a signal receiver arranged on the receiving arm, and the transmitting arm and the receiving arm move synchronously in the slide rail, driving the signal transmitter and the signal receiver to scan the wafer, so that when the scanned data indicates that the wafer is deformed, the wafer located on the wafer supporting part is placed in the storage cavity.

3. The wafer transfer unit according to claim 2, wherein: There are two signal transmitters and two signal receivers; the plane where one group of signal transmitters and signal receivers are located is flush with the upper surface of the wafer, and the plane where the other group of signal transmitters and signal receivers are located is flush with the lower surface of the wafer, and the distance between each group of signal transmitters and signal receivers and the wafer does not exceed the preset scanning distance.

4. The wafer transfer unit according to claim 1, wherein: The wafer detection part is a detection side wall, including a first detection side wall and a second detection side wall, the first detection side wall is located at one end of the base plate, and the second detection side wall is located at the other end of the base plate relative to the first detection side wall; the scanning component includes a signal transmitter arranged on the first detection side wall, and a signal receiver arranged on the second detection side wall.

5. The wafer transfer unit according to claim 4, wherein: The number of the signal transmitters and the number of the signal receivers are both 8, the signal transmitters and the signal receivers are all located on the same horizontal plane, and the distance between the horizontal plane and the wafer does not exceed a preset scanning distance.

6. The wafer transfer unit according to claim 1, wherein: The wafer storage unit includes: a wafer storage support plate, fixed on the top surface of the base plate and located between the wafer detection parts; The supporting columns are located on the top surface of the wafer storage support plate, wherein each supporting column is provided with a plurality of wafer supporting members, and the wafer supporting members provided on different supporting columns are all located on the same horizontal plane.

7. The wafer transfer unit according to claim 1, wherein: The wafer supporting portion includes: A wafer carrying platform, fixedly connected to the top of the wafer storage unit; At least three wafer supporting feet are fixed on the wafer supporting platform and are used to support the wafer.

8. The wafer transfer unit according to claim 7, wherein: The wafer supporting feet are arranged in an equilateral triangle on the top surface of the wafer supporting platform, and the width of the contact surface between the wafer supporting feet and the wafer is less than or equal to 5 mm.

9. The wafer transfer unit according to any one of claims 3 or 5, characterized in that: The preset scanning distance is 1 to 10 mm.

10. A wafer processing device, characterized in that: Comprising a wafer transfer unit as described in any one of claims 1-9.

11. The wafer processing equipment according to claim 10, wherein: Also includes: The wafer moving fork is used to place the deformed wafer into the storage cavity.

Images