Device and system for wafer transmission

Abstract

A device and system for wafer transfer, the device is used for transferring wafers between a first chamber and a second chamber of a processing device, and the device comprises a connecting plate which is fixedly connected to the chamber wall of the first chamber and is provided with a plurality of through transmission through holes; the sealing plate and the connecting plate are arranged in a spaced mode in the vertical direction, the sealing plate can move relative to the connecting plate so as to seal the second cavity, and the sealing plate comprises two vacuum openings communicating with different vacuum pumps and a plurality of sealing rod holes; the transmission mechanism comprises a plurality of hollow transmission rods, and the transmission rods are fixedly connected with the bottom side of the sealing plate; the vacuum assembly comprises two valve plates and a plurality of sealing rods, and the sealing rods penetrate through the transmission rod and the transmission through hole to be fixedly connected with the valve plates so as to drive the valve plates to seal the vacuum opening; and the sealing connecting assembly comprises a plurality of corrugated pipes, one ends of the corrugated pipes are fixedly connected with the connecting plate, the other ends of the corrugated pipes are fixedly connected with the sealing plate or the valve plate, and the vacuum opening, the transmission through hole and the sealing rod hole are enclosed and sealed.

Description

Technical Field

[0001] The present disclosure generally relates to the field of silicon wafer processing technology. More specifically, the present disclosure relates to an apparatus and system for wafer transfer. Background Art

[0002] In the field of silicon wafer processing, processing equipment often needs to transfer wafers from the atmospheric environment into a vacuum chamber. This process often uses conveying devices such as robots to move wafers within a high vacuum environment. Such devices may have complex transmission structures, which often make it difficult to ensure sealing. In a high vacuum environment, poor sealing can result in the workspace vacuum level not meeting the required level, allowing external environmental contamination.

[0003] In view of this, there is an urgent need to provide a device for wafer transfer so as to improve the sealing performance of the wafer conveying structure. Utility Model Content

[0004] In order to at least solve one or more of the technical problems mentioned above, the present disclosure provides a device and system for wafer transfer in multiple aspects.

[0005] In a first aspect, the present disclosure provides a device for wafer conveying, which is used to transfer wafers between a first chamber and a second chamber of a processing equipment, comprising: a connecting plate, which is fixedly connected to the cavity wall of the first chamber, and a plurality of through transmission holes are provided on the connecting plate; a sealing plate, which is spaced apart from the connecting plate in a vertical direction and can move relative to the connecting plate to seal the second chamber relative to the first chamber, and the sealing plate includes two vacuum openings respectively connected to different vacuum pumps, and a plurality of sealing rod holes; a transmission mechanism, which includes a plurality of hollow transmission rods, and the transmission rods are fixedly connected to the bottom side of the sealing plate; a vacuum assembly, which includes two valve plates and a plurality of sealing rods, and the plurality of sealing rods pass through the transmission rods and the transmission holes and are fixedly connected to the valve plates to drive the valve plates to seal the vacuum openings; a sealing connection assembly, which includes a plurality of bellows, at least some of the bellows are fixedly connected to the connecting plate at one end and fixedly connected to the sealing plate or the valve plate at the other end, and enclose the sealed vacuum openings, transmission holes and sealing rod holes.

[0006] In some embodiments, the transmission mechanism also includes a relay and a limit bracket fixedly connected to the relay, the limit bracket includes a limit block extending in the vertical direction, the vacuum assembly includes a single-acting cylinder for driving the valve plate to move, the protruding end of the single-acting cylinder of the vacuum assembly is fixedly connected to the synchronization bracket, and the limit block limits the synchronization bracket in the vertical direction.

[0007] In some embodiments, the vacuum assembly includes multiple single-acting cylinders, the synchronization bracket is fixedly connected to the protruding ends of at least two single-acting cylinders, and a buffer spring is arranged between the synchronization bracket and the limit bracket. The limit bracket also includes a spring support portion extending in a horizontal direction, one end of the buffer spring abuts the spring support portion, and the other end abuts the upper surface of the synchronization bracket.

[0008] In some embodiments, the vacuum assembly includes a first valve plate assembly and a second valve plate assembly, wherein the first valve plate assembly and the second valve plate assembly each include two single-acting cylinders, the protruding ends of the two single-acting cylinders of the first valve plate assembly are fixedly connected to a synchronous bracket, and the protruding ends of the two single-acting cylinders of the second valve plate assembly are fixedly connected to another synchronous bracket.

[0009] In some embodiments, the transmission mechanism also includes a relay plate arranged at intervals along the vertical direction on the lower side of the relay member, the vacuum assembly includes a vacuum tube arranged along the vertical direction and connected to the vacuum opening, and a vacuum pump arranged at the end of the vacuum tube, the fixed part of the single-acting cylinder is fixedly connected to the vertical lower side of the relay plate, the vacuum tube passes through the pipe through-hole of the relay plate along the vertical direction, and the vacuum pump is connected to the vacuum tube on the vertical lower side of the relay plate.

[0010] In some embodiments, a sealing through hole is provided inside the transmission rod, and two guide sleeves are fixedly provided inside the sealing through hole. The two guide sleeves are respectively located at the axial ends of the sealing through hole. The sealing rod is passed through the sealing through hole, and the outer peripheral surface of the sealing rod cooperates with the inner hole of the guide sleeve so as to be limited and guided by the guide sleeve.

[0011] In some embodiments, a downwardly protruding sealing flange is provided on the bottom side of the valve plate. The sealing flange is annular and includes a sealing groove and a sealing ring accommodated in the sealing groove. An opening boss protruding upward in a vertical direction is provided on the upper side of the sealing plate. The opening boss surrounds the vacuum opening. When the valve plate closes the vacuum opening, the opening boss and the sealing flange can abut each other along a first direction.

[0012] In some embodiments, the sealing connection assembly includes a first bellows, a second bellows, and a third bellows, the valve plate includes a sealing connection hole for fixed connection to the sealing rod, the first bellows includes a first connection part, a second connection part and a third connection part, the first connection part at least partially extends into the sealing connection hole of the valve plate and is fully welded to the sealing connection hole, the second connection part at least partially extends into the sealing rod hole of the sealing plate and is fully welded to the sealing rod hole, the third connection part at least partially extends into the transmission through hole of the connecting plate and is fully welded to the transmission through hole, one end of the second bellows and the third bellows are fully welded to the connecting plate, and the other end is fully welded to the sealing plate.

[0013] In some embodiments, the vacuum assembly includes a first valve plate and a second valve plate, the sealing plate has a first vacuum opening and a second vacuum opening, and the upper side of the sealing plate also has a first accommodating cavity for accommodating the first valve plate and a second accommodating cavity for accommodating the second valve plate. The first valve plate and the second valve plate can be at least partially accommodated in the corresponding first accommodating cavity and the second accommodating cavity along the vertical direction. The first vacuum opening is opened in the part of the sealing plate corresponding to the center of the first accommodating cavity, and the second vacuum opening is opened in the part of the sealing plate corresponding to the center of the second accommodating cavity.

[0014] In a second aspect, the present disclosure provides a system for wafer transfer, comprising the apparatus for wafer transfer according to the first aspect and various embodiments.

[0015] Through the device for wafer conveying provided above, the disclosed embodiment can significantly improve the airtight performance of the wafer conveying device by arranging the sealing rod that controls the opening and closing of the valve plate inside the transmission rod, and arranging multiple bellows to surround and seal the connection between the sealing rod and the transmission rod and the connecting plate, the sealing plate and the valve plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an illustrative and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0017] Figure 1 An exemplary perspective view showing an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0018] Figure 2 An exemplary perspective view showing an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0019] Figure 3 An exemplary perspective view showing an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0020] Figure 4 An exemplary perspective view showing a driving mechanism of an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0021] Figure 5 An exemplary perspective view showing a combination of a sealing assembly and a vacuum assembly of an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0022] Figure 6 An exemplary cross-sectional view showing a combination of a sealing assembly and a vacuum assembly of an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0023] Figure 7 An exemplary perspective view showing a combination of a sealing assembly and a vacuum assembly of an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0024] Figure 8 An exemplary side view of a system for wafer transfer according to some embodiments of the present disclosure is shown;

[0025] Figure 9a An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown;

[0026] Figure 9b An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown;

[0027] Figure 9c An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown. DETAILED DESCRIPTION

[0028] The following will clearly and completely describe the technical solutions in the embodiments of this disclosure in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of this disclosure, not all of them. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this disclosure.

[0029] It should be understood that the terms “include” and “comprising” used in the specification and claims of the present disclosure indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.

[0030] It should also be understood that the terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. As used in this disclosure and the claims, the singular forms "a," "an," and "" are intended to include the plural forms unless the context clearly indicates otherwise. It should be further understood that the term "and / or" as used in this disclosure and the claims refers to any and all possible combinations of one or more of the associated listed items, including and including these combinations.

[0031] As used in this specification and claims, the term "if" can be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0032] The specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0033] The disclosed embodiment provides a device for wafer conveying, which can significantly improve the airtightness performance of the wafer conveying device by arranging a sealing rod that controls the opening and closing of the valve plate inside the transmission rod, and arranging multiple bellows to surround and seal the connection between the sealing rod and the transmission rod and the connecting plate, the sealing plate and the valve plate.

[0034] See also Figure 1 and Figure 8 , Figure 1 An exemplary perspective view showing an apparatus for wafer transfer according to some embodiments of the present disclosure; Figure 8 An exemplary side view of a system for wafer transfer according to some embodiments of the present disclosure is shown. In some embodiments, the wafer transfer apparatus 100 can be used to seal and evacuate a second chamber 220 communicating with the first chamber 210 relative to the first chamber 210, thereby transferring a wafer 90 to a high-vacuum processing or inspection space under a vacuum environment. The wafer transfer apparatus can include a sealing assembly 10 for sealing the chamber, a drive mechanism 20 for driving the sealing assembly 10 to perform related actions, and a vacuum assembly 30 for evacuating the chamber.

[0035] See also Figure 2 and Figure 3 , Figure 2 An exemplary perspective view showing an apparatus for wafer transfer according to some embodiments of the present disclosure; Figure 3An exemplary stereoscopic view of an apparatus for wafer transfer according to some embodiments of the present disclosure is shown. Specifically, in some embodiments, the sealing assembly 10 may include a connecting assembly 120 for connecting to the processing equipment 200, and a sealing conveying device 110 capable of moving relative to the connecting assembly 120 to transfer wafers. The connecting assembly 120 may, for example, include a connecting plate 12 for fixedly connecting to the processing equipment 200, which may, for example, be fixedly connected to the bottom wall of the first chamber 210. The sealing conveying device 110 may include a sealing plate 11 vertically spaced from the connecting plate 12, the sealing plate 11 being capable of moving relative to the connecting plate 12 in the vertical direction to transfer wafers and being capable of sealing the second chamber 220 relative to the first chamber 210. To this end, an upper sealing groove 116 may, for example, be provided on the upper surface of the sealing plate 11, and an upper sealing ring 117 may be provided in the upper sealing groove 116 for fitting with the step surface 224 adjacent to the second chamber 220 and the first chamber 210.

[0036] The sealing plate 11 may be provided with a first vacuum opening 111 and a second vacuum opening 112 extending through the plate surface, and the connecting plate 12 may be provided with a first vacuum pipe opening 121 and a second vacuum pipe opening 122 extending through the plate surface. The first vacuum opening 111 and the second vacuum opening 112 may, for example, be connected to corresponding vacuum pumps, so that when the sealing conveyor 110 seals the second chamber 220, the first vacuum opening 111 and the second vacuum opening 112 are connected to the second chamber 220 to evacuate it. Vacuum pipes for connecting to vacuum pumps may be provided radially inwardly of the first vacuum pipe opening 121 and the second vacuum pipe opening 122. In some embodiments, the first vacuum opening 111 may be vertically aligned with the first vacuum pipe opening 121, while the second vacuum opening 112 may be aligned with the second vacuum pipe opening 122 to facilitate the installation of the vacuum pipes.

[0037] See also Figure 4 , Figure 4 An exemplary stereoscopic diagram of a drive mechanism of an apparatus for wafer transfer according to some embodiments of the present disclosure is shown, wherein components such as a transmission rod are hidden to clearly illustrate its internal structure. The drive mechanism 20 may include a drive assembly and a transmission assembly, wherein the transmission assembly is limited relative to the processing equipment 200 along a first horizontal direction, and the transmission assembly is fixedly connected to the sealing plate 11 of the sealing conveying device 110. The drive assembly may include a drive bevel inclined from the first horizontal direction toward the vertical direction, and the drive assembly and the transmission assembly abut at the drive bevel, so that the horizontal movement of the drive assembly along the first horizontal direction drives the vertical movement of the transmission assembly. Thus, the drive mechanism 20 can drive the sealing conveying device 110 to rise in the vertical direction to seal the second chamber 220, or to descend in the vertical direction to connect the first chamber 210 with the second chamber 220, by means of a drive member arranged in the horizontal direction.

[0038] The vacuum assembly 30 may include a first vacuum assembly and a second vacuum assembly. The first vacuum assembly includes a roughing assembly 33 connected to the first vacuum opening 111 on the sealing plate 11 via a first vacuum line 38, and a first valve plate assembly for sealing the first vacuum opening 111. The second vacuum assembly includes a fine pumping assembly 34 connected to the second vacuum opening 112 via a second vacuum line 37, and a second valve plate assembly for sealing the second vacuum opening 112. The roughing assembly 33 may, for example, be a vacuum pipe connected to the first vacuum line 38 and a centralized negative pressure generator (not shown) in the factory connected to the vacuum pipe. The roughing assembly 33 provides a stable negative pressure source to the first vacuum opening 111 for initially evacuating the sealed second chamber 220. The fine pumping assembly 34 may, for example, include a molecular pump that begins operating after the roughing assembly 33 performs the initial evacuation, further evacuating the second chamber 220 to achieve the target vacuum level.

[0039] In some embodiments, the drive assembly of the drive mechanism 20 includes a drive member 22 and a guide plate 21 driven by the drive member 22 to move along a first horizontal direction, and the transmission assembly includes a follower wheel 222. The guide plate 21 is provided with a guide groove 211 formed by being recessed laterally into the interior of the guide plate 21. The guide groove 211 is inclined from the first horizontal direction toward the vertical direction, and its inner side is capable of cooperating with the follower wheel 222. The guide groove 211 is used to drive the follower wheel 222 to move in the vertical direction when the guide plate 21 moves along the first horizontal direction. The drive member 22 can be, for example, a rotary drive member such as a stepper motor or a servo motor, and provides precise drive along the first horizontal direction via a lead screw and guide rail mechanism. In some embodiments, the drive member 22 can also be a linear drive member such as a linear motor or a cylinder, thereby directly providing drive along the first horizontal direction.

[0040] In some embodiments, the two inclined sidewalls of the guide groove 211 form two opposing driving ramps. When the driving member 22 drives the guide plate 21 to reciprocate along the first horizontal direction, the two driving ramps of the guide groove 211 can respectively abut against the follower wheel 222, driving it to move vertically. The follower wheel 222 can extend entirely or partially into the guide groove 211, with its circumferential side surfaces able to contact and roll along the two driving ramps of the guide groove 211. The diameter of the follower wheel 222 can match the width of the guide groove 211, ensuring a small gap between the follower wheel 222 and the driving ramps. This prevents the follower wheel 222 from bouncing during movement within the guide groove 211, which could cause vibration in the sealing conveyor 110 and affect wafer handling.

[0041] In some embodiments, the guide groove 211 may include multiple sections. For example, it may include an inclined section 213, as described above, for driving the follower wheel 222 up and down. Near the upper end of the inclined section 213, an adjustment section 214 and a holding section 215 are also provided. The holding section 215 may be formed by extending horizontally from the end of the guide groove 211, for example, at a relatively higher end of the guide groove 211 in the vertical direction. The adjustment section 214 may be disposed between the holding section 215 and the inclined section 213 and may extend at a shallower angle than the inclined section 213. The holding section 215 supports the follower wheel 222 when the sealing conveyor 110 needs to be maintained in an elevated position, while the adjustment section 214 allows for fine-tuning of the height. For example, when the sealing conveyor 110 is in the elevated position, the follower wheel 222 moves from the inclined section 213 to the adjustment section 214. At this time, because the inclination angle of the adjustment section 214 is more gradual, when the driving member 22 drives the guide plate 21 to move the same distance in the first horizontal direction, the driving wheel moves a shorter distance in the vertical direction in the adjustment section 214 than when the driving wheel moves in the inclined section 213. As a result, the height of the sealing conveyor 110 can be fine-tuned to achieve a more satisfactory sealing effect.

[0042] In addition, an access port 216 can be provided on the upper side of the guide groove 211. The access port 216 can be a groove opened upward and laterally from the upper side of the guide groove 211. The access port 216 can be used to allow the follower wheel 222 to fall into the guide groove 211 from top to bottom to facilitate the installation and replacement of the transmission component.

[0043] In some embodiments, the drive assembly may include two guide plates 21 arranged at intervals along a horizontal direction perpendicular to the first horizontal direction. The bottoms of the two guide plates 21 may be fixedly connected to a guide base plate 217, and one end of the two guide plates 21 along the first horizontal direction may be fixedly connected to a drive support plate 218. The bottom of the guide base plate 217 may be connected to a guide rail assembly 29, which may be a guide rail slider assembly arranged along the first direction. The bottom surface of the guide base plate 217 is fixedly connected to the slider of the guide rail slider assembly so that it can be accurately guided by the guide rail. The drive support plate 218 may be fixedly connected to the output end of the drive assembly, thereby allowing it to reciprocate along the first horizontal direction under the drive of the driver 22. The two guide plates 21, the guide base plate 217, and the drive support plate 218 together form a guide bracket, which enhances the stability of the drive assembly when transmitting driving force.

[0044] See also Figure 5 and Figure 6 , Figure 5An exemplary perspective view showing a combination of a sealing assembly and a vacuum assembly of an apparatus for wafer transfer according to some embodiments of the present disclosure; Figure 6 An exemplary cross-sectional view of a combination of a sealing component and a vacuum component of an apparatus for wafer transfer according to some embodiments of the present disclosure is shown, wherein Figure 5 and Figure 6 Also shown are multiple transmission rods connected to the connecting plate. The connecting plate 12 may be provided with multiple transmission through-holes 128. The transmission assembly may include a relay 23 and multiple transmission rods 24. A follower wheel 222 is connected to the side of the relay 23. One end of the multiple transmission rods 24 is fixedly connected to the relay 23, and the other end passes through the transmission through-holes 128 and is fixedly connected to the sealing plate 11. In some embodiments, a transmission stopper 129 is also fixedly provided on the underside of the connecting plate 12. The transmission stopper 129 can be, for example, a hollow ball bearing sleeve or other limiting device. The radially inner through-hole of the transmission stopper 129 surrounds the transmission through-hole 128, thereby limiting and guiding the transmission rod 24 as it passes through the transmission through-hole 128.

[0045] The relay 23 can, for example, be roughly in the shape of a hollow cuboid, the length direction of which can be consistent with the first horizontal direction, and the width direction of which can be set to be perpendicular to the first horizontal direction. The follower wheel 222 can, for example, include an axle and a wheel body that can rotate freely relative to the axle. The axle can, for example, be fixed to the side of the relay 23 by bolt connection or the like, and enable the follower wheel 222 to roll on an inclined surface. In some embodiments, four follower wheels 222 can be provided on the relay 23, of which two follower wheels 222 are respectively provided on the sides facing the guide plate 21. Correspondingly, the drive assembly includes two guide plates 21 respectively arranged on both sides of the relay 23 in the transverse direction, and each guide plate 21 is provided with two guide grooves 211 corresponding to the follower wheels 222.

[0046] In some embodiments, the sealing plate 11 can be generally circular and can include multiple sealing rod holes 118 extending through the plate surface. The first valve plate assembly can include a first valve plate 31 and multiple sealing rods 351 fixedly connected to the first valve plate 31. The second valve plate assembly can include a second valve plate 32 and multiple sealing rods 351 fixedly connected to the second valve plate 32. Both the first valve plate 31 and the second valve plate 32 can be formed as generally elongated plates, with sealing holes 39 for fixed connection to the sealing rods 351 disposed on the bottom sides of their respective longitudinal ends. Each of the multiple transmission rods 24 can include a sealing through hole 242 extending axially through the transmission rod 24. The multiple sealing rods 351 are respectively disposed in the sealing through hole 242 of the corresponding transmission rod 24 and pass through the sealing rod holes 118 in the sealing plate 11 to be fixedly connected to the sealing holes 39 in the first valve plate 31 and the second valve plate 32, respectively. In some embodiments, a guide sleeve 241 is fixedly disposed within the sealing through-hole 242. The guide sleeve 241 may be, for example, a ball bearing sleeve or other component capable of vertically guiding the sealing rod 351 therein. One or more guide sleeves may be disposed within the sealing through-hole 242. For example, two guide sleeves 241 may be disposed, each located near the vertical ends of the sealing through-hole 242, thereby stably supporting and guiding the sealing rod 351.

[0047] In some embodiments, the upper side of the sealing plate 11 further forms a first accommodating cavity 310 for accommodating the first valve plate 31, and a second accommodating cavity 320 for accommodating the second valve plate 32. The first valve plate 31 and the second valve plate 32 can be at least partially retracted vertically within the corresponding first accommodating cavity 310 and the second accommodating cavity 320. The first vacuum opening 111 can be located in a portion of the sealing plate 11 corresponding to the center of the first accommodating cavity 310, while the second vacuum opening 112 can be located in a portion of the sealing plate 11 corresponding to the center of the second accommodating cavity 320. Thus, the first valve plate 31 and the second valve plate 32 can move vertically within the corresponding first accommodating cavity 310 or the second accommodating cavity 320 during operation of the equipment, opening or closing the first vacuum opening 111 or the second vacuum opening 112. They do not protrude excessively vertically, thereby interfering with wafer handling. Furthermore, the provision of the first accommodating cavity 310 and the second accommodating cavity 320 also reduces the weight of the sealing plate 11 , thereby making the device lighter and saving energy costs.

[0048] In some embodiments, the bottom surfaces of the first and second valve plates 31 and 32 may be provided with a sealing flange 329 for enclosing the first and second vacuum openings 111 and 112. The sealing flange 329 may, for example, be a vertically downwardly projecting annular protrusion. In some embodiments, the sealing flange 329 may also include a vertically downwardly projecting annular sealing groove configured to engage with a sealing member, such as a rubber sealing ring, to enhance sealing performance. In some embodiments, the outer periphery of the first and second vacuum openings 111 and 112 may also be provided with an opening boss 119 radially enclosing the first and second vacuum openings 111 and 112. The opening boss 119 protrudes vertically upward, and its upper surface is configured to abut against the sealing flange 329 on the bottom side of the first and second valve plates 31 and 32, thereby reducing the vertical distance required for the first and second valve plates 31 and 32 to move during sealing.

[0049] Both the first and second valve plate assemblies may further include a plurality of single-acting cylinders 35 vertically arranged, and compression springs 353 vertically disposed between the protruding ends of the single-acting cylinders 35 and the transmission rod 24. The fixed portion 359 of the single-acting cylinder 35 is fixedly connected to the relay plate 233. The relay plate 233 and the relay member 23 may be vertically spaced apart and fixedly connected to each other via a threaded connection or other means. The protruding ends 358 of the single-acting cylinder 35 are fixedly connected to the sealing rod 351. The upper ends of the plurality of compression springs 353 vertically abut the bottom of the transmission rod 24, while their lower ends abut the upper side of the protruding ends 358 of the single-acting cylinder 35. The sealing rod 351 extends radially inwardly of the compression springs 353 and extends into the sealing through-hole 242 of the transmission rod 24. Thus, the first valve plate 31 or the second valve plate 32 can be driven by the single-acting cylinder 35 to move upward in the vertical direction, and when the single-acting cylinder 35 is not driven, the protruding end of the single-acting cylinder 35 is pressed downward by the spring force of the compression spring 353.

[0050] In some embodiments, the central portion of the relay plate 233 is further provided with a plurality of pipe through-holes for passing vacuum tubes. For example, the relay plate 233 may include a first pipe through-hole 234 and a second pipe through-hole 235. The first pipe through-hole 234 may be used to pass through the first vacuum tube 38, while the second pipe through-hole 235 may be used to pass through the second vacuum tube 37. Thus, the connection portion between the roughing assembly 33 and the first vacuum tube 38 and the fine pumping assembly 34 may be disposed on the vertical lower side of the relay plate 233. Furthermore, since the fixing portions of the plurality of single-acting cylinders 35 are also disposed on the vertical lower side of the relay plate 233, workers can easily access and maintain the relevant pneumatic pipelines, significantly facilitating the use and maintenance of the equipment.

[0051] When the first valve plate 31 or the second valve plate 32 is driven upward by the single-acting cylinder 35, the first valve plate 31 or the second valve plate 32 separates vertically from the first vacuum opening 111 and the second vacuum opening 112, respectively, thereby opening the first vacuum opening 111 and / or the second vacuum opening 112. At this time, the second chamber 220 can be evacuated by the vacuum pump. When the single-acting cylinder 35 is not driven, the downward spring force exerted by the compression spring 353 on the extended end of the single-acting cylinder 35 drives the sealing rod 351 downward, thereby automatically sealing the first vacuum opening 111 and the second vacuum opening 112. In this way, the corresponding chamber can be sealed for a long time without consuming energy, making the equipment more energy-efficient during production and debugging, and able to cope with unexpected situations such as sudden drops in air pressure caused by sudden power outages or equipment failures.

[0052] The vacuum assembly 30 may also include a limit bracket 36 fixedly connected to the relay 23. The limit bracket 36 may be formed into a long strip with a roughly "L"-shaped cross section, for example. The limit bracket 36 may include a limit block 366 extending in the vertical direction, and a spring support portion 362 extending horizontally perpendicular to the vertical direction. In some embodiments, the first valve plate assembly and the second valve plate assembly each include two single-acting cylinders 35 for driving the valve plate to move. The first valve plate assembly also includes a first synchronization bracket 368. The protruding ends 358 of the two corresponding single-acting cylinders 35 of the first valve plate assembly are fixedly connected to the first synchronization bracket 368. Similarly, the second valve plate assembly also includes a second synchronization bracket 369. The protruding ends 358 of the two corresponding single-acting cylinders 35 of the second valve plate assembly are fixedly connected to the second synchronization bracket 369.

[0053] For example, the first synchronization bracket 368 and the second synchronization bracket 369 can be formed as two semi-annular components that can be fixed relative to each other. The ends of the two semi-annular components are connected to form a circular ring. The hollow portion of the circular ring can be used to accommodate components such as the first vacuum tube 38 or the second vacuum tube 37 located in the center of the ring. The ends of the circular ring can also be used to clamp and secure the extended ends of the two single-acting cylinders 35. This ensures more consistent extension and retraction of the two single-acting cylinders 35 corresponding to the first valve plate assembly or the second valve plate assembly, improving stability during vertical actuation.

[0054] A buffer spring 365 may be provided between the first and second synchronous brackets 368, 369 and the limiting bracket 36, and a limiting block 366 may vertically limit the first and second synchronous brackets 368, 369. Specifically, in some embodiments, the upper surfaces of the first and second synchronous brackets 368, 369 may be vertically opposed to the limiting bracket 36, such that when the first and second synchronous brackets 368, 369 are raised by the corresponding single-acting cylinders 35, their upper surfaces vertically approach the limiting bracket 36. When the first and second synchronous brackets 368, 369 rise to a predetermined height, the vertically extending limiting block 366 of the limiting bracket 36 may abut against the upper surfaces of the first and second synchronous brackets 368, 369. As a result, the lifting height of the first and second synchronous brackets 368, 369 can be limited in the vertical direction, thereby limiting the lifting height of the first and second valve plates 31, 32. At the same time, the upper surfaces of the first and second synchronous brackets 368, 369 can also face the bottom surface of the horizontally extending spring support portion 362 of the limiting bracket 36, and a vertically extending buffer spring 365 can be disposed between the upper sides of the first and second synchronous brackets 368, 369 and the lower side of the spring support portion 362.

[0055] The spring force of the buffer spring 365 can act in the same direction as the compression spring 353, thereby further increasing the sealing pressure when the first valve plate 31 and the second valve plate 32 move downward to seal. Furthermore, the buffer spring 365 can be disposed, for example, laterally inboard of two laterally spaced single-acting cylinders 35, thereby vertically pressing downward against the center portions of the first and second synchronization brackets 368 and 369, further vertically compressing the first and second synchronization brackets 368 and 369 to prevent them from shaking or tilting during operation due to lack of restraint.

[0056] See also Figure 7 , Figure 7An exemplary stereoscopic diagram of the combination of a sealing assembly and a vacuum assembly of a wafer transfer device according to some embodiments of the present disclosure is shown, with components such as a relay being shown to illustrate the connection relationship. In some embodiments, the position-limiting bracket 360 can also be configured as having only a generally elongated main body, with each position-limiting bracket 360 having two ends fixedly connected to the top ends of two vertically disposed position-limiting struts 363, while the bottom ends of the position-limiting struts are fixedly connected to a position-limiting support plate 361, which is further fixedly connected to the relay 23. Thus, the position-limiting bracket 360 is fixed relative to the relay 23 and is vertically disposed above the first synchronous bracket 368 and / or the second synchronous bracket 369. When the first synchronous bracket 368 and the second synchronous bracket 369 are raised to a predetermined height, the position-limiting bracket 360 can vertically abut against the upper surface of the first synchronous bracket 368 and / or the second synchronous bracket 369. This also allows for limiting the position of the single-acting cylinder 35. In some embodiments, the limiting bracket 360 can be made of a material with relatively low hardness, such as engineering plastics, so that the sound generated when a collision occurs between the first synchronization bracket 368 and / or the second synchronization bracket 369 and the limiting bracket 360 is smaller, which is beneficial to noise reduction of the equipment.

[0057] See again Figure 6 In some embodiments, the sealing assembly 10 may further include a sealing connection assembly, which may include, for example, multiple bellows. At least some of the bellows may be fully welded to the connecting plate 12 at one end, and fully welded to the sealing plate 11 or the first valve plate 31 and the second valve plate 32 at the other end. Thus, the multiple bellows are securely connected between the connecting plate 12, the sealing plate 11, the first valve plate 31, and the second valve plate 32, and will not loosen due to long-term, high-frequency movement and vibration during production, thereby causing sealing failure. The multiple bellows may be respectively arranged corresponding to the transmission through hole 128, the sealing rod hole 118, the sealing connection hole 39, the first vacuum opening 111, the first vacuum pipe port 121, and the second vacuum opening 112, and the second vacuum pipe port 122, so as to surround and seal them.

[0058] Specifically, the multiple transmission holes 128 on the connecting plate 12 can be aligned with the multiple sealing rod holes 118 on the sealing plate 11, respectively. The multiple sealing rod holes 118 on the sealing plate 11 can be aligned with the multiple sealing connection holes 39 on the first valve plate 31 and the second valve plate 32, respectively. The first vacuum pipe port 121 on the connecting plate 12 can be aligned with the first vacuum opening 111 on the sealing plate 11, and the second vacuum pipe port 122 on the connecting plate 12 can be aligned with the second vacuum opening 112 on the sealing plate 11. One end of the multiple first bellows 141 can be welded to the connecting plate 12, and the other end can pass through the sealing rod holes 118 of the sealing plate 11 and be welded to the first valve plate 31 or the second valve plate 32. Thus, multiple first bellows 141 can be respectively disposed around multiple groups of aligned transmission through-holes 128, sealing rod holes 118, and sealing connection holes 39 to seal the gaps between the transmission rod 24 and the transmission through-holes 128, the gaps between the sealing rod 351 and the sealing rod holes 118, and the gaps between the sealing rod 351 and the sealing connection holes 39. Similarly, second bellows 142 can be disposed around the aligned first vacuum port 121 and the first vacuum opening 111, and third bellows 143 can be disposed around the aligned second vacuum port 122 and the second vacuum opening 112. Thus, the connection between the connecting plate 12 and the sealing plate 11 is strictly sealed by the bellows welded to the connecting plate 12 and the sealing plate 11, significantly improving the airtightness of the sealing assembly 10 during use and preventing a decrease in airtightness due to component wear after prolonged use.

[0059] In some embodiments, the first bellows 141, the second bellows 142, and the third bellows 143 can each be roughly cylindrical, including at least two connecting portions spaced axially apart, and a retractable bellows body disposed between the two adjacent connecting portions. The connecting portions can be made of a material such as an easily weldable metal and can be roughly cylindrical, so as to at least partially extend axially into the corresponding holes to be welded. For example, the first bellows 141 can include three connecting portions spaced axially apart, namely, a first connecting portion 141a, a second connecting portion 141b, and a third connecting portion 141c. The first connecting portion 141a can, for example, at least partially extend into the sealing connection hole 39 of the first valve plate 31 or the second valve plate 32 and be fully welded thereto. The second connecting portion 141b can extend into the sealing rod hole 118 of the sealing plate 11 after the first bellows 141 passes through it and be fully welded thereto. Similarly, the third connecting portion 141c can at least partially extend into the transmission through-hole 128 of the connecting plate 12 and be fully welded to the transmission through-hole 128. Thus, the first bellows 141 completely circumferentially surrounds the corresponding connection gap between the transmission rod 24 and the sealing rod 351. Similarly, the second bellows 142 and the third bellows 143 can, in a similar manner to the first bellows 141, respectively surround and seal the first vacuum opening 111 and the first vacuum port 121, and the second vacuum opening 112 and the second vacuum port 122, thereby significantly improving the overall airtightness of the sealed transmission mechanism.

[0060] In the case where the first bellows 141 includes three connecting parts spaced apart in the axial direction, the first tube body between the first connecting part 141a and the second connecting part 141b can be located in the first accommodating cavity 310 or the second accommodating cavity 320 to seal the sealing rod hole 118 and the sealing connecting hole 39. The second tube body between the second connecting part 141b and the third connecting part 141c can be located between the connecting plate 12 and the sealing plate 11 to seal the transmission through hole 128 and the sealing rod hole 118. Thus, the two tube bodies of the first bellows 141 can realize the sealing function of two separate bellows, and since the two segments are formed as one piece, there is no need to connect and seal the two tube bodies by welding or the like, so the sealing performance can be further ensured. It will be understood by those skilled in the art that the present disclosure does not limit the specific structure of the sealing tube. For example, when the welding sealing effect can be guaranteed, the first tube body and the second tube body can also be set as two separate bellows.

[0061] The sealed transmission mechanism of some embodiments disclosed herein utilizes a horizontally placed drive component, and enables the drive component to abut against the transmission component via an inclined surface to drive the transmission component to move in a vertical direction. This can change the setting direction of the drive component, making the equipment layout more compact, which is conducive to the miniaturization of wafer transfer equipment.

[0062] See also Figure 8 In some embodiments, a system 300 for wafer transfer may include some of the devices 100 for wafer transfer in the above-mentioned embodiments, and the system further includes a wafer storage device 400 and a processing device 200. The wafer storage device 400 may be, for example, a front-end module (EFEM) of a device for wafer processing, which may include, for example, a wafer storage mechanism for storing multiple wafers, a wafer transport mechanism for transferring wafers, and a wafer recovery mechanism for recovering wafers after processing or inspection. The wafers 90 enter and exit the wafer storage device 400 through a wafer transfer port 410. The processing device 200 may be, for example, a device for receiving wafers and performing inspection or processing on the wafers, and may include a first chamber 210 and a second chamber 220 stacked and interconnected, a wafer receiving opening 221 for communicating with the second chamber 220 to receive the wafer 90, and a third chamber 230 for performing corresponding processing on the wafers. The third chamber 230 is connected to the first chamber 210 via a transfer window 231, and a first transfer mechanism 70 for transferring wafers between the second chamber 220 and the third chamber 230 is also provided in the third chamber 230. The wafer transfer apparatus 100 described in some embodiments of the present disclosure can be connected to the wafer storage device 400 and receive wafers transferred from the wafer storage device 400. The sealed transfer device 110 is then used to transfer the wafers between the first chamber 210 and the second chamber 220, and the wafers are then removed or returned by the first transfer mechanism 70.

[0063] See also Figures 9a to 9c , Figure 9a An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown, wherein a sealing transfer device is located at a corresponding position of the second chamber; Figure 9b An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown, wherein a sealing transfer device is located at a relay position; Figure 9c An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown, wherein the sealed transfer device is located at a position corresponding to the first chamber. In some embodiments, the sealed transfer device 110 can be driven by a drive mechanism 20 to reciprocate vertically relative to the first chamber 210 and the second chamber 220 and can move to three predetermined positions: a position corresponding to the first chamber, a position corresponding to the second chamber, and a relay position.

[0064] In some embodiments, when the sealing conveyor 110 is located at a position corresponding to the second chamber, the follower wheel 222 can be located, for example, above the inclined section 213 of the guide groove 211, or at a position corresponding to the adjustment section 214, so that the sealing conveyor 110 is vertically positioned high, thereby causing the outer periphery of the sealing plate 11 to abut against and seal the step surface 224 between the first chamber 210 and the second chamber 220. By adjusting the vertical height of the wafer support 115 on the upper side of the sealing plate 11, the wafer 90 transferred from the wafer storage device 400 can be received through the wafer receiving opening 221.

[0065] When the sealing conveyor 110 is in the intermediate position, the follower wheel 222 can, for example, be located in the middle of the inclined section 213, causing the sealing plate 11 to disengage from the stepped surface 224 and move downward into the first chamber 210. By setting the vertical height of the intermediate position, the sealing conveyor 110 can correspond to the first transfer mechanism 70 at the intermediate position, allowing the receiving portion of the first transfer mechanism 70 to move below the wafer 90 carried by the sealing conveyor 110. Alternatively, the receiving portion of the first transfer mechanism 70 can transfer the wafer 90 from the third chamber 230 to above the sealing conveyor 110. In some embodiments, the drive member 22 can be a drive member with controllable output, such as a stepper motor. By adjusting the output of the drive member 22, the guide plate 21 can be stopped and locked at a preset position after moving to the preset position. Thus, by setting the preset position, the height of the sealing conveyor 110 at the intermediate position can be determined without requiring adaptive modifications to the guide plate structure for the intermediate position.

[0066] Furthermore, when the sealed conveyor 110 is located at the position corresponding to the first chamber, the follower wheel 222 can be located, for example, below the inclined section 213, so that the sealed conveyor 110 is vertically positioned at a low position. If the sealed conveyor 110 is loaded with wafers 90 at the intermediate position, the wafers 90 will disengage from the sealed conveyor 110 during its movement to the position corresponding to the first chamber and will be supported by the receiving portion of the first transfer mechanism 70, thereby being transferred to the interior of the third chamber 230.

[0067] Although a plurality of embodiments of the present disclosure have been shown and described herein, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Those skilled in the art may conceive of many modifications, changes, and alternatives without departing from the ideas and spirit of the present disclosure. It should be understood that in practicing the present disclosure, various alternatives to some of the embodiments of the present disclosure described herein may be adopted. The appended claims are intended to define the scope of protection of the present disclosure and therefore cover equivalents or alternatives within the scope of these claims.

Claims

1. A device for wafer transfer, for transferring a wafer (90) between a first chamber (210) and a second chamber (220) of a processing device (200), characterized in that: include: a connecting plate (12) fixedly connected to the cavity wall of the first cavity (210), the connecting plate (12) being provided with a plurality of through transmission holes (128); a sealing plate (11) spaced apart from the connecting plate (12) in a vertical direction and movable relative to the connecting plate (12) to seal the second chamber relative to the first chamber (210), wherein the sealing plate (11) includes two vacuum openings respectively connected to different vacuum pumps, and a plurality of sealing rod holes (118); A transmission mechanism comprising a plurality of hollow transmission rods (24), wherein the transmission rods (24) are fixedly connected to the bottom side of the sealing plate (11); A vacuum assembly comprising two valve plates and a plurality of sealing rods (351), wherein the plurality of sealing rods (351) pass through a transmission rod (24) and a transmission through hole (128) and are fixedly connected to the valve plates to drive the valve plates to seal the vacuum opening; A sealing connection assembly comprises a plurality of bellows, at least some of which have one end fixedly connected to the connection plate (12) and the other end fixedly connected to the sealing plate (11) or the valve plate, and enclose and seal the vacuum opening, the transmission through hole (128) and the sealing rod hole (118).

2. The device according to claim 1, characterized in that The transmission mechanism further comprises a relay (23) and a limiting bracket (36) fixedly connected to the relay (23), the limiting bracket (36) comprising a limiting block (366) extending in a vertical direction, the vacuum assembly comprising a single-acting cylinder (35) for driving the valve plate to move, the protruding end (358) of the single-acting cylinder (35) of the vacuum assembly being fixedly connected to the synchronous bracket, and the limiting block (366) limiting the synchronous bracket in a vertical direction.

3. The device according to claim 2, characterized in that The vacuum assembly includes a plurality of single-acting cylinders, the synchronous bracket is fixedly connected to the protruding ends of at least two single-acting cylinders, and a buffer spring (365) is provided between the synchronous bracket and the limiting bracket (36). The limiting bracket (36) also includes a spring support portion (362) extending in a horizontal direction, and one end of the buffer spring (365) abuts against the spring support portion (362), and the other end abuts against the upper surface of the synchronous bracket.

4. The device according to claim 3, characterized in that The vacuum assembly includes a first valve plate assembly and a second valve plate assembly, wherein the first valve plate assembly and the second valve plate assembly each include two single-acting cylinders (35), the protruding ends (358) of the two single-acting cylinders (35) of the first valve plate assembly are fixedly connected to a synchronous bracket, and the protruding ends (358) of the two single-acting cylinders (35) of the second valve plate assembly are fixedly connected to another synchronous bracket.

5. The device according to claim 4, characterized in that The transmission mechanism further includes a relay plate (233) arranged at intervals along the vertical direction on the lower side of the relay member (23); the vacuum assembly includes a vacuum tube arranged along the vertical direction and connected to the vacuum opening, and a vacuum pump arranged at the end of the vacuum tube; the fixing portion (359) of the single-acting cylinder (35) is fixedly connected to the vertical lower side of the relay plate (233); the vacuum tube passes through the pipe through hole of the relay plate (233) in the vertical direction; and the vacuum pump is connected to the vacuum tube on the vertical lower side of the relay plate (233).

6. The device according to claim 5, characterized in that A sealing through hole (242) is provided inside the transmission rod (24), and two guide sleeves (241) are fixedly provided inside the sealing through hole (242). The two guide sleeves (241) are respectively located at the axial ends of the sealing through hole (242). The sealing rod (351) is passed through the sealing through hole (242), and the outer peripheral surface of the sealing rod (351) cooperates with the inner hole of the guide sleeve (241) so as to be limited and guided by the guide sleeve (241).

7. The device according to claim 6, characterized in that A downwardly protruding sealing flange (329) is provided on the bottom side of the valve plate. The sealing flange (329) is annular and includes a sealing groove and a sealing ring accommodated in the sealing groove. An opening boss (119) protruding upward in a vertical direction is provided on the upper side of the sealing plate (11). The opening boss (119) surrounds the vacuum opening. When the valve plate closes the vacuum opening, the opening boss (119) and the sealing flange (329) can abut against each other along a first direction.

8. The device according to any one of claims 1 to 7, characterized in that The sealing connection assembly includes a first bellows (141), a second bellows (142), and a third bellows (143); the valve plate includes a sealing connection hole (39) for fixedly connecting with the sealing rod (351); the first bellows (141) includes a first connection portion (141a), a second connection portion (141b), and a third connection portion (141c); the first connection portion (141a) at least partially extends into the sealing connection hole (39) of the valve plate and is fixedly connected with the sealing connection hole (351). 9) fully welded connection, the second connecting portion (141b) at least partially extends into the sealing rod hole (118) of the sealing plate (11) and is fully welded to the sealing rod hole (118), the third connecting portion (141c) at least partially extends into the transmission through hole (128) of the connecting plate (12) and is fully welded to the transmission through hole (128), one end of the second bellows (142) and the third bellows (143) are fully welded to the connecting plate (12), and the other end are fully welded to the sealing plate (11).

9. The device according to claim 8, characterized in that The vacuum assembly includes a first valve plate (31) and a second valve plate (32); the sealing plate (11) has a first vacuum opening (111) and a second vacuum opening (112); the upper side of the sealing plate (11) also has a first accommodating cavity (310) for accommodating the first valve plate (31) and a second accommodating cavity (320) for accommodating the second valve plate (32); the first valve plate (31) and the second valve plate (32) can be at least partially accommodated in the corresponding first accommodating cavity (310) and second accommodating cavity (320) in the vertical direction; the first vacuum opening (111) is opened in a portion of the sealing plate (11) corresponding to the center of the first accommodating cavity (310), and the second vacuum opening (112) is opened in a portion of the sealing plate (11) corresponding to the center of the second accommodating cavity (320).

10. A system for wafer transfer, characterized in that: The device comprises the device for wafer transfer according to any one of claims 1 to 9.

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