Slide glass device for vertical furnace tube

Abstract

The utility model provides a slide glass device for a vertical furnace tube. The slide glass device comprises a top plate, a bottom plate and a plurality of connecting columns, the top plate is arranged above the bottom plate in parallel, and the connecting column is connected between the top plate and the bottom plate; the plurality of connecting columns are circularly distributed, and a placing space is formed among the plurality of connecting columns; a plurality of bearing blocks are arranged on the sides, close to the containing space, of the connecting columns, a plurality of stopping blocks are arranged on at least two connecting columns, the stopping blocks are connected to the tops of the bearing blocks, and materials are placed between the stopping blocks and the bearing blocks. According to the utility model, the stop block is arranged on the connecting column, so that the wafer is limited by the stop block, the wafer is effectively prevented from sliding on the bearing block due to factors such as vibration, airflow disturbance and the like, and the risk that the wafer slides out of the slide glass device and falls off is greatly reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer carriers, and more specifically to a wafer carrier for a vertical furnace tube. Background Art

[0002] In the production process of integrated circuits, vertical furnace tubes have become key equipment on the current domestic 6-, 8-, and 12-inch integrated circuit production lines. They are mainly used to perform diffusion, oxidation, or low-pressure chemical vapor deposition processes on silicon and silicon carbide wafers under high-temperature conditions.

[0003] In vertical furnace applications, wafers are typically placed horizontally on a wafer carrier, with transmission components used to automatically move wafers in and out of the furnace. However, due to various factors such as mechanical vibration and airflow disturbances, wafers may slip on the wafer carrier or even slide off, posing a risk of falling. Utility Model Content

[0004] The purpose of the utility model is to overcome the defects of the prior art and provide a wafer carrier device for a vertical furnace tube to solve the technical problem that wafers are prone to sliding or even falling on the wafer carrier device.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] The utility model provides a wafer carrier device for a vertical furnace tube, which comprises: a top plate, a bottom plate and a plurality of connecting columns; the top plate is arranged parallel to the top of the bottom plate, and the connecting columns are connected between the top plate and the bottom plate; the plurality of connecting columns are distributed in a circular shape, and a placement space is formed between the plurality of connecting columns; a plurality of bearing blocks are provided on one side of the connecting column close to the placement space, and a plurality of blocking blocks are provided on at least two of the connecting columns, the blocking blocks are connected to the top of the bearing blocks, and materials are placed between the blocking blocks and the bearing blocks.

[0007] In one embodiment, a plurality of blocking blocks are provided on two adjacent connecting pillars that are farthest apart, and the blocking blocks of the two adjacent connecting pillars are arranged on the sides close to each other.

[0008] In one embodiment, the blocking block is arranged in an arc shape on a side close to the placement space; the curvature of the blocking block corresponds to the curvature of the wafer.

[0009] In one embodiment, the vertical height of the blocking block is greater than the thickness of the wafer.

[0010] In one embodiment, an inclined surface is provided on the top of the supporting block.

[0011] In one embodiment, the inclined surface is inclined from the plane where the top of the supporting block is located toward the plane where the bottom plate is located.

[0012] In one embodiment, the inclination angle of the inclined surface is 2°-6°.

[0013] In one embodiment, the connecting column includes: a first column and two second columns; the first column and the second column are connected between the top plate and the bottom plate, and the first column is located between the two second columns; the blocking block is provided on the second column.

[0014] In one embodiment, the first column and the second column are respectively located on two sides of a vertical center section of the placement space.

[0015] In one embodiment, the number of the first pillars is two, and the two first pillars are located between the two second pillars.

[0016] The beneficial effects of the present invention compared with the prior art are as follows: the present invention provides a blocking block on the connecting column so that the wafer is restricted by the blocking block, effectively preventing the wafer from sliding on the carrier block due to factors such as vibration and airflow disturbance, greatly reducing the risk of the wafer sliding out of the carrier device and falling; the blocking block prevents the wafer from moving in the horizontal direction of the carrier block, ensuring that the wafer can remain stable in the vertical furnace tube and during the transfer of the carrier device, thereby ensuring the position accuracy of the wafer during high-temperature processes such as diffusion, oxidation or low-pressure chemical vapor deposition, and improving the production quality of integrated circuits.

[0017] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In addition, in order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a front view structural schematic diagram of a wafer carrier device for a vertical furnace tube provided by the utility model;

[0019] Figure 2 This is a rear structural schematic diagram of a wafer carrier device for a vertical furnace tube provided by the present invention;

[0020] Figure 3 for Figure 2 Schematic diagram of the local A enlarged structure;

[0021] Figure 4 for Figure 2 Schematic diagram of the cross-sectional structure at BB;

[0022] Figure 5 for Figure 4 Schematic diagram of the local C amplification structure;

[0023] Figure 6 The utility model provides a schematic diagram of the connection structure between the first column and the wafer of a wafer carrier device for a vertical furnace tube.

[0024] Reference numerals:

[0025] 1. Top plate; 2. Bottom plate; 3. Connecting column; 31. Carrying block; 311. Inclined surface; 32. Stop block; 33. First column; 34. Second column; 4. Placement space; 5. Inlet and outlet; 6. Wafer. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments. The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] It will be understood that when used in this specification and the appended claims, the terms “comprises” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0028] It should also be understood that the terms used in this utility model specification are only for the purpose of describing specific embodiments and are not intended to limit the utility model. As used in this utility model specification and the appended claims, the singular forms "a", "an" and "the" are intended to include plural forms unless the context clearly indicates otherwise.

[0029] It should be further understood that the term “and / or” used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0030] See also Figure 1-6 As shown, this embodiment discloses a wafer carrier device for a vertical furnace tube.

[0031] The wafer carrier of this embodiment is used to load a horizontally placed wafer 6 so that the wafer 6 can enter the vertical furnace tube under the drive of the transmission component to undergo various processes such as diffusion, oxidation or low-pressure chemical vapor deposition.

[0032] The wafer carrier device for a vertical furnace tube of this embodiment includes: a top plate 1, a bottom plate 2 and a plurality of connecting columns 3; the top plate 1 is arranged parallel to the bottom plate 2, and the connecting columns 3 are connected between the top plate 1 and the bottom plate 2; the plurality of connecting columns 3 are distributed in a circular shape, and a placement space 4 is formed between the plurality of connecting columns 3; a plurality of supporting blocks 31 are provided on the side of the connecting columns 3 close to the placement space 4, and a plurality of blocking blocks 32 are provided on at least two of the connecting columns 3, and the blocking blocks 32 are connected to the top of the supporting blocks 31, and the material is placed between the blocking blocks 32 and the supporting blocks 31.

[0033] During the specific implementation, the wafer carrier is first placed outside the vertical furnace body; then the wafer 6 is placed between the supporting block 31 and the blocking block 32 located on the same layer in the placement space 4; then the wafer carrier is moved into the vertical furnace tube; the vertical furnace tube is started, and the wafer 6 is processed; after the wafer 6 processing is completed, the wafer carrier is taken out of the vertical furnace tube and moved to the next workstation.

[0034] The wafer carrier device for the vertical furnace tube of this embodiment is provided with a blocking block 32 on the connecting column 3 so that the wafer 6 is restricted by the blocking block 32, effectively preventing the wafer 6 from sliding on the carrier block 31 due to factors such as vibration and airflow disturbance, greatly reducing the risk of the wafer 6 sliding out of the wafer carrier device and falling; the blocking block 32 prevents the wafer 6 from moving in the horizontal direction of the carrier block 31, ensuring that the wafer 6 can remain stable in the vertical furnace tube and during the transfer of the wafer carrier device, thereby ensuring the position accuracy of the wafer 6 during high-temperature processes such as diffusion, oxidation or low-pressure chemical vapor deposition, and improving the production quality of integrated circuits.

[0035] Specifically, a plurality of carrier blocks 31 are linearly distributed on the connecting column 3 from top to bottom, with gaps between adjacent carrier blocks 31. The carrier blocks 31 of the connecting columns 3 correspond one to one, and the carrier blocks 31 on the same plane form a placement layer. The plurality of carrier blocks 31 are linearly distributed in the vertical direction, which is conducive to forming multiple placement layers distributed from top to bottom, so that multiple wafers 6 can be stacked and placed in the wafer carrier, making full use of the vertical space in the wafer carrier and the vertical furnace tube, improving the space utilization rate of the wafer carrier, and helping to improve the loading capacity of the wafer carrier, so that the vertical furnace tube can process a large number of wafers 6 at a time, thereby improving the processing efficiency of the vertical furnace tube.

[0036] In this embodiment, the number of carrier blocks 31 on a connecting column 3 is 50-170. The wafer carrier can be loaded with 50-170 wafers 6 at a time, avoiding the frequent opening and closing of the vertical furnace tube, reducing the number of wafer carrier replacements and reloading and unloading of wafers 6, reducing energy and human resource consumption, and thereby improving overall production efficiency. It is understood that in other embodiments, the number of carrier blocks 31 can be adjusted according to actual needs or the vertical height of the connecting column 3.

[0037] Specifically, a number of blocking blocks 32 are provided on the two adjacent connecting pillars 3 that are the farthest apart. At least two connecting pillars 3 are used as the entrance and exit 5 for taking and placing wafers 6, and the two connecting pillars 3 with the longest distance between them are selected as the connecting pillars 3 on both sides of the entrance and exit 5. Furthermore, in order to allow the wafer 6 to smoothly enter and exit the placement layer, the distance between the connecting pillars 3 on both sides of the entrance and exit 5 is set to be greater than the diameter of the wafer 6, so as to provide sufficient entry and exit space for the wafer 6. However, when the wafer 6 is placed on the placement layer, the distance between the connecting pillars 3 on both sides of the entrance and exit 5 makes it easy for the wafer 6 to slide out of the placement layer. Therefore, blocking blocks 32 are provided on the connecting pillars 3 on both sides of the entrance and exit 5, which can prevent the wafer 6 from sliding out of the carrier device from the entrance and exit 5. The supporting blocks 31 on the placement layer are connected to the connecting pillars 3, and the distance between the connecting pillars 3 outside the two sides of the entrance and exit 5 is smaller. Under the restrictive effect of the connecting pillars 3, the wafer 6 cannot slide out from between other connecting pillars 3 outside the entrance and exit 5.

[0038] See also Figure 1 As shown, the distance between the two outermost connecting posts 3 is the longest. The connecting posts 3 on either side of the inlet and outlet 5 are each provided with a plurality of blocking blocks 32. The two connecting posts 3 in the middle, however, already serve as blocks for the supporting blocks 31 and do not require blocking blocks 32. Therefore, blocking blocks 32 are not required on any connecting posts 3 other than the two furthest apart. This saves processing steps and resources, further improving the production efficiency of the wafer carrier. It also reduces wear on the wafer 6 by the blocking blocks 32, ensuring a smooth surface.

[0039] Specifically, the blocking blocks 32 of two adjacent connecting columns 3 are arranged on a side close to each other. The blocking blocks 32 are arranged close to the inlet and outlet 5, which helps to restrict the wafer 6 from the outside of the wafer 6, so that the wafer 6 is firmly placed between the blocking blocks 32 and the supporting blocks 31. When the wafer 6 slides to the inlet and outlet 5 and contacts the blocking blocks 32, the blocking blocks 32 give the outer wall of the wafer 6 a reverse resistance force, thereby preventing the wafer 6 from sliding out of the carrier device from the supporting blocks 31 on both sides of the inlet and outlet 5. It is understandable that in other embodiments, the blocking blocks 32 can be arranged on the upper surface of the supporting blocks 31, and the wafer 6 is placed on the blocking blocks 32, instead of the blocking blocks 32 being arranged on the side of the supporting blocks 31 away from the placement space 4. That is, the supporting blocks 31 on the connecting columns 3 on both sides of the inlet and outlet 5 are heightened so that the placement layer is tilted, so that the wafer 6 is subjected to a resistance force oblique to the center of the placement layer, thereby preventing the wafer 6 from sliding out of the inlet and outlet 5.

[0040] Specifically, the blocking block 32 is arranged in an arc shape on one side close to the placement space 4. The inner side of the blocking block 32 is arranged in an arc shape, so that the inner side of the blocking block 32 has no sharp edges, which greatly reduces the risk of scratching the wafer 6 and thus ensures the production quality of the wafer 6.

[0041] Specifically, the curvature of the stopper 32 corresponds to the curvature of the wafer 6. The inner side of the stopper 32 is adapted to the outer wall of the wafer 6, which can not only reduce friction on the outer wall of the wafer 6, but also improve the fit between the stopper 32 and the wafer 6, thereby enhancing the restraining effect on the wafer 6, preventing the wafer 6 from shifting during processing, and further improving the stability and reliability of the entire production process.

[0042] Specifically, the vertical height of the blocking block 32 is greater than the thickness of the wafer 6. Because the blocking block 32 is greater than the thickness of the wafer 6, even if the wafer 6 undergoes slight dimensional changes due to thermal expansion and contraction or other physical effects during processing, or if the wafer 6 is affected by hot air flows from above or below, causing slight vertical displacement, these changes can be effectively blocked by the blocking block 32. The blocking block 32 enhances the vertical restriction of the wafer 6, ensuring the positional stability of the wafer 6 during processing. This, in turn, ensures that the heat and processing conditions received by various surface portions of the wafer 6 during processing are more consistent, thereby ensuring the processing quality and consistency of the wafer 6.

[0043] Specifically, an inclined surface 311 is provided on the top of the supporting block 31. Relative to the horizontal plane, the setting of the inclined surface 311 improves the contact between the wafer 6 and the supporting block 31 from surface contact to point contact, greatly reducing the contact area between the supporting block 31 and the wafer 6, thereby helping to reduce the damage to the wafer 6 caused by friction during the processing. The setting of the inclined surface 311 allows the remaining surfaces of the wafer 6, except for the contact points, to be in contact with the airflow in the vertical furnace tube. When the wafer 6 is heated, the heat can be dissipated more quickly through the gap between the inclined surface 311 and the wafer 6, which helps to improve the heat dissipation efficiency of the wafer 6 during the processing, thereby reducing the risk of damage to the wafer 6 due to overheating.

[0044] Specifically, the inclined surface 311 is inclined from the plane where the top of the supporting block 31 is located to the plane where the base plate 2 is located. The inclined surface 311 is inclined downward, so that the wafer 6 can naturally slide to the lower side of the supporting block 31 when placed, forming a stable point contact. Since the center of gravity of the wafer 6 is located at its geometric center, and the design of the inclined surface 311 enables the wafer 6 to be automatically centered when placed, ensuring the accuracy and convenience of the placement of the wafer 6. At the same time, the downward-inclined supporting block 31 can adapt to changes in the specifications and dimensions of the wafer 6. For example, the wafer 6 will expand and contract slightly during processing, and the existence of the inclined surface 311 allows the wafer 6 to have a certain space for buffering when it expands, thereby avoiding excessive extrusion or friction between the wafer 6 and the supporting block 31 caused by expansion. It can also make the crystal slide a small distance along the inclined surface 311 when the wafer 6 shrinks, thereby avoiding the wafer 6 from falling after shrinking due to the small size of the supporting block 31. In addition, the inclined surface 311 is inclined downward, and can also provide the wafer 6 with a reverse supporting force toward the top plate 1 and toward the center of the placement space 4, so that when the wafer 6 contacts the inclined surface 311, it has a tendency to correct its position toward the center of the placement space 4, and it is difficult to slide from the supporting block 31 to the connecting column 3, thereby avoiding the wafer 6 contacting or colliding with the connecting column 3 and causing damage to the wafer 6. The inclined surface 311 and the blocking block 32 cooperate with each other to prevent the wafer 6 from sliding out of the inlet and outlet 5, thereby improving the placement stability of the wafer 6.

[0045] See also Figure 3 As shown, when the wafer 6 is placed on the inclined surface 311 of the supporting block 31, the wafer 6 has a contact point with the supporting block 31 on each connecting column 3, and forms an angle α. The existence of the angle α makes the contact point between the supporting block 31 and the wafer 6 at the edge of the wafer 6, avoiding the contact between the middle part of the wafer 6 and the supporting block 31, protecting the middle area of ​​the wafer 6 from scratches to the greatest extent, reducing the contact of the lower surface of the wafer 6 with the particles on the surface of the supporting block 31, and ensuring the cleanliness and processing quality of the wafer 6.

[0046] Specifically, the tilt angle of the inclined surface 311 is 2°-6°. The included angle α of 2°-6° makes the tilt angle of the top of the carrier block 31 gentle, which not only ensures that the wafer 6 can be stably placed on the carrier block 31, but also avoids the situation where the carrier block 31 tilts at a large angle, causing the wafer 6 to slide a large distance in the process of adapting to the inclined surface 311 to slide to a stable contact point, resulting in increased friction between the wafer 6 and the inclined surface 311, and affecting the surface quality of the wafer 6.

[0047] In this embodiment, the angle of inclination of the inclined surface 311 is 3.5°. The moderate 3.5° angle between the inclined surface 311 and the horizontal plane at the top of the support block 31 ensures that the wafer 6 can be stably placed on the support block 31 under the action of gravity, without causing the wafer 6 to slip or tilt unsteadily due to an angle that is too large or too small. It is understood that in other embodiments, the angle of inclination of the inclined surface 311 can be adjusted according to actual needs.

[0048] Preferably, the number of the connecting pillars 3 is at least three. Increasing the number of the connecting pillars 3 improves the stability and reliability of the wafer carrier device.

[0049] Specifically, when the number of connecting columns 3 is three, the wafer 6 is placed in the wafer carrier device and contacts at least three supporting blocks 31. The three supporting blocks 31 form a stable triangular support structure, which can effectively prevent the wafer 6 from shaking or tilting due to vibration, airflow disturbance and other factors during the processing process, thereby ensuring the stable processing of the wafer 6 in the vertical furnace tube.

[0050] Specifically, when the number of connecting pillars 3 is three or more, the wafer 6 is subjected to more and more balanced support forces on the placement layer, which helps to reduce deformation or cracks of the wafer 6 due to uneven force, improves the processing quality and yield of the wafer 6, and can also adapt to changes in sudden situations. For example, during the processing, the supporting block 31 breaks due to long-term use, accidents or high temperature environment, resulting in a reduction in the support points of the wafer 6. However, due to the presence of other supporting blocks 31, the wafer 6 can still remain level and stable, and will not fall or cause serious displacement due to failure of single-point support.

[0051] Specifically, the connecting columns 3 include a first column 33 and two second columns 34. The first column 33 and the second columns 34 are connected between the top plate 1 and the bottom plate 2, with the first column 33 located between the two second columns 34. A stopper 32 is provided on each of the second columns 34. The two second columns 34 serve as the connecting columns 3 on either side of the inlet / outlet 5. The stopper 32 is provided on each of the second columns 34 to prevent the wafer 6 from slipping out of the wafer carrier through the inlet / outlet 5.

[0052] Specifically, the first column 33 and the second column 34 are located on either side of the vertical center section of the placement space 4. It is understood that the first column 33 and the second column 34 are distributed in a circular pattern between the top plate 1 and the bottom plate 2, thereby forming a hollow vertical cylindrical placement space 4. By vertically dividing the placement space 4 into two semi-cylindrical shapes, the first column 33 and the second column 34 are located on two different semi-cylindrical shapes. This makes the distance between the second column 34 and the first column 33 much larger than the radius of the placement layer, allowing the wafer 6 to be supported on both sides, further ensuring the stability and balance of the placement of the wafer 6, and avoiding the first column 33 and the second column 34 from being concentrated on the same side of the placement space 4, causing the wafer 6 to be subjected to force on one side and easily tilted or broken.

[0053] Specifically, the blocking block 32 is provided on the side of the supporting block 31 on the second column 34 close to the other second column 34. Between the two second columns 34 is the entrance and exit 5, which is used to take the wafer 6 therefrom. The entrance and exit 5 provide sufficient space for the wafer 6 to enter and exit. In specific implementation, when taking out the wafer 6 from the carrier device, the wafer 6 is lifted above the blocking block 32 to smoothly take out the wafer 6. When placing the wafer 6 into the carrier device, the wafer 6 is extended from above the blocking block 32 into the placement layer to place the wafer 6 on the supporting block 31. The blocking block 32 is provided at the entrance and exit 5, which neither hinders the taking and placing of the wafer 6 nor prevents the wafer 6 from sliding from the entrance and exit 5 to the outside of the carrier device during the processing of the wafer 6 or the movement of the carrier device.

[0054] In this embodiment, there are two first pillars 33, located between the two second pillars 34. The distance between the two first pillars 33 is smaller than the distance between the two second pillars 34. The first pillars 33 provide stable support for the top plate 1 and bottom plate 2, as well as stable and balanced support for the wafer 6. They also serve as a backstop for the wafer 6, preventing it from leaving the wafer carrier. It will be appreciated that in other embodiments, the number of first pillars 33 can be adjusted based on actual needs or the dimensions of the wafer 6.

[0055] It is understandable that in other embodiments, both the top and bottom of the carrier block 31 are provided with inclined surfaces 311, and the blocking blocks 32 are arranged on the inclined surfaces 311 on both sides of the carrier block 31 of the second column 34. The bottom of the carrier block 31 is also inclined and limited, so that the wafer carrier device can be used upside down, that is, when the wafer carrier device is used in reverse, the top plate 1 can serve as the lower part of the wafer carrier device, and the bottom plate 2 serves as the upper part of the wafer carrier device. The bottom of the original carrier block 31 can serve as a new support surface for the wafer 6, so that when the wafer carrier device is used in reverse, the carrier block 31 can still play the role of guiding the wafer 6 to be stably placed, and can also assist the wafer 6 to better dissipate heat under the action of the airflow in the vertical furnace tube, thereby ensuring the stability and quality of the wafer 6 processing. Whether the blocking blocks 32 are located at the top or bottom of the carrier block 31, they can effectively prevent the wafer 6 from slipping during processing or movement, and maintain the stable position of the wafer 6.

[0056] This embodiment provides a wafer carrier device for a vertical furnace tube. By arranging a blocking block on the connecting column, the wafer is restricted by the blocking block, which effectively prevents the wafer from sliding on the carrier block due to factors such as vibration and airflow disturbance, greatly reducing the risk of the wafer sliding out of the wafer carrier device and falling; the blocking block prevents the wafer from moving in the horizontal direction of the carrier block, ensuring that the wafer can remain stable in the vertical furnace tube and during the transfer process of the wafer carrier device, thereby ensuring the position accuracy of the wafer during high-temperature processes such as diffusion, oxidation or low-pressure chemical vapor deposition, and improving the production quality of integrated circuits.

[0057] The above examples are merely used to further illustrate the technical content of the present invention for easier understanding by the reader. However, they do not limit the implementation of the present invention to these examples. Any technical extension or reinvention based on the present invention is protected by the present invention. The scope of protection of the present invention shall be determined by the claims.

Claims

1. A wafer carrier for a vertical furnace tube, characterized in that: include: A top plate, a bottom plate and several connecting columns; the top plate is arranged parallel to the bottom plate, and the connecting columns are connected between the top plate and the bottom plate; the several connecting columns are distributed in a circle, and a placement space is formed between the several connecting columns; a plurality of bearing blocks are provided on the side of the connecting column close to the placement space, and a plurality of blocking blocks are provided on at least two of the connecting columns, and the blocking blocks are connected to the top of the bearing blocks, and the materials are placed between the blocking blocks and the bearing blocks.

2. The wafer carrier device for a vertical furnace tube according to claim 1, characterized in that: A plurality of blocking blocks are provided on two adjacent connecting columns that are farthest apart, and the blocking blocks of the two adjacent connecting columns are arranged on the sides close to each other.

3. The wafer carrier device for a vertical furnace tube according to claim 1, characterized in that: The blocking block is arranged in an arc shape on one side close to the placement space; the curvature of the blocking block corresponds to the curvature of the wafer.

4. The wafer carrier device for a vertical furnace tube according to claim 1, characterized in that: The vertical height of the blocking block is greater than the thickness of the wafer.

5. The wafer carrier device for a vertical furnace tube according to claim 1, characterized in that: The top of the bearing block is provided with an inclined surface.

6. The wafer carrier device for a vertical furnace tube according to claim 5, characterized in that: The inclined surface is inclined from the plane where the top of the bearing block is located to the plane where the bottom plate is located.

7. The wafer carrier device for a vertical furnace tube according to claim 6, characterized in that: The inclination angle of the inclined surface is 2°-6°.

8. The wafer carrier device for a vertical furnace tube according to claim 1, characterized in that: The connecting column includes: a first column and two second columns; the first column and the second column are connected between the top plate and the bottom plate, and the first column is located between the two second columns; the blocking block is provided on the second column.

9. The wafer carrier device for a vertical furnace tube according to claim 8, characterized in that: The first column and the second column are respectively located on two sides of the vertical center section of the placement space.

10. The wafer carrier device for a vertical furnace tube according to claim 9, characterized in that: The number of the first columns is two, and the two first columns are located between the two second columns.

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