Chip transfer device and chip feeding equipment
By designing an automated chip transfer device, the automated transfer of wafer chips is achieved, solving the problems of contamination and damage caused by manual operation, improving production efficiency and reducing costs.
Patent Information
- Application Number
- CN202422841448.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2034-11-21
AI Technical Summary
In the existing technology, the chip transfer process on the wafer relies on manual operation, resulting in high risk of chip contamination and damage, high labor costs and low production efficiency.
A chip transfer device is designed, including a frame, a workbench, a picking and flipping mechanism, and a transfer mechanism. The automated picking and flipping components and transfer components are used to realize the automated transfer of wafer chips. The wafer is fixed by a clamping component, and the chip is lifted by a pin component. The imaging unit is used for precise positioning to realize accurate picking and transfer of the chip.
It effectively reduces the risk of chip contamination and damage, improves chip transfer efficiency and production efficiency, and reduces labor costs.
Smart Images
Figure CN223390526U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chip technology, and in particular to a chip transfer device and a chip loading equipment. Background Art
[0002] Wafers are a common form of chip in the semiconductor packaging and testing industry and are the most common semiconductor material. Chips are typically attached to a blue film carrier, which is then attached to a wafer ring. Wafers generally come in 6-inch, 8-inch, and 12-inch sizes. Currently, 8-inch wafers are the most common, but 12-inch wafers are also becoming increasingly common.
[0003] Currently, manual operation is often used when transferring chips on wafers. Workers are required to manually remove the chips and transfer them to a tray, and then manually place the chips one by one on a carrier as needed. The entire process uses manual operation and handling, resulting in a higher risk of chip contamination and damage, high labor costs, and low production efficiency. Utility Model Content
[0004] Based on this, the present application provides a chip transfer device and chip loading equipment, which can reduce the risk of chip contamination and damage, reduce labor costs, and improve chip production efficiency.
[0005] A chip transfer device, comprising:
[0006] frame;
[0007] A workbench, provided on the frame, for carrying and processing wafers;
[0008] The pick-up and flipping mechanism includes a first drive module and two pick-up and flipping assemblies. The first drive module is located on one side of the workbench along the first direction and is provided on the frame. The two pick-up and flipping assemblies are arranged in parallel and connected to the first drive module. The pick-up and flipping assemblies are used to pick up and drive the chips on the wafer to flip 180 degrees. The first drive module is used to drive the two pick-up and flipping assemblies to move alternately along the first direction.
[0009] The transfer mechanism includes two transfer components, which are located on both sides of the workbench along the second direction and are arranged on the frame; the two transfer components correspond to two pick-up and flip-over components, and each transfer component is used to receive and transfer the chips on the corresponding pick-up and flip-over component; the first direction intersects with the second direction.
[0010] In one embodiment, the workbench includes a clamping assembly and a ejector assembly; the clamping assembly is constructed as a hollow structure, and the clamping assembly is used to clamp and fix the wafer; the ejector assembly is located in the middle of the clamping assembly, and the ejector assembly is used to lift the chip on the wafer upward.
[0011] In one embodiment, the clamping assembly includes a cover, a pressing unit and a support seat, a clamping position for placing the wafer is formed between the cover and the support seat, and the pressing unit is used to drive the cover close to the support seat to expand the wafer.
[0012] In one embodiment, the ejector pin assembly includes an ejection module and a second drive module; the ejection module includes a cylinder and a plurality of push pins, the end of the cylinder is provided with a through hole and a vacuum hole, and a vacuum cavity is formed in the cylinder; the push pins can move up and down in the through hole; the second drive module is connected to the ejection module, and the second drive module is used to drive the ejection module to move along a third direction; the third direction is perpendicular to the first direction, and the third direction is perpendicular to the second direction.
[0013] In one embodiment, the workbench also includes a rotating component, a first movable component and a second movable component, the rotating component is used to drive the clamping component to rotate; the first movable component is used to drive the rotating component to move along the first direction; the second movable component is arranged on the frame, and the second movable component is used to drive the first movable component to move along the second direction.
[0014] In one embodiment, the chip transfer device further includes a first imaging unit, which is provided on the frame and located directly above the ejector assembly, and is used to obtain first position information of the chip on the wafer and the ejector assembly;
[0015] The rotating component can drive the clamping component to rotate according to the first position information; the first movable component can drive the rotating component to move along the first direction according to the first position information; the second movable component can drive the first movable component to move along the second direction according to the first position information, so that the chip on the wafer is moved to directly above the ejector pin component.
[0016] In one embodiment, each of the picking and flipping components includes an adsorption head, a flipping drive and a third drive module, the flipping drive is connected to the adsorption head, and the flipping drive is used to drive the adsorption head to flip 180°; the third drive module is connected to the flipping drive, and the third drive module is used to drive the flipping drive to move along a third direction; the third drive module of each of the picking and flipping components is connected to the first drive module; the third direction is perpendicular to the first direction, and the third direction is perpendicular to the second direction.
[0017] In one embodiment, each of the transfer components includes a linear rotation execution module, a fourth drive module and a fifth drive module; the linear rotation execution module is used to pick up the chip and can drive the chip to rotate and move along the third direction; the fourth drive module is used to drive the linear rotation execution module to move along the first direction; the fifth drive module is arranged on the frame, and the fifth drive module is used to drive the fourth drive module to move along the second direction; the third direction is parallel to the first direction, and the third direction is perpendicular to the second direction.
[0018] In one embodiment, the chip transfer device further includes a second imaging unit, which is disposed on the frame; the second imaging unit is configured to obtain second position information of the chip received by the transfer assembly relative to the nozzle center of the linear rotation execution module;
[0019] The linear rotation execution module is capable of driving the chip to rotate according to the second position information; the fourth driving module is capable of driving the linear rotation execution module to move along the first direction according to the second position information; and the fifth driving module is capable of driving the fourth driving module to move along the second direction according to the second position information, so as to compensate for the position deviation of the chip relative to the center of the nozzle on the linear rotation execution module;
[0020] The second imaging unit is further used to perform appearance inspection on the chip received by the transfer assembly.
[0021] A chip loading device comprises the chip transfer device in any of the above embodiments.
[0022] The above-mentioned chip transfer device includes a workbench, a picking and flipping mechanism and a transfer mechanism arranged on a frame. The picking and flipping mechanism includes two picking and flipping components and a first driving module for driving the two picking and flipping components to move alternately along a first direction. The transfer mechanism includes two transfer components corresponding to the two picking and flipping components one by one. When transferring the chips of the wafer on the workbench, the first driving module drives the two picking and flipping components to move alternately along the first direction. The two picking and flipping components alternately pick up the chips on the wafer. The two transfer components respectively undertake and transfer the chips on the corresponding picking and flipping components, thereby realizing the automatic transfer of chips on the wafer, greatly reducing the risk of chip contamination and damage, effectively improving the efficiency of chip transfer, and effectively improving chip production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 A schematic structural diagram of a chip transfer device provided in some embodiments of the present application.
[0024] Figure 2 A schematic structural diagram of a workbench in a chip transfer device provided in some embodiments of the present application.
[0025] Figure 3 A schematic structural diagram of the ejector pin assembly in the chip transfer device provided in some embodiments of the present application.
[0026] Figure 4 A schematic structural diagram of the pick-up and flipping mechanism in the chip transfer device provided in some embodiments of the present application.
[0027] Figure 5 A schematic structural diagram of a transfer mechanism in a chip transfer device provided in some embodiments of the present application.
[0028] Figure 6 This is a schematic structural diagram of the first imaging unit in the chip transfer device provided in some embodiments of the present application.
[0029] Figure 7 This is a schematic structural diagram of the second imaging unit in the chip transfer device provided in some embodiments of the present application.
[0030] Figure 8 A schematic structural diagram of a wafer provided in some embodiments of the present application.
[0031] Description of reference numerals:
[0032] 10. Chip transfer device; 11. Rack; 12. Workbench; 121. Clamping assembly; 1211. Cover; 1211a. Connecting plate; 1211b. Pressing plate; 1211c. Window; 1211d. Avoidance; 1212. Pressing unit; 1213. Support seat; 122. Ejector pin assembly; 1221. Ejection module; 1221a. Cylinder; 1222. Second drive module; 123. Rotating assembly; 124. First moving assembly; 1241. First guide rail assembly; 1242. First drive member; 125. Second Moving assembly; 1251, second guide rail assembly; 1252, second driving member; 13, first imaging unit; 14, pickup and flipping mechanism; 141, first driving module; 142, pickup and flipping assembly; 1421, adsorption head; 1422, flipping driving member; 1423, third driving module; 15, transfer mechanism; 151, transfer assembly; 1511, linear rotation execution module; 1512, fourth driving module; 1513, fifth driving module; 16, second imaging unit; X, first direction; Y, second direction; Z, third direction;
[0033] 20. Wafer; 21. Film; 22. Chip. DETAILED DESCRIPTION
[0034] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.
[0035] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.
[0036] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.
[0037] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.
[0038] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.
[0039] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.
[0040] See also Figure 1The embodiment of the first aspect of the present application provides a chip transfer device 10, comprising a frame 11, a workbench 12, a pick-up and flipping mechanism 14, and a transfer mechanism 15; the workbench 12 is provided on the frame 11, and the workbench 12 is used to carry and process the wafer 20; the pick-up and flipping mechanism 14 comprises a first driving module 141 and two pick-up and flipping components 142, the first driving module 141 is located on one side of the workbench 12 along the first direction X and is provided on the frame 11; the two pick-up and flipping components 142 are arranged in parallel and connected to the first driving module 141; the pick-up and flipping components 142 are arranged in parallel and connected to the first driving module 141; 42 is used to pick up and drive the chip 22 on the wafer 20 to flip 180°; the first driving module 141 is used to drive the two picking and flipping components 142 to move alternately along the first direction X; the transfer mechanism 15 includes two transfer components 151, and the two transfer components 151 are located on both sides of the workbench 12 along the second direction Y and are arranged on the frame 11; the two transfer components 151 correspond to the two picking and flipping components 142, and each transfer component 151 is used to receive and transfer the chip 22 on the corresponding picking and flipping component 142; the first direction X intersects with the second direction Y.
[0041] The chip transfer device 10 provided in the embodiment of the present application includes a workbench 12, a picking and flipping mechanism 14 and a transfer mechanism 15 arranged on a frame 11. The picking and flipping mechanism 14 includes two picking and flipping components 142 and a first driving module 141 for driving the two picking and flipping components 142 to move alternately along a first direction X. The transfer mechanism 15 includes two transfer components 151 corresponding to the two picking and flipping components 142. When the chip 22 of the wafer 20 on the workbench 12 is transferred, the first driving module 141 drives the two picking and flipping components 142 to move alternately along the first direction X. The two picking and flipping components 142 alternately pick up the chips 22 on the wafer 20. The two transfer components 151 respectively undertake and transfer the chips 22 on the corresponding picking and flipping components 142, thereby realizing the automatic transfer of the chips 22 on the wafer 20, greatly reducing the risk of contamination and damage of the chips 22, effectively improving the efficiency of chip 22 transfer, and effectively improving the chip 22 production efficiency.
[0042] It should be noted that, see Figure 8 The wafer 20 includes a film 21 and a plurality of chips 22 adhered to the film 21 . The plurality of chips 22 can be arranged at intervals in a first direction X and a second direction Y, and the chips 22 can be substantially rectangular.
[0043] In one embodiment, see Figure 2 The workbench 12 includes a clamping assembly 121 and a pin assembly 122; the clamping assembly 121 is constructed as a hollow structure, and the clamping assembly 121 is used to clamp and fix the wafer 20; the pin assembly 122 is located in the middle of the clamping assembly 121, and the pin assembly 122 is used to lift the chip 22 on the wafer 20 upward.
[0044] In this way, when transferring the chip 22 on the wafer 20, the clamping assembly 121 can be used to support and fix the wafer 20, and the ejector assembly 122 can lift the chip 22 on the wafer 20 upward, so that the lifted chip 22 is higher than the nearby non-lifted chip 22, so that the picking-up flip assembly 142 can take away the lifted chip 22, which is beneficial to improve the transfer efficiency of the chip 22 and improve the production efficiency of the chip 22.
[0045] In one embodiment, see Figure 2 The clamping assembly 121 includes a cover 1211, a pressing unit 1212 and a support seat 1213. A clamping position for placing the wafer 20 is formed between the cover 1211 and the support seat 1213. The pressing unit 1212 is used to drive the cover 1211 close to the support seat 1213 to expand the wafer 20.
[0046] In this way, by providing the cover 1211 , the pressing unit 1212 and the support base 1213 , the wafer 20 can be easily fixed and expanded, so that the chips 22 on the wafer 20 can be peeled off and transferred.
[0047] It should be noted that, see Figure 2 The cover 1211 includes a connecting plate 1211a and a pressing plate 1211b. A gap is formed between the pressing plate 1211b and the connecting plate 1211a, through which the wafer 20 can enter the clamping position. A window 1211c is formed in the middle of the pressing plate 1211b, through which the chip 22 can be exposed. The pressing plate 1211b also has an escape opening 1211d connected to the window 1211c to allow the clamping jaw assembly that clamps the wafer 20 to pass through.
[0048] In one embodiment, see Figure 3 The ejector assembly 122 includes an ejection module 1221 and a second driving module 1222; the ejection module 1221 includes a cylinder 1221a and a plurality of push pins (not shown in the figure), the end of the cylinder 1221a is provided with a through hole (not shown in the figure) and a vacuum hole (not shown in the figure), and a vacuum cavity (not shown in the figure) is formed in the cylinder 1221a; the push pins can move up and down in the through hole; the second driving module 1222 is connected to the ejection module 1221, and the second driving module 1222 is used to drive the ejection module 1221 to move along the third direction Z; the third direction Z is perpendicular to the first direction X, and the third direction Z is perpendicular to the second direction Y.
[0049] In this way, when the picking-up flipping component 142 reaches above the lifted chip 22, the second driving module 1222 drives the pushing module 1221 to move upward a certain distance, and multiple push pins move upward along the through hole to lift the chip 22. At the same time, the vacuum cavity in the cylinder 1221a forms a negative pressure at the vacuum hole, so that the vacuum hole can produce an adsorption effect on the film 21 of the wafer 20, prompting the chip 22 to be peeled off from the film 21, so that the picking-up flipping component 142 can easily pick up the chip 22.
[0050] In one embodiment, see Figure 2 The workbench 12 also includes a rotating assembly 123, a first movable assembly 124 and a second movable assembly 125. The rotating assembly 123 is used to drive the clamping assembly 121 to rotate; the first movable assembly 124 is used to drive the rotating assembly 123 to move along the first direction X; the second movable assembly 125 is provided on the frame 11, and the second movable assembly 125 is used to drive the first movable assembly 124 to move along the second direction Y.
[0051] In this way, when transferring the chip 22 on the wafer 20, the first moving component 124 drives the rotating component 123 to move along the first direction X, and the second moving component 125 drives the first moving component 124 along the second direction Y, thereby driving the clamping component 121 to move along the first direction X and the second direction Y, so that the chips 22 on the wafer 20 are lifted up in turn, and the rotating component 123 drives the clamping component 121 to rotate, so that the wafer 20 fixed by the clamping component 121 can be rotated a certain angle, ensuring that each chip lifted by the ejector pin component 122 is placed neatly for subsequent picking up and transfer of the chip 22.
[0052] In one example, see Figure 2 The first moving component 124 includes a first guide rail component 1241 and a first driving component 1242. The first guide rail component 1241 is arranged along the first direction X. The clamping component 121 is slidably set on the first guide rail component 1241. The first driving component 1242 is used to drive the rotating component 123 to move along the first guide rail component 1241; the first driving component 1242 includes a linear motor.
[0053] In one example, see Figure 2 The second moving component 125 includes a second guide rail component 1251 and a second driving component 1252. The second guide rail component 1251 is arranged along the second direction Y. The first guide rail component 1241 is slidably arranged on the second guide rail component 1251. The fifth driving component is used to drive the first guide rail component 1241 to move along the second guide rail component 1251. The second driving component 1252 includes a linear motor.
[0054] In one embodiment, see Figure 1 and Figure 6The chip transfer device 10 also includes a first imaging unit 13, which is provided on the frame 11 and is located directly above the ejector assembly 122. The first imaging unit 13 is used to obtain first position information of the chip 22 on the wafer 20 and the ejector assembly 122; the rotating assembly 123 can drive the clamping assembly 121 to rotate according to the first position information; the first moving assembly 124 can drive the rotating assembly 123 to move along the first direction X according to the first position information; the second moving assembly 125 can drive the first moving assembly 124 to move along the second direction Y according to the first position information, so that the chip 22 on the wafer 20 is moved directly above the ejector assembly 122.
[0055] In this way, by setting the first imaging unit 13, the first position information of the chip 22 and the ejector assembly 122 on the wafer 20 obtained by the first imaging unit 13 can provide data support for the rotating assembly 123, the first moving assembly 124 and the second moving assembly 125, thereby ensuring that each chip 22 on the wafer 20 can be accurately moved to directly above the ejector assembly 122, so that each chip 22 on the wafer 20 can be lifted up, thereby facilitating the picking and transfer of the chip 22, which is beneficial to improving the transfer efficiency of the chip 22.
[0056] In one embodiment, see Figure 4 Each picking and flipping component 142 includes an adsorption head 1421, a flipping drive 1422 and a third driving module 1423. The flipping drive 1422 is connected to the adsorption head 1421, and the flipping drive 1422 is used to drive the adsorption head 1421 to flip 180°; the third driving module 1423 is connected to the flipping drive 1422, and the third driving module 1423 is used to drive the flipping drive 1422 to move along the third direction Z; the third driving module 1423 of each picking and flipping component 142 is connected to the first driving module 141; the third direction Z is perpendicular to the first direction X, and the third direction Z is perpendicular to the second direction Y.
[0057] In this way, the picking and flipping component 142 can pick up the chip 22 on the wafer 20 by adsorption through the adsorption head 1421, and drive the adsorption head 1421 to flip 180° through the flipping driving component 1422, so that the chip 22 on the adsorption head 1421 is set upward, so that the corresponding transfer component 151 picks up the chip 22; the flipping driving component 1422 is driven by the third driving module 1423 to move along the third direction Z, which can drive the adsorption head 1421 to move along the third direction Z, so that the adsorption head 1421 picks up the chip 22, and can keep the adsorption head 1421 at a certain height after picking up the chip 22, so as to avoid the adsorption head 1421 colliding with other components when the picking and flipping component 142 moves along the first direction X.
[0058] In one embodiment, see Figure 5Each transfer component 151 includes a linear rotation execution module 1511, a fourth drive module 1512 and a fifth drive module 1513; the linear rotation execution module 1511 is used to pick up the chip 22 and can drive the chip 22 to rotate and move along the third direction Z; the fourth drive module 1512 is used to drive the linear rotation execution module 1511 to move along the first direction X; the fifth drive module 1513 is arranged on the frame 11, and the fifth drive module 1513 is used to drive the fourth drive module 1512 to move along the second direction Y; the third direction Z is perpendicular to the first direction X, and the third direction Z is perpendicular to the second direction Y.
[0059] In this way, when the transfer component 151 receives and transfers the chip 22 on the corresponding picking and flipping component 142, the fourth driving module 1512 and the fourth driving module 1512 drive the linear rotation execution module 1511 to move along the first direction X and the second direction Y respectively, so that the linear rotation execution module 1511 moves to above the picking and flipping component 142, so that the linear rotation execution module 1511 docks with the adsorption head 1421 of the picking and flipping component 142 and picks up the chip 22.
[0060] It should be noted that the linear rotation execution module 1511, also known as the ZR module, includes a suction nozzle, an encoder, a vacuum pipeline, a built-in guide rail, a voice coil motor and a servo motor. The voice coil motor controls the suction nozzle to move along the third direction ZZ (that is, the Z-axis direction), and the servo motor controls the rotational movement of the suction nozzle.
[0061] In one embodiment, see Figure 1 and Figure 7 The chip transfer device 10 also includes a second imaging unit 16, which is arranged on the frame 11; the second imaging unit 16 is used to obtain the second position information of the chip 22 undertaken by the transfer component 151 relative to the nozzle center of the linear rotation execution module 1511; the linear rotation execution module 1511 can drive the chip 22 to rotate according to the second position information; the fourth driving module 1512 can drive the linear rotation execution module 1511 to move along the first direction X according to the second position information, and the fifth driving module 1513 can drive the fourth driving module 1512 to move along the second direction Y according to the second position information to compensate for the position deviation of the chip 22 relative to the nozzle center on the linear rotation execution module 1511; the second imaging unit 16 is also used to perform appearance inspection on the chip 22 undertaken by the transfer component 151.
[0062] In this way, before transferring chip 22 to the next workstation, the second imaging unit 16 can be used to obtain the second position information of chip 22 received by transfer assembly 151 relative to the nozzle center of linear rotation execution module 1511, so that linear rotation execution module 1511 can drive chip 22 to rotate according to the second position information, the fourth drive module 1512 drives linear rotation execution module 1511 to move in the first direction X according to the second position information, and the fifth drive module 1513 drives the fourth drive module 1512 to move in the second direction Y according to the second position information. This can compensate for the positional deviation and angular deviation of chip 22 relative to the nozzle center on linear rotation execution module 1511, realize the position calibration of chip 22, and enable chip 22 to be accurately transferred to the next workstation. In addition, the second imaging unit 16 can be used to perform appearance inspection of chip 22, timely eliminate problematic chips 22, and help improve the yield rate.
[0063] The second embodiment of the present application provides a chip loading device, comprising the chip transfer device of any of the above embodiments, so as to improve chip loading efficiency and chip production efficiency.
[0064] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0065] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.
Claims
1. A chip transfer device, characterized in that: include: frame; A workbench, provided on the frame, for carrying and processing wafers; The pick-up and flipping mechanism includes a first drive module and two pick-up and flipping assemblies. The first drive module is located on one side of the workbench along the first direction and is provided on the frame. The two pick-up and flipping assemblies are arranged in parallel and connected to the first drive module. The pick-up and flipping assemblies are used to pick up and drive the chips on the wafer to flip 180 degrees. The first drive module is used to drive the two pick-up and flipping assemblies to move alternately along the first direction. The transfer mechanism includes two transfer components, which are located on both sides of the workbench along the second direction and are arranged on the frame; the two transfer components correspond one-to-one to the two pick-up and flip-over components, and each transfer component is used to receive and transfer the chips on the corresponding pick-up and flip-over component; the first direction intersects with the second direction.
2. The chip transfer device according to claim 1, wherein: The workbench includes a clamping assembly and a ejector assembly; the clamping assembly is constructed as a hollow structure, and the clamping assembly is used to clamp and fix the wafer; the ejector assembly is located in the middle of the clamping assembly, and the ejector assembly is used to lift the chip on the wafer upward.
3. The chip transfer device according to claim 2, characterized in that: The clamping assembly includes a cover, a pressing unit and a support seat. A clamping position for placing the wafer is formed between the cover and the support seat. The pressing unit is used to drive the cover close to the support seat to expand the wafer.
4. The chip transfer device according to claim 2, wherein: The ejector assembly includes an ejection module and a second drive module; the ejection module includes a cylinder and a plurality of ejector pins, the end of the cylinder is provided with a through hole and a vacuum hole, and a vacuum cavity is formed in the cylinder; the ejector pins can move up and down in the through hole; the second drive module is connected to the ejection module, and the second drive module is used to drive the ejection module to move along a third direction; the third direction is perpendicular to the first direction, and the third direction is perpendicular to the second direction.
5. The chip transfer device according to claim 2, wherein: The workbench also includes a rotating assembly, a first moving assembly and a second moving assembly, the rotating assembly is used to drive the clamping assembly to rotate; the first moving assembly is used to drive the rotating assembly to move along the first direction; the second moving assembly is arranged on the frame, and the second moving assembly is used to drive the first moving assembly to move along the second direction.
6. The chip transfer device according to claim 5, characterized in that: The chip transfer device further includes a first imaging unit, which is provided on the frame and located directly above the ejector assembly, and is used to obtain first position information of the chip on the wafer and the ejector assembly; The rotating component can drive the clamping component to rotate according to the first position information; the first movable component can drive the rotating component to move along the first direction according to the first position information; the second movable component can drive the first movable component to move along the second direction according to the first position information, so that the chip on the wafer is moved to directly above the ejector pin component.
7. The chip transfer device according to claim 1, wherein: Each of the pick-up and flipping components includes an adsorption head, a flipping drive member, and a third drive module. The flipping drive member is connected to the adsorption head and is used to drive the adsorption head to flip 180 degrees. The third drive module is connected to the flipping drive member and is used to drive the flipping drive member to move along a third direction. The third drive module of each of the pick-up and flipping components is connected to the first drive module. The third direction is perpendicular to the first direction, and the third direction is perpendicular to the second direction.
8. The chip transfer device according to claim 1, wherein: Each of the transfer components includes a linear rotation execution module, a fourth drive module and a fifth drive module; the linear rotation execution module is used to pick up the chip and can drive the chip to rotate and move along the third direction; the fourth drive module is used to drive the linear rotation execution module to move along the first direction; the fifth drive module is arranged on the frame, and the fifth drive module is used to drive the fourth drive module to move along the second direction; the third direction is parallel to the first direction, and the third direction is perpendicular to the second direction.
9. The chip transfer device according to claim 8, characterized in that: The chip transfer device further includes a second imaging unit, which is disposed on the frame; the second imaging unit is used to obtain second position information of the chip received by the transfer assembly relative to the nozzle center of the linear rotation execution module; The linear rotation execution module is capable of driving the chip to rotate according to the second position information; the fourth driving module is capable of driving the linear rotation execution module to move along the first direction according to the second position information; and the fifth driving module is capable of driving the fourth driving module to move along the second direction according to the second position information, so as to compensate for the position deviation of the chip relative to the center of the nozzle on the linear rotation execution module; The second imaging unit is further used to perform appearance inspection on the chip received by the transfer assembly.
10. A chip loading device, characterized in that: A chip transfer device comprising the chip transfer device according to any one of claims 1 to 9.