High-low voltage power distribution cabinet with heat dissipation structure

Abstract

The utility model provides a high-low voltage power distribution cabinet with a heat dissipation structure, which comprises a cabinet body, a heat dissipation assembly is arranged at the top in the cabinet body, and an air outlet and an air inlet are arranged on the inner side surface of the cabinet body; the heat dissipation assembly comprises a shell, a heat conduction shell arranged in the shell, a semiconductor chilling plate attached to the heat conduction shell and a fan arranged in the heat conduction shell, and the air inlet end of the shell is located at the air inlet; an air inducing cover is arranged at the air outlet end in the shell, one end of the air inducing cover is large, the other end of the air inducing cover is small, the outer side of the large end is fixedly connected with the shell, the small end extends into the heat conduction shell, the air inducing cover is provided with an arc-shaped air inducing face, and a cooling air channel is formed between the heat conduction shell and the shell. The technical problem that in the prior art, when a semiconductor chilling plate is adopted for cooling air, a cooling fan needs to be independently arranged for cooling the semiconductor chilling plate can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of power distribution cabinets, in particular to a high and low voltage power distribution cabinet with a heat dissipation structure. Background Art

[0002] As the name suggests, high and low voltage distribution cabinets are distribution equipment used for power distribution, control, metering and cable connection in power supply systems. Generally, power supply bureaus and substations use high-voltage switchgear, which is then stepped down by the transformer and led to the low-voltage side to the low-voltage distribution cabinet. The low-voltage distribution cabinet is then led to the distribution boards, control boxes, and switch boxes of various power users. The equipment in the cabinet is a distribution device that is assembled into one by some switches, circuit breakers, fuses, buttons, indicator lights, meters, wires and other protective devices to meet the design functional requirements.

[0003] In the prior art, when dissipating heat from a distribution cabinet, a micro fan is generally used to send cold air from the outside into the distribution cabinet for heat dissipation. However, when the air temperature is relatively high, the heat dissipation effect is poor. Therefore, the prior art uses semiconductor refrigeration sheets to cool the air, allowing cold air to enter the cabinet and cool the components in the cabinet. When in use, the semiconductor refrigeration sheet needs to dissipate heat from the hot end, so a separate heat dissipation fan needs to be installed to cool the semiconductor refrigeration sheet. Utility Model Content

[0004] The purpose of the utility model is to provide a high and low voltage distribution cabinet with a heat dissipation structure, which can solve the technical problem in the prior art that when semiconductor refrigeration sheets are used to cool the air, a separate heat dissipation fan needs to be set up to cool the semiconductor refrigeration sheets.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0006] A high and low voltage power distribution cabinet with a heat dissipation structure comprises a cabinet body, a heat dissipation component is arranged at the top of the cabinet body, and an air outlet and an air inlet are arranged on the inner side of the cabinet body;

[0007] The heat dissipation assembly includes a housing, a heat-conducting shell arranged inside the housing, a semiconductor refrigeration sheet mounted on the heat-conducting shell, and a fan arranged inside the heat-conducting shell, and the air inlet end of the housing is located at the air inlet;

[0008] An air induced draft hood is provided at the air outlet end inside the shell. The air induced draft hood has one large end and a small end. The outer side of the large end is fixedly connected to the shell, and the small end extends into the heat-conducting shell. The air induced draft hood has an arc-shaped air-inducing surface. A cooling air duct is formed between the heat-conducting shell and the shell. An air outlet pipe is provided on the shell to communicate with the cooling air duct, and the air outlet pipe passes through the cabinet.

[0009] Among them, the hot end of the semiconductor refrigeration plate is provided with a heat conducting fin.

[0010] Furthermore, a plurality of first heat-conducting columns are arranged inside the heat-conducting shell.

[0011] Among them, a plurality of second heat-conducting columns are arranged inside the heat-conducting shell, and the first heat-conducting columns and the second heat-conducting columns are arranged alternately to form a three-dimensional network structure.

[0012] Preferably, the heat-conducting housing has a mounting portion, the mounting portion is connected to the housing, and the fan is connected to the mounting portion via a mounting plate.

[0013] Furthermore, a sliding drawer is provided in the shell, a baffle is provided on the right side of the sliding drawer, ventilation holes are provided on the side of the sliding drawer opposite to the baffle and on the baffle, and a filter is provided in the sliding drawer.

[0014] Among them, the filter net is a moisture-absorbing net.

[0015] A permanent magnet is installed on the baffle, and the baffle is fixed on the cabinet after being adsorbed by the permanent magnet.

[0016] For further optimization, a duckbill membrane valve is provided at the air outlet.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] In actual use, the utility model introduces external air into the heat-conducting shell through the fan, so that the air is cooled when it flows through the heat-conducting shell, and since an air induced hood is provided at the air outlet end in the shell, the air induced hood has a large end and a small end, the outer side of the large end is fixedly connected to the shell, and the small end extends into the heat-conducting shell, and the air induced hood has an arc-shaped air-inducing surface; under the action of the air induced hood, a part of the cold air is sent into the cabinet to cool the interior of the cabinet, and the other part of the cold air enters the cooling air duct under the action of the arc-shaped air-inducing surface and is discharged from the air outlet pipe. When the semiconductor refrigeration chip is mounted on the heat-conducting shell, the semiconductor refrigeration chip can be cooled when cold air flows through the cooling air duct; the utility model cools the air through the semiconductor refrigeration chip, so that the low-temperature air enters the cabinet to cool the components inside the cabinet. At the same time, the air is guided under the action of the induced draft hood to cool the semiconductor refrigeration chip. The utility model can solve the technical problem in the prior art that when the semiconductor refrigeration chip is used to cool the air, a separate heat dissipation fan needs to be set up to cool the semiconductor refrigeration chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 It is a three-dimensional diagram of the utility model.

[0021] Figure 2 For this utility model Figure 1 Front view after removing the cabinet door.

[0022] Figure 3 For this utility model Figure 2 A partial enlarged schematic diagram of point A in the middle.

[0023] Figure 4 This is a schematic diagram of the internal structure of the heat dissipation component of the present utility model.

[0024] Reference numerals:

[0025] 101-cabinet, 102-heat dissipation assembly, 103-air outlet, 104-air inlet, 105-housing, 106-heat-conducting shell, 107-semiconductor refrigeration plate, 108-fan, 109-air induced hood, 110-arc-shaped air-inducing surface, 111-cooling air duct, 112-air outlet pipe, 113-heat-conducting fins, 114-first heat-conducting column, 115-second heat-conducting column, 116-three-dimensional mesh structure, 117-installation portion, 118-sliding drawer, 119-baffle, 120-ventilation hole, 121-filter, 122-permanent magnet, 123-cabinet door. DETAILED DESCRIPTION

[0026] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the embodiments of the present invention. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0027] In the description of the embodiments of the present invention, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc. indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0029] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0030] In the embodiments of the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0031] The disclosure below provides many different embodiments or examples for implementing different structures of the embodiments of the present invention. In order to simplify the disclosure of the embodiments of the present invention, the components and settings of specific examples are described below. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. In addition, the embodiments of the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0032] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0033] See Figures 1-4 This embodiment discloses a power distribution cabinet, specifically a high and low voltage power distribution cabinet with a heat dissipation structure, including a cabinet body 101, an air outlet 103 and an air inlet 104 are provided on the inner side of the cabinet body 101, and a heat dissipation component 102 is provided at the top position of the cabinet body 101.

[0034] In this embodiment, the structure of the heat dissipation component 102 is as follows:

[0035] The heat dissipation assembly 102 includes a housing 105, a heat-conducting shell 106 disposed inside the housing 105, a semiconductor cooling sheet 107 mounted on the heat-conducting shell 106, and a fan 108 disposed inside the heat-conducting shell 106. The air inlet end of the housing 105 is located at the air inlet 104.

[0036] An air duct 109 is provided at the air outlet end inside the outer shell 105. The air duct 109 has one large end and a small end. The outer side of the large end is fixedly connected to the outer shell 105, and the small end extends into the heat-conducting shell 106. The air duct 109 has an arc-shaped air-inducing surface 110. A cooling air duct 111 is formed between the heat-conducting shell 106 and the outer shell 105. An air outlet pipe 112 is provided on the outer shell 105 to communicate with the cooling air duct 111, and the air outlet pipe 112 passes through the cabinet 101.

[0037] In this embodiment, the outside air is introduced into the heat-conducting shell 106 by the fan 108, so that the air is cooled when it flows through the heat-conducting shell 106. In addition, since an air induced hood 109 is provided at the air outlet end in the shell 105, the air induced hood 109 has a large end and a small end. The outer side of the large end is fixedly connected to the shell 105, and the small end extends into the heat-conducting shell 106. The air induced hood 109 has an arc-shaped air-inducing surface 110. Under the action of the air induced hood 109, part of the cold air is sent into the cabinet 101 to cool the interior of the cabinet 101, and the other part of the cold air enters the cooling air duct 111 under the action of the arc-shaped air-inducing surface 110 and is discharged from the air outlet pipe 112. Since the semiconductor refrigeration sheet 107 is mounted on the heat-conducting shell 106, the semiconductor refrigeration sheet 107 can be cooled when the cold air flows through the cooling air duct 111; the utility model uses the semiconductor refrigeration sheet 107 to cool the air, so that the low-temperature air enters the cabinet 101 to cool the components inside the cabinet 101. At the same time, the air is guided under the action of the induced draft hood 109 to cool the semiconductor refrigeration sheet 107. The utility model can solve the technical problem in the prior art that when the semiconductor refrigeration sheet 107 is used to cool the air, a separate heat dissipation fan 108 needs to be set up to cool the semiconductor refrigeration sheet 107.

[0038] The hot end of the semiconductor refrigeration plate 107 is provided with a heat-conducting fin 113 ; the heat-conducting fin 113 extending into the cooling air duct 111 can increase the contact area with the cold air, thereby improving the cooling effect on the semiconductor refrigeration plate 107 .

[0039] A plurality of first heat-conducting columns 114 are disposed inside the heat-conducting housing 105 . Furthermore, a plurality of second heat-conducting columns 115 are disposed inside the heat-conducting housing 105 . The first heat-conducting columns 114 and the second heat-conducting columns 115 are alternately disposed to form a three-dimensional network structure 116 .

[0040] In this way, a three-dimensional network structure 116 can be formed inside the heat-conducting shell 106, thereby improving the cooling effect on the air.

[0041] The heat-conducting housing 105 has a mounting portion 117 , which is connected to the housing 105 , and the fan 108 is connected to the mounting portion 117 via a mounting plate.

[0042] Furthermore, a sliding drawer 118 is provided in the housing 105 , a baffle 119 is provided on the right side of the sliding drawer 118 , ventilation holes 120 are provided on the side of the sliding drawer 118 opposite to the baffle 119 and on the baffle 119 , and a filter 121 is provided in the sliding drawer 118 .

[0043] The filter net 121 is a moisture-absorbing net.

[0044] The filter 121 can filter the air, remove the impurities in the air, and prevent moisture from entering the cabinet 101, so as to ensure that the interior of the cabinet 101 is in a dry state.

[0045] The baffle 119 is provided with a permanent magnet 122 , and the baffle 119 is fixed to the cabinet 101 after being adsorbed by the permanent magnet 122 . The filter 121 can be quickly replaced by the permanent magnet 122 .

[0046] Furthermore, duckbill membrane valves are provided at the air outlet pipe 112 and the air outlet 103; such a setting can block the air outlet pipe 112 and the air outlet 103 when the fan 108 is in a stopped state, thereby preventing moisture from entering the interior of the cabinet 101. After the fan 108 is started, the interior of the cabinet 101 will be under positive pressure, and the duckbill membrane valve will open to exhaust air.

[0047] In actual use, a cabinet door 123 is provided on the cabinet body 101 .

[0048] In actual use, the fan and the semiconductor cooling plate 107 are connected to a power source.

[0049] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0050] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high and low voltage distribution cabinet with a heat dissipation structure, comprising a cabinet body, characterized in that: A heat dissipation component is provided at the top of the cabinet, and an air outlet and an air inlet are provided on the side of the cabinet; The heat dissipation assembly includes a housing, a heat-conducting shell arranged inside the housing, a semiconductor refrigeration sheet mounted on the heat-conducting shell, and a fan arranged inside the heat-conducting shell, and the air inlet end of the housing is located at the air inlet; An air induced draft hood is provided at the air outlet end inside the shell. The air induced draft hood has one large end and a small end. The outer side of the large end is fixedly connected to the shell, and the small end extends into the heat-conducting shell. The air induced draft hood has an arc-shaped air-inducing surface. A cooling air duct is formed between the heat-conducting shell and the shell. An air outlet pipe is provided on the shell to communicate with the cooling air duct, and the air outlet pipe passes through the cabinet.

2. The high and low voltage distribution cabinet with a heat dissipation structure according to claim 1, characterized in that: The hot end of the semiconductor refrigeration plate is provided with a heat conducting fin.

3. The high and low voltage distribution cabinet with a heat dissipation structure according to claim 1, characterized in that: A plurality of first heat-conducting columns are arranged inside the heat-conducting shell.

4. The high and low voltage distribution cabinet with a heat dissipation structure according to claim 3, characterized in that: A plurality of second heat-conducting columns are arranged inside the heat-conducting shell, and the first heat-conducting columns and the second heat-conducting columns are arranged alternately to form a three-dimensional network structure.

5. The high and low voltage distribution cabinet with a heat dissipation structure according to claim 3, characterized in that: The heat-conducting housing has a mounting portion, which is connected to the housing, and the fan is connected to the mounting portion through a mounting plate.

6. The high and low voltage distribution cabinet with a heat dissipation structure according to claim 1, characterized in that: A sliding drawer is arranged in the shell, a baffle is arranged on the right side of the sliding drawer, ventilation holes are arranged on the side of the sliding drawer opposite to the baffle and on the baffle, and a filter is arranged in the sliding drawer.

7. The high and low voltage distribution cabinet with a heat dissipation structure according to claim 6, characterized in that: The filter is a moisture-absorbing mesh.

8. The high and low voltage distribution cabinet with a heat dissipation structure according to claim 6, characterized in that: A permanent magnet is installed on the baffle, and the baffle is fixed on the cabinet body after being adsorbed by the permanent magnet.

9. A high and low voltage distribution cabinet with a heat dissipation structure according to any one of claims 1 to 8, characterized in that: A duckbill membrane valve is provided at the air outlet.

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