Heat dissipation packaging structure

Abstract

The utility model belongs to the technical field of chip packaging, and discloses a heat dissipation packaging structure, which comprises a frame, a first chip, a second chip, a flexible bonding belt and a plastic package body, and is characterized in that the frame comprises a plurality of conductor bases; the first chip and the second chip are respectively arranged on different conductor bases; the flexible bonding belt is connected with the first chip and the second chip, a first heat dissipation block is attached to the side, away from the first chip, of the flexible bonding belt, and a second heat dissipation block is attached to the side, away from the second chip, of the flexible bonding belt. The end face of the side, away from the flexible bonding belt, of the first heat dissipation block and the end face of the side, away from the flexible bonding belt, of the second heat dissipation block are flush and both exposed out of the plastic package body. The first chip and the second chip are connected through the flexible bonding belt, the height difference of the chips does not need to be considered, design and processing are facilitated, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a heat dissipation packaging structure. Background Art

[0002] Currently, the CLIP process (3D-printed continuous liquid interface curing technology) is commonly used in chip packaging. For packaging objects with two different chips mixed together, due to the inconsistent thickness of the two chips, the CLIP process needs to ensure that the height of the two chips is consistent as much as possible, and the glue thickness on the upper and lower sides of the chips is consistent. Otherwise, due to the height difference between the left and right chips, problems such as uneven force and chip cracks will occur when installing the CLIP layer. Severe problems may also lead to cold solder joints and collapse of the packaging structure. In order to ensure the height consistency of the two chips, the underlying frame of the packaging structure needs to be specially designed, and the glue thickness on both sides of the two chips needs to be precisely controlled. This makes the packaging structure complex and inconvenient to process. It is also inconvenient to install and fix the subsequent heat sink, affecting the heat dissipation efficiency. Utility Model Content

[0003] The purpose of the utility model is to provide a heat dissipation packaging structure, which does not need to consider the height difference of the chip, is convenient for design and processing, and improves the heat dissipation efficiency.

[0004] To achieve this purpose, the present invention adopts the following technical solutions: a heat dissipation packaging structure, including a frame, a first chip, a second chip, a flexible bonding tape and a plastic package, the frame including a plurality of conductor bases arranged at intervals, the bottom of the conductor bases being connected with pins; the first chip and the second chip are respectively installed on different conductor bases; the flexible bonding tape is arranged across the top of the frame and is respectively connected to the first chip, the second chip and the conductor bases where the first chip and the second chip are not arranged, the side of the flexible bonding tape facing away from the first chip is provided with a first heat dissipation block, and the side of the flexible bonding tape facing away from the second chip is provided with a second heat dissipation block; the plastic package covers the frame, the first chip, the second chip, the flexible bonding tape, the first heat dissipation block and the second heat dissipation block, and the end faces of the first heat dissipation block facing away from the flexible bonding tape and the side of the second heat dissipation block facing away from the flexible bonding tape are flush and both are exposed to the plastic package.

[0005] Preferably, the flexible bonding tape has a flat first connecting portion and a flat second connecting portion, the first connecting portion is bonded to and fixedly connected with the first chip, and the second connecting portion is bonded to and fixedly connected with the second chip.

[0006] Preferably, the first chip is fixed to the first connecting portion by friction welding.

[0007] Preferably, the first heat dissipation block is fixed to the first connection portion and the first chip around the first connection portion by soldering with solder paste.

[0008] Preferably, the outer edge of the solder paste is chamfered.

[0009] Preferably, the outer peripheral wall of the conductor base is provided with a concave and convex locking portion, the locking portion between two adjacent conductor bases forms a labyrinth channel, and the plastic package body fills the labyrinth channel.

[0010] Preferably, a polished surface is provided on the top of the plastic package body, and the polished surface is flush with an end surface of the first heat dissipation block on a side facing away from the flexible bonding tape.

[0011] Preferably, portions of the first heat dissipation block and the second heat dissipation block exposed from the plastic package body are covered with a protective layer.

[0012] Preferably, the pins are configured as QFN package pins.

[0013] Preferably, the flexible bonding tape is configured as an aluminum tape or an aluminum-clad copper tape.

[0014] The beneficial effects of the present invention are as follows: the first chip and the second chip are connected by a flexible bonding tape, and the flexible bonding tape can absorb the height difference between the first chip and the second chip, so that multiple conductor bases can adopt a universal design, and there is no need to consider the height difference between the first chip and the second chip and the difference in glue thickness on both sides, which facilitates design and processing and reduces the cost of frame design. In addition, the first heat dissipation block and the second heat dissipation block can be designed with different heights, thereby compensating for the height difference between the first chip and the second chip, so that the first heat dissipation block and the second heat dissipation block can be exposed to the plastic package at the same time, reducing the pressure on the first chip and the second chip, realizing double-sided heat dissipation, and improving heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the heat dissipation packaging structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the connection of the flexible bonding tape of the present utility model;

[0017] Figure 3 This is a schematic structural diagram of the heat dissipation packaging structure of the present invention when it is not encapsulated;

[0018] Figure 4 yes Figure 3 Enlarged view of point A in the middle;

[0019] Figure 5 This is a schematic diagram of the heat dissipation packaging structure of the utility model after encapsulation;

[0020] Figure 6 It is a schematic structural diagram of the heat dissipation packaging structure of the present invention after polishing.

[0021] In the figure: 100, frame; 110, conductor base; 111, locking part; 112, maze channel; 120, pin; 200, first chip; 300, second chip; 400, flexible bonding tape; 410, first heat sink; 411, solder paste; 412, protective layer; 420, second heat sink; 430, first connecting part; 440, second connecting part; 450, third locking part; 500, plastic package; 510, polished surface. DETAILED DESCRIPTION

[0022] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0023] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0024] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0025] In the description of this embodiment, the terms "upper," "lower," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0026] Reference Figure 1 As shown, a heat dissipation packaging structure provided according to an embodiment of the present application includes a frame 100, a first chip 200, a second chip 300, a flexible bonding tape 400, and a plastic package 500. The frame 100 includes a plurality of spaced apart conductor bases 110, and the bottoms of the conductor bases 110 are connected to pins 120. Optionally, the conductor bases 110 are made of a metal or alloy with excellent electrical and thermal conductivity, such as pure copper, tin bronze, etc., which will not be described in detail here.

[0027] The first chip 200 and the second chip 300 are respectively mounted on different conductive bases 110. A flexible bonding tape 400 is arranged across the frame 100 and is respectively connected to the first chip 200, the second chip 300, and the conductive base 110 not provided with the first chip 200 and the second chip 300. A first heat sink 410 is attached to the side of the flexible bonding tape 400 facing away from the first chip 200, and a second heat sink 420 is attached to the side of the flexible bonding tape 400 facing away from the second chip 300. For example, the first chip 200 can be a face-up IGBT chip, and the second chip 300 can be a flip-up FRD chip.

[0028] The plastic package 500 is coated on the frame 100, the first chip 200, the second chip 300, the flexible bonding tape 400, the first heat sink 410, and the second heat sink 420. The end surfaces of the first heat sink 410 and the second heat sink 420 facing away from the flexible bonding tape 400 are flush and exposed to the plastic package 500. In other words, the frame 100, the first chip 200, the second chip 300, the flexible bonding tape 400, the first heat sink 410 and the second heat sink 420 are all coated inside the plastic package 500. The end surfaces of the first heat sink 410 facing away from the flexible bonding tape 400 and the second heat sink 420 facing away from the flexible bonding tape 400 are flush and exposed to the plastic package 500. Optionally, the first heat sink 410 and the second heat sink 420 are both configured as metal or alloy parts with high thermal conductivity, such as pure copper, etc., which will not be described in detail here.

[0029] It can be understood that since the flexible bonding tape 400 can be bent and deformed to a certain extent, the first chip 200 and the second chip 300 are connected through the flexible bonding tape 400. The flexible bonding tape 400 can absorb the height difference between the first chip 200 and the second chip 300, so that the multiple conductor bases 110 can adopt a universal design (that is, the multiple conductor bases 110 are equal in height), and there is no need to consider the height difference between the first chip 200 and the second chip 300 and the difference in glue thickness on both sides, which facilitates design and processing and reduces the design cost of the frame 100. In addition, the first heat dissipation block 410 and the second heat dissipation block 420 can be designed with different heights to compensate for the height difference between the first chip 200 and the second chip 300. On the premise of ensuring the flatness of the surface of the packaging structure, the first heat dissipation block 410 and the second heat dissipation block 420 can be exposed to the plastic package at the same time, reducing the pressure on the first chip 200 and the second chip 300. The first heat dissipation block 410, the second heat dissipation block 420 and the frame 100 cooperate to achieve double-sided heat dissipation, effectively improving the heat dissipation efficiency.

[0030] Furthermore, the portions of the first heat sink 410 and the second heat sink 420 exposed from the plastic package 500 are covered with a protective layer 412. Optionally, the protective layer 412 can be an antioxidant formed on the surfaces of the first heat sink 410 and the second heat sink 420 by electroplating, painting, or soldering.

[0031] By setting up the protective layer 412, the thickness of the protective layer 412 is relatively small. Under the premise of not affecting the heat dissipation of the first heat dissipation block 410 and the second heat dissipation block 420, the first heat dissipation block 410, the second heat dissipation block 420 and the water vapor impurities in the air can be isolated, thereby avoiding corrosion and oxidation of the first heat dissipation block 410 and the second heat dissipation block 420, and effectively extending the service life of the first heat dissipation block 410 and the second heat dissipation block 420.

[0032] Furthermore, the pin 120 is configured as a QFN package pin. The QFN (Quad Flat No-leads Package) package, that is, a square flat no-lead package, means that the pin 120 is set as an electrode contact located below the plastic package 500, and the projection of the pin 120 on the horizontal plane is located within the projection of the plastic package 500 on the horizontal plane, with no extension and no folded pin.

[0033] Configuring pin 120 as a QFN package pin can reduce the mounting area ratio of pin 120, lower the overall height of the heat dissipation package structure, reduce the weight of the heat dissipation package structure, and effectively enhance the electrical and thermal performance of the heat dissipation package structure.

[0034] Reference Figure 2As shown, it can be understood that the flexible bonding tape 400 has a flat first connecting portion 430 and a second connecting portion 440, the first connecting portion 430 is adhered to and fixedly connected to the first chip 200, and the first heat dissipation block 410 is adhered to the side of the first connecting portion 430 facing away from the first chip 200, the second connecting portion 440 is adhered to and fixedly connected to the second chip 300, and the second heat dissipation block 420 is adhered to the side of the second connecting portion 440 facing away from the second chip 300.

[0035] The first connection part 430 and the second connection part 440 are a planar structure formed by bending and pressing the flexible bonding tape 400. By setting the first connection part 430 and the second connection part 440, the contact area between the flexible bonding tape 400 and the first chip 200, the second chip 300, the first heat dissipation block 410 and the second heat dissipation block 420 can be effectively increased, further enhancing the electrical and thermal performance of the heat dissipation packaging structure.

[0036] Optionally, the flexible bonding tape 400 further includes a flat third locking portion 450, which is secured to the conductive base 110 without the first chip 200 or the second chip 300. The specific structure and effects of the third locking portion 450 are described above with reference to the first connecting portion 430 and are not further elaborated here.

[0037] The flexible bonding tape 400 is configured as an aluminum tape or an aluminum-clad copper tape.

[0038] The flexible bonding tape 400 is configured as an aluminum tape or an aluminum-clad copper tape, which reduces the layout cost of the flexible bonding tape 400 while ensuring the electrical and thermal conductivity of the flexible bonding tape 400 and facilitates mass production of heat dissipation packaging structures.

[0039] Furthermore, the first chip 200 is fixed to the first connection portion 430 by friction welding.

[0040] Friction welding secures the first chip 200 to the flexible bonding ribbon 400, allowing for molecular diffusion and recrystallization at the interface between the first chip 200 and the flexible bonding ribbon 400, thereby effectively improving the reliability and precision of the connection between the first chip 200 and the flexible bonding ribbon 400. Furthermore, friction welding can also be used to connect the second chip 300 and the second connecting portion 440, which will not be discussed further herein.

[0041] Reference Figure 3 and Figure 4As shown, it can be understood that the bottom surface of the first heat dissipation block 410 covers the first connection portion 430 and the first chip 200 around the first connection portion 430, and the first heat dissipation block 410 is soldered and fixed to the first connection portion 430 and the first chip 200 around the first connection portion 430 via solder paste 411. The bottom surface of the second heat dissipation block 420 covers the second connection portion 440 and the second chip 300 around the second connection portion 440, and the second heat dissipation block 420 is also soldered and fixed to the second connection portion 440 and the second chip 300 around the second connection portion 440 via solder paste 411.

[0042] Since the solder paste 411 itself has good thermal conductivity, the first heat dissipation block 410 is connected to the first connection part 430 and the first chip 200 around the first connection part 430 through the solder paste 411, thereby avoiding the first connection part 430 separating the first heat dissipation block 410 and the first chip 200, affecting the heat dissipation of the first chip 200, and further improving the heat dissipation efficiency of the heat dissipation packaging structure.

[0043] Furthermore, outer edges of the solder paste 411 at the bottom of the first heat dissipation block 410 and outer edges of the solder paste 411 at the bottom of the second heat dissipation block 420 are chamfered.

[0044] Chamfering the outer edges of solder paste 411 allows for better control of its flow and shape during soldering, locking it in place and preventing excessive buildup, bridging, and overflow defects. Furthermore, the chamfer spreads the solder paste 411 more evenly, reducing solder joint voids and improving solder joint reliability. Furthermore, the chamfer design reduces solder paste waste during the printing process, improving production efficiency.

[0045] Optionally, the first chip 200 and the conductor base 110 , and the second chip 300 and the conductor base 110 may also be fixed by soldering with solder paste 411 , which will not be described in detail here.

[0046] Reference Figure 3 and Figure 5 As shown, it can be understood that the outer peripheral wall of the conductor base 110 is provided with a concave and convex locking portion 111 , and the locking portion 111 between two adjacent conductor bases 110 forms a labyrinth channel 112 , and the plastic package body 500 fills the labyrinth channel 112 .

[0047] By setting the locking portion 111, during the injection molding process of the plastic package body 500, the concave portion of the locking portion 111 can be filled and the protruding portion of the locking portion 111 can be covered. At the same time, the labyrinth channel 112 between two adjacent conductor bases 110 can be filled, thereby locking the conductor base 110 and effectively improving the overall structural tightness of the heat dissipation packaging structure.

[0048] Reference Figure 1 and Figure 6As shown, it can be understood that a polished surface 510 is provided on the top of the plastic package body 500 , and the polished surface 510 is flush with the end surface of the first heat dissipation block 410 (or the second heat dissipation block 420 ) facing away from the flexible bonding tape 400 .

[0049] Because there is a certain height difference between the first chip 200 and the second chip 300 after assembly, a first heat sink 410 and a second heat sink 420 of different heights are required to compensate for the height difference between the first chip 200 and the second chip 300. By providing the polished surface 510, during the injection molding of the plastic package 500, it is no longer necessary to strictly control the height of the first heat sink 410 and the second heat sink 420. Instead, the top surface of the plastic package 500 can be polished after injection molding until the first heat sink 410 and the second heat sink 420 are exposed outside the plastic package 500. This effectively reduces the production difficulty of the heat dissipation packaging structure and improves production efficiency.

[0050] Obviously, the above-described embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the manner in which the present invention is to be implemented. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A heat dissipation packaging structure, characterized in that: include: The frame (100) comprises a plurality of conductor bases (110) arranged at intervals, wherein the bottoms of the conductor bases (110) are connected to pins (120); a first chip (200) and a second chip (300), wherein the first chip (200) and the second chip (300) are respectively mounted on different conductor bases (110); a flexible bonding tape (400) arranged across the frame (100) and connected to the first chip (200), the second chip (300), and the conductor base (110) on which the first chip (200) and the second chip (300) are not arranged; a first heat dissipation block (410) is attached to the side of the flexible bonding tape (400) facing away from the first chip (200); and a second heat dissipation block (420) is attached to the side of the flexible bonding tape (400) facing away from the second chip (300); A plastic package (500) is coated on the frame (100), the first chip (200), the second chip (300), the flexible bonding tape (400), the first heat dissipation block (410) and the second heat dissipation block (420), and the end faces of the first heat dissipation block (410) facing away from the flexible bonding tape (400) and the end faces of the second heat dissipation block (420) facing away from the flexible bonding tape (400) are flush and both are exposed on the plastic package (500).

2. The heat dissipation packaging structure according to claim 1, characterized in that: The flexible bonding tape (400) has a flat first connecting portion (430) and a second connecting portion (440), wherein the first connecting portion (430) is adhered to and fixedly connected to the first chip (200), and the second connecting portion (440) is adhered to and fixedly connected to the second chip (300).

3. The heat dissipation packaging structure according to claim 2, characterized in that: The first chip (200) is welded and fixed to the first connecting portion (430) by friction welding.

4. The heat dissipation packaging structure according to claim 2, characterized in that: The first heat dissipation block (410) is fixed to the first connection portion (430) and the first chip (200) around the first connection portion (430) by soldering with solder paste (411).

5. The heat dissipation packaging structure according to claim 4, characterized in that: The outer edge of the solder paste (411) is provided with a chamfer.

6. The heat dissipation packaging structure according to claim 1, characterized in that: The outer peripheral wall of the conductor base (110) is provided with a concave and convex locking portion (111), the locking portion (111) between two adjacent conductor bases (110) forms a labyrinth channel (112), and the plastic package body (500) fills the labyrinth channel (112).

7. The heat dissipation packaging structure according to any one of claims 1 to 6, characterized in that: A polished surface (510) is provided on the top of the plastic package body (500), and the polished surface (510) is flush with an end surface of the first heat dissipation block (410) facing away from the flexible bonding tape (400).

8. The heat dissipation packaging structure according to any one of claims 1 to 6, characterized in that: Portions of the first heat dissipation block (410) and the second heat dissipation block (420) exposed outside the plastic package (500) are both covered with a protective layer (412).

9. The heat dissipation packaging structure according to any one of claims 1 to 6, characterized in that: The pins (120) are configured as QFN package pins.

10. The heat dissipation packaging structure according to any one of claims 1 to 6, characterized in that: The flexible bonding tape (400) is configured as an aluminum tape or an aluminum-clad copper tape.

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