Inter-module wafer conveying unit

Abstract

The utility model belongs to the technical field of gluing and developing equipment, and particularly relates to an inter-module wafer conveying unit, which comprises a mounting substrate and a plurality of groups of wafer conveying assemblies. Each wafer conveying assembly comprises a linkage electric cylinder linear driving structure, a connecting support, a vacuum adsorption table mounting plate and a vacuum adsorption table. And the linkage electric cylinder linear driving structure is used for driving the connecting bracket, the vacuum adsorption table mounting plate and the vacuum adsorption table to integrally move to the two modules respectively. And the top surfaces of the vacuum adsorption tables are used for directly adsorbing wafers. Compared with a traditional linear driving assembly structure, the arrangement of the linkage electric cylinder linear driving structure can accelerate the transmission speed of wafers between modules, thereby facilitating the improvement of the productivity; the repeated positioning precision is high, the centering effect of the manipulator is facilitated, and the process unit performance and the wafer processing quality are improved; the structure is simple, the occupied space is small, the installation is convenient, the production assembly efficiency is improved, the production assembly cost is reduced, and the failure rate is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of glue coating and developing equipment, in particular to an inter-module wafer transfer unit. Background Art

[0002] The coating and developing equipment usually consists of multiple modules, each of which contains multiple process units. The interaction between the process units within each module is completed by a robot, and the interaction between modules is completed by a wafer transfer unit.

[0003] Existing wafer transfer units typically utilize a linear drive assembly consisting of a motor, a master-slave belt assembly, and a guide assembly. This structure results in slow transfer speeds, hindering productivity gains, and poor repeatability, impacting subsequent robot centering. Furthermore, the complex structure and large footprint lead to high production and assembly costs and low efficiency. Furthermore, the complex structure can lead to high failure rates, impacting production efficiency and causing poor wafer processing quality stability. Therefore, a new type of wafer transfer unit is urgently needed to address these issues. Utility Model Content

[0004] In view of the above problems, the present invention aims to provide an inter-module wafer transfer unit.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] An inter-module wafer transfer unit includes a mounting base and several sets of wafer transfer components;

[0007] Each set of wafer transfer components includes a linkage electric cylinder linear drive structure, a connecting bracket, a vacuum adsorption table mounting plate, and a vacuum adsorption table;

[0008] The linked electric cylinder linear drive structure of each group of wafer transfer components has a fixed end and a linear output end. The fixed end of the linked electric cylinder linear drive structure of each group of wafer transfer components is respectively fixed to the mounting substrate, and the linear output end of the linked electric cylinder linear drive structure of each group of wafer transfer components is respectively fixed to the connecting bracket of the same group of wafer transfer components. The vacuum adsorption table mounting plate of each group of wafer transfer components is respectively mounted on the connecting bracket of the same group of wafer transfer components. The vacuum adsorption table of each group of wafer transfer components is respectively mounted on the vacuum adsorption table mounting plate of the same group of wafer transfer components. The top surface of the vacuum adsorption table of each group of wafer transfer components is used for directly adsorbing wafers.

[0009] The moving directions of the linear output ends of the linear drive structures of the linked electric cylinders of each group of wafer transfer assemblies are parallel to each other.

[0010] The wafer transfer components are provided in two groups, wherein the vacuum adsorption table mounting plate of the wafer transfer components in one group is located above the vacuum adsorption table mounting plate of the wafer transfer components in the other group.

[0011] The linear drive structure of the linked electric cylinder of each group of wafer transfer components includes a first-stage transfer electric cylinder, a transfer electric cylinder connecting plate, and a second-stage transfer electric cylinder;

[0012] The outer shell of the first-level transmission electric cylinder of the linkage electric cylinder linear drive structure of each group of wafer transfer components is respectively fixed to the mounting base as the fixed end of the linkage electric cylinder linear drive structure of the wafer transfer components of the group, the driving end of the first-level transmission electric cylinder of the linkage electric cylinder linear drive structure of each group of wafer transfer components is respectively fixed to the transmission electric cylinder connecting plate of the linkage electric cylinder linear drive structure of the same group of wafer transfer components, the outer shell of the second-level transmission electric cylinder of the linkage electric cylinder linear drive structure of each group of wafer transfer components is respectively installed on the transmission electric cylinder connecting plate of the linkage electric cylinder linear drive structure of the same group of wafer transfer components, and the driving end of the second-level transmission electric cylinder of the linkage electric cylinder linear drive structure of each group of wafer transfer components is respectively fixed to the connecting bracket of the same group of wafer transfer components as the linear output end of the linkage electric cylinder linear drive structure of the wafer transfer components of the group.

[0013] The vacuum adsorption table mounting plates of each group of wafer conveying assemblies are respectively mounted on the top ends of the connecting brackets of the same group of wafer conveying assemblies by screws.

[0014] A plurality of leveling screws for leveling the top ends of the connection brackets of the wafer conveying assemblies in the same group are evenly provided on the vacuum adsorption table mounting plate of each group of the wafer conveying assemblies.

[0015] A drag chain fixing frame is installed on the installation base plate, and a drag chain fixing plate is also provided on the side of the connecting bracket of each group of wafer transfer components.

[0016] The vacuum adsorption table of each group of wafer conveying components is respectively mounted on the vacuum adsorption table mounting plate of the same group of wafer conveying components through screws.

[0017] The lower part of the vacuum adsorption table of each group of wafer transfer components is connected to an air path connection joint for vacuuming the vacuum adsorption table. The air path connection joints of the vacuum adsorption table of each group of wafer transfer components are connected to one end of a corresponding filter through a pipeline. The other end of each filter is connected to a corresponding solenoid valve through a pipeline. Each solenoid valve is connected to an external vacuum source through a pipeline. All the filters and all the solenoid valves are arranged on an air path element mounting seat, and the air path element mounting seat is mounted below the mounting substrate. The vacuum adsorption table mounting plate of each group of wafer transfer components is provided with an air path connection joint through which the air path connection joint connected to the corresponding vacuum adsorption table passes.

[0018] The vacuum adsorption table mounting plate of at least one group of the wafer transfer components is provided with a pipe distribution groove connected to the air path connection joint through-port on the vacuum adsorption table mounting plate, and the vacuum adsorption table mounting plate provided with the pipe distribution groove is also provided with a pipe cover plate for covering the pipe distribution groove.

[0019] The advantages and positive effects of this utility model are:

[0020] The utility model adopts the setting of the linear drive structure of the linked electric cylinder, which can speed up the transmission speed of the wafer between modules compared with the traditional linear drive component structure, and helps to improve production capacity; and has high repeatability positioning accuracy, which is beneficial to the centering effect of the robot, improves the performance of the process unit and the quality of wafer processing; the structure is simple, occupies little space, and is easy to install, thereby improving production and assembly efficiency, reducing production and assembly costs, and reducing failure rates. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the structure of the linkage electric cylinder linear drive structure of the utility model;

[0023] Figure 3 This is a schematic structural diagram of the vacuum adsorption table of the present utility model;

[0024] Figure 4 This is a schematic diagram of the structure of the connection bracket and vacuum adsorption table mounting plate of one set of wafer transfer components of the present invention;

[0025] Figure 5 This is a schematic diagram of the structure of the connection bracket and vacuum adsorption table mounting plate of another set of wafer transfer components of the present invention;

[0026] Figure 6 This is a schematic diagram of the arrangement structure of each gas path component on the gas path component mounting base of the utility model;

[0027] Figure 7 This is a schematic diagram of the connection principle of each gas path component of the present utility model.

[0028] In the figure: 1 is the mounting base plate, 2 is the connecting bracket, 3 is the vacuum adsorption table mounting plate, 301 is the air path connection joint through-hole, 302 is the pipe laying groove, 4 is the vacuum adsorption table, 5 is the first-level transmission electric cylinder, 6 is the transmission electric cylinder connecting plate, 7 is the second-level transmission electric cylinder, 8 is the leveling top screw, 9 is the drag chain fixing bracket, 10 is the drag chain fixing plate, 11 is the air path connection joint, 12 is the filter, 13 is the solenoid valve, 14 is the air path component mounting seat, 15 is the vacuum gauge, and 16 is the pipeline cover. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1-7 The utility model is further described in detail.

[0030] An inter-module wafer transfer unit, such as Figure 1-7 As shown, this embodiment includes a mounting substrate 1 and two sets of wafer transfer assemblies. The number of wafer transfer assemblies can also be adjusted according to usage requirements. The mounting substrate 1 can generally be installed on one of two adjacent modules and located at the junction of the two modules to facilitate wafer transfer between the two modules.

[0031] Each wafer transfer assembly includes a linked electric cylinder linear drive structure, a connecting bracket 2, a vacuum table mounting plate 3, and a vacuum table 4. The linked electric cylinder linear drive structures of the two wafer transfer assemblies operate independently to transfer wafers without interfering with each other, meeting wafer transfer scheduling requirements.

[0032] The linear drive structure of the linked electric cylinder of each group of wafer transfer components has a fixed end and a linear output end. The fixed end of the linear drive structure of the linked electric cylinder of each group of wafer transfer components is respectively fixed to the mounting base plate 1, and the linear output end of the linear drive structure of the linked electric cylinder of each group of wafer transfer components is respectively fixed to the connecting bracket 2 of the same group of wafer transfer components. The vacuum adsorption table mounting plate 3 of each group of wafer transfer components is respectively mounted on the connecting bracket 2 of the same group of wafer transfer components. The vacuum adsorption table 4 of each group of wafer transfer components is respectively mounted on the vacuum adsorption table mounting plate 3 of the same group of wafer transfer components. The top surface of the vacuum adsorption table 4 of each group of wafer transfer components is used to directly adsorb wafers. In this embodiment, the structure of the vacuum adsorption table 4 itself adopts the existing technology. The top surface is provided with an adsorption groove for vacuum adsorption of wafers, and the interior thereof is provided with a vacuum duct connected to each adsorption groove. In this embodiment, the linear output ends of the linked electric cylinder linear drive structures of each wafer transfer assembly move in parallel directions. The vacuum table mounting plate 3 of one wafer transfer assembly is positioned above the vacuum table mounting plate 3 of another wafer transfer assembly. The shape and configuration of each connecting bracket 2 can be customized as needed, resulting in a more compact and space-saving overall structure. The linked electric cylinder linear drive structure drives the connecting bracket 2, vacuum table mounting plate 3, and vacuum table 4 to move to the two modules, respectively.

[0033] Specifically, if Figure 2As shown, the linked electric cylinder linear drive structure of each wafer transfer assembly in this embodiment includes a primary transfer cylinder 5, a transfer cylinder connecting plate 6, and a secondary transfer cylinder 7. In this embodiment, all primary and secondary transfer cylinders 5 and 7 are commercially available servo cylinders, controlled by an external controller. This results in fast wafer transfer speeds between modules, high repeatability, and a low failure rate. Furthermore, the structure is simpler, space-saving, and effectively reduces production and assembly costs.

[0034] The housing of the primary transfer cylinder 5 of each wafer transfer assembly's linear drive mechanism serves as the fixed end of the mechanism, secured to the mounting base 1. The driving end of each primary transfer cylinder 5 is secured to the transfer cylinder connecting plate 6 of the same wafer transfer assembly's linear drive mechanism. The housing of each secondary transfer cylinder 7 is mounted on the connecting plate 6 of the same wafer transfer assembly's linear drive mechanism. The driving end of each secondary transfer cylinder 7 serves as the linear output end of the mechanism, secured to the connecting bracket 2 of the same wafer transfer assembly. The movements of the primary and secondary transfer cylinders 5 and 7 are controlled separately, thereby enabling the overall extension and retraction of the linear drive mechanism. The number of electric cylinder linkage settings of the linkage electric cylinder linear drive structure of each set of wafer transfer components can also be adjusted according to usage requirements.

[0035] In this embodiment, when the wafer transfer unit is working, by setting the transfer speed of each electric cylinder, the first-level transfer cylinder 5 drives the second-level transfer cylinder 7 through the transfer cylinder connecting plate 6. The second-level transfer cylinder 7 drives the connecting bracket 2, the vacuum adsorption table mounting plate 3, the vacuum adsorption table 4 and the adsorbed wafer to move back and forth relative to the outer shell of the first-level transfer cylinder 7 at twice the set speed, effectively improving the transfer speed.

[0036] Specifically, if Figure 4 and Figure 5 As shown, in this embodiment, the vacuum adsorption table mounting plates 3 of the wafer transfer assemblies are screwed to the top of the connecting brackets 2 of the same wafer transfer assembly group, allowing for easy assembly and disassembly. Four leveling screws 8 are also evenly distributed on the vacuum adsorption table mounting plates 3 of each wafer transfer assembly group for leveling the top of the connecting brackets 2 of the same wafer transfer assembly group. The placement of each leveling screw 8 can be based on existing technology. By rotating the leveling screws 8, the vacuum adsorption table mounting plates 3 can be ensured to be level on the top of the connecting brackets 2, further ensuring stable and accurate wafer transfer during equipment operation.

[0037] Specifically, if Figure 1 、 Figure 2 、 Figure 4 and Figure 5 As shown, in this embodiment, two drag chain mounting brackets 9 are mounted on the mounting base 1, and a drag chain mounting plate 10 is also provided on the side of the connecting bracket 2 of each wafer transfer assembly. The arrangement of the drag chain mounting brackets 9 and the drag chain mounting plates 10 facilitates the installation of drag chains with cables or pipes, making the overall structure neat and compact.

[0038] Specifically, if Figure 1 、 Figure 3 、 Figure 6 and Figure 7 As shown, in this embodiment, the vacuum adsorption table 4 of each group of wafer conveying components is respectively installed on the vacuum adsorption table mounting plate 3 of the same group of wafer conveying components by screws, which is convenient for assembly and disassembly. The lower part of the vacuum adsorption table 4 of each group of wafer conveying components is connected to an air path connection joint 11 for vacuuming the vacuum adsorption table 4. The air path connection joint 11 is connected to the vacuum extraction channel inside the vacuum adsorption table 4, and the connection structure between the air path connection joint 11 and the vacuum adsorption table 4 also adopts the existing technology. The air path connection joint 11 of the vacuum adsorption table 4 of each group of wafer conveying components is connected to one end of a corresponding filter 12 through a pipeline, and the other end of each filter 12 is connected to a solenoid valve 13 through a pipeline. Each solenoid valve 13 is connected to an external vacuum source through a pipeline. All filters 12 and all solenoid valves 13 are arranged on an air path component mounting seat 14, and the air path component mounting seat 14 is installed below the mounting substrate 1. The other end of each filter 12 is connected to the corresponding solenoid valve 13 on the pipeline, which is also connected to a vacuum gauge 15. Each vacuum gauge 15 is also set on the gas path component mounting seat 14 to detect the vacuum value when the wafer is adsorbed, so as to check whether the pipeline is normal. The gas path component mounting seat 14 is also provided with a number of aviation plugs, quick-connect connectors, etc. for pipeline connection. In this embodiment, the filter 12 is a commercially available product. The filter 12 is used to filter the extracted gas to protect the subsequent gas path components; each solenoid valve 13 is a commercially available electromagnetic three-way valve, which is respectively connected to an external controller to control the on and off of each location, so as to control whether the vacuum adsorption platform 4 at each location is adsorbed. The vacuum adsorption platform mounting plate 3 of each group of wafer transfer components is provided with an air path connection joint through-hole 301 for the air path connection joint 11 connected to the corresponding vacuum adsorption platform 4 to pass through, which also facilitates the connection of the air path connection joint 11 with the pipeline.

[0039] like Figure 4As shown, in this embodiment, the upper vacuum adsorption table mounting plate 3 of one set of wafer transfer assemblies is provided with a pipe routing groove 302 that connects to the gas connection joint through-hole 301 on the vacuum adsorption table mounting plate 3. A pipe cover 16 is also screwed onto the vacuum adsorption table mounting plate 3 with the pipe routing groove 302 to cover the pipe routing groove 302. The pipe routing groove 302 is used to pass through and accommodate a pipe that extends to the gas connection joint through-hole 301 and connects to the gas connection joint 11. The pipe cover 16 can also cover the pipe in the pipe routing groove 302 to secure the pipe, making the overall structure neat and compact.

Claims

1. An inter-module wafer transfer unit, characterized in that: It comprises a mounting base plate (1) and a plurality of wafer transfer components; Each group of wafer transfer components includes a linkage electric cylinder linear drive structure, a connecting bracket (2), a vacuum adsorption table mounting plate (3), and a vacuum adsorption table (4); The linear drive structure of the linked electric cylinder of each group of wafer transfer components has a fixed end and a linear output end. The fixed end of the linear drive structure of the linked electric cylinder of each group of wafer transfer components is respectively fixed to the mounting base plate (1). The linear output end of the linear drive structure of the linked electric cylinder of each group of wafer transfer components is respectively fixed to the connecting bracket (2) of the same group of wafer transfer components. The vacuum adsorption table mounting plate (3) of each group of wafer transfer components is respectively mounted on the connecting bracket (2) of the same group of wafer transfer components. The vacuum adsorption table (4) of each group of wafer transfer components is respectively mounted on the vacuum adsorption table mounting plate (3) of the same group of wafer transfer components. The top surface of the vacuum adsorption table (4) of each group of wafer transfer components is used for directly adsorbing wafers.

2. The inter-module wafer transfer unit according to claim 1, characterized in that: The moving directions of the linear output ends of the linear drive structures of the linked electric cylinders of each group of wafer transfer assemblies are parallel to each other.

3. The inter-module wafer transfer unit according to claim 1, wherein: The wafer transfer components are provided in two groups, wherein the vacuum adsorption table mounting plate (3) of the wafer transfer components in one group is located above the vacuum adsorption table mounting plate (3) of the wafer transfer components in the other group.

4. The inter-module wafer transfer unit according to claim 1, wherein: The linked electric cylinder linear drive structure of each group of wafer transfer components comprises a first-stage transfer electric cylinder (5), a transfer electric cylinder connecting plate (6), and a second-stage transfer electric cylinder (7); The outer shell of the first-stage transmission electric cylinder (5) of the linkage electric cylinder linear drive structure of each group of wafer transfer components is respectively fixed to the mounting base plate (1) as the fixed end of the linkage electric cylinder linear drive structure of the wafer transfer components of the group; the driving end of the first-stage transmission electric cylinder (5) of the linkage electric cylinder linear drive structure of each group of wafer transfer components is respectively fixed to the transmission electric cylinder connecting plate (6) of the linkage electric cylinder linear drive structure of the same group of wafer transfer components; the outer shell of the second-stage transmission electric cylinder (7) of the linkage electric cylinder linear drive structure of each group of wafer transfer components is respectively installed on the transmission electric cylinder connecting plate (6) of the linkage electric cylinder linear drive structure of the same group of wafer transfer components; the driving end of the second-stage transmission electric cylinder (7) of the linkage electric cylinder linear drive structure of each group of wafer transfer components is respectively fixed to the connecting bracket (2) of the same group of wafer transfer components as the linear output end of the linkage electric cylinder linear drive structure of the wafer transfer components of the group.

5. The inter-module wafer transfer unit according to claim 1, wherein: The vacuum adsorption table mounting plate (3) of each group of wafer conveying components is respectively mounted on the top of the connecting bracket (2) of the same group of wafer conveying components by screws.

6. The inter-module wafer transfer unit according to claim 5, characterized in that: A plurality of leveling screws (8) for leveling the top of the connection bracket (2) of the wafer transfer assembly in the same group are evenly provided on the vacuum adsorption table mounting plate (3) of each group of wafer transfer assemblies.

7. The inter-module wafer transfer unit according to claim 1, wherein: A drag chain fixing frame (9) is installed on the installation base plate (1), and a drag chain fixing plate (10) is also provided on the side of the connection bracket (2) of each group of wafer transfer assemblies.

8. The inter-module wafer transfer unit according to claim 1, wherein: The vacuum adsorption table (4) of each group of wafer conveying components is respectively mounted on the vacuum adsorption table mounting plate (3) of the same group of wafer conveying components via screws.

9. The inter-module wafer transfer unit according to claim 1, wherein: The lower part of the vacuum adsorption table (4) of each group of wafer conveying components is connected to an air path connection joint (11) for vacuuming the vacuum adsorption table (4), and the air path connection joint (11) of the vacuum adsorption table (4) of each group of wafer conveying components is connected to one end of a corresponding filter (12) through a pipeline, and the other end of each filter (12) is connected to a corresponding solenoid valve (13) through a pipeline, and each solenoid valve (13) is connected to an external vacuum source through a pipeline, and all the filters (12) and all the solenoid valves (13) are arranged on an air path element mounting seat (14), and the air path element mounting seat (14) is installed below the mounting substrate (1), and an air path connection joint through-hole (301) for the air path connection joint (11) connected to the corresponding vacuum adsorption table (4) to pass through is opened on the vacuum adsorption table mounting plate (3) of each group of wafer conveying components.

10. The inter-module wafer transfer unit according to claim 9, characterized in that: A pipe-laying groove (302) connected to a gas connection joint through-hole (301) on the vacuum adsorption table mounting plate (3) is provided on the vacuum adsorption table mounting plate (3) of at least one group of the wafer transfer assemblies; and a pipe cover plate (16) for covering the pipe-laying groove (302) is also provided on the vacuum adsorption table mounting plate (3) provided with the pipe-laying groove (302).

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